JP2005236087A - Aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively avoid interference between an optical system unit and a mobile object. <P>SOLUTION: A stroke limit which limits the movable range of at least one of a holding member 38 holding an optical system unit PU and a base 71 disposed below the optical system unit PU, and a stroke limit which limits the movable range of a mobile object WTB which has a photosensitive object W mounted and can move along an upper surface of the base and can move in a prescribed stroke range also in a gravity direction, are set according to sequence by a control device 20 which controls anti-vibration parts (56, 66) supporting at least one of a driving system 27 which drives the mobile object, the holding member and the base to a floor surface F to move along the gravity direction in the prescribed stroke range. In the control device, the stroke limit of at least one of the holding member, the base and the movement body is reset every sequence. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus, and more particularly to an exposure apparatus used in a lithography process when manufacturing an electronic device such as a semiconductor element (integrated circuit) or a liquid crystal display element.

  Conventionally, in a lithography process for manufacturing an electronic device such as a semiconductor element (such as an integrated circuit) or a liquid crystal display element, a wafer on which a resist (photosensitive agent) is applied via a projection optical system with an image of a mask or reticle pattern. Or a step-and-repeat reduction projection exposure apparatus (so-called stepper) that transfers to each of a plurality of shot areas on an object such as a glass plate (hereinafter referred to as “wafer”), or a step-and-scan type Projection exposure apparatuses (so-called scanning steppers (also called scanners)) and the like are mainly used.

  In this type of projection exposure apparatus, with the miniaturization of patterns due to high integration of integrated circuits, higher resolution (resolution) has been required year by year. For this reason, exposure light has a shorter wavelength and a projection optical system. The numerical aperture (NA) has been gradually increased (larger NA). However, shortening the wavelength of exposure light and increasing the NA of the projection optical system improve the resolution of the projection exposure apparatus, but reduce the depth of focus. In addition, it has been certain that the exposure wavelength will be further shortened in the future, and if it remains as it is, the depth of focus becomes too narrow, and there is a possibility that the margin during the exposure operation will be insufficient.

  Therefore, an exposure apparatus using an immersion method has recently attracted attention as a method of substantially shortening the exposure wavelength and increasing (widening) the depth of focus as compared with the air. As an exposure apparatus using this immersion method, an exposure apparatus that performs exposure in a state where the space between the lower surface of the projection optical system and the wafer surface is locally filled with a liquid such as water or an organic solvent is known (for example, See Patent Document 1 below). In the exposure apparatus described in Patent Document 1, the wavelength of exposure light in a liquid is 1 / n times that in air (n is a refractive index of the liquid, usually about 1.2 to 1.6). Use this to improve the resolution and to increase the depth of focus by n times compared to a projection optical system that can achieve the same resolution as that without using the immersion method (assuming that such a projection optical system can be manufactured). That is, the depth of focus can be increased substantially n times as compared with that in the air.

  By the way, in a recent projection exposure apparatus, the stage surface plate that supports the wafer stage is physically separated from the lens barrel surface plate that holds the projection optical system, and is installed below the projection optical system (hereinafter referred to as the projection optical system). For convenience, it is referred to as a “stage-stable separately placed type”). In this stage surface plate separate type projection exposure apparatus, the lens barrel surface plate that holds the projection optical system is supported via a first vibration isolation mechanism by a support member called a frame caster installed on the floor surface. . Further, the stage surface plate that supports the wafer stage is supported on the frame caster or on the floor surface via the second vibration isolation mechanism. Further, a wafer table (a part of the wafer stage) on which the wafer is placed is movable in the vertical direction in order to align the surface of the wafer with the image plane (best imaging plane) of the projection optical system.

  In a conventional stage exposure apparatus of a separate type of surface plate, the stroke limits for setting the movable range within the stroke range relating to the gravity direction of each of the first vibration isolation mechanism, the second vibration isolation mechanism, and the wafer table are mutually It was set independently. In addition, the reset operation for setting the positions of the first vibration isolation mechanism, the second vibration isolation mechanism, and the wafer table in the direction of gravity to the respective origin positions was performed simultaneously. Since the interval (so-called working distance) was sufficiently wide (for example, about 9 mm), the wafer table and the projection optical system did not interfere at the time of resetting.

  However, in an exposure apparatus that employs a local liquid immersion method as described in Patent Document 1, the above-described relationship is used because the surface tension of the liquid is used to hold the liquid between the projection optical system and the wafer. It is necessary to make the working distance as narrow as possible, for example, about 1 mm. For this reason, the stage surface plate separate type projection exposure apparatus adopting the local liquid immersion method, like the conventional projection exposure apparatus, includes the first vibration isolation mechanism, the second vibration isolation mechanism, and the wafer table. If each had its own stroke limit and the stroke limit was set individually, the interference phenomenon between the lowermost end of the projection optical system and the wafer table could not only be reset, but also during normal use. It can happen.

  The interference phenomenon between the lowermost end portion of the projection optical system and the table as described above is not limited to the projection exposure apparatus other than the immersion exposure apparatus, but may be an electron beam (EB) exposure apparatus or other exposure apparatuses. This may occur when the distance between the optical system unit including the wafer and the wafer (working distance) is narrow.

International Publication No. 99/49504 Pamphlet

  The present invention has been made under the above circumstances. From the first viewpoint, the exposure apparatus exposes the photosensitive object (W) with an energy beam (IL) to form a predetermined pattern on the photosensitive object. An optical system unit (PU) including an exposure optical system (PL) that irradiates the photosensitive object with the energy beam; a holding member (38) that holds the optical system unit; and independent of the holding member A base (71) disposed below the optical system unit and having an upper surface substantially parallel to the floor surface (F); and the photosensitive object is placed and movable along the upper surface of the base; A movable body (WTB) movable in a predetermined stroke range in the direction of gravity; a drive system (28, 29, 31, 33) for driving the movable body; and at least one of the holding member and the base, Predetermined strike A vibration isolator (56, 66, 72, 90) that supports the floor surface while isolating it so that it can move along the direction of gravity in the range of the torque; and the drive system and the vibration isolator And a stroke limit for limiting a movable range within the predetermined stroke range of the movable body, and a stroke limit for limiting a movable range within the predetermined stroke range of at least one of the holding member and the base. And a control device (20) that is set according to the sequence.

  According to this, the stroke limit that restricts the movable range of at least one of the holding member that holds the optical system unit and the base disposed below the optical system unit, and the photosensitive object are placed on the upper surface of the base. A stroke limit that restricts a movable range of the movable body that is movable along the gravity direction and within a predetermined stroke range, and a drive system that drives the movable body, and at least one of the holding member and the base Is set according to the sequence by a control device that controls the vibration isolator that supports the floor surface while isolating it so as to be movable along the direction of gravity within a predetermined stroke range. For this reason, in the control device, for each sequence, the necessary movable range in the gravitational direction of at least one of the holding member and the base and the necessary movable range in the gravitational direction of the moving body are obtained in advance by calculation and retained for each sequence. The setting of the stroke limit of at least one of the member and the base and the moving body is changed. In this way, by changing the setting of the stroke limit as necessary, the member that is held by the holding member and faces the moving body when driven indefinitely within each preset stroke range. Even in the case where the moving body (for example, the optical system unit) and the moving body come into contact with each other and interfere with each other, it is possible to control so as not to interfere in actual operation.

  In this case, various configurations of the anti-vibration unit are conceivable, for example, the anti-vibration unit includes a first air mount (60) capable of changing the height of the holding member from the floor surface within a predetermined stroke range; A second air mount (80) in which the height of the base from the floor surface can be changed within a predetermined stroke range, and each of the first and second air mounts can be moved according to an instruction from the control device. Each of the stroke limits for limiting the range may be set, and the first and second adjustment units (72, 90) for adjusting the internal pressures of the first and second air mounts may be included. .

  In this case, when the first air mount is at the lowest position of the stroke range and the second air mount is at the lowest position of the stroke range, the first air mount is held by the holding member and faces the moving body. The stroke range of each of the first air mount, the second air mount, and the moving body can be set so that the member to be moved and the moving body do not interfere with each other.

  In this case, when the first air mount is at the lowest position in the stroke range, and the second air mount and the moving body are at the highest position in the stroke range, the first air mount is held by the holding member. The stroke ranges of the first air mount, the second air mount, and the moving body are set so that the lowermost part of the member facing the moving body interferes with the moving body. Alternatively, when each of the first air mount, the second air mount, and the movable body moves within a predetermined stroke range, at least a predetermined stroke of the first air mount. In a part of the range, the lowermost part of the member held by the holding member and facing the moving body interferes with the moving body. 1 of the air mount, the second air mount and the moving body each stroke range can also be that they are set.

  According to a second aspect of the present invention, there is provided an exposure apparatus that exposes a photosensitive object (W) with an energy beam (IL) from an exposure optical system (PL) and forms a predetermined pattern on the photosensitive object. A movable body (WTB) that holds the photosensitive object, is movable in a horizontal plane and is movable within a predetermined stroke range in the direction of gravity; and has a substantially horizontal upper surface, and the movable body is disposed on the upper surface. A base (71) that is movably supported by; and a drive system (28, 29, 31, 33) for driving the movable body; and a member that is disposed above the movable body and that faces the movable body (51A, 51B, 91); a variable section (56, 66, 72, 90) for changing the distance between the member and the base in the direction of gravity within a predetermined stroke range; and the drive system Control device for controlling the variable part (20), and when the member and the base are closest to each other within a predetermined stroke range of the variable portion and the moving body is at the highest position in the predetermined stroke range, When the mobile body interferes, the control device controls at least one of the drive system and the variable portion so that interference between the member and the mobile body does not occur. Exposure apparatus.

  According to this, even when the member and the movable body interfere with each other under a specific condition, it is possible to prevent mutual interference (collision) from occurring.

  In this case, the variable portion includes a first variable mechanism (56) and a second variable mechanism (66) that individually support the member and the base so as to be movable along the direction of gravity. can do. Further, the control device may set a stroke limit that limits a movable range in a stroke range of the movable body and a movable range in a stroke range of the member and the base according to an operation sequence. it can.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a schematic configuration of an exposure apparatus 100 according to an embodiment. The exposure apparatus 100 is a step-and-scan projection exposure apparatus (also called a scanning stepper (scanner)).

  The exposure apparatus 100 includes a light source and an illumination optical system. The illumination system 10 illuminates a reticle R as a mask with illumination light (exposure light) IL as an energy beam, a reticle stage RST that holds the reticle R, and an optical system unit. Projection unit PU, a wafer stage WST on which a wafer W as a photosensitive object is placed, a body BD on which the reticle stage RST and the projection unit PU are mounted, a control system for these, and the like.

  The illumination system 10 is, for example, disclosed in JP-A-6-349701 (corresponding US Pat. No. 5,534,970) and the like. , A relay lens, a variable ND filter, a reticle blind, etc. (all not shown). In this illumination system 10, the slit-shaped illumination area on the reticle R defined by the reticle blind is illuminated with illumination light IL with a substantially uniform illuminance. Here, as the illumination light IL, for example, ArF excimer laser light (wavelength 193 nm) is used. As the optical integrator, a fly-eye lens, a rod integrator (an internal reflection type integrator), a diffractive optical element, or the like can be used.

  The reticle stage RST is levitated and supported on a reticle base 36 constituting a top plate of a second column 34, which will be described later, with a clearance of about several μm, for example, by an air bearing (not shown) provided on the bottom surface thereof. Yes. On reticle stage RST, reticle R is fixed by, for example, vacuum suction (or electrostatic suction). Here, the reticle stage RST is two-dimensionally (X-axis direction, Y-axis direction, and the like) in an XY plane perpendicular to the optical axis AX of the projection optical system PL described later by a reticle stage drive unit 12 including a linear motor or the like. It can be finely driven in the rotation direction (θz direction) around the Z axis orthogonal to the XY plane, and the reticle base 36 is set to a predetermined scanning direction (here, the Y axis direction that is the direction orthogonal to the paper surface in FIG. 1). ) Can be driven at the scanning speed specified in (1).

  The reticle stage RST is actually a reticle coarse movement stage that can be driven in a predetermined stroke range in the Y-axis direction on the reticle base 36 by a linear motor, and at least three actuators (for example, voice coils) for the reticle coarse movement stage. 1 is shown as a single stage for the sake of convenience of illustration. FIG. 1 shows a reticle fine movement stage that can be finely driven in the X-axis direction, Y-axis direction, and θz direction by a motor or the like. Accordingly, in the following, the reticle stage RST is a single stage that can be finely driven in the X-axis direction, the Y-axis direction, and the θz direction by the reticle stage drive unit 12 and that can be scanned in the Y-axis direction. Will be described.

  In the case of this embodiment, measures are taken to reduce as much as possible the influence of vibration caused by the reaction force acting on the stator of the linear motor when the reticle stage RST is driven (particularly during scanning drive). Specifically, the stator of the linear motor described above is provided separately from the body BD as disclosed in, for example, JP-A-8-330224 (corresponding US Pat. No. 5,874,820). The reaction force that is supported by a support member (reaction frame) (not shown) and acts on the stator of the linear motor when the reticle stage RST is driven is transmitted to the floor F of the clean room via the reaction frame. It is supposed to be escaped. In addition, for example, a reaction force canceling mechanism using a momentum conservation law disclosed in Japanese Patent Laid-Open No. 8-63231 (corresponding US Pat. No. 6,246,204) is used as a reaction force canceling mechanism for reticle stage RST. It may be adopted.

  The position of the reticle stage RST in the stage moving surface is always detected by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 via a movable mirror 15 with a resolution of about 0.5 to 1 nm, for example. Yes. In this case, position measurement is performed with reference to the fixed mirror 14 fixed to the side surface of the lens barrel 40 constituting the projection unit PU. Here, actually, a Y moving mirror having a reflecting surface orthogonal to the Y-axis direction and an X moving mirror having a reflecting surface orthogonal to the X-axis direction are provided on the reticle stage RST. Correspondingly, a reticle Y interferometer and a reticle X interferometer are provided, and correspondingly, a fixed mirror for X-axis direction position measurement and a fixed mirror for Y-axis direction position measurement are provided. However, in FIG. 1, these are typically shown as a movable mirror 15, a reticle interferometer 16, and a fixed mirror 14. For example, the end surface of the reticle stage RST may be mirror-finished to form a reflecting surface (corresponding to the reflecting surface of the movable mirror 15). Further, at least one corner cube type mirror (for example, a retroreflector) is used instead of the reflecting surface extending in the X-axis direction used for detecting the position of the reticle stage RST in the scanning direction (Y-axis direction in the present embodiment). Also good. Here, one of the reticle Y interferometer and the reticle X interferometer, for example, the reticle Y interferometer is a two-axis interferometer having two measurement axes, and the reticle stage RST is based on the measurement value of the reticle Y interferometer. In addition to the Y position, rotation in the θz direction can also be measured.

  The measurement value of the reticle interferometer 16 is sent to the stage controller 20 and the main controller 50 via this. In response to an instruction from main controller 50, stage controller 20 drives and controls reticle stage RST via reticle stage drive unit 12 based on the measurement value of reticle interferometer 16.

  Above the reticle R, light having an exposure wavelength for simultaneously observing the pair of reference marks on the wafer stage WST and the pair of reticle marks on the reticle R corresponding thereto is used via the projection optical system PL. A pair of reticle alignment systems 13A and 13B (not shown in FIG. 1, refer to FIG. 3) formed of a TTR (Through The Reticle) alignment system are provided at a predetermined distance in the X-axis direction. As the pair of reticle alignment systems 13A and 13B, one having the same configuration as that disclosed in, for example, Japanese Patent Laid-Open No. 7-176468 (corresponding US Pat. No. 5,646,413) is used. .

  The projection unit PU is held by a part of the body BD below the reticle stage RST in FIG. The body BD includes a first column 32 provided on a frame caster FC installed on the floor F of the clean room, and a second column 34 fixed on the first column 32.

  The frame caster FC includes a base plate BS placed horizontally on the floor surface F, and a plurality of, for example, three (or four) leg portions 39 (provided on the paper surface in FIG. 1) fixed on the base plate BS. The rear leg is not shown).

  The first column 32 includes a plurality of, for example, three (or four) first vibration isolation mechanisms (first variable) fixed individually to the upper ends of the plurality of leg portions 39 constituting the frame caster FC. A lens barrel surface plate (main frame) 38 as a holding member supported substantially horizontally by a mechanism 56 is provided.

  The lens barrel surface plate 38 is made of, for example, a casting, and a circular opening (not shown) is formed at a substantially central portion thereof. In this circular opening, a support member IV having a stepped cylindrical shape and a circular opening formed in the center is inserted from above, and this support member IV is inserted into the lens barrel surface plate via the upper large-diameter portion. 38. The projection unit PU is inserted from above into the circular opening of the support member IV, and is supported by the support member IV via a flange FLG provided near the lower end of the outer periphery thereof. That is, in this way, the projection unit PU is held on the lens barrel surface plate 38 via the support member IV. Here, as a material of the flange FLG and the support member IV, a low thermal expansion material such as Inver (36% nickel, 0.25% manganese, and low expansion composed of iron containing a small amount of carbon and other elements). Alloy) is used.

  On the upper surface of the lens barrel surface plate 38, one end (lower end) of a plurality of, for example, three legs 41 (note that the legs on the back side of the drawing in FIG. 1 are not shown) is fixed at a position surrounding the projection unit PU. Has been. The other end (upper end) surface of each leg 41 is on substantially the same horizontal plane, and the lower surface of the reticle base 36 is fixed to the upper end surface of each leg 41. In this way, the reticle base 36 is horizontally supported by the plurality of legs 41. That is, the second column 34 is configured by the reticle base 36 and the three legs 41 that support the reticle base 36. The reticle base 36 is formed with an opening 36a serving as a passage for the illumination light IL at the center thereof.

  The projection unit PU is a projection optical system as an exposure optical system that includes a lens barrel 40 that is cylindrical and has a flange FLG in the vicinity of the lower end of the outer periphery thereof, and a plurality of optical elements that are held by the lens barrel 40. It is comprised by PL.

  As the projection optical system PL, for example, a refractive optical system including a plurality of lenses (lens elements) having a common optical axis AX in the Z-axis direction is used. This projection optical system PL is, for example, both-side telecentric and has a predetermined projection magnification (for example, 1/4 or 1/5). For this reason, when the illumination area of the reticle R is illuminated by the illumination light IL from the illumination system 10, the illumination light IL that has passed through the reticle R causes the circuit of the reticle R in the illumination area to pass through the projection optical system PL. A reduced image of the pattern (a reduced image of a part of the circuit pattern) is formed on the wafer W whose surface is coated with a resist (photosensitive agent). Here, the wafer W is a disk-shaped substrate such as a semiconductor (silicon or the like) or SOI (Silicon Insulator), for example, and a resist is coated thereon.

  In the exposure apparatus 100 according to the present embodiment, since exposure using a liquid immersion method is performed, the reticle side opening increases as the numerical aperture NA substantially increases. For this reason, in a refractive optical system composed only of lenses, it is difficult to satisfy Petzval's condition, and the projection optical system tends to be enlarged. In order to avoid such an increase in the size of the projection optical system, a catadioptric system (catadioptric system) including a mirror and a lens may be used.

  Further, in the exposure apparatus 100 of the present embodiment, in order to perform exposure using the liquid immersion method, a lens (hereinafter referred to as “front lens”) as an optical element closest to the image plane (wafer W side) constituting the projection optical system PL. In the vicinity of 91), a liquid supply nozzle 51 </ b> A and a liquid recovery nozzle 51 </ b> B constituting the liquid immersion device 132 are provided. The liquid supply nozzle 51A and the liquid recovery nozzle 51B are held by a lens barrel surface plate 38 as a holding member, and are arranged so as to face a wafer table WTB (details will be described later) as a moving body.

  The liquid supply nozzle 51A is connected to the other end of a supply pipe (not shown) whose one end is connected to a liquid supply device 131A (not shown in FIG. 1, see FIG. 3), and connected to the liquid recovery nozzle 51B. Is connected to the other end of a recovery pipe (not shown) whose one end is connected to the liquid recovery device 131B (not shown in FIG. 1, see FIG. 3).

  The liquid supply device 131A includes a liquid tank, a pressure pump, a temperature control device, a valve for controlling supply / stop of the liquid to the supply pipe, and the like. As the valve, for example, it is desirable to use a flow rate control valve so that not only the supply / stop of the liquid but also the flow rate can be adjusted. The temperature control device adjusts the temperature of the liquid in the liquid tank to the same temperature as the temperature in the chamber (not shown) in which the exposure apparatus main body is housed.

  The liquid recovery apparatus 131B includes a liquid tank, a suction pump, a valve for controlling recovery / stop of the liquid via a recovery pipe, and the like. As the valve, it is desirable to use a flow control valve corresponding to the above-described valve on the liquid supply device 131A side.

  Here, as the liquid, ultrapure water (hereinafter simply referred to as “water” unless otherwise required) through which ArF excimer laser light (light having a wavelength of 193 nm) passes is used. Ultrapure water has the advantage that it can be easily obtained in large quantities at a semiconductor manufacturing plant or the like and has no adverse effect on the photoresist, optical lens, etc. on the wafer. In addition, since the ultrapure water has no adverse effect on the environment and the content of impurities is extremely low, it can be expected to clean the surface of the wafer and the surface of the front lens 91.

  The refractive index n of water is approximately 1.44. In this water, the wavelength of the illumination light IL is shortened to 193 nm × 1 / n = about 134 nm.

  Each of the liquid supply device 131A and the liquid recovery device 131B includes a controller, and each controller is controlled by the main controller 50 (see FIG. 3). In response to an instruction from the main controller 50, the controller of the liquid supply device 131A opens a valve connected to the supply pipe at a predetermined opening degree, and water between the leading ball 91 and the wafer W is supplied via the liquid supply nozzle 51A. Supply. At this time, the controller of the liquid recovery apparatus 131B opens a valve connected to the recovery pipe at a predetermined opening degree according to an instruction from the main control apparatus 50, and the front ball 91 and the wafer W via the liquid recovery nozzle 51B. Water is recovered in the liquid recovery device 131B (liquid tank) from between the two. At this time, the main controller 50 always has the same amount of water supplied from the liquid supply nozzle 51A between the leading ball 91 and the wafer W and the amount of water recovered through the liquid recovery nozzle 51B. Thus, a command is given to the controller of the liquid supply apparatus 131A and the controller of the liquid recovery apparatus 131B. Accordingly, a certain amount of water Lq (see FIG. 1) is held between the front ball 91 and the wafer W. In this case, the water Lq held between the leading ball 91 and the wafer W is always replaced.

  As is clear from the above description, the liquid immersion device 132 of this embodiment includes the liquid supply device 131A, the liquid recovery device 131B, a supply pipe, a recovery pipe, a liquid supply nozzle 51A, a liquid recovery nozzle 51B, and the like. A local immersion apparatus.

  In the above description, in order to simplify the description, one liquid supply nozzle and one liquid recovery nozzle are provided. However, the present invention is not limited to this, for example, International Publication No. 99/49504. It is good also as employ | adopting the structure which has many nozzles so that it may be disclosed by number pamphlet. In short, as long as the liquid can be supplied between the lowermost optical member (tip ball) 91 and the wafer W constituting the projection optical system PL, any configuration may be used.

  Although not shown, for example, an optical fiber type water leakage sensor is installed outside the liquid immersion area where the water Lq is held, for example, outside the liquid supply nozzle 51A and the liquid recovery nozzle 51B, and the main controller 50 is configured to instantaneously detect the occurrence of water leakage based on the output of the water leakage sensor.

  As shown in FIG. 1, wafer stage WST is not in contact with the upper surface of stage base 71 as a base disposed horizontally below projection unit PU via a plurality of air bearings provided on the bottom surface thereof. It is supported by levitation. On wafer stage WST, wafer W is fixed by vacuum chucking (or electrostatic chucking) via wafer holder 70.

  The stage base 71 includes a plurality of (for example, three) support members 73 respectively disposed at a plurality of locations (for example, three locations) on a flat plate MP called a maintenance plate installed on the base plate BS. The plurality of (for example, three) second anti-vibration mechanisms (second variable mechanisms) 66 respectively fixed to the upper surface of the support member 73 are supported substantially horizontally via support hardware 89A to 89C.

  More specifically, on the −X side surface of the stage base 71, support hardware 89 </ b> A and 89 </ b> B made of metal having an L-shaped cross section in the vicinity of the end portion on one side and the other side in the Y-axis direction (however, In FIG. 1, the support metal 89B is hidden in the back of the support metal 89A. Further, on the + X side surface of the stage base 71, a support metal 89C made of a metal having an L-shaped cross section is fixed at the center in the Y-axis direction. The stage base 71 is supported on each of the three support members 73 via the second vibration isolation mechanisms 66 via the three support hardwares 89A to 89C, respectively.

  In the present embodiment, a third column is configured by the stage base 71 (and the support hardware 89A to 89C) and the plurality of support members 73.

  The surface (upper surface) on the + Z side of the stage base 71 is processed so as to have a very high flatness, and serves as a guide surface that is a movement reference surface of the wafer stage WST.

  Wafer stage WST is along the guide surface by XY drive unit 31 (not shown in FIG. 1, see FIG. 3) including an actuator such as a linear motor (or a planar motor) below projection optical system PL in FIG. XY stage 28 that is driven in the XY plane, and is mounted on XY stage 28 via Z / tilt drive unit 29 (see FIG. 3). It includes a wafer table WTB as a moving body that is micro-driven in three degrees of freedom in the direction of rotation around the X axis and in the θy direction (the direction of rotation around the Y axis). Wafer W is fixed to the upper surface of wafer table WTB via wafer holder 70 by vacuum chucking (or electrostatic chucking) or the like.

  The Z / tilt driving unit 29 includes, for example, three actuators (for example, a voice coil motor or an EI core) that support the wafer table WTB at three points on the XY stage 28. Note that the Z / tilt driving unit 29 actually exists on the XY stage 28, but in this specification, for convenience of illustration and description, in a part of the wafer stage driving unit 27 of FIG. The explanation is as if it exists (see FIG. 3 etc.).

  As described above, the XY stage 28 and the wafer table WTB constituting the wafer stage WST are respectively driven by the XY drive unit 31, the Z / tilt drive unit 29, and a Z / tilt controller 33 (see FIG. 3) described later. In FIG. 1, the XY drive unit 31, the Z / tilt drive unit 29, and the Z / tilt controller 33 are collectively shown as a wafer stage drive unit 27.

  The wafer holder 70 includes a plate-like main body portion and an auxiliary plate fixed to the upper surface of the main body portion and having a circular opening having a diameter approximately 2 mm larger than the diameter of the wafer W at the center thereof. A large number of pins are arranged in a region inside the circular opening of the auxiliary plate, and the wafer W is supported by the large number of pins and is vacuum-sucked. In this case, when the wafer W is vacuum-sucked, the surface of the wafer W and the surface of the auxiliary plate are substantially the same height.

  The auxiliary plate has an opening having a predetermined shape in a part thereof, and a reference mark plate is fitted in the opening. The surface of the reference mark plate is flush with the auxiliary plate. The surface of the reference mark plate includes at least a pair of reticle alignment first reference marks and a second reference for baseline measurement of an off-axis alignment system having a known positional relationship with respect to the first reference marks. A mark or the like is formed.

  Position information in the XY plane of the wafer table WTB (wafer stage WST) is obtained by a wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 18 that irradiates a length measuring beam onto a movable mirror 17 fixed on the wafer table WTB. For example, it is always detected with a resolution of about 0.5 to 1 nm. The wafer interferometer 18 is fixed to the lens barrel plate 38 in a suspended state, and is reflected by the movable mirror 17 with reference to the reflecting surface of the fixed mirror 57 fixed to the side surface of the lens barrel 40 constituting the projection unit PU. The position information of the surface is measured as the position information of wafer stage WST.

  Here, on the wafer stage WST, in actuality, a Y moving mirror having a reflecting surface orthogonal to the Y axis direction that is the scanning direction and an X moving mirror having a reflecting surface orthogonal to the X axis direction that is the non-scanning direction. Corresponding to this, laser interferometers and fixed mirrors are also provided for X-axis direction position measurement and Y-axis direction position measurement, respectively, but these are representatively moved in FIG. Illustrated as mirror 17, wafer interferometer 18, and fixed mirror 57. For example, the end surface of wafer table WTB may be mirror-finished to form a reflecting surface (corresponding to the reflecting surface of movable mirror 17). The X-axis direction position measurement laser interferometer and the Y-axis direction position measurement laser interferometer are both multi-axis interferometers having a plurality of measurement axes, in addition to the X and Y positions of the wafer table WTB, Rotation (yawing (rotation in the θz direction), pitching (rotation in the θx direction), and rolling (rotation in the θy direction)) can also be measured. Therefore, in the following description, it is assumed that the wafer interferometer 18 measures the positions of the wafer table WTB in the X, Y, θz, θy, and θx directions in five degrees of freedom. Further, the multi-axis interferometer irradiates a laser beam (not shown) provided on the lens barrel surface plate 38 holding the projection unit PU through a reflective surface installed on the wafer stage WST with an inclination of 45 °. The relative position information regarding the optical axis AX direction (Z-axis direction) of the projection optical system PL may be detected.

  The position information (or velocity information) of wafer stage WST is sent to stage controller 20 and main controller 50 via this, and stage controller 20 responds to instructions from main controller 50 in accordance with instructions from main controller 50. Based on the position information (or speed information), the position of the wafer stage WST in the XY plane is controlled via the XY drive unit 31.

  In the exposure apparatus 100 of the present embodiment, although not shown in FIG. 1, for example, Japanese Laid-Open Patent Publication No. 6-283403 (corresponding to US Pat. No. 5,587) comprising an irradiation system 42a and a light receiving system 42b (see FIG. 3). An oblique incidence type multi-point focal position detection system similar to that disclosed in Japanese Patent No. 448,332) is provided. In this embodiment, as an example, the irradiation system 42a is suspended and supported below the lens barrel platen 38 on the −X side of the liquid supply nozzle 51A, and the light receiving system 42b is fixed on the + X side of the liquid recovery nozzle 51B. It is suspended and supported below the board 38. That is, the irradiation system 42a, the light receiving system 42b, and the projection optical system PL are attached to the same member (lens barrel plate 38), and the positional relationship between them is maintained constant. The member to which the irradiation system 42a and the light receiving system 42b are attached is not limited to the lens barrel surface plate 38, but may be any member that maintains a constant positional relationship with the projection optical system PL, for example, a mirror of the projection unit PU. The cylinder 40 or the support member IV may be used.

  The irradiation system 42a has a light source whose on / off is controlled by the main controller 50, and emits an imaging light beam for forming images of a large number of pinholes or slits toward the imaging surface of the projection optical system PL. Is irradiated from an oblique direction with respect to the optical axis AX. On the other hand, the reflected light beam of the imaging light beam reflected on the wafer surface is received by the light receiving element in the light receiving system 42b and converted into an electric signal (defocus signal). The defocus signal (defocus signal) is supplied to the stage controller 20 and the main controller 50 through the stage controller 20. The stage control device 20 responds to an instruction from the main control device 50 at the time of scanning exposure, which will be described later, based on a defocus signal (defocus signal), for example, an S curve signal, in the Z position on the surface of the wafer W, in the θx direction. The rotation and the rotation in the θy direction are calculated, and an instruction is given to the Z / tilt controller 33 that controls the Z / tilt driving unit 29 based on the calculation result. Based on the command, the Z / tilt controller 33 calculates the drive amount of each actuator that drives each of the three support points for the wafer table WTB in the Z-axis direction, and sets the corresponding support point driven by each actuator. Each actuator is driven while monitoring the output of the linear encoder that detects the position in the Z-axis direction. In this way, the movement of wafer table WTB in the Z-axis direction and the two-dimensional tilt (that is, rotation in the θx and θy directions) are controlled, and the irradiation region of illumination light IL (conjugated with the illumination region described above) is controlled. Auto-focusing (automatic focusing) and auto-leveling are performed so that the surface of the wafer W substantially coincides with the imaging plane of the projection optical system PL within the irradiation area of the illumination light IL.

  In this embodiment, the space between the uppermost position and the lowermost position in the Z-axis direction of each support point that can be driven by each actuator is the stroke range of wafer table WTB, which will be described later.

  Similarly, in the exposure apparatus 100 of the present embodiment, although not shown in FIG. 1, an off-axis alignment system ALG (not shown in FIG. 1, see FIG. 3) is provided in the vicinity of the projection unit PU. . As this off-axis alignment system, for example, the target mark is irradiated with a broadband detection light beam that does not expose the resist on the wafer, and the target mark image formed on the light receiving surface by the reflected light from the target mark is not shown. An image processing type FIA (Filed Image Alignment) type alignment sensor that captures an image of the index of the image using an imaging device (CCD) or the like and outputs the imaged signals is used. The off-axis alignment system ALG supplies mark position information based on the index center to the main controller 50. Based on the supplied information and the measurement value of wafer interferometer 18, main controller 50 determines the detection target mark, specifically, the second reference mark on the reference mark plate or the alignment mark on the wafer. Position information on the stage coordinate system defined by the measurement axis of the wafer interferometer 18 is measured.

  FIG. 2 is a partial cross-sectional view of the components in the vicinity of one end portion of the lens barrel surface plate 38 and in the vicinity of one end portion of the stage base 71. Each of the first anti-vibration mechanisms 56 typically takes one of the first anti-vibration mechanisms 56 and supports a lens barrel surface plate 38 as a support object as shown in FIG. A first air mount (hereinafter also simply referred to as “air mount”) 60 and a micro-drive unit 62 capable of micro-driving the lens barrel base plate 38 with high response in the direction of gravity (vertical direction in the drawing in FIG. 2). And.

  The air mount 60 is provided with a housing 61 having an opening in the upper portion, a holding member 63 that holds the lens barrel surface plate 38, and is connected to the housing 61 and the holding member 63. A diaphragm 65 that forms a substantially airtight gas chamber 64 together with the housing 61 and the holding member 63, and an electromagnetic regulator that adjusts the pressure of the gas, for example, air, filled in the gas chamber 64 (hereinafter referred to as "appropriately" 67) (also referred to as a “regulator”).

  The micro drive unit 62 generates electromagnetic force that drives the lens barrel platen 38 in the direction of gravity by performing electromagnetic interaction between the mover 68a directly attached to the lens barrel platen 38 and the mover 68a. A voice coil motor 68 having a stator 68 b that performs the operation, and a current supply source 69 that supplies a drive current to the voice coil motor 68.

  In the first anti-vibration mechanism 56 configured as described above, the first anti-vibration controller 72 as the first adjustment unit is based on the measurement value of the pressure sensor (not shown) according to the instruction of the stage control device 20. The electromagnetic regulator 67 is controlled to control the pressure of the gas in the gas chamber 64, for example, air. However, since the internal pressure of the gas in the gas chamber 64 is high, the control response can be secured only about 20 Hz. Therefore, when high response control is required, the first vibration isolation controller 72 is connected to the lens barrel surface plate 38. The voice coil motor 68 is controlled in accordance with the output of an attached accelerometer (not shown) or the like. Of course, slight vibrations such as floor vibrations are isolated by the air spring of the air mount 60 (insulated at the micro G level).

  In addition, one end of a first valve 76 composed of a normally open electromagnetic valve is connected to the housing 61 of the air mount 60 via a pipe 74, and a predetermined end is connected to the other end of the first valve 76. One end of a first orifice 78 composed of an orifice pipe having an opening area is connected, and the other end of the first orifice 78 is open to the atmosphere (more precisely, a chamber (not shown) surrounding the exposure apparatus main body). Open to the interior atmosphere). The first valve 76 is normally closed by the first vibration isolation controller 72.

  Each of the three second vibration isolation mechanisms 66 is configured in the same manner as the first vibration isolation mechanism 56 described above, except that the support object is different. In FIG. 2, the second vibration isolation mechanism 66 that supports the stage base 71 via the support hardware 89 </ b> A among the three second vibration isolation mechanisms 66 is representatively shown. As shown in FIG. 2, each second vibration isolation mechanism 66 includes a second air mount (hereinafter, referred to as a second air mount) that supports a stage base 71 as a support object via a support hardware 89A (89B or 89C). 80, and a micro-driving unit capable of micro-driving the stage base 71 with high response in the direction of gravity (vertical direction in the drawing in FIG. 2) via the support hardware 89A (89B or 89C). 81.

  Like the air mount 60 described above, the air mount 80 is provided with a housing 82 having an opening in the upper portion and a holding member that holds the stage base 71 via a support hardware 89A. 83, a diaphragm 85 which is connected to the housing 82 and the holding member 83 and forms a gas chamber 84 in an almost airtight state together with the housing 82 and the holding member 83, and a gas filled in the gas chamber 84, for example, And an electromagnetic regulator (hereinafter also referred to as “regulator” as appropriate) 86 for adjusting the pressure of air.

  The micro drive unit 81 performs electromagnetic interaction between the movable element 87a directly attached to the supporting metal 89A (89B or 89C) and the movable element 87a, and via the supporting metal 89A (89B or 89C). A voice coil motor 87 having a stator 87b that generates an electromagnetic force for driving the stage base 71 in the direction of gravity, and a current supply source 88 for supplying a drive current to the voice coil motor 87.

  In the second anti-vibration mechanism 66 configured as described above, the second anti-vibration controller 90 as the second adjustment unit is based on the measurement value of the pressure sensor (not shown) according to the instruction of the stage control device 20. Thus, the electromagnetic regulator 86 is controlled to control the pressure of the gas in the gas chamber 84 formed inside the housing 82, for example, air. In this case as well, when high response control is required, the second image stabilization controller 90 controls the voice coil motor 87 in accordance with the output of an accelerometer (not shown) or the like. Further, fine vibration such as floor vibration transmitted through the base plate BS and the flat plate MP is isolated by the air spring of the air mount 80 (insulated at the micro G level).

  One end of a second valve 94 made of a normally open electromagnetic valve is connected to the housing 82 of the air mount 80 via a pipe 92, and the other end of the second valve 94 is connected to the first valve 94. One end of a second orifice 95 made of an orifice pipe having an opening area larger than that of the orifice 78 is connected, and the other end of the second orifice 95 is open to the atmosphere (more precisely, the non-circularity surrounding the exposure apparatus main body). Open to the internal atmosphere of the chamber shown). The second valve 94 is normally closed by the second vibration isolation controller 90.

  FIG. 3 is a block diagram showing the main configuration of the control system in the exposure apparatus 100 of the present embodiment. In FIG. 3, a control system is configured with the main controller 50 and the stage controller 20 as the center.

  The main controller 50 includes a so-called microcomputer (or workstation) including a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), etc. To control. The stage controller 20 is composed of a microcomputer, and in response to an instruction from the main controller 50, the reticle stage drive unit 12, the wafer stage drive unit 27, the first image stabilization controller 72, the second image stabilization controller 90, and the like. To control.

  Here, this control system constitutes a master / slave system as can be seen from FIG. That is, the main controller 50 constitutes a master processor, and the stage controller 20 under the master processor constitutes a slave processor. The first and second anti-vibration controllers 72 and 90, the Z / tilt controller 33, and the like are configured by a function processor under the stage control device 20.

  Next, in the exposure apparatus 100 of the present embodiment, each of the first air mounts 60 that respectively constitute the three first vibration isolation mechanisms 56 and each second that constitutes each of the three second vibration isolation mechanisms 66. A reset sequence for setting the positions of the air mount 80 and the wafer table WTB in the gravity direction to the respective origin positions (neutral positions) will be described.

  Here, prior to the description of the reset sequence itself, the stroke range (mechanical maximum movable range) of the air mounts 60 and 80 and the wafer table WTB in the Z-axis direction in this embodiment will be described with reference to FIG. To do. FIG. 5 schematically shows the stroke range ST1 of each air mount 60 in the Z-axis direction, the stroke range ST2 of each air mount 80 in the Z-axis direction, and the stroke range ST3 of wafer table WTB in the Z-axis direction. It is. FIG. 5 is a diagram showing the relationship between the stroke ranges ST1, ST2, and ST3 in a state where the lowest position of the stroke range ST1 of each air mount 60 and the neutral position of the stroke range of each air mount 80 coincide. But there is. In FIG. 5, the position of the uppermost surface of wafer table WTB is the representative position of wafer table WTB, and each air mount 60 is attached to a lens barrel surface plate 38 that is an object to be supported by air mount 60. The position of the lower end surface of the front lens 91 of the projection unit PU held is the representative position of the air mount 60. For each air mount 80, the position of the upper surface of the stage base 71 supported by the air mount 80 (in FIG. 5). For convenience, this position coincides with the neutral position within the movable range of wafer table WTB). This is the representative position of air mount 80.

  In FIG. 5, reference numeral WD denotes the lowermost end portion of the projection unit PU when the three air mounts 60, the air mounts 80, and the wafer table WTB are all at the origin position (neutral position), that is, the front lens 91. A working distance which is a distance between the lower end surface and the upper surface of wafer table WTB (that is, the surface of wafer W) is shown. In this embodiment, the working distance WD is set to 1 mm. Further, as shown in FIG. 5, in the present embodiment, ST1 is set to ± 1 mm, ST2 is set to ± 0.8 mm, and ST3 is set to ± 0.5 mm.

  As is apparent from FIG. 5, in this embodiment, the working distance is as narrow as 1 mm. Therefore, the positions of the air mounts 60, the air mounts 80, and the wafer table WTB in the gravitational direction are unconditionally set. If the respective origin positions are set, the lowermost end of the projection unit PU (the lower surface of the leading ball 91) and the wafer table WTB may interfere with each other as much as 1.3 mm as indicated by the symbol D in FIG. That is, when each air mount 60 is at the lowest position in the stroke range ST1, and each air mount 80 and wafer table WTB are at the highest position in the respective stroke ranges ST2 and ST3, the lowermost end of the projection unit PU (the front lens 91). The stroke ranges of the air mounts 60, the air mounts 80 and the wafer table WTB are set so that the lower surface of the wafer table and the wafer table WTB interfere with each other with an interference width of 1.3 mm.

  Next, the reset sequence will be described along the flowchart of FIG. 4 showing the processing algorithm of the stage control apparatus 20 and with reference to other drawings as appropriate.

  The algorithm shown in FIG. 4 is started when a reset start instruction command is received from the main controller 50.

  First, in step 102, the gas in the gas chamber of each air mount 60 and each air mount 80 is forcibly exhausted to lower the lens barrel base plate 38 and the stage base 71 to the lowest position, and the Z / tilt drive unit 29 A thrust is generated by each of the actuators to forcibly lower the wafer table WTB to the lowest position. The operation of each unit executed in step 102 is actually performed by the stage controller 20 giving commands to the first image stabilization controller 72, the second image stabilization controller 90, and the Z / tilt controller 33, respectively. The first anti-vibration controller 72, the second anti-vibration controller 90, and the Z / tilt controller 33 that have received this command perform the operations in accordance with the respective commands.

  Here, the forced exhaust of the gas in the gas chamber of each air mount 60 and each air mount 80 may be performed by opening the first valve 76 and the second valve 94, or setting of the regulators 67 and 86. It may be done by changing.

  In any case, in the state where the lens barrel surface plate 38 and the stage base 71 are both lowered to the lowest position due to the forced exhaust, regardless of the position of the wafer table WTB, the lowermost end of the projection unit PU (the lower surface of the front lens 91). ) And the wafer table WTB (that is, even when the wafer table WTB is at the uppermost position, the distance between the lowermost end of the projection unit PU (the lower surface of the leading ball 91) and the wafer table WTB is 0.3 mm). (See FIG. 5).

  In the next step 104, a positioning command (target position: +0.5 mm (first air mount scale)) is given to the first image stabilization controller 72. Thereby, the internal pressure of the gas chamber 64 of each air mount 60 is adjusted by the first vibration-proof controller 72 via the regulator 72, and the lower end surface (representative position of the air mount 60) of the front lens 91 is +0.5 mm. Positioned. Of course, when the first valve 76 is opened in step 102, prior to the adjustment of the internal pressure of the gas chamber 64 of each air mount 60, the first valve 76 is connected to the first vibration isolation controller. 72 needs to be closed.

  Note that the target position in step 104: +0.5 mm (first air mount scale) is the lowest end of the projection unit PU (even if each air mount 80 is at the uppermost position and the wafer table WTB is at the uppermost position). The lower surface of the front lens 91) and the wafer table WTB are positions that satisfy the condition that they do not interfere with each other.

  In the next step 106, the process waits for the predetermined time T1 to elapse after the positioning command is issued in step 104. When the predetermined time T1 elapses, the process proceeds to the next step 108 to instruct the second image stabilization controller 90. (Target position: ± 0 mm (second air mount scale)). Thereby, the internal pressure control of the gas chamber 84 via the regulator 86 of each air mount 80 is started by the second anti-vibration controller 90, and after the positioning of the lower end surface of the front lens 91 by each air mount 60 is started, The positioning of the upper surface of the stage base 71 (representative position of the air mount 80) by each air mount 80 is started with a slight delay. Of course, also in this case, when the second valve 94 is opened in the above-described step 102, the second valve 94 is moved to the second valve prior to the adjustment of the internal pressure of the gas chamber 84 of each air mount 80. It is necessary to close it via the vibration isolating controller 90.

  In the next step 110, it waits for the positioning of the lower end surface of the front lens 91 to the target position to be completed, and when the positioning is completed, the process proceeds to step 112, and each of the first image stabilization controllers 72 is A command is given to set the stroke limit for limiting the movable range (referred to as ST1 ′) within the stroke range ST1 of the air mount 60 to the lower limit value +0.4 mm and the upper limit value +1.0 mm. Thereby, the stroke limit is set by software by the first vibration isolation controller 72, and the subsequent movable range ST1 'of each air mount 60 is limited to a range of (+0.4 mm to +1.0 mm). The stroke limit (lower limit value +0.4 mm, upper limit value +1.0 mm) is set even when each air mount 80 is at the uppermost position and the wafer table WTB is at the uppermost position. The lower surface of the front ball 91) and the wafer table WTB are set with stroke limits in a range where no interference occurs.

  In the next step 114, the Z / tilt controller 33 is instructed to start resetting the wafer table WTB (target position: ± 0 mm). As a result, the Z / tilt controller 33 starts driving the actuators of the Z / tilt driving unit 29 and starts resetting the wafer table WTB.

  In the next step 116, it waits for the positioning of the upper surface of the stage base 71 to the target position to be completed, and when the positioning is completed, the process proceeds to step 118 and the second anti-vibration controller 90 is informed of each air mount. A command is given to set the stroke limit for limiting the movable range (referred to as ST2 ′) within the 80 stroke range ST2 to the lower limit value −0.2 mm and the upper limit value +0.2 mm. As a result, the stroke limit is set in software by the second vibration isolation controller 90, and the subsequent movable range ST2 'of each air mount 80 is limited to a range of (-0.2 mm to +0.2 mm).

  In the next step 120, the process waits for the reset of the wafer table WTB to be completed. When this reset is completed, the process proceeds to step 122, where the Z / tilt controller 33 is moved within the stroke range ST3 of the wafer table WTB. A command is given to set the stroke limit for limiting (ST3 ′) to the lower limit value −0.1 mm and the upper limit value +0.1 mm. Thus, the stroke limit is set by software by the Z / tilt controller 33, and the subsequent movable range ST3 'of the wafer table WTB in the Z-axis direction is limited to a range of (-0.1 mm to +0.1 mm).

  In the next step 124, a command and a positioning command (target position: ±±) for setting the stroke limit of each air mount 60 to the lower limit value −0.2 mm and the upper limit value +0.2 mm to the first vibration isolation controller 72. 0). As a result, the first vibration-proof controller 72 positions the lower end surface of the front lens 91 to the origin (neutral point), and the stroke limit is set in software, and the movable range of each air mount 60 thereafter. ST1 ′ is limited to a range of (−0.2 mm to +0.2 mm).

  In the next step 126, the Z / tilt controller 33 is instructed to set the stroke limit of the wafer table WTB to the lower limit value −0.5 mm and the upper limit value +0.5 mm, and then the reset sequence of this routine is performed. Terminate the process.

  As a result, the Z / tilt controller 33 sets the stroke limit according to the lower limit value and the upper limit value (in this case, the stroke limit setting is canceled), and the subsequent movable range ST3 ′ of the wafer table WTB in the Z-axis direction. Is set to the stroke range ST3 (-0.5 mm to +0.5 mm).

  As a result of the above reset sequence, the final movable range of each part is as follows, as shown in FIG.

Movable range ST1 ′ of each air mount 60: −0.2 mm to +0.2 mm
Movable range ST2 ′ of each air mount 80: −0.2 mm to +0.2 mm
Wafer table WTB movable range ST3 ': -0.5 mm to +0.5 mm
As a result, the movable range of wafer table WTB that requires the widest movable range is 1 mm, and the movable range of wafer table WTB is sufficiently secured. At this time, as can be seen from FIG. 6, in the stage control device 20, each air mount 60 is at the lowest position of the movable range ST1 ′, and each air mount 80 is at the highest position of the movable range ST2 ′. In addition, even when wafer table WTB is at the uppermost position of movable range ST3 ′, each air mount 60, each air so that there is no interference between the lowermost end of projection unit PU (the lower surface of tip 91) and wafer table WTB. The stroke limits of the mount 80 and the wafer table WTB are set.

  Further, in the present embodiment, during the above-described reset sequence, the stage control device 20 once sets the stroke limit of each air mount 60 within a range where interference between the projection unit PU and the wafer table WTB does not occur, and thereafter After the stroke limits of the air mount 80 and the wafer table WTB are set, they are reset to a desired range. Therefore, as indicated by the symbol D in FIG. 5 described above, when the positions of the air mounts 60, the air mounts 80, and the wafer table WTB in the gravity direction are set to the respective origin positions unconditionally, The projection unit PU and the wafer during resetting are set in spite of the setting of the strokes of each part so that the lowermost end of the projection unit PU (the lower surface of the leading ball 91) and the wafer table WTB may interfere with each other up to 1.3 mm. Interference with the table WTB does not occur.

  In the sequence other than the reset sequence, which will be described below, as described above, when an operation command is issued from the main controller 50 to the stage controller 20, the stage controller 20 is required for each operation. Operation commands for the air mount 60, each air mount 80, and the wafer table WTB are instructed to each controller, and a stroke limit is set via each controller.

In the exposure apparatus 100 of the present embodiment, when a device is manufactured, the operation proceeds generally in the following procedure as in a normal scanner.
a. Reticle exchange (i.e. unloading of reticle from reticle stage RST and loading of reticle onto reticle stage RST (if no reticle is on reticle stage RST, simply load reticle)), b. Baseline measurement of reticle alignment and off-axis alignment system ALG is performed prior to wafer alignment at the head of the lot. A. And b. In parallel (or after a. And b.), C. Wafer exchange (that is, unloading of the exposed wafer from the wafer holder 70 and loading of the unexposed wafer onto the wafer holder 70 is performed (if there is no wafer on the wafer holder 70, the wafer is simply loaded). The lot leading wafer is placed on the wafer holder 70. Thereafter, the lot leading wafer is subjected to exposure of d.wafer alignment (for example, EGA) and e.step and scan method. When the exposure of the wafer is completed, the above operations c., D., And e. Are repeated to process the second and subsequent wafers in the lot, and the last wafer in the lot. When the processing for is completed, the operations a. And b. Above are performed, and the processing for the wafer of the next lot is started. That. In this way, processing for the wafer of the plurality lot is performed.

  A. Reticle exchange, b. Baseline measurement of reticle alignment and off-axis alignment system ALG, c. Wafer exchange, d. Wafer alignment, e. Each operation sequence of the step-and-scan exposure is not different from that of a normal scanner, and thus detailed description thereof is omitted. However, in the present embodiment, at the time of reticle alignment and exposure, the liquid supply device 131A and the liquid recovery device 131B constituting the liquid immersion device 132 are controlled by the main control device 50 as described above, and the leading ball 91 and the wafer Each operation is performed in a state in which a certain amount of water Lq (see FIG. 1) is held between W and W.

  The baseline measurement of the off-axis alignment system ALG is f. The baseline check sequence may be performed at any time other than the lot head. Further, in the exposure apparatus 100 of the present embodiment, as disclosed in, for example, Japanese Patent Laid-Open No. 5-190423 (corresponding US Pat. No. 5,502,311), the multipoint focal position detection system (42a, 42b). For adjusting the detection offset of each sensor and the offset between sensors g. A focus calibration sequence is also executed.

  Thus, in the present embodiment, in addition to the reset sequence, the a. ~ G. In these operation sequences, the lens barrel surface plate 38 and the stage base 71 need to be positioned at predetermined height positions, but an offset load or vibration is generated. Or, if transmitted, these effects need to be reduced or eliminated. Therefore, the air mounts 60 that support the lens barrel surface plate 38 and the air mounts 80 that support the stage base 71 are slightly movable so as to reduce the effects of vibrations and uneven loads acting on the respective support objects. It is desirable to set the stroke limit to allow the range. On the other hand, the wafer table WTB is relatively large during, for example, autofocusing (automatic focusing) and autoleveling that substantially matches the surface of the wafer W with the imaging surface of the projection optical system PL during scanning exposure. Need to drive. Also in the above-described focus calibration sequence, it is necessary to perform scanning movement or step movement in the Z-axis direction within a relatively large stroke range.

  Therefore, the stage control device 20 has the above a. ~ G. In the operation sequence such as, the first image stabilization controller 72, the second image stabilization controller 90, and the Z / tilt controller 33 so that the movable ranges ST1 ′, ST2 ′, ST3 ′ of the above-described parts are as follows. The stroke limit of each part is set via each.

Movable range ST1 ′ of each air mount 60: −0.1 mm to +0.1 mm
Movable range ST2 ′ of each air mount 80: −0.1 mm to +0.1 mm
Wafer table WTB movable range ST3 ′: −0.5 mm to +0.5 mm
It can be seen that the stroke limit setting (overall setting) in this case is clearly different from that during the reset sequence.

  As is apparent from the above description, in the present embodiment, the wafer W is placed on the wafer table WTB, can move along the upper surface of the stage base 71, and is also predetermined in the gravitational direction (Z-axis direction). A movable body that is movable in the stroke range ST3 is configured. Also mounted are a Z / tilt drive unit 29 for driving the wafer table WTB in the Z-axis direction, θx direction and θy direction, a Z / tilt controller 33 for controlling the Z / tilt drive unit 29, and the Z tilt drive unit 29. The XY stage 28 and the XY drive unit 31 that drives the XY stage 28 in the XY plane constitute a drive system that drives the wafer table WTB as a moving body. That is, the wafer table drive unit 27 (see FIG. 3) and the XY stage 28 constitute a drive system for the wafer table WTB.

  Further, in the present embodiment, the lens barrel surface plate 38 is moved with respect to the floor surface F so as to be movable along the direction of gravity within a predetermined stroke range by the three first vibration isolation mechanisms (first variable mechanisms) 56. It is supported while preventing vibration. Further, the stage base 71 can be moved along the direction of gravity within a predetermined stroke range by the three second vibration isolation mechanisms (second variable mechanisms) 66 through the support hardware 89A, 89B, 89C, respectively. It is supported while preventing vibration against the surface. The three first anti-vibration mechanisms 56 and the three second anti-vibration mechanisms 66, and the first anti-vibration controller 72 and the second anti-vibration controller 90 that control these are provided with an anti-vibration unit (and variable). Part).

  As described above, according to the exposure apparatus 100 of the present embodiment, the stroke limit that limits the movable range ST1 ′ in the gravity direction (Z-axis direction) of the lens barrel surface plate 38 that holds the projection unit PU as the optical system unit. Further, the stroke limit for limiting the movable range ST2 ′ in the Z-axis direction of the stage base 71 arranged below the projection unit PU and the stroke limit for limiting the movable range ST3 ′ in the Z-axis direction of the wafer table WTB are stage control. It is set by the apparatus 20 according to the sequence (the operation sequence of the exposure apparatus). That is, the stage control device 20 obtains in advance a necessary movable range of the lens barrel base plate 38 and the stage base 71 and a necessary movable range of the wafer table WTB in the gravitational direction for each sequence. The stroke limits of the lens barrel surface plate 38, the stage base 71 and the wafer table WTB are reset. During each sequence, the lens barrel surface plate 38 (air mount 60), the stage base 71 (air mount 80), and the wafer table WTB are controlled within the set stroke limit. In this case, as a result of calculating a positioning target value (target position) of any one of the lens barrel surface plate 38, the stage base 71, and the wafer table WTB, the target value is movable as defined by the set stroke limit. If it is out of range, a warning may be issued to stop the sequence.

  In this way, by resetting the stroke limit as necessary, the projection unit PU and the wafer table WTB come into contact with each other if each is driven indefinitely within each preset stroke range. Even in the case of interference, it is possible to control so as not to interfere in actual operation.

  Further, in the exposure apparatus 100 of the present embodiment, there is a possibility that an emergency situation may occur in which the air mount 60, the air mount 80, and the wafer table WTB are out of control due to, for example, an earthquake, a power failure, a stage control system error, or the like. In such a case, the above movable range cannot be maintained. In such a case, however, the stage controller 20 controls the first valve 76 constituting each first vibration isolation mechanism 56 via the first vibration isolation controller 72, and the stage controller 20 performs the first control. The second valve 94 constituting each second vibration isolation mechanism 66 via the second vibration isolation controller 90 cannot be controlled. As a result, the first valve 76 and the second valve 94, which are normally open electromagnetic valves, are opened, and the air in the gas chamber 84 of each air mount 80 and the air in the gas chamber 64 of each air mount 60 are opened. However, since the opening area of the first orifice 78 is set to be smaller than the opening area of the second orifice 95, the amount of air discharged from each gas chamber 84 per unit time is compared with that of the second orifice 95. The exhaust amount per unit time of the air in each gas chamber 64 is smaller. Accordingly, the lowering speed of the lens barrel surface plate 38 is slower than the lowering speed of the stage base 71, and it is possible to reliably prevent the lower end of the front lens 91 of the projection unit PU from coming into contact with the wafer table WTB. Yes. When each air mount 80 is at the lowest position in the stroke range and each air mount 60 is at the lowest position in the stroke range, even if the wafer table WTB is at the highest position in the stroke range, the projection unit There is no interference between the lower end of the PU ball 91 and the wafer table WTB (see FIG. 5).

  Further, according to the exposure apparatus 100 of the present embodiment, exposure (immersion exposure) is performed in a state where water (liquid) is supplied between the projection optical system PL and the wafer W on the wafer table WTB by the immersion apparatus 132. Is done. Therefore, by performing exposure with a high resolution and a greater depth of focus than in the air, the pattern of the reticle R can be accurately transferred onto the wafer. For example, a fine pattern of about 70 to 100 nm can be transferred as a device rule. Can be realized.

  In the above embodiment, the a. ~ G. In the operation sequence, all stroke limits are set to be the same in all sequences. However, the present invention is not limited to this, and at least one stroke of each air mount 60, each air mount 80, and wafer table WTB is not limited to this. Limit settings may be different.

  Further, the stage control device 20 sets the stroke limit described above when the device is in operation, for example, and it is not necessary to precisely position the air mounts 60 and 80 when the device is not in operation, so the movable range ST1 Since ', ST2' is expanded and the wafer table WTB does not operate, the movable range ST3 'of the wafer table WTB is narrowed accordingly, and each stroke limit is set so that each becomes the following movable range. You may do it.

Movable range ST1 ′ of each air mount 60: −0.3 mm to +0.3 mm
Movable range ST2 ′ of each air mount 80: −0.3 mm to +0.3 mm
Wafer table WTB movable range ST3 ': -0.3 mm to +0.3 mm
In this case, the stage control apparatus 20 sets all the stroke limits of the air mounts 60, the air mounts 80, and the wafer table WTB to values different from those when the apparatus is in operation when the apparatus is not in operation. Not limited to this, one or two of the stroke limits of each air mount 60, each air mount 80, and wafer table WTB may be set to a value different from that during operation of the apparatus.

  Further, regardless of the program executed by the main controller 50, the operator designates the stage stop coordinates and moves the wafer stage WST to an arbitrary position, or uses a joystick provided at the operation desk or the like. When the wafer stage WST is moved to a position or during manual operation, the movable range ST1 ′ is determined after positioning the wafer table WTB near the lowest point (for example, a position of −0.4 mm) at least during the movement of the wafer stage WST. Each stroke limit may be set so that .about.ST3 'is as follows.

Movable range ST1 ′ of each air mount 60: −0.2 mm to +0.2 mm
Movable range ST2 ′ of each air mount 80: −0.2 mm to +0.2 mm
Wafer table WTB movable range ST3 ′: −0.5 mm to −0.3 mm
In this way, even when wafer table WTB is greatly inclined, it is more certain that a situation in which projection unit PU (front lens 91) interferes with wafer table WTB will occur during movement of wafer stage WST. Can be avoided.

  As an emergency measure, in the exposure apparatus of the above embodiment, for example, as shown in FIG. ), An end of each first valve 76 opposite to the housing 61 may be connected to a pressurized gas supply source, for example, a compressed air tank 96. In this case as well, the first and second valves 76 and 94 are closed by the first anti-vibration controller 72 and the second anti-vibration controller 90 in normal times, as described above. In this way, when the first valve 76 and the second valve 94, which are normally open electromagnetic valves, are opened in an emergency, the air in the gas chamber 84 of each air mount 80 is exhausted to the atmosphere. However, the pressurized air from the compressed air tank 96 flows into the gas chamber 64 of each air mount 60. As a result, the stage base 71 is lowered while the lens barrel surface plate 38 is raised, so that it is possible to more reliably avoid the interference between the projection unit PU and the wafer table WTB.

  In the above-described embodiment, the anti-vibration is supported while the anti-vibration is supported with respect to the floor F so that both the lens barrel surface plate 38 and the stage base 71 can move along the direction of gravity within a predetermined stroke range. The exposure apparatus 100 includes a stroke limit for limiting the movable range ST3 ′ within the stroke range ST3 of the wafer table WTB, and the movable range ST1 ′ within the stroke range ST1 of the lens barrel base plate 38. The case where the stroke limit that limits the stroke limit and the stroke limit that limits the movable range ST2 ′ within the stroke range ST2 of the stage base 71 are set according to the sequence has been described. However, it goes without saying that the present invention is not limited to this. That is, the exposure apparatus of the present invention includes a holding member (in the above embodiment, the lens base plate 38 corresponds to this) and a base (which holds the optical unit (in the above embodiment, the projection unit PU corresponds to this)) and a base ( In the above-described embodiment, there is provided an anti-vibration part that supports at least one of the stage base 71 and the floor surface while being anti-vibrated with respect to the floor so that the stage base 71 can move along the direction of gravity within a predetermined stroke range. A drive system that drives a movable body (wafer table WTB corresponds to this in the above embodiment) and a control device that controls the vibration isolator (stage control device 20 corresponds to this in the above embodiment) What is necessary is just to set the stroke limit of the said mobile body and the stroke limit of the said holding member and the said base according to a sequence. Even in such a case, the control device obtains the necessary movable range of at least one of the holding member and the base and the necessary movable range of the moving body in the gravitational direction in advance for each sequence. By resetting at least one of the holding member and the base and the stroke limit of the moving body, it is possible to control the optical system unit and the moving body so that they do not contact and interfere with each other.

  In the above-described embodiment, each first air mount 60 is at the lowest position in the stroke range ST1, and each second air mount 80 and wafer table WTB are at the highest position in the respective stroke ranges ST2, ST3. The description has been given of the case where the stroke ranges of the first air mount, the second air mount, and the wafer table WTB are set so that the lowermost part of the projection unit PU and the wafer table WTB interfere with each other. The present invention is not limited to this. For example, in the exposure apparatus of the present invention, when each of the first air mount, the second air mount, and the moving body moves within the predetermined stroke range, at least the predetermined stroke range of the first air mount. The stroke ranges of the first air mount, the second air mount, and the moving body may be set so that the lowermost part of the optical system unit and the moving body interfere with each other in a part of the range.

  In the above-described embodiment, the case where the wafer table WTB placed on the XY stage via the Z / tilt driving unit 29 constitutes a moving body has been described. Of course, in the case of a single stage capable of micro-driving at least in the Z-axis direction in addition to the two-dimensional movement in the X-axis and Y-axis directions, the stage itself may constitute a moving body. is there.

  In the above embodiment, the case where the projection unit PU constitutes an optical system unit and the lower surface of the front lens 91 is a member at the lowest end of the projection unit PU held by the lens barrel surface plate 38 as a holding member will be described. However, there are cases where the prisms constituting the multi-point AF system described above are provided in the lens barrel of the projection unit PU, and in such a case, the optical system unit including such prisms etc. The prism may be the lowermost part of the member held by the lens barrel surface plate 38. Alternatively, the liquid supply nozzle 51A or the liquid recovery nozzle 51B held on the lens barrel base plate 38 may be the lowermost part of the member held on the lens barrel base plate 38 facing the wafer table WTB. That is, the member at the lowermost end of the member held on the lens barrel base plate 38 is not limited to the front end 91 of the projection unit PU, and the lowermost part of the member held by the lens barrel base plate 38 and facing the wafer table WTB. Anything can be used.

  Moreover, although the said embodiment demonstrated the case where each stroke limit of each 1st air mount 60, each 2nd air mount 80, and wafer table WTB was set according to a sequence, this invention is described. It is not limited to this. For example, the wafer table WTB, the first air mounts 60, and the second air mounts are arranged according to the positional relationship so that the wafer table WTB does not interfere with the lowermost portion of the projection unit PU even during the sequence. 80 may be controlled. That is, in the exposure apparatus of the present invention, members (for example, the projection unit PU and the liquid supply nozzle described above) that are disposed above the movable body (for example, the above-described wafer table WTB corresponds to this) and are opposed to the movable body. 51A, the liquid recovery nozzle 51B, etc.) and the base (for example, the above-mentioned stage base 71 corresponds to this) that movably supports the moving body, the variable part (for example, the above-mentioned vibration isolating part corresponds to this) The member and the base are closest to each other within the predetermined stroke range of the variable portion, and the moving body is at the highest position (uppermost position) of the predetermined stroke range. Sometimes, when the lowermost part of the member interferes with the moving body, the control device (for example, the above-described stage control device 20 corresponds to this) The interference may be controlled at least one of the drive system and the variable portion so as not to occur. This can also prevent interference (collision) between the moving body and the member.

In the embodiment described above, ultrapure water (water) is used as the liquid, but the present invention is not limited to this. As the liquid, a safe liquid that is chemically stable and has a high transmittance of the illumination light IL, such as a fluorine-based inert liquid, may be used. As this fluorinated inert liquid, for example, Fluorinert (trade name of 3M, USA) can be used. This fluorine-based inert liquid is also excellent in terms of cooling effect. In addition, a liquid that is transmissive to the illumination light IL and has a refractive index as high as possible, and that is stable with respect to the projection optical system and the photoresist applied to the wafer surface (for example, cedar oil) is used. You can also. When an F ₂ laser is used as the light source, a fluorine-based liquid (for example, fomblin oil) can be used as the liquid.

  In the above embodiment, the recovered liquid may be reused. In this case, it is desirable to provide a filter for removing impurities from the recovered liquid in the liquid recovery device or the recovery pipe. .

  In the above embodiment, the optical element closest to the image plane of the projection optical system PL is the front lens 91. However, the optical element is not limited to the lens, and the optical characteristics of the projection optical system PL For example, it may be an optical plate (parallel plane plate or the like) used for adjusting aberrations (spherical aberration, coma aberration, etc.) or a simple cover glass. The optical element closest to the image plane of the projection optical system PL (the front lens 91 in the above embodiment) is a liquid (above-mentioned) due to scattering particles generated from the resist by irradiation of the illumination light IL or adhesion of impurities in the liquid. In the embodiment, the surface may be contaminated by contact with water. For this reason, the optical element may be fixed to the lowermost part of the lens barrel 40 so as to be detachable (replaceable), and may be periodically replaced.

  In such a case, if the optical element in contact with the liquid is a lens, the cost of the replacement part is high and the time required for the replacement becomes long, leading to an increase in maintenance cost (running cost) and a decrease in throughput. . Therefore, the optical element that comes into contact with the liquid may be a plane parallel plate that is cheaper than the lens 91, for example.

  In the above embodiment, the range in which the liquid (water) flows may be set so as to cover the entire projection area of the reticle pattern image (the irradiation area of the illumination light IL), and the size thereof may be arbitrary. However, in controlling the flow rate, flow rate, etc., it is desirable to make the range as small as possible by making it slightly larger than the irradiation region.

  In the above-described embodiment, the case where the present invention is applied to a scanning exposure apparatus such as a step-and-scan method has been described, but it is needless to say that the scope of the present invention is not limited to this. That is, the present invention can be applied to a step-and-repeat projection exposure apparatus, a step-and-stitch exposure apparatus, or a proximity exposure apparatus.

  The use of the exposure apparatus is not limited to the exposure apparatus for semiconductor manufacturing, but for example, an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern to a square glass plate, an organic EL, a thin film magnetic head, an image sensor (CCD, etc.), micromachines, DNA chips and the like can also be widely applied to exposure apparatuses. Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates or silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

The light source of the exposure apparatus of each of the above embodiments is not limited to an ArF excimer laser light source, but a pulse laser light source such as a KrF excimer laser light source or an F ₂ laser light source, g-line (wavelength 436 nm), i-line (wavelength 365 nm). It is also possible to use an ultra-high pressure mercury lamp that emits such bright lines.

  In addition, a single wavelength laser beam oscillated from a DFB semiconductor laser or fiber laser is amplified by, for example, a fiber amplifier doped with erbium (or both erbium and ytterbium), and a nonlinear optical crystal is obtained. It is also possible to use harmonics that have been converted into ultraviolet light. The magnification of the projection optical system may be not only a reduction system but also an equal magnification or an enlargement system.

  In the above embodiment, it is needless to say that the illumination light IL of the exposure apparatus is not limited to light having a wavelength of 100 nm or more, and light having a wavelength of less than 100 nm may be used. For example, in recent years, in order to expose a pattern of 70 nm or less, EUV (Extreme Ultraviolet) light in a soft X-ray region (for example, a wavelength region of 5 to 15 nm) is generated using an SOR or a plasma laser as a light source, and its exposure wavelength Development of an EUV exposure apparatus using an all-reflection reduction optical system designed under (for example, 13.5 nm) and a reflective mask is underway. In this apparatus, a configuration in which scanning exposure is performed by synchronously scanning a mask and a wafer using arc illumination is conceivable.

  The present invention can also be applied to an exposure apparatus that uses a charged particle beam such as an electron beam or an ion beam. The electron beam exposure apparatus may be any of a pencil beam method, a variable shaped beam method, a cell projection method, a blanking aperture array method, and a mask projection method. For example, in an exposure apparatus using an electron beam, an optical system including an electromagnetic lens is used. This optical system constitutes an exposure optical system, and an optical system unit including a lens barrel of the exposure optical system is provided. Composed.

  The pattern transfer characteristics of a semiconductor device are adjusted by a step of designing the function / performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and the adjustment method described above. The exposure apparatus according to the embodiment is manufactured through a lithography step for transferring a pattern formed on a mask onto a photosensitive object, a device assembly step (including a dicing process, a bonding process, and a packaging process), an inspection step, and the like.

  The exposure apparatus of the present invention is suitable for manufacturing micro devices such as semiconductor elements and liquid crystal display elements.

It is a figure which shows schematic structure of the exposure apparatus 100 of one Embodiment. FIG. 2 is a partial cross-sectional view showing components in the vicinity of one end of the lens barrel surface plate in FIG. 1 and in the vicinity of one end of a base. FIG. 2 is a block diagram showing a main part of a control system of the exposure apparatus in FIG. 1. It is a flowchart which shows the processing algorithm of the stage control apparatus at the time of a reset sequence. It is a figure which shows the stroke range of a 1st air mount, a 2nd air mount, and a wafer table. It is a figure which shows each movable range of the 1st air mount, the 2nd air mount, and a wafer table after completion | finish of a reset sequence. It is a figure which shows a modification.

Explanation of symbols

20... Stage control device (control device) 28... XY stage (part of the drive system) 29... Z / tilt drive part (part of the drive system) 31 ... XY drive part (part of the drive system) 33... Z / tilt controller (part of drive system), 38... Lens barrel surface plate (holding member), 56... First vibration isolation mechanism (part of vibration isolation unit), 60. 66 ... second vibration isolation mechanism (part of the vibration isolation part), 71 ... base, 72 ... first vibration isolation controller (part of the vibration isolation part, first adjustment part), 76 ... first valve 78 ... first orifice, 80 ... second air mount, 90 ... second anti-vibration controller (part of the anti-vibration unit, second adjusting unit), 94 ... second valve, 95 ... second 96 ... compressed air tank (pressurized gas supply source), 100 ... exposure apparatus, 132 ... immersion apparatus, IL ... illumination light (energy) Gibimu), W ... wafer (photosensitive object), PU ... projection unit (optical system unit), PL ... projection optical system (exposure optical system), F ... floor, WTB ... wafer table (mobile).

Claims (18)

An exposure apparatus that exposes a photosensitive object with an energy beam to form a predetermined pattern on the photosensitive object,
An optical system unit including an exposure optical system for irradiating the photosensitive object with the energy beam;
A holding member for holding the optical system unit;
Independent of the holding member, a base disposed below the optical system unit and having an upper surface substantially parallel to the floor surface;
A movable body on which the photosensitive object is mounted, movable along the upper surface of the base, and movable in a predetermined stroke range in the direction of gravity;
A drive system for driving the movable body;
An anti-vibration part that supports at least one of the holding member and the base while being anti-vibrated with respect to the floor surface so as to be movable in the direction of gravity within a predetermined stroke range;
A stroke limit for controlling the drive system and the vibration isolator, and limiting a movable range of the movable body within the predetermined stroke range, and at least one of the predetermined range of the holding member and the base. An exposure apparatus comprising: a control device that sets a stroke limit that limits a movable range according to a sequence.   The vibration isolator is capable of changing a height of the holding member from the floor surface within a predetermined stroke range and a height of the base from the floor surface within a predetermined stroke range. In accordance with an instruction from the second air mount and the control device, stroke limits for limiting the movable ranges of the first and second air mounts are set, respectively, and the first and second air mounts are set. The exposure apparatus according to claim 1, further comprising first and second adjustment units that respectively adjust the internal pressure of the first and second adjustment units.   When the first air mount is at the lowest position in the stroke range and the second air mount is at the lowest position in the stroke range, a member that is held by the holding member and faces the moving body; The exposure apparatus according to claim 2, wherein stroke ranges of the first air mount, the second air mount, and the moving body are set so as not to interfere with the moving body.   When the first air mount is at the lowest position in the stroke range, and the second air mount and the movable body are at the highest position in the respective stroke ranges, the first air mount is held by the holding member and faces the movable body. The stroke range of each of the first air mount, the second air mount, and the moving body is set so that the lowermost part of the member to be interfered with the moving body. The exposure apparatus described.   When each of the first air mount, the second air mount, and the moving body moves within a predetermined stroke range, at least within a range of the predetermined stroke range of the first air mount. The stroke range of each of the first air mount, the second air mount, and the moving body is such that the moving body interferes with the lowermost part of the member that is held by the holding member and faces the moving body. The exposure apparatus according to claim 3, wherein the exposure apparatus is set.   In the control device, the first air mount is at the lowest position of the movable range within the stroke range, and the second air mount and the movable body are at the highest position of the movable range within the respective stroke ranges. The stroke limit of each of the first air mount, the second air mount, and the moving body is set so that interference between the moving body and the member that is held by the holding member and faces the moving body does not occur. The exposure apparatus according to claim 3, wherein the exposure apparatus is set.   The control device includes the first air mount during a reset sequence for setting the positions of the first and second air mounts and the moving body in the direction of gravity to the respective origin positions, and during other sequences. The exposure apparatus according to claim 4, wherein at least one setting of a stroke limit of each of the second air mount and the moving body is changed.   8. The control device according to claim 7, wherein the control device starts initial setting of each stroke limit in the order of the first air mount, the second air mount, and the moving body during the reset sequence. The exposure apparatus described.   In the reset sequence, the control device temporarily sets the stroke limit of the first air mount within a range in which interference between the movable body held by the holding member and the member facing the movable body does not occur, 9. The exposure apparatus according to claim 7, wherein after the strokes of the second air mount and the movable body are set thereafter, the exposure range is reset to a desired range. A normally open first valve having one end connected to the first air mount;
A first orifice having one end connected to the other end of the first valve and the other end open to the atmosphere;
A normally open second valve having one end connected to the second air mount;
A second orifice having one end connected to the other end of the second valve, the other end being open to the atmosphere and having a larger opening area than the first orifice;
The exposure apparatus according to any one of claims 3 to 9, wherein the first and second valves are closed by the first and second adjustment units in normal operation. A normally open type first valve having one end connected to the first air mount and the other end connected to a source of pressurized gas;
A normally open second valve having one end connected to the second air mount and the other end open to the atmosphere;
The exposure apparatus according to any one of claims 3 to 9, wherein the first and second valves are closed by the first and second adjustment units in normal operation.   The control device sets at least one of the strokes of the first air mount, the second air mount, and the movable body to a value different from that when the device is in operation when the device is not in operation. The exposure apparatus according to any one of claims 2 to 11, wherein the exposure apparatus is characterized.   The exposure apparatus according to claim 1, further comprising a liquid immersion apparatus that supplies a liquid between the exposure optical system and the photosensitive object on the moving body. An exposure apparatus that exposes a photosensitive object with an energy beam from an exposure optical system and forms a predetermined pattern on the photosensitive object,
A movable body that holds the photosensitive object and is movable in a horizontal plane and movable in a predetermined stroke range in the direction of gravity;
A base having a substantially horizontal upper surface and movably supporting the movable body on the upper surface;
A drive system for driving the movable body;
A member disposed above the movable body and provided to face the movable body;
A variable portion that changes a distance in a direction along the direction of gravity between the member and the base within a predetermined stroke range;
A control device for controlling the drive system and the variable unit;
When the member and the base are closest to each other within a predetermined stroke range of the variable portion and the moving body is at the highest position within the predetermined stroke range, the lowermost portion of the member and the moving body interfere with each other. In
The exposure apparatus is characterized in that the control device controls at least one of the drive system and the variable portion so that interference between the member and the moving body does not occur.   15. The exposure according to claim 14, wherein the variable portion includes a first variable mechanism and a second variable mechanism that individually support the member and the base so as to be movable along the direction of gravity. apparatus.   The said control apparatus sets the stroke limit which each restrict | limits the movable range in the stroke range of the said mobile body, and the movable range in the stroke range of the said member and the said base according to an operation sequence. The exposure apparatus according to 14 or 15.   The exposure apparatus according to claim 14, wherein the member includes the exposure optical system. An immersion device for supplying a liquid that transmits the energy beam between the exposure optical system and the photosensitive object;
The exposure apparatus according to claim 14, wherein the member includes at least a part of the liquid immersion apparatus.

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