JP2002190488A5 - - Google Patents

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Publication number
JP2002190488A5
JP2002190488A5 JP2000387825A JP2000387825A JP2002190488A5 JP 2002190488 A5 JP2002190488 A5 JP 2002190488A5 JP 2000387825 A JP2000387825 A JP 2000387825A JP 2000387825 A JP2000387825 A JP 2000387825A JP 2002190488 A5 JP2002190488 A5 JP 2002190488A5
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JP
Japan
Prior art keywords
semiconductor device
manufacturing
substrate
mold
pattern
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Application number
JP2000387825A
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English (en)
Japanese (ja)
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JP2002190488A (ja
JP3619773B2 (ja
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Publication date
Priority claimed from JP2000387825A external-priority patent/JP3619773B2/ja
Priority to JP2000387825A priority Critical patent/JP3619773B2/ja
Application filed filed Critical
Priority to SG200107100A priority patent/SG92821A1/en
Priority to US09/987,532 priority patent/US6596561B2/en
Priority to TW090128724A priority patent/TW526598B/zh
Priority to KR1020010081051A priority patent/KR100551641B1/ko
Priority to CNB011338032A priority patent/CN1230882C/zh
Publication of JP2002190488A publication Critical patent/JP2002190488A/ja
Priority to US10/453,606 priority patent/US6723583B2/en
Priority to US10/784,276 priority patent/US6872597B2/en
Priority to US11/047,660 priority patent/US7015069B2/en
Publication of JP3619773B2 publication Critical patent/JP3619773B2/ja
Application granted granted Critical
Publication of JP2002190488A5 publication Critical patent/JP2002190488A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000387825A 2000-12-20 2000-12-20 半導体装置の製造方法 Expired - Lifetime JP3619773B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000387825A JP3619773B2 (ja) 2000-12-20 2000-12-20 半導体装置の製造方法
SG200107100A SG92821A1 (en) 2000-12-20 2001-11-13 A method of manufacturing a semiconductor device and a semiconductor device
US09/987,532 US6596561B2 (en) 2000-12-20 2001-11-15 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture
TW090128724A TW526598B (en) 2000-12-20 2001-11-20 Manufacturing method of semiconductor device and semiconductor device
KR1020010081051A KR100551641B1 (ko) 2000-12-20 2001-12-19 반도체 장치의 제조 방법 및 반도체 장치
CNB011338032A CN1230882C (zh) 2000-12-20 2001-12-20 一种半导体器件的制造方法和一种半导体器件
US10/453,606 US6723583B2 (en) 2000-12-20 2003-06-04 Method of manufacturing a semiconductor device using a mold
US10/784,276 US6872597B2 (en) 2000-12-20 2004-02-24 Method of manufacturing a semiconductor device and a semiconductor device
US11/047,660 US7015069B2 (en) 2000-12-20 2005-02-02 Method of manufacturing a semiconductor device and a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000387825A JP3619773B2 (ja) 2000-12-20 2000-12-20 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004069427A Division JP2004172647A (ja) 2004-03-11 2004-03-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2002190488A JP2002190488A (ja) 2002-07-05
JP3619773B2 JP3619773B2 (ja) 2005-02-16
JP2002190488A5 true JP2002190488A5 (enExample) 2005-02-17

Family

ID=18854673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000387825A Expired - Lifetime JP3619773B2 (ja) 2000-12-20 2000-12-20 半導体装置の製造方法

Country Status (6)

Country Link
US (4) US6596561B2 (enExample)
JP (1) JP3619773B2 (enExample)
KR (1) KR100551641B1 (enExample)
CN (1) CN1230882C (enExample)
SG (1) SG92821A1 (enExample)
TW (1) TW526598B (enExample)

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154658A (ja) * 1997-07-30 1999-02-26 Hitachi Ltd 半導体装置及びその製造方法並びにフレーム構造体
KR100556240B1 (ko) * 1998-07-28 2006-03-03 세이코 엡슨 가부시키가이샤 반도체 장치 제조방법
JP4586316B2 (ja) * 2001-08-21 2010-11-24 日本テキサス・インスツルメンツ株式会社 半導体チップ搭載用基板及びそれを用いた半導体装置
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
AU2003234812A1 (en) 2002-06-05 2003-12-22 Hitachi Ulsi Systems Co., Ltd. Semiconductor device
JP3812500B2 (ja) * 2002-06-20 2006-08-23 セイコーエプソン株式会社 半導体装置とその製造方法、電気光学装置、電子機器
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
AU2003255956A1 (en) * 2002-08-05 2004-02-25 Koninklijke Philips Electronics N.V. Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method
US7064426B2 (en) * 2002-09-17 2006-06-20 Chippac, Inc. Semiconductor multi-package module having wire bond interconnect between stacked packages
US20040061213A1 (en) * 2002-09-17 2004-04-01 Chippac, Inc. Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
US7049691B2 (en) * 2002-10-08 2006-05-23 Chippac, Inc. Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
JP4607429B2 (ja) 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4796271B2 (ja) * 2003-07-10 2011-10-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20050047106A1 (en) * 2003-08-29 2005-03-03 Martino Peter Miguel Substrate reinforcing in an LGA package
TWI222186B (en) * 2003-09-04 2004-10-11 Advanced Semiconductor Eng Method for manufacturing package substrate strip and structure from the same
JP2005116762A (ja) * 2003-10-07 2005-04-28 Fujitsu Ltd 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造
JP2005150350A (ja) * 2003-11-14 2005-06-09 Renesas Technology Corp 半導体装置の製造方法
JP4488733B2 (ja) * 2003-12-24 2010-06-23 三洋電機株式会社 回路基板の製造方法および混成集積回路装置の製造方法。
JP2006073586A (ja) * 2004-08-31 2006-03-16 Renesas Technology Corp 半導体装置の製造方法
US7791180B2 (en) * 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
US7595548B2 (en) * 2004-10-08 2009-09-29 Yamaha Corporation Physical quantity sensor and manufacturing method therefor
CN100416807C (zh) * 2004-10-20 2008-09-03 力晶半导体股份有限公司 半导体封装结构及其制造方法
JP2006190771A (ja) 2005-01-05 2006-07-20 Renesas Technology Corp 半導体装置
DE102005002862A1 (de) * 2005-01-20 2006-07-27 Infineon Technologies Ag Vefahren zur Herstellung eines FBGA-Bauelementes und Substrat zur Durchführung des Verfahrens
TWI283050B (en) * 2005-02-04 2007-06-21 Phoenix Prec Technology Corp Substrate structure embedded method with semiconductor chip and the method for making the same
JP2006269486A (ja) * 2005-03-22 2006-10-05 Renesas Technology Corp 半導体装置の製造方法
US8461675B2 (en) * 2005-12-13 2013-06-11 Sandisk Technologies Inc. Substrate panel with plating bar structured to allow minimum kerf width
JP4741383B2 (ja) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 電子部品の樹脂封止方法
US20070269929A1 (en) * 2006-05-17 2007-11-22 Chih-Chin Liao Method of reducing stress on a semiconductor die with a distributed plating pattern
WO2007136651A2 (en) * 2006-05-17 2007-11-29 Sandisk Corporation Semiconductor device with a distributed plating pattern
US20070267759A1 (en) * 2006-05-17 2007-11-22 Chih-Chin Liao Semiconductor device with a distributed plating pattern
JP2007335581A (ja) * 2006-06-14 2007-12-27 Renesas Technology Corp 半導体装置の製造方法
JP2008004855A (ja) * 2006-06-26 2008-01-10 Nitto Denko Corp Ｔａｂ用テープキャリア
JP2008016630A (ja) * 2006-07-06 2008-01-24 Matsushita Electric Ind Co Ltd プリント配線板およびその製造方法
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2008047573A (ja) * 2006-08-11 2008-02-28 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置の製造装置、樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置
US20080036078A1 (en) * 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
JP5037071B2 (ja) * 2006-08-29 2012-09-26 新光電気工業株式会社 樹脂封止型半導体装置の製造方法
US7616451B2 (en) * 2006-10-13 2009-11-10 Stmicroelectronics S.R.L. Semiconductor package substrate and method, in particular for MEMS devices
DE102006058010B9 (de) * 2006-12-08 2009-06-10 Infineon Technologies Ag Halbleiterbauelement mit Hohlraumstruktur und Herstellungsverfahren
DE102006062473A1 (de) * 2006-12-28 2008-07-03 Qimonda Ag Halbleiterbauelement mit auf einem Substrat montiertem Chip
KR100849792B1 (ko) * 2007-04-23 2008-07-31 삼성전기주식회사 칩 부품의 제조방법
US8637972B2 (en) * 2007-06-08 2014-01-28 Sandisk Technologies Inc. Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel
KR100878194B1 (ko) * 2007-07-20 2009-01-13 세크론 주식회사 반도체 몰딩 장치
JP4659802B2 (ja) * 2007-09-25 2011-03-30 シャープ株式会社 絶縁性配線基板、これを用いた半導体パッケージ、および絶縁性配線基板の製造方法
KR100876899B1 (ko) * 2007-10-10 2009-01-07 주식회사 하이닉스반도체 반도체 패키지
US9117714B2 (en) * 2007-10-19 2015-08-25 Visera Technologies Company Limited Wafer level package and mask for fabricating the same
KR100931295B1 (ko) * 2008-01-24 2009-12-11 세크론 주식회사 전자 부품 몰딩 장치 및 전자 부품 몰딩 방법
JP2009206429A (ja) * 2008-02-29 2009-09-10 Toshiba Corp 記憶媒体
US20090224412A1 (en) * 2008-03-04 2009-09-10 Powertech Technology Corporation Non-planar substrate strip and semiconductor packaging method utilizing the substrate strip
US8217514B2 (en) * 2008-04-07 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with warpage control system and method of manufacture thereof
JP5203045B2 (ja) * 2008-05-28 2013-06-05 日本特殊陶業株式会社 多層配線基板の中間製品、多層配線基板の製造方法
KR100882108B1 (ko) * 2008-06-02 2009-02-06 삼성전기주식회사 칩 부품의 제조방법
CN101621894B (zh) * 2008-07-04 2011-12-21 富葵精密组件(深圳)有限公司 电路板组装方法及电路板预制品
JP2010021275A (ja) * 2008-07-09 2010-01-28 Mitsubishi Electric Corp 半導体装置の製造方法
JP2010093109A (ja) * 2008-10-09 2010-04-22 Renesas Technology Corp 半導体装置、半導体装置の製造方法および半導体モジュールの製造方法
US8568961B2 (en) * 2008-11-25 2013-10-29 Lord Corporation Methods for protecting a die surface with photocurable materials
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
US7851266B2 (en) * 2008-11-26 2010-12-14 Micron Technologies, Inc. Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
JP2010135418A (ja) * 2008-12-02 2010-06-17 Shinko Electric Ind Co Ltd 配線基板及び電子部品装置
TWI384603B (zh) 2009-02-17 2013-02-01 Advanced Semiconductor Eng 基板結構及應用其之封裝結構
JP5985136B2 (ja) 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
FR2943849B1 (fr) * 2009-03-31 2011-08-26 St Microelectronics Grenoble 2 Procede de realisation de boitiers semi-conducteurs et boitier semi-conducteur
JP5119484B2 (ja) * 2009-06-18 2013-01-16 三洋電機株式会社 実装基板およびそれを用いた半導体装置
KR101037450B1 (ko) * 2009-09-23 2011-05-26 삼성전기주식회사 패키지 기판
KR101101669B1 (ko) * 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
EP2330618A1 (en) * 2009-12-04 2011-06-08 STMicroelectronics (Grenoble 2) SAS Rebuilt wafer assembly
JP5503466B2 (ja) * 2010-08-31 2014-05-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5666211B2 (ja) * 2010-09-01 2015-02-12 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 配線基板及び半導体装置の製造方法
US8456021B2 (en) * 2010-11-24 2013-06-04 Texas Instruments Incorporated Integrated circuit device having die bonded to the polymer side of a polymer substrate
US8759153B2 (en) * 2011-09-06 2014-06-24 Infineon Technologies Ag Method for making a sensor device using a graphene layer
US8373269B1 (en) * 2011-09-08 2013-02-12 Taiwan Semiconductor Manufacturing Company, Ltd. Jigs with controlled spacing for bonding dies onto package substrates
JP5885332B2 (ja) 2011-10-20 2016-03-15 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20130071792A (ko) * 2011-12-21 2013-07-01 삼성전자주식회사 Ｍｕｆ용 ｐｃｂ 및 그 ｐｃｂ 몰딩 구조
KR101922191B1 (ko) * 2012-03-02 2019-02-20 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP6217101B2 (ja) * 2013-03-22 2017-10-25 富士電機株式会社 半導体装置の製造方法及び取り付け治具
US10405434B2 (en) 2013-03-22 2019-09-03 Fuji Electric Co., Ltd. Mounting jig for semiconductor device
US9082885B2 (en) 2013-05-30 2015-07-14 Samsung Electronics Co., Ltd. Semiconductor chip bonding apparatus and method of forming semiconductor device using the same
JP6044473B2 (ja) * 2013-06-28 2016-12-14 株式会社デンソー 電子装置およびその電子装置の製造方法
US9449943B2 (en) * 2013-10-29 2016-09-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
KR20150062556A (ko) * 2013-11-29 2015-06-08 삼성전기주식회사 휨방지 부재가 구비된 스트립 레벨 기판 및 이의 제조 방법
US9397051B2 (en) 2013-12-03 2016-07-19 Invensas Corporation Warpage reduction in structures with electrical circuitry
JP6194804B2 (ja) * 2014-01-23 2017-09-13 株式会社デンソー モールドパッケージ
KR102214512B1 (ko) * 2014-07-04 2021-02-09 삼성전자 주식회사 인쇄회로기판 및 이를 이용한 반도체 패키지
US9711552B2 (en) 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US10043769B2 (en) * 2015-06-03 2018-08-07 Micron Technology, Inc. Semiconductor devices including dummy chips
US20180166356A1 (en) * 2016-12-13 2018-06-14 Globalfoundries Inc. Fan-out circuit packaging with integrated lid
CN108738366B (zh) * 2017-02-20 2022-03-15 新电元工业株式会社 电子装置
KR102696423B1 (ko) * 2019-08-14 2024-08-20 삼성전자주식회사 반도체 장치
US11469149B2 (en) * 2019-11-15 2022-10-11 Semtech Corporation Semiconductor device and method of forming mold degating structure for pre-molded substrate

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW344109B (en) * 1994-02-10 1998-11-01 Hitachi Ltd Methods of making semiconductor devices
JP2531382B2 (ja) 1994-05-26 1996-09-04 日本電気株式会社 ボ―ルグリッドアレイ半導体装置およびその製造方法
JP3066251B2 (ja) * 1994-08-05 2000-07-17 シャープ株式会社 プリント配線基板
JP3214788B2 (ja) * 1994-11-21 2001-10-02 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
MY118036A (en) * 1996-01-22 2004-08-30 Lintec Corp Wafer dicing/bonding sheet and process for producing semiconductor device
CN100428449C (zh) * 1996-07-12 2008-10-22 富士通株式会社 半导体装置
US5776798A (en) 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
JPH10244556A (ja) 1997-03-06 1998-09-14 Sony Corp 半導体パッケージの製造方法
JPH10256286A (ja) 1997-03-07 1998-09-25 Nkk Corp 半導体装置の製造方法
JP2971834B2 (ja) 1997-06-27 1999-11-08 松下電子工業株式会社 樹脂封止型半導体装置の製造方法
US5904502A (en) * 1997-09-04 1999-05-18 International Business Machines Corporation Multiple 3-dimensional semiconductor device processing method and apparatus
JP3601985B2 (ja) * 1998-10-30 2004-12-15 富士通株式会社 半導体パッケージの製造方法
US6448650B1 (en) * 1998-05-18 2002-09-10 Texas Instruments Incorporated Fine pitch system and method for reinforcing bond pads in semiconductor devices
JP2000156435A (ja) * 1998-06-22 2000-06-06 Fujitsu Ltd 半導体装置及びその製造方法
JP3127889B2 (ja) 1998-06-25 2001-01-29 日本電気株式会社 半導体パッケージの製造方法およびその成形用金型
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
US6479887B1 (en) * 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
JP4234244B2 (ja) * 1998-12-28 2009-03-04 富士通マイクロエレクトロニクス株式会社 ウエハーレベルパッケージ及びウエハーレベルパッケージを用いた半導体装置の製造方法
JP2000223608A (ja) * 1999-01-29 2000-08-11 Nec Corp 半導体パッケージ及びその製造方法
JP2000228566A (ja) * 1999-02-04 2000-08-15 Matsushita Electric Ind Co Ltd 集合プリント配線板
SG92685A1 (en) * 1999-03-10 2002-11-19 Towa Corp Method of coating semiconductor wafer with resin and mold used therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
US6245595B1 (en) * 1999-07-22 2001-06-12 National Semiconductor Corporation Techniques for wafer level molding of underfill encapsulant
JP2001135658A (ja) * 1999-11-08 2001-05-18 Towa Corp 電子部品の組立方法及び組立装置
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
JP3738176B2 (ja) * 2000-08-03 2006-01-25 三洋電機株式会社 半導体装置の製造方法

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