CH378863A - Verfahren zur Herstellung eines Halbleitereigenschaften aufweisenden chemischen Elementes - Google Patents

Verfahren zur Herstellung eines Halbleitereigenschaften aufweisenden chemischen Elementes

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Publication number
CH378863A
CH378863A CH4780657A CH4780657A CH378863A CH 378863 A CH378863 A CH 378863A CH 4780657 A CH4780657 A CH 4780657A CH 4780657 A CH4780657 A CH 4780657A CH 378863 A CH378863 A CH 378863A
Authority
CH
Switzerland
Prior art keywords
manufacture
chemical element
semiconductor properties
semiconductor
properties
Prior art date
Application number
CH4780657A
Other languages
English (en)
Inventor
Theodor Dr Rummel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH378863A publication Critical patent/CH378863A/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/08—Compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B41/00—Obtaining germanium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B30/00—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions
    • C30B30/02—Production of single crystals or homogeneous polycrystalline material with defined structure characterised by the action of electric or magnetic fields, wave energy or other specific physical conditions using electric fields, e.g. electrolysis
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B9/00—Single-crystal growth from melt solutions using molten solvents
    • C30B9/14—Single-crystal growth from melt solutions using molten solvents by electrolysis
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/27—Control of temperature characterised by the use of electric means with sensing element responsive to radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/917—Magnetic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
CH4780657A 1954-05-18 1957-06-28 Verfahren zur Herstellung eines Halbleitereigenschaften aufweisenden chemischen Elementes CH378863A (de)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
DES67478A DE1134459B (de) 1954-05-18 1954-05-18 Halbleiterbauelement mit einem Halbleiterkoerper aus Silizium
DES39209A DE1102117B (de) 1954-05-18 1954-05-18 Verfahren zum Herstellen von reinstem Silicium
DES42803A DE1223815B (de) 1954-05-18 1955-02-24 Verfahren zur Herstellung von reinstem Silicium
DES0042824 1955-02-25
DES49371A DE1193022B (de) 1954-05-18 1956-07-06 Verfahren zur Herstellung von reinstem Silicium
DES50407A DE1185449B (de) 1954-05-18 1956-09-18 Einrichtung zum Herstellen von reinsten Halbleiterstoffen
DES55831A DE1211610B (de) 1954-05-18 1957-11-11 Verfahren zur Herstellung von reinstem Silicium
DES56317A DE1208298B (de) 1954-05-18 1957-12-19 Verfahren zum Herstellen von Silicium fuer Halbleiteranordnungen
DE1958S0058219 DE1217348C2 (de) 1954-05-18 1958-05-14 Verfahren zur Herstellung von reinstem Silicium
DES61117A DE1209113B (de) 1954-05-18 1958-12-23 Verfahren zum Herstellen von hochreinem Silicium
DES66308A DE1212949B (de) 1954-05-18 1959-12-17 Verfahren zum Herstellen von hochreinem Silicium
DES69895A DE1235266B (de) 1954-05-18 1961-05-18 Verfahren zum Herstellen reinster kristalliner Stoffe, insbesondere fuer Halbleiterzwecke

Publications (1)

Publication Number Publication Date
CH378863A true CH378863A (de) 1964-06-30

Family

ID=27582950

Family Applications (6)

Application Number Title Priority Date Filing Date
CH473362A CH509824A (de) 1954-05-18 1955-05-17 Verfahren zum Herstellen eines aus mindestens zwei halbleitenden chemischen Elementen zusammengesetzten, mindestens teilweise legierten Halbleitermaterials
CH358411D CH358411A (de) 1954-05-18 1955-05-17 Verfahren zum Herstellen eines Halbleitereigenschaften aufweisenden chemischen Elementes in kompakt-kristallinem Zustand
CH4780657A CH378863A (de) 1954-05-18 1957-06-28 Verfahren zur Herstellung eines Halbleitereigenschaften aufweisenden chemischen Elementes
CH6585358A CH416582A (de) 1954-05-18 1958-11-05 Verfahren zum Herstellen von kristallischem Silizium für Halbleiteranordnungen
CH8185859A CH424732A (de) 1954-05-18 1959-12-15 Verfahren zum Herstellen eines hochreinen Halbleiterstabes
CH1344660A CH440228A (de) 1954-05-18 1960-11-29 Verfahren zum Herstellen eines hochreinen Siliziumstabes

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CH473362A CH509824A (de) 1954-05-18 1955-05-17 Verfahren zum Herstellen eines aus mindestens zwei halbleitenden chemischen Elementen zusammengesetzten, mindestens teilweise legierten Halbleitermaterials
CH358411D CH358411A (de) 1954-05-18 1955-05-17 Verfahren zum Herstellen eines Halbleitereigenschaften aufweisenden chemischen Elementes in kompakt-kristallinem Zustand

Family Applications After (3)

Application Number Title Priority Date Filing Date
CH6585358A CH416582A (de) 1954-05-18 1958-11-05 Verfahren zum Herstellen von kristallischem Silizium für Halbleiteranordnungen
CH8185859A CH424732A (de) 1954-05-18 1959-12-15 Verfahren zum Herstellen eines hochreinen Halbleiterstabes
CH1344660A CH440228A (de) 1954-05-18 1960-11-29 Verfahren zum Herstellen eines hochreinen Siliziumstabes

Country Status (6)

Country Link
US (5) US2854318A (de)
CH (6) CH509824A (de)
DE (11) DE1102117B (de)
FR (2) FR1125207A (de)
GB (6) GB809250A (de)
NL (7) NL218408A (de)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL122356C (de) * 1954-05-18 1900-01-01
DE1017795B (de) * 1954-05-25 1957-10-17 Siemens Ag Verfahren zur Herstellung reinster kristalliner Substanzen, vorzugsweise Halbleitersubstanzen
US3330251A (en) * 1955-11-02 1967-07-11 Siemens Ag Apparatus for producing highest-purity silicon for electric semiconductor devices
DE1061593B (de) * 1956-06-25 1959-07-16 Siemens Ag Vorrichtung zur Gewinnung reinsten Halbleitermaterials fuer elektrotechnische Zwecke
US3021197A (en) * 1956-11-20 1962-02-13 Olin Mathieson Preparation of diborane
DE1207922B (de) * 1957-04-30 1965-12-30 Standard Elektrik Lorenz Ag Verfahren zum Herstellen von hochreinen Halbleitersubstanzen, insbesondere von Silizium
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
US2993763A (en) * 1957-11-14 1961-07-25 Plessey Co Ltd Manufacturing process for the preparation of flakes of sintered silicon
DE1081869B (de) * 1957-12-03 1960-05-19 Siemens Ag Verfahren zur Herstellung von Silicium-Einkristallen
DE1198321B (de) * 1958-01-06 1965-08-12 Int Standard Electric Corp Verfahren zur Herstellung von Halbleitermaterial grosser Reinheit
DE1098496B (de) * 1958-04-11 1961-02-02 Wacker Chemie Gmbh Verfahren zur gleichzeitigen Herstellung von kristallinem oder amorphem Silicium und Siliciumverbindungen mit Si-Si-Bindungen
BE578542A (de) * 1958-05-16
US3030189A (en) * 1958-05-19 1962-04-17 Siemens Ag Methods of producing substances of highest purity, particularly electric semiconductors
NL238464A (de) * 1958-05-29
DE1123653B (de) * 1958-07-25 1962-02-15 Gen Electric Verfahren zum Herstellen von Siliciumtetrajodid
US3020129A (en) * 1958-07-25 1962-02-06 Gen Electric Production of silicon of improved purity
US3017251A (en) * 1958-08-19 1962-01-16 Du Pont Process for the production of silicon
BE582787A (de) * 1958-09-20 1900-01-01
NL124906C (de) * 1958-12-09
NL246431A (de) * 1958-12-16 1900-01-01
DE1154796B (de) * 1958-12-16 1963-09-26 Western Electric Co Verfahren zum Reinigen von Silicium- oder Germaniumverbindungen
NL246971A (de) * 1959-01-02 1900-01-01
US3025192A (en) * 1959-01-02 1962-03-13 Norton Co Silicon carbide crystals and processes and furnaces for making them
NL251143A (de) * 1959-05-04
DE1140548B (de) * 1959-06-25 1962-12-06 Siemens Ag Verfahren zum Herstellen von einkristallinen Halbleiterkoerpern
NL256017A (de) * 1959-09-23 1900-01-01
NL256255A (de) * 1959-11-02
DE1128412B (de) * 1959-12-17 1962-04-26 Metallgesellschaft Ag Verfahren zur Herstellung von Reinstsilicium durch thermische Zersetzung von gasfoermigen Siliciumverbindungen
DE1147567B (de) * 1960-01-15 1963-04-25 Siemens Ag Verfahren zum Gewinnen von insbesondere einkristallinem, halbleitendem Silicium
NL262949A (de) * 1960-04-02 1900-01-01
US3098774A (en) * 1960-05-02 1963-07-23 Mark Albert Process for producing single crystal silicon surface layers
DE1123300B (de) * 1960-06-03 1962-02-08 Siemens Ag Verfahren zur Herstellung von Silicium oder Germanium
DE1155098B (de) * 1960-06-10 1963-10-03 Siemens Ag Verfahren zur Gewinnung von reinstem Silicium
US3161474A (en) * 1960-06-21 1964-12-15 Siemens Ag Method for producing hyperpure semiconducting elements from their halogen compounds
DE1129145B (de) * 1960-07-07 1962-05-10 Knapsack Ag Verfahren zur Herstellung von hochreinem Silicium
US3134694A (en) * 1960-08-25 1964-05-26 Siemens Ag Apparatus for accurately controlling the production of semiconductor rods
DE1216842B (de) * 1960-09-30 1966-05-18 Karl Ernst Hoffmann Verfahren zur Herstellung von reinstem Silicium und Germanium
DE1138746B (de) * 1960-10-22 1962-10-31 Int Standard Electric Corp Verfahren zur Reinigung von Siliciumtetrachlorid
DE1419717A1 (de) * 1960-12-06 1968-10-17 Siemens Ag Monokristalliner Halbleiterkoerper und Verfahren zur Herstellung desselben
DE1198787B (de) * 1960-12-17 1965-08-19 Siemens Ag Verfahren zur Gewinnung von reinstem Silicium, Siliciumkarbid oder Germanium aus ihren gasfoermigen Verbindungen
NL277330A (de) * 1961-04-22
US3188244A (en) * 1961-04-24 1965-06-08 Tektronix Inc Method of forming pn junction in semiconductor material
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GB833290A (en) 1960-04-21
FR1125207A (fr) 1956-10-26
GB898342A (en) 1962-06-06
DE1211610B (de) 1966-03-03
GB809250A (en) 1959-02-18
GB849718A (en) 1960-09-28
NL233004A (de) 1900-01-01
DE1235266B (de) 1967-03-02
US2981605A (en) 1961-04-25
DE1212949B (de) 1966-03-24
CH440228A (de) 1967-07-31
NL130620C (de) 1900-01-01
CH416582A (de) 1966-07-15
DE1134459B (de) 1962-08-09
DE1217348C2 (de) 1966-12-22
NL113118C (de) 1900-01-01
NL258754A (de) 1900-01-01
NL122356C (de) 1900-01-01
US2854318A (en) 1958-09-30
US3146123A (en) 1964-08-25
US3232792A (en) 1966-02-01
DE1217348B (de) 1966-05-26
GB938699A (en) 1963-10-02
DE1185449B (de) 1965-01-14
NL246576A (de) 1900-01-01
DE1102117B (de) 1961-03-16
CH424732A (de) 1966-11-30
NL218408A (de) 1900-01-01
DE1223815B (de) 1966-09-01
DE1208298B (de) 1966-01-05
CH509824A (de) 1971-07-15
CH358411A (de) 1961-11-30
US3063811A (en) 1962-11-13
DE1193022B (de) 1965-05-20
FR1182346A (fr) 1959-06-24
GB889192A (en) 1962-02-07
DE1209113B (de) 1966-01-20

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