CN102751295B - 半导体装置与用于制造半导体装置的方法 - Google Patents

半导体装置与用于制造半导体装置的方法 Download PDF

Info

Publication number
CN102751295B
CN102751295B CN201210271486.3A CN201210271486A CN102751295B CN 102751295 B CN102751295 B CN 102751295B CN 201210271486 A CN201210271486 A CN 201210271486A CN 102751295 B CN102751295 B CN 102751295B
Authority
CN
China
Prior art keywords
layer
electrode layer
oxide semiconductor
insulating layer
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210271486.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102751295A (zh
Inventor
山崎舜平
坂田淳一郎
三宅博之
桑原秀明
高桥辰也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN102751295A publication Critical patent/CN102751295A/zh
Application granted granted Critical
Publication of CN102751295B publication Critical patent/CN102751295B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/471Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/02554Oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02565Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Shift Register Type Memory (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
CN201210271486.3A 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法 Active CN102751295B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-169599 2009-07-18
JP2009169599 2009-07-18
CN201080019588.5A CN102576732B (zh) 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201080019588.5A Division CN102576732B (zh) 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法

Publications (2)

Publication Number Publication Date
CN102751295A CN102751295A (zh) 2012-10-24
CN102751295B true CN102751295B (zh) 2015-07-15

Family

ID=43464651

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201080019588.5A Expired - Fee Related CN102576732B (zh) 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法
CN201210271486.3A Active CN102751295B (zh) 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201080019588.5A Expired - Fee Related CN102576732B (zh) 2009-07-18 2010-06-25 半导体装置与用于制造半导体装置的方法

Country Status (7)

Country Link
US (6) US8552423B2 (enExample)
EP (1) EP2457256B1 (enExample)
JP (9) JP5455825B2 (enExample)
KR (5) KR102181301B1 (enExample)
CN (2) CN102576732B (enExample)
TW (7) TW202018909A (enExample)
WO (1) WO2011010543A1 (enExample)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663214B2 (ja) * 2009-07-03 2015-02-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101929726B1 (ko) 2009-07-18 2018-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
KR102181301B1 (ko) 2009-07-18 2020-11-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 제조 방법
WO2011010545A1 (en) 2009-07-18 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011010542A1 (en) * 2009-07-23 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
EP2284891B1 (en) * 2009-08-07 2019-07-24 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
TWI596741B (zh) * 2009-08-07 2017-08-21 半導體能源研究所股份有限公司 半導體裝置和其製造方法
JP5663231B2 (ja) * 2009-08-07 2015-02-04 株式会社半導体エネルギー研究所 発光装置
US8115883B2 (en) 2009-08-27 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
WO2011027701A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
KR101988341B1 (ko) 2009-09-04 2019-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 발광 장치를 제작하기 위한 방법
WO2011027702A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
KR101832698B1 (ko) * 2009-10-14 2018-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
WO2011052382A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN105206514B (zh) 2009-11-28 2018-04-10 株式会社半导体能源研究所 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法
WO2011070901A1 (en) 2009-12-11 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101928897B1 (ko) 2010-08-27 2018-12-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 기억 장치, 반도체 장치
US8766253B2 (en) * 2010-09-10 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8803143B2 (en) 2010-10-20 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor including buffer layers with high resistivity
TWI658516B (zh) 2011-03-11 2019-05-01 日商半導體能源研究所股份有限公司 半導體裝置的製造方法
US8859330B2 (en) * 2011-03-23 2014-10-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8956944B2 (en) * 2011-03-25 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9082860B2 (en) * 2011-03-31 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI654762B (zh) 2011-05-05 2019-03-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
US8610482B2 (en) * 2011-05-27 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Trimming circuit and method for driving trimming circuit
JP2013069864A (ja) * 2011-09-22 2013-04-18 Canon Inc 検出装置及び検出システム
US20130082843A1 (en) * 2011-09-30 2013-04-04 Apple Inc. Detection of fracture of display panel or other patterned device
JP2013093565A (ja) * 2011-10-07 2013-05-16 Semiconductor Energy Lab Co Ltd 半導体装置
TWI484626B (zh) * 2012-02-21 2015-05-11 璨圓光電股份有限公司 半導體發光元件及具有此半導體發光元件的發光裝置
JP2014041344A (ja) 2012-07-27 2014-03-06 Semiconductor Energy Lab Co Ltd 液晶表示装置の駆動方法
US9625764B2 (en) 2012-08-28 2017-04-18 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR102161078B1 (ko) 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
KR20140029202A (ko) 2012-08-28 2014-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
CN102854687B (zh) * 2012-09-26 2014-12-17 南京中电熊猫液晶显示科技有限公司 一种金属氧化物边缘场开关型液晶显示面板及其制造方法
KR102089244B1 (ko) * 2012-12-11 2020-03-17 엘지디스플레이 주식회사 더블 게이트형 박막 트랜지스터 및 이를 포함하는 유기 발광 다이오드 표시장치
US9905585B2 (en) * 2012-12-25 2018-02-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising capacitor
KR102798241B1 (ko) 2012-12-25 2025-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102196949B1 (ko) * 2013-03-29 2020-12-30 엘지디스플레이 주식회사 박막 트랜지스터, 박막 트랜지스터 제조 방법 및 박막 트랜지스터를 포함하는 표시 장치
KR102080065B1 (ko) * 2013-04-30 2020-04-07 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
TWI495942B (zh) * 2013-05-20 2015-08-11 Au Optronics Corp 畫素結構、顯示面板與畫素結構的製作方法
CN103441128B (zh) * 2013-05-27 2016-01-20 南京中电熊猫液晶显示科技有限公司 一种tft阵列基板及其制造方法
CN103309108B (zh) * 2013-05-30 2016-02-10 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置
TWI624936B (zh) * 2013-06-05 2018-05-21 半導體能源研究所股份有限公司 顯示裝置
JP6410496B2 (ja) * 2013-07-31 2018-10-24 株式会社半導体エネルギー研究所 マルチゲート構造のトランジスタ
JP6426402B2 (ja) * 2013-08-30 2018-11-21 株式会社半導体エネルギー研究所 表示装置
JP2015179247A (ja) * 2013-10-22 2015-10-08 株式会社半導体エネルギー研究所 表示装置
US9806098B2 (en) * 2013-12-10 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
JP2015188062A (ja) 2014-02-07 2015-10-29 株式会社半導体エネルギー研究所 半導体装置
KR102333604B1 (ko) * 2014-05-15 2021-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 이 반도체 장치를 포함하는 표시 장치
TWI666776B (zh) 2014-06-20 2019-07-21 日商半導體能源研究所股份有限公司 半導體裝置以及包括該半導體裝置的顯示裝置
KR20160034200A (ko) * 2014-09-19 2016-03-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
WO2016067144A1 (en) 2014-10-28 2016-05-06 Semiconductor Energy Laboratory Co., Ltd. Display device, manufacturing method of display device, and electronic device
CN107111972B (zh) 2014-10-28 2020-04-28 株式会社半导体能源研究所 功能面板、功能面板的制造方法、模块、数据处理装置
KR102456654B1 (ko) 2014-11-26 2022-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
CN107004719B (zh) * 2014-11-28 2020-07-03 夏普株式会社 半导体装置及其制造方法
US20160155803A1 (en) * 2014-11-28 2016-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device, Method for Manufacturing the Semiconductor Device, and Display Device Including the Semiconductor Device
JP6251823B2 (ja) * 2014-11-28 2017-12-20 シャープ株式会社 半導体装置およびその製造方法
US20160155849A1 (en) * 2014-12-02 2016-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, module, and electronic device
US9954112B2 (en) 2015-01-26 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN107408579B (zh) * 2015-03-03 2021-04-02 株式会社半导体能源研究所 半导体装置、该半导体装置的制造方法或包括该半导体装置的显示装置
US10008609B2 (en) * 2015-03-17 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, or display device including the same
US10002970B2 (en) * 2015-04-30 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of the same, or display device including the same
CN105070727B (zh) * 2015-08-21 2019-01-15 京东方科技集团股份有限公司 一种薄膜晶体管阵列基板、其制作方法及显示装置
US9773919B2 (en) * 2015-08-26 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10816865B2 (en) * 2016-03-15 2020-10-27 Sharp Kabushiki Kaisha Active matrix substrate
SG10201701689UA (en) 2016-03-18 2017-10-30 Semiconductor Energy Lab Semiconductor device, semiconductor wafer, and electronic device
US10205008B2 (en) * 2016-08-03 2019-02-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US10141544B2 (en) 2016-08-10 2018-11-27 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent display device and manufacturing method thereof
CN106783887B (zh) * 2017-01-03 2019-12-24 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示装置
JP6867832B2 (ja) 2017-03-09 2021-05-12 三菱電機株式会社 アレイ基板、液晶表示装置、薄膜トランジスタ、およびアレイ基板の製造方法
US10263090B2 (en) * 2017-04-24 2019-04-16 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
CN107134543B (zh) * 2017-04-24 2019-05-07 深圳市华星光电半导体显示技术有限公司 阵列基板及制造方法、显示装置
CN107293493A (zh) * 2017-06-06 2017-10-24 武汉华星光电技术有限公司 铟镓锌氧化物薄膜晶体管的制作方法
JP6903503B2 (ja) 2017-07-05 2021-07-14 三菱電機株式会社 薄膜トランジスタ基板、液晶表示装置および薄膜トランジスタ基板の製造方法
CN107526480B (zh) * 2017-09-22 2020-04-28 厦门天马微电子有限公司 一种显示面板和显示装置
KR102092034B1 (ko) * 2017-12-06 2020-03-23 엘지디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US20200073189A1 (en) * 2018-08-30 2020-03-05 Sharp Kabushiki Kaisha Active matrix substrate, display device, and method for manufacturing active matrix substrate
CN110442254B (zh) * 2019-02-26 2020-06-09 京东方科技集团股份有限公司 触控显示基板及触控显示装置
CN111722446B (zh) * 2019-03-22 2023-01-31 夏普株式会社 有源矩阵基板的制造方法
KR102723703B1 (ko) * 2019-05-28 2024-10-31 삼성디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
GB2587793B (en) 2019-08-21 2023-03-22 Pragmatic Printing Ltd Electronic circuit comprising transistor and resistor
GB2610886B (en) 2019-08-21 2023-09-13 Pragmatic Printing Ltd Resistor geometry
JP6854375B1 (ja) * 2020-06-26 2021-04-07 株式会社ドワンゴ 表示媒体、表示支援媒体および処理装置
CN112802878B (zh) * 2020-12-30 2024-01-30 天马微电子股份有限公司 一种显示面板和显示装置
US12477825B2 (en) 2021-04-23 2025-11-18 E Ink Holdings Inc. Electronic device and wiring structure thereof
TWI813217B (zh) * 2021-12-09 2023-08-21 友達光電股份有限公司 半導體裝置及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2776083B2 (ja) * 1991-08-23 1998-07-16 日本電気株式会社 液晶表示装置およびその製造方法
CN1930692A (zh) * 2004-03-12 2007-03-14 惠普开发有限公司 具有包含二元氧化物的混合物的沟道的半导体器件
CN101335293A (zh) * 2005-09-29 2008-12-31 株式会社半导体能源研究所 半导体器件及其制造方法

Family Cites Families (206)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198861A (ja) 1984-03-23 1985-10-08 Fujitsu Ltd 薄膜トランジスタ
JPH0244256B2 (ja) 1987-01-28 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244260B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPS63210023A (ja) 1987-02-24 1988-08-31 Natl Inst For Res In Inorg Mater InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法
JPH0244258B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244262B2 (ja) 1987-02-27 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244263B2 (ja) 1987-04-22 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JP2714016B2 (ja) * 1988-08-05 1998-02-16 株式会社東芝 表示装置
JPH05326953A (ja) * 1991-04-26 1993-12-10 Tonen Corp アクティブマトリックス型画像表示パネルの製造方法
JPH05251705A (ja) 1992-03-04 1993-09-28 Fuji Xerox Co Ltd 薄膜トランジスタ
JP3423108B2 (ja) 1994-05-20 2003-07-07 三洋電機株式会社 表示装置及び表示装置の製造方法
JP3479375B2 (ja) 1995-03-27 2003-12-15 科学技術振興事業団 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法
EP0820644B1 (en) 1995-08-03 2005-08-24 Koninklijke Philips Electronics N.V. Semiconductor device provided with transparent switching element
JP3625598B2 (ja) * 1995-12-30 2005-03-02 三星電子株式会社 液晶表示装置の製造方法
TW494266B (en) * 1996-05-13 2002-07-11 Nanya Technology Corp Manufacturing method of thin film transistor liquid crystal display
JP3525665B2 (ja) * 1997-01-07 2004-05-10 日本電信電話株式会社 常装着型電話装置
JP4044999B2 (ja) * 1998-01-09 2008-02-06 東芝松下ディスプレイテクノロジー株式会社 平面表示装置用アレイ基板、及びその製造方法
JP3702096B2 (ja) * 1998-06-08 2005-10-05 三洋電機株式会社 薄膜トランジスタ及び表示装置
JP2001051292A (ja) 1998-06-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置および半導体表示装置
JP4170454B2 (ja) 1998-07-24 2008-10-22 Hoya株式会社 透明導電性酸化物薄膜を有する物品及びその製造方法
JP2000122091A (ja) * 1998-10-19 2000-04-28 Sony Corp 電気光学装置の製造方法及び電気光学装置用の駆動基板の製造方法
JP2000150861A (ja) * 1998-11-16 2000-05-30 Tdk Corp 酸化物薄膜
JP3276930B2 (ja) * 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置
JP2000231124A (ja) * 1999-02-12 2000-08-22 Sony Corp 電気光学装置、電気光学装置用の駆動基板、及びこれらの製造方法
US6888522B1 (en) * 1999-03-31 2005-05-03 Minolta Co., Ltd. Information display apparatus
JP4552239B2 (ja) * 1999-05-12 2010-09-29 ソニー株式会社 表示用薄膜半導体素子及び表示装置
TW460731B (en) * 1999-09-03 2001-10-21 Ind Tech Res Inst Electrode structure and production method of wide viewing angle LCD
JP4253826B2 (ja) * 1999-09-07 2009-04-15 カシオ計算機株式会社 画像読取装置
US6620719B1 (en) 2000-03-31 2003-09-16 International Business Machines Corporation Method of forming ohmic contacts using a self doping layer for thin-film transistors
JP4042340B2 (ja) * 2000-05-17 2008-02-06 カシオ計算機株式会社 情報機器
JP2001345448A (ja) 2000-05-31 2001-12-14 Toshiba Corp 薄膜トランジスタの製造方法および薄膜トランジスタ
JP4850328B2 (ja) 2000-08-29 2012-01-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4089858B2 (ja) 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
JP4974427B2 (ja) * 2000-09-29 2012-07-11 株式会社半導体エネルギー研究所 半導体装置及び電子装置
KR20020038482A (ko) * 2000-11-15 2002-05-23 모리시타 요이찌 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널
JP4954366B2 (ja) * 2000-11-28 2012-06-13 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6580657B2 (en) 2001-01-04 2003-06-17 International Business Machines Corporation Low-power organic light emitting diode pixel circuit
TWI221645B (en) 2001-01-19 2004-10-01 Semiconductor Energy Lab Method of manufacturing a semiconductor device
JP3997731B2 (ja) * 2001-03-19 2007-10-24 富士ゼロックス株式会社 基材上に結晶性半導体薄膜を形成する方法
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
JP4312420B2 (ja) * 2001-05-18 2009-08-12 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP2003051599A (ja) * 2001-05-24 2003-02-21 Semiconductor Energy Lab Co Ltd 半導体装置及び電子機器
JP2003029293A (ja) 2001-07-13 2003-01-29 Minolta Co Ltd 積層型表示装置及びその製造方法
JP2003090997A (ja) 2001-07-13 2003-03-28 Seiko Epson Corp カラーフィルタ基板及び電気光学装置、カラーフィルタ基板の製造方法及び電気光学装置の製造方法並びに電子機器
JP4241315B2 (ja) * 2001-07-13 2009-03-18 セイコーエプソン株式会社 カラーフィルタ基板及び電気光学装置、カラーフィルタ基板の製造方法及び電気光学装置の製造方法並びに電子機器
US6952023B2 (en) * 2001-07-17 2005-10-04 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2003037268A (ja) * 2001-07-24 2003-02-07 Minolta Co Ltd 半導体素子及びその製造方法
KR100820104B1 (ko) 2001-07-25 2008-04-07 엘지.필립스 엘시디 주식회사 액정 표시 장치 및 그의 제조 방법
JP4090716B2 (ja) * 2001-09-10 2008-05-28 雅司 川崎 薄膜トランジスタおよびマトリクス表示装置
JP3925839B2 (ja) 2001-09-10 2007-06-06 シャープ株式会社 半導体記憶装置およびその試験方法
JP4634673B2 (ja) 2001-09-26 2011-02-16 シャープ株式会社 液晶表示装置及びその製造方法
WO2003040441A1 (fr) * 2001-11-05 2003-05-15 Japan Science And Technology Agency Film mince monocristallin homologue a super-reseau naturel, procede de preparation et dispositif dans lequel est utilise ledit film mince monocristallin
JP4164562B2 (ja) 2002-09-11 2008-10-15 独立行政法人科学技術振興機構 ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
JP4083486B2 (ja) * 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 LnCuO(S,Se,Te)単結晶薄膜の製造方法
JP4069648B2 (ja) * 2002-03-15 2008-04-02 カシオ計算機株式会社 半導体装置および表示駆動装置
CN1445821A (zh) 2002-03-15 2003-10-01 三洋电机株式会社 ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法
JP3933591B2 (ja) * 2002-03-26 2007-06-20 淳二 城戸 有機エレクトロルミネッセント素子
US7339187B2 (en) * 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
JP2004014982A (ja) 2002-06-11 2004-01-15 Konica Minolta Holdings Inc 半導体回路および画像表示装置
JP2004022625A (ja) * 2002-06-13 2004-01-22 Murata Mfg Co Ltd 半導体デバイス及び該半導体デバイスの製造方法
US7105868B2 (en) * 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
JP2004096431A (ja) * 2002-08-30 2004-03-25 Seiko Instruments Inc 移動通信端末およびその着信応答方法
US7067843B2 (en) * 2002-10-11 2006-06-27 E. I. Du Pont De Nemours And Company Transparent oxide semiconductor thin film transistors
JP2004184150A (ja) * 2002-12-02 2004-07-02 Tohoku Ricoh Co Ltd 磁気検知装置、方位検知システム及び携帯通信端末
JP3783064B2 (ja) * 2003-01-22 2006-06-07 東芝松下ディスプレイテクノロジー株式会社 有機elディスプレイ及びアクティブマトリクス基板
KR200310610Y1 (ko) * 2003-01-24 2003-04-14 주식회사 카서 손목착용형 착신신호 전기자극형 이동통신장치
JP4166105B2 (ja) 2003-03-06 2008-10-15 シャープ株式会社 半導体装置およびその製造方法
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
JP2004295716A (ja) * 2003-03-28 2004-10-21 I'm Co Ltd 表示機能付電子機器
JP4108633B2 (ja) 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
TW200511589A (en) * 2003-07-25 2005-03-16 Hewlett Packard Development Co Transistor including a deposited channel region having a doped portion
US20050017244A1 (en) 2003-07-25 2005-01-27 Randy Hoffman Semiconductor device
US7262463B2 (en) 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
JP4402396B2 (ja) 2003-08-07 2010-01-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2005047968A1 (en) 2003-11-14 2005-05-26 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US7247822B2 (en) * 2004-02-05 2007-07-24 Methode Electronics, Inc. Carbon fiber heating element assembly and methods for making
CN1998087B (zh) 2004-03-12 2014-12-31 独立行政法人科学技术振兴机构 非晶形氧化物和薄膜晶体管
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7145174B2 (en) * 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
WO2005091370A1 (en) 2004-03-22 2005-09-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing integrated circuit
JP5030388B2 (ja) * 2004-03-22 2012-09-19 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
CN100505310C (zh) 2004-04-21 2009-06-24 三菱电机株式会社 半导体装置和图像显示装置
JP2005311037A (ja) 2004-04-21 2005-11-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2005333107A (ja) 2004-04-21 2005-12-02 Mitsubishi Electric Corp 半導体装置、画像表示装置および半導体装置の製造方法
JP4641741B2 (ja) 2004-05-28 2011-03-02 三菱電機株式会社 半導体装置
US7211825B2 (en) * 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
KR100615233B1 (ko) * 2004-07-21 2006-08-25 삼성에스디아이 주식회사 박막 트랜지스터, 및 이를 구비한 평판 표시장치
JP4877873B2 (ja) * 2004-08-03 2012-02-15 株式会社半導体エネルギー研究所 表示装置及びその作製方法
EP1624333B1 (en) 2004-08-03 2017-05-03 Semiconductor Energy Laboratory Co., Ltd. Display device, manufacturing method thereof, and television set
JP2006100760A (ja) * 2004-09-02 2006-04-13 Casio Comput Co Ltd 薄膜トランジスタおよびその製造方法
TWM267760U (en) * 2004-09-10 2005-06-11 Giga Byte Tech Co Ltd Watch type handset
US7285501B2 (en) * 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
US7298084B2 (en) * 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
CA2585190A1 (en) * 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
US7829444B2 (en) * 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
US7868326B2 (en) * 2004-11-10 2011-01-11 Canon Kabushiki Kaisha Field effect transistor
US7453065B2 (en) * 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
US7863611B2 (en) * 2004-11-10 2011-01-04 Canon Kabushiki Kaisha Integrated circuits utilizing amorphous oxides
US7791072B2 (en) * 2004-11-10 2010-09-07 Canon Kabushiki Kaisha Display
KR20070085879A (ko) * 2004-11-10 2007-08-27 캐논 가부시끼가이샤 발광 장치
US7579224B2 (en) * 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
TWI472037B (zh) * 2005-01-28 2015-02-01 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
TWI569441B (zh) * 2005-01-28 2017-02-01 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
US8993867B2 (en) 2005-02-02 2015-03-31 Audiobrax Indústria E Comércio De Produtos Eletrônicos S/A Mobile communication device with musical instrument functions
WO2006081643A1 (en) 2005-02-02 2006-08-10 Audiobrax Indústria E Comércio De Produtos Eletrônicos S.A. Mobile communication device with music instrumental functions
US7858451B2 (en) * 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) * 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
JP2006245031A (ja) 2005-02-28 2006-09-14 Casio Comput Co Ltd 薄膜トランジスタパネル
JP5117667B2 (ja) * 2005-02-28 2013-01-16 カシオ計算機株式会社 薄膜トランジスタパネル
US20060197092A1 (en) * 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US8681077B2 (en) * 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
JP2006269808A (ja) 2005-03-24 2006-10-05 Mitsubishi Electric Corp 半導体装置および画像表示装置
US7544967B2 (en) * 2005-03-28 2009-06-09 Massachusetts Institute Of Technology Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US8300031B2 (en) * 2005-04-20 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element
JP2006344849A (ja) 2005-06-10 2006-12-21 Casio Comput Co Ltd 薄膜トランジスタ
JP4856900B2 (ja) * 2005-06-13 2012-01-18 パナソニック株式会社 電界効果トランジスタの製造方法
US7402506B2 (en) * 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7691666B2 (en) 2005-06-16 2010-04-06 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7507618B2 (en) 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
KR100711890B1 (ko) * 2005-07-28 2007-04-25 삼성에스디아이 주식회사 유기 발광표시장치 및 그의 제조방법
KR20070019401A (ko) 2005-08-12 2007-02-15 삼성전자주식회사 유기 발광 표시 장치용 구동 필름, 구동 패키지, 이의 제조방법 및 이를 포함하는 유기 발광표시 장치
JP2007059128A (ja) * 2005-08-23 2007-03-08 Canon Inc 有機el表示装置およびその製造方法
JP2007073561A (ja) 2005-09-02 2007-03-22 Kochi Prefecture Sangyo Shinko Center 薄膜トランジスタ
JP4280736B2 (ja) * 2005-09-06 2009-06-17 キヤノン株式会社 半導体素子
JP4850457B2 (ja) 2005-09-06 2012-01-11 キヤノン株式会社 薄膜トランジスタ及び薄膜ダイオード
JP2007073705A (ja) * 2005-09-06 2007-03-22 Canon Inc 酸化物半導体チャネル薄膜トランジスタおよびその製造方法
JP5116225B2 (ja) * 2005-09-06 2013-01-09 キヤノン株式会社 酸化物半導体デバイスの製造方法
KR100729043B1 (ko) * 2005-09-14 2007-06-14 삼성에스디아이 주식회사 투명 박막 트랜지스터 및 그의 제조방법
JP5078246B2 (ja) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
US8149346B2 (en) 2005-10-14 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
JP5037808B2 (ja) * 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
JP5129473B2 (ja) 2005-11-15 2013-01-30 富士フイルム株式会社 放射線検出器
US7745798B2 (en) * 2005-11-15 2010-06-29 Fujifilm Corporation Dual-phosphor flat panel radiation detector
WO2007058329A1 (en) * 2005-11-15 2007-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR100732849B1 (ko) * 2005-12-21 2007-06-27 삼성에스디아이 주식회사 유기 발광 표시장치
TWI292281B (en) * 2005-12-29 2008-01-01 Ind Tech Res Inst Pixel structure of active organic light emitting diode and method of fabricating the same
US7867636B2 (en) * 2006-01-11 2011-01-11 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
JP4977478B2 (ja) * 2006-01-21 2012-07-18 三星電子株式会社 ZnOフィルム及びこれを用いたTFTの製造方法
US7576394B2 (en) * 2006-02-02 2009-08-18 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US7977169B2 (en) * 2006-02-15 2011-07-12 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
KR101157270B1 (ko) 2006-02-17 2012-06-15 삼성전자주식회사 유기박막 트랜지스터의 제조방법 및 그에 의해 제조된유기박막 트랜지스터
US20070205423A1 (en) 2006-03-03 2007-09-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5110803B2 (ja) * 2006-03-17 2012-12-26 キヤノン株式会社 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法
KR20070101033A (ko) 2006-04-10 2007-10-16 삼성전자주식회사 신호 구동 소자 및 이를 포함하는 표시 장치
KR20070101595A (ko) 2006-04-11 2007-10-17 삼성전자주식회사 ZnO TFT
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
JP2007334317A (ja) * 2006-05-16 2007-12-27 Semiconductor Energy Lab Co Ltd 液晶表示装置及び半導体装置
JP4277874B2 (ja) * 2006-05-23 2009-06-10 エプソンイメージングデバイス株式会社 電気光学装置の製造方法
KR100801961B1 (ko) * 2006-05-26 2008-02-12 한국전자통신연구원 듀얼 게이트 유기트랜지스터를 이용한 인버터
JP5028033B2 (ja) 2006-06-13 2012-09-19 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4609797B2 (ja) * 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
JP4404881B2 (ja) * 2006-08-09 2010-01-27 日本電気株式会社 薄膜トランジスタアレイ、その製造方法及び液晶表示装置
JP4999400B2 (ja) * 2006-08-09 2012-08-15 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4332545B2 (ja) * 2006-09-15 2009-09-16 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP4274219B2 (ja) * 2006-09-27 2009-06-03 セイコーエプソン株式会社 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置
JP5164357B2 (ja) * 2006-09-27 2013-03-21 キヤノン株式会社 半導体装置及び半導体装置の製造方法
TWI850180B (zh) 2006-09-29 2024-07-21 日商半導體能源研究所股份有限公司 半導體裝置
US7622371B2 (en) * 2006-10-10 2009-11-24 Hewlett-Packard Development Company, L.P. Fused nanocrystal thin film semiconductor and method
JP2008134625A (ja) * 2006-10-26 2008-06-12 Semiconductor Energy Lab Co Ltd 半導体装置、表示装置及び電子機器
US7772021B2 (en) * 2006-11-29 2010-08-10 Samsung Electronics Co., Ltd. Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
JP2008140684A (ja) * 2006-12-04 2008-06-19 Toppan Printing Co Ltd カラーelディスプレイおよびその製造方法
KR101363555B1 (ko) * 2006-12-14 2014-02-19 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 그 제조 방법
CN100573286C (zh) * 2006-12-25 2009-12-23 瀚宇彩晶股份有限公司 液晶显示器结构
KR101303578B1 (ko) * 2007-01-05 2013-09-09 삼성전자주식회사 박막 식각 방법
US8207063B2 (en) * 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
JP5196870B2 (ja) 2007-05-23 2013-05-15 キヤノン株式会社 酸化物半導体を用いた電子素子及びその製造方法
US8436349B2 (en) * 2007-02-20 2013-05-07 Canon Kabushiki Kaisha Thin-film transistor fabrication process and display device
JP2008235871A (ja) 2007-02-20 2008-10-02 Canon Inc 薄膜トランジスタの形成方法及び表示装置
WO2008105347A1 (en) 2007-02-20 2008-09-04 Canon Kabushiki Kaisha Thin-film transistor fabrication process and display device
KR100851215B1 (ko) * 2007-03-14 2008-08-07 삼성에스디아이 주식회사 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치
KR101373435B1 (ko) 2007-03-22 2014-03-14 엘지디스플레이 주식회사 표시기판, 이를 구비한 유기발광다이오드 표시장치 및이들의 제조 방법
US7795613B2 (en) * 2007-04-17 2010-09-14 Toppan Printing Co., Ltd. Structure with transistor
KR101325053B1 (ko) 2007-04-18 2013-11-05 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR20080094300A (ko) * 2007-04-19 2008-10-23 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이
KR101334181B1 (ko) * 2007-04-20 2013-11-28 삼성전자주식회사 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법
US20080269568A1 (en) * 2007-04-25 2008-10-30 Isp Investments Inc. Methods for validating a radiotherapy plan by a dosimetry service
CN101663762B (zh) * 2007-04-25 2011-09-21 佳能株式会社 氧氮化物半导体
JP5261979B2 (ja) * 2007-05-16 2013-08-14 凸版印刷株式会社 画像表示装置
US8803781B2 (en) * 2007-05-18 2014-08-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
KR101345376B1 (ko) 2007-05-29 2013-12-24 삼성전자주식회사 ZnO 계 박막 트랜지스터 및 그 제조방법
JP5272342B2 (ja) * 2007-07-13 2013-08-28 凸版印刷株式会社 薄膜トランジスタ基板の製造方法及び画像表示装置
JP5101387B2 (ja) * 2007-09-13 2012-12-19 富士フイルム株式会社 カプセル型内視鏡
US20090079920A1 (en) * 2007-09-20 2009-03-26 Mitsubishi Electric Corporation Display device and method of manufacturing the same
KR100959460B1 (ko) 2007-11-16 2010-05-25 주식회사 동부하이텍 투명 박막 트랜지스터 및 투명 박막 트랜지스터의 제조방법
JP5377940B2 (ja) * 2007-12-03 2013-12-25 株式会社半導体エネルギー研究所 半導体装置
JP5213421B2 (ja) 2007-12-04 2013-06-19 キヤノン株式会社 酸化物半導体薄膜トランジスタ
JP5215158B2 (ja) * 2007-12-17 2013-06-19 富士フイルム株式会社 無機結晶性配向膜及びその製造方法、半導体デバイス
TW200828063A (en) 2007-12-19 2008-07-01 Kinpo Elect Inc Real-time translation system and method
JP5291928B2 (ja) 2007-12-26 2013-09-18 株式会社日立製作所 酸化物半導体装置およびその製造方法
JP5127470B2 (ja) 2008-01-15 2013-01-23 三菱電機株式会社 バス装置
JP5540517B2 (ja) 2008-02-22 2014-07-02 凸版印刷株式会社 画像表示装置
JP2009265271A (ja) 2008-04-23 2009-11-12 Nippon Shokubai Co Ltd 電気光学表示装置
US9041202B2 (en) 2008-05-16 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
JP4623179B2 (ja) * 2008-09-18 2011-02-02 ソニー株式会社 薄膜トランジスタおよびその製造方法
JP5451280B2 (ja) * 2008-10-09 2014-03-26 キヤノン株式会社 ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置
US9146542B2 (en) * 2009-03-05 2015-09-29 Raja Singh Tuli Method for managing web access from a small footprint portable device
KR101739154B1 (ko) 2009-07-17 2017-05-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
WO2011007677A1 (en) 2009-07-17 2011-01-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR102181301B1 (ko) * 2009-07-18 2020-11-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치 제조 방법
KR101929726B1 (ko) 2009-07-18 2018-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
KR101782176B1 (ko) 2009-07-18 2017-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
WO2011010545A1 (en) * 2009-07-18 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2011010542A1 (en) 2009-07-23 2011-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9357921B2 (en) * 2009-10-16 2016-06-07 At&T Intellectual Property I, Lp Wearable health monitoring system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2776083B2 (ja) * 1991-08-23 1998-07-16 日本電気株式会社 液晶表示装置およびその製造方法
CN1930692A (zh) * 2004-03-12 2007-03-14 惠普开发有限公司 具有包含二元氧化物的混合物的沟道的半导体器件
CN101335293A (zh) * 2005-09-29 2008-12-31 株式会社半导体能源研究所 半导体器件及其制造方法

Also Published As

Publication number Publication date
US20220068977A1 (en) 2022-03-03
KR101907366B1 (ko) 2018-10-11
TWI472016B (zh) 2015-02-01
TW201250988A (en) 2012-12-16
KR20120123157A (ko) 2012-11-07
TWI557879B (zh) 2016-11-11
KR20120117723A (ko) 2012-10-24
JP2011044699A (ja) 2011-03-03
US8552423B2 (en) 2013-10-08
US11177289B2 (en) 2021-11-16
KR20180042450A (ko) 2018-04-25
KR20180112107A (ko) 2018-10-11
KR101851403B1 (ko) 2018-04-23
KR101414926B1 (ko) 2014-07-04
TW201123422A (en) 2011-07-01
US11715741B2 (en) 2023-08-01
CN102751295A (zh) 2012-10-24
US20120300151A1 (en) 2012-11-29
TWI644414B (zh) 2018-12-11
TWI481010B (zh) 2015-04-11
TW202018909A (zh) 2020-05-16
JP2023015041A (ja) 2023-01-31
JP5714141B2 (ja) 2015-05-07
TW202115868A (zh) 2021-04-16
US20200058682A1 (en) 2020-02-20
CN102576732A (zh) 2012-07-11
JP2018186273A (ja) 2018-11-22
JP6339151B2 (ja) 2018-06-06
JP6030171B2 (ja) 2016-11-24
US10461098B2 (en) 2019-10-29
TWI693696B (zh) 2020-05-11
JP2019149555A (ja) 2019-09-05
JP2014132660A (ja) 2014-07-17
US20110012112A1 (en) 2011-01-20
KR102181301B1 (ko) 2020-11-20
JP6506445B2 (ja) 2019-04-24
JP2017050550A (ja) 2017-03-09
JP2025072488A (ja) 2025-05-09
US20140293183A1 (en) 2014-10-02
EP2457256A1 (en) 2012-05-30
WO2011010543A1 (en) 2011-01-27
JP5455825B2 (ja) 2014-03-26
JP2021100124A (ja) 2021-07-01
EP2457256B1 (en) 2020-06-17
TW201519409A (zh) 2015-05-16
TW201832348A (zh) 2018-09-01
KR20190112846A (ko) 2019-10-07
US20160118417A1 (en) 2016-04-28
CN102576732B (zh) 2015-02-25
US8698143B2 (en) 2014-04-15
US9263472B2 (en) 2016-02-16
EP2457256A4 (en) 2015-07-29
TW201707191A (zh) 2017-02-16
JP2015159290A (ja) 2015-09-03

Similar Documents

Publication Publication Date Title
JP7408748B2 (ja) 半導体装置の作製方法
CN102751295B (zh) 半导体装置与用于制造半导体装置的方法
JP6271050B2 (ja) 半導体装置
TWI629769B (zh) 半導體裝置和其製造方法
CN101997005B (zh) 半导体器件及其制造方法
CN101997007B (zh) 半导体装置及制造半导体装置的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant