ATE413931T1 - Verfahren zum randdichten von sperrfilmen - Google Patents

Verfahren zum randdichten von sperrfilmen

Info

Publication number
ATE413931T1
ATE413931T1 AT02766338T AT02766338T ATE413931T1 AT E413931 T1 ATE413931 T1 AT E413931T1 AT 02766338 T AT02766338 T AT 02766338T AT 02766338 T AT02766338 T AT 02766338T AT E413931 T1 ATE413931 T1 AT E413931T1
Authority
AT
Austria
Prior art keywords
barrier
sealed
edge
layer
edge sealing
Prior art date
Application number
AT02766338T
Other languages
English (en)
Inventor
Paul Burrows
John Pagano
Eric Mast
Peter Martin
Gordon Graff
Mark Gross
Original Assignee
Vitex Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitex Systems Inc filed Critical Vitex Systems Inc
Application granted granted Critical
Publication of ATE413931T1 publication Critical patent/ATE413931T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/186—Sealing members characterised by the disposition of the sealing members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/19—Sealing members characterised by the material
    • H01M50/191—Inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/19—Sealing members characterised by the material
    • H01M50/193—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/19—Sealing members characterised by the material
    • H01M50/197—Sealing members characterised by the material having a layered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133337—Layers preventing ion diffusion, e.g. by ion absorption
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
AT02766338T 2001-09-28 2002-09-23 Verfahren zum randdichten von sperrfilmen ATE413931T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/966,163 US6866901B2 (en) 1999-10-25 2001-09-28 Method for edge sealing barrier films

Publications (1)

Publication Number Publication Date
ATE413931T1 true ATE413931T1 (de) 2008-11-15

Family

ID=25511000

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02766338T ATE413931T1 (de) 2001-09-28 2002-09-23 Verfahren zum randdichten von sperrfilmen

Country Status (8)

Country Link
US (4) US6866901B2 (de)
EP (1) EP1432528B1 (de)
JP (1) JP4303591B2 (de)
CN (1) CN1327974C (de)
AT (1) ATE413931T1 (de)
AU (1) AU2002330080A1 (de)
DE (1) DE60229866D1 (de)
WO (1) WO2003028903A2 (de)

Families Citing this family (210)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US6866901B2 (en) * 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US20100330748A1 (en) * 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US7194801B2 (en) * 2000-03-24 2007-03-27 Cymbet Corporation Thin-film battery having ultra-thin electrolyte and associated method
US20050274322A1 (en) * 2001-02-26 2005-12-15 Lee Chung J Reactor for producing reactive intermediates for low dielectric constant polymer thin films
US6881447B2 (en) * 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
US7211828B2 (en) * 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
TW548860B (en) 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
DE10140991C2 (de) * 2001-08-21 2003-08-21 Osram Opto Semiconductors Gmbh Organische Leuchtdiode mit Energieversorgung, Herstellungsverfahren dazu und Anwendungen
US20090208754A1 (en) * 2001-09-28 2009-08-20 Vitex Systems, Inc. Method for edge sealing barrier films
JP2003282238A (ja) * 2002-03-25 2003-10-03 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル及び製造方法
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
US20070216300A1 (en) * 2002-04-04 2007-09-20 International Display Systems, Inc. Organic opto-electronic device with environmentally protective barrier
US20050174045A1 (en) * 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US20030203210A1 (en) * 2002-04-30 2003-10-30 Vitex Systems, Inc. Barrier coatings and methods of making same
US7164155B2 (en) 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8535396B2 (en) 2002-08-09 2013-09-17 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
JP2004095330A (ja) * 2002-08-30 2004-03-25 Tohoku Pioneer Corp 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器
JP4185341B2 (ja) * 2002-09-25 2008-11-26 パイオニア株式会社 多層バリア膜構造、有機エレクトロルミネッセンス表示パネル及び製造方法
US7294209B2 (en) * 2003-01-02 2007-11-13 Cymbet Corporation Apparatus and method for depositing material onto a substrate using a roll-to-roll mask
US6906436B2 (en) * 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
US20040131760A1 (en) * 2003-01-02 2004-07-08 Stuart Shakespeare Apparatus and method for depositing material onto multiple independently moving substrates in a chamber
US7603144B2 (en) * 2003-01-02 2009-10-13 Cymbet Corporation Active wireless tagging system on peel and stick substrate
US7862906B2 (en) 2003-04-09 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent element and light-emitting device
US7510913B2 (en) * 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
JP3892826B2 (ja) * 2003-05-26 2007-03-14 株式会社東芝 電力増幅器及びこれを用いた無線通信装置
JP2004362912A (ja) * 2003-06-04 2004-12-24 Toyota Industries Corp 有機エレクトロルミネッセンス素子及びその製造方法
US20050070097A1 (en) * 2003-09-29 2005-03-31 International Business Machines Corporation Atomic laminates for diffusion barrier applications
US7211351B2 (en) * 2003-10-16 2007-05-01 Cymbet Corporation Lithium/air batteries with LiPON as separator and protective barrier and method
JP2005123012A (ja) * 2003-10-16 2005-05-12 Pioneer Electronic Corp 有機エレクトロルミネセンス表示パネルとその製造方法
US8722160B2 (en) * 2003-10-31 2014-05-13 Aeris Capital Sustainable Ip Ltd. Inorganic/organic hybrid nanolaminate barrier film
US7612498B2 (en) * 2003-11-27 2009-11-03 Toshiba Matsushita Display Technology Co., Ltd. Display element, optical device, and optical device manufacturing method
KR20070024473A (ko) * 2004-01-06 2007-03-02 사임베트 코퍼레이션 층상 배리어구조와 그 형성방법
US8642455B2 (en) * 2004-02-19 2014-02-04 Matthew R. Robinson High-throughput printing of semiconductor precursor layer from nanoflake particles
JP2005322464A (ja) * 2004-05-07 2005-11-17 Canon Inc 有機ｅｌ素子
US20050269943A1 (en) * 2004-06-04 2005-12-08 Michael Hack Protected organic electronic devices and methods for making the same
KR100601324B1 (ko) * 2004-07-27 2006-07-14 엘지전자 주식회사 유기 전계 발광 소자
US20090032108A1 (en) * 2007-03-30 2009-02-05 Craig Leidholm Formation of photovoltaic absorber layers on foil substrates
US7342356B2 (en) * 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
WO2006063308A2 (en) 2004-12-08 2006-06-15 Symmorphix, Inc. DEPOSITION OF LICoO2
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US7846579B2 (en) 2005-03-25 2010-12-07 Victor Krasnov Thin film battery with protective packaging
US8679674B2 (en) * 2005-03-25 2014-03-25 Front Edge Technology, Inc. Battery with protective packaging
KR101387855B1 (ko) * 2005-07-15 2014-04-22 사임베트 코퍼레이션 연질 및 경질 전해질층을 가진 박막 배터리 및 그 제조방법
US7776478B2 (en) * 2005-07-15 2010-08-17 Cymbet Corporation Thin-film batteries with polymer and LiPON electrolyte layers and method
US20070012244A1 (en) * 2005-07-15 2007-01-18 Cymbet Corporation Apparatus and method for making thin-film batteries with soft and hard electrolyte layers
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) * 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7722929B2 (en) * 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7767498B2 (en) * 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7549905B2 (en) * 2005-09-30 2009-06-23 International Display Systems, Inc. Method of encapsulating an organic light emitting device
US7621794B2 (en) * 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
KR20080080154A (ko) * 2005-12-29 2008-09-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅 공정을 위한 물질의 분무화 방법
TWI314025B (en) * 2006-04-13 2009-08-21 Au Optronics Corp Method for fabricating active illumination apparatus
US8158450B1 (en) 2006-05-05 2012-04-17 Nanosolar, Inc. Barrier films and high throughput manufacturing processes for photovoltaic devices
US20070295389A1 (en) * 2006-05-05 2007-12-27 Nanosolar, Inc. Individually encapsulated solar cells and solar cell strings having a hybrid organic/inorganic protective layer
WO2008004180A2 (en) * 2006-07-03 2008-01-10 Koninklijke Philips Electronics N.V. Electrochemical energy source, electronic module and electronic device provided with such an electrochemical energy source
KR20090069323A (ko) 2006-09-29 2009-06-30 인피니트 파워 솔루션스, 인크. 가요성 기판의 마스킹 및 가요성 기판에 배터리 층을 증착하기 위한 재료의 구속
US7968146B2 (en) 2006-11-01 2011-06-28 The Trustees Of Princeton University Hybrid layers for use in coatings on electronic devices or other articles
WO2008057045A1 (en) * 2006-11-06 2008-05-15 Agency For Science, Technology And Research Nanoparticulate encapsulation barrier stack
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
WO2008082362A1 (en) * 2006-12-28 2008-07-10 Agency For Science, Technology And Research Encapsulated device with integrated gas permeation sensor
US20080265444A1 (en) * 2007-04-26 2008-10-30 Heetronix Thin-film aluminum nitride encapsulant for metallic structures on integrated circuits and method of forming same
US7862627B2 (en) * 2007-04-27 2011-01-04 Front Edge Technology, Inc. Thin film battery substrate cutting and fabrication process
KR100875099B1 (ko) * 2007-06-05 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
JP5296343B2 (ja) * 2007-07-31 2013-09-25 住友化学株式会社 バリア層つき基板、表示素子および表示素子の製造方法
KR100906284B1 (ko) * 2007-11-02 2009-07-06 주식회사 실트론 산소농도 특성이 개선된 반도체 단결정의 제조방법
US20090136839A1 (en) * 2007-11-28 2009-05-28 Front Edge Technology, Inc. Thin film battery comprising stacked battery cells and method
JP5258272B2 (ja) * 2007-11-30 2013-08-07 三菱電機株式会社 窒化物半導体装置およびその製造方法
WO2009079004A1 (en) * 2007-12-18 2009-06-25 Lumimove, Inc., Dba Crosslink Flexible electroluminescent devices and systems
CN101903560B (zh) 2007-12-21 2014-08-06 无穷动力解决方案股份有限公司 用于电解质膜的溅射靶的方法
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
EP2229706B1 (de) 2008-01-11 2014-12-24 Infinite Power Solutions, Inc. Dünnfilmeinkapselung für dünnfilmbatterien und andere geräte
US8420252B2 (en) * 2008-02-27 2013-04-16 Cymbet Corporation Battery layout incorporating full metal edge seal
JP5595377B2 (ja) 2008-04-02 2014-09-24 インフィニット パワー ソリューションズ， インコーポレイテッド エネルギー取入れに関連したエネルギー貯蔵デバイスに対する受動的過不足電圧の制御および保護
KR101563763B1 (ko) 2008-05-07 2015-10-27 더 트러스티즈 오브 프린스턴 유니버시티 전자 장치들 또는 다른 물품들 위의 코팅들에 사용하기 위한 혼성 층들
US8053984B2 (en) * 2008-05-26 2011-11-08 Lg Display Co., Ltd. Organic light emitting diode display
JP2012500610A (ja) 2008-08-11 2012-01-05 インフィニット パワー ソリューションズ， インコーポレイテッド 電磁エネルギー獲得ための統合コレクタ表面を有するエネルギーデバイスおよびその方法
KR101613671B1 (ko) 2008-09-12 2016-04-19 사푸라스트 리써치 엘엘씨 전자기 에너지에 의해 데이터 통신을 하는 통합 도전성 표면을 가진 에너지 장치 및 그 통신 방법
FR2936651B1 (fr) * 2008-09-30 2011-04-08 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
JP2010087339A (ja) * 2008-10-01 2010-04-15 Fujifilm Corp 有機太陽電池素子
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
JP2010093172A (ja) * 2008-10-10 2010-04-22 Fujifilm Corp 封止デバイス
US9337446B2 (en) * 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) * 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
TWI389271B (zh) * 2009-04-10 2013-03-11 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
DE102009018518A1 (de) 2009-04-24 2010-10-28 Tesa Se Transparente Barrierelaminate
US8823154B2 (en) * 2009-05-08 2014-09-02 The Regents Of The University Of California Encapsulation architectures for utilizing flexible barrier films
US20100285288A1 (en) * 2009-05-11 2010-11-11 Taiwan Green Point Enterprises Co., Ltd. Bonding method for hetero-materials and composite shell body made thereby
JP5650737B2 (ja) * 2009-07-31 2015-01-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 光起電力セル用の架橋性封止材
US8502494B2 (en) * 2009-08-28 2013-08-06 Front Edge Technology, Inc. Battery charging apparatus and method
KR101792287B1 (ko) 2009-09-01 2017-10-31 사푸라스트 리써치 엘엘씨 집적된 박막 배터리를 갖는 인쇄 회로 보드
EP2292339A1 (de) 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Beschichtungsverfahren und Beschichtungsvorrichtung
KR101117726B1 (ko) * 2009-12-15 2012-03-07 삼성모바일디스플레이주식회사 플렉서블 디스플레이용 기판, 이를 제조하는 방법, 및 이 기판제조방법을 이용한 유기 발광 디스플레이 장치의 제조 방법
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
JP5611811B2 (ja) 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
JP5290268B2 (ja) * 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
JP5611812B2 (ja) 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体、これを含む表示装置及び表示装置の製造方法
US8590338B2 (en) * 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US20110162705A1 (en) * 2010-01-06 2011-07-07 Popa Paul J Moisture resistant photovoltaic devices with elastomeric, polysiloxane protection layer
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
CN102947976B (zh) 2010-06-07 2018-03-16 萨普拉斯特研究有限责任公司 可充电、高密度的电化学设备
US9254506B2 (en) 2010-07-02 2016-02-09 3M Innovative Properties Company Moisture resistant coating for barrier films
TWI443784B (zh) 2010-07-29 2014-07-01 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
US8609980B2 (en) 2010-07-30 2013-12-17 E I Du Pont De Nemours And Company Cross-linkable ionomeric encapsulants for photovoltaic cells
TWI466243B (zh) * 2010-09-10 2014-12-21 Ind Tech Res Inst 環境敏感電子元件之封裝體及其封裝方法
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
JP5631728B2 (ja) * 2010-12-28 2014-11-26 株式会社アルバック 絶縁膜形成方法、及び絶縁膜形成装置
JP5631729B2 (ja) * 2010-12-28 2014-11-26 株式会社アルバック 半導体装置
CN102586730A (zh) * 2011-01-17 2012-07-18 鸿富锦精密工业（深圳）有限公司 镀膜件及其制备方法
JP6096126B2 (ja) * 2011-01-27 2017-03-15 ヴィトリフレックス・インコーポレーテッド 無機多層積層体並びにそれに関連する方法及び構成物
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
US8865340B2 (en) 2011-10-20 2014-10-21 Front Edge Technology Inc. Thin film battery packaging formed by localized heating
CN102427110B (zh) * 2011-12-02 2014-04-16 济南大学 多基元压电复合材料及其制备方法和应用
US9887429B2 (en) 2011-12-21 2018-02-06 Front Edge Technology Inc. Laminated lithium battery
US8864954B2 (en) 2011-12-23 2014-10-21 Front Edge Technology Inc. Sputtering lithium-containing material with multiple targets
WO2013102269A1 (en) 2012-01-05 2013-07-11 Electrovaya Inc. Thin film electrochemical cell with a polymer double seal
US9312511B2 (en) * 2012-03-16 2016-04-12 Universal Display Corporation Edge barrier film for electronic devices
US9077000B2 (en) 2012-03-29 2015-07-07 Front Edge Technology, Inc. Thin film battery and localized heat treatment
US9257695B2 (en) 2012-03-29 2016-02-09 Front Edge Technology, Inc. Localized heat treatment of battery component films
CN102629519B (zh) * 2012-04-25 2014-08-27 中国科学院化学研究所 一种超级电容器隔膜的制备方法
EP2685515A1 (de) * 2012-07-12 2014-01-15 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren und System zur Aufteilung einer Grenzfolie
US8963270B2 (en) * 2012-08-07 2015-02-24 Pu Ni Tai Neng (HangZhou) Co., Limited Fabrication of interconnected thin-film concentrator cells using shadow masks
US10784455B2 (en) 2012-08-08 2020-09-22 3M Innovative Properties Company Coatings for barrier films and methods of making and using the same
EP2882761B1 (de) 2012-08-08 2017-04-19 3M Innovative Properties Company Harnstoff(multi)-urethan(meth)acrylat-silanzusammensetzungen und artikel damit
BR112015002836A2 (pt) 2012-08-08 2018-04-24 3M Innovative Properties Co dispositivos fotovoltaicos com filme de barreira para encapsulação.
TWI501441B (zh) 2012-08-24 2015-09-21 Ind Tech Res Inst 非連續複合阻障層、其形成方法及包含其之封裝結構
KR102072799B1 (ko) * 2012-09-12 2020-02-04 삼성디스플레이 주식회사 유기 발광 장치 및 이의 제조 방법
US9159964B2 (en) 2012-09-25 2015-10-13 Front Edge Technology, Inc. Solid state battery having mismatched battery cells
US8753724B2 (en) 2012-09-26 2014-06-17 Front Edge Technology Inc. Plasma deposition on a partially formed battery through a mesh screen
US9356320B2 (en) 2012-10-15 2016-05-31 Front Edge Technology Inc. Lithium battery having low leakage anode
TWI497655B (zh) 2012-12-14 2015-08-21 Ind Tech Res Inst 環境敏感電子元件封裝體及其製作方法
US8912018B2 (en) 2012-12-17 2014-12-16 Universal Display Corporation Manufacturing flexible organic electronic devices
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
CN103904247A (zh) * 2012-12-25 2014-07-02 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
KR20140091346A (ko) * 2013-01-11 2014-07-21 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP6054763B2 (ja) 2013-02-12 2016-12-27 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
US9544997B2 (en) 2013-03-01 2017-01-10 Panasonic Corporation Multi-layered film, electronic device, and manufacturing methods thereof
US9368749B2 (en) 2013-03-12 2016-06-14 Samsung Sdi Co., Ltd. Patterned multilayered stack, and system and method for making the same
JP6139196B2 (ja) 2013-03-15 2017-05-31 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置及び有機エレクトロルミネッセンス表示装置の製造方法
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
CN104078579A (zh) * 2013-03-29 2014-10-01 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
CN104167507A (zh) * 2013-05-20 2014-11-26 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US20140370228A1 (en) * 2013-06-13 2014-12-18 Industrial Technology Research Institute Substrate structure
TWI504513B (zh) * 2013-08-02 2015-10-21 Innolux Corp 可撓性顯示裝置
JP6169439B2 (ja) 2013-08-21 2017-07-26 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置及びその製造方法
JP2015050022A (ja) 2013-08-30 2015-03-16 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
JP6189692B2 (ja) 2013-09-25 2017-08-30 株式会社ジャパンディスプレイ Ｏｌｅｄ表示パネル
JP2015109192A (ja) 2013-12-04 2015-06-11 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
DE102013226594A1 (de) * 2013-12-19 2015-06-25 Robert Bosch Gmbh Verfahren zum Herstellen eines Laufrads und eines Läufers
US20150252125A1 (en) * 2014-03-10 2015-09-10 Cheil Industries Inc. Curable resin compositions and barrier stacks including the same
KR102369298B1 (ko) * 2014-04-29 2022-03-03 삼성디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조방법
US20150346050A1 (en) * 2014-05-30 2015-12-03 Samsung Sdi Co., Ltd. Multilayer encapsulation with integrated gas permeation sensor
KR20160000192A (ko) * 2014-06-24 2016-01-04 코오롱인더스트리 주식회사 태양전지 모듈 패키지 및 그 제조방법
JP2016018849A (ja) 2014-07-07 2016-02-01 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
EP3186319A4 (de) 2014-07-25 2018-04-18 Kateeva, Inc. Tintenzusammensetzungen für organische dünnschicht und verfahren
JP6453579B2 (ja) 2014-08-08 2019-01-16 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
JP6307384B2 (ja) 2014-08-11 2018-04-04 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
JP6486033B2 (ja) * 2014-08-21 2019-03-20 東京エレクトロン株式会社 有機ｅｌ素子封止膜の形成方法
DE102014013262A1 (de) * 2014-09-08 2016-03-10 Schott Ag Vorrichtung und Verfahren zum Durchtrennen von mit einer Geschwindigkeit bewegten Werkstücken mechanisch spröder und nichtmetallischer Werkstoffe
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
US10008739B2 (en) 2015-02-23 2018-06-26 Front Edge Technology, Inc. Solid-state lithium battery with electrolyte
KR20180048690A (ko) 2015-08-31 2018-05-10 카티바, 인크. 디- 및 모노(메트)아크릴레이트 기초 유기 박막 잉크 조성물
KR102409060B1 (ko) 2015-09-11 2022-06-16 삼성디스플레이 주식회사 표시 장치
CN105552247B (zh) * 2015-12-08 2018-10-26 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
KR102474203B1 (ko) 2015-12-22 2022-12-06 삼성디스플레이 주식회사 디스플레이 장치 제조방법 및 이에 따라 제조된 디스플레이 장치
JP2017152256A (ja) 2016-02-25 2017-08-31 株式会社ジャパンディスプレイ 表示装置
JP6792950B2 (ja) 2016-03-17 2020-12-02 株式会社ジャパンディスプレイ 表示装置
KR102524535B1 (ko) 2016-03-29 2023-04-24 삼성디스플레이 주식회사 디스플레이 장치
US11679412B2 (en) 2016-06-13 2023-06-20 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
US20170358445A1 (en) 2016-06-13 2017-12-14 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
CN106711354A (zh) * 2016-12-02 2017-05-24 武汉华星光电技术有限公司 有机半导体器件的封装方法
JP2018181433A (ja) 2017-04-04 2018-11-15 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置及びその製造方法
WO2018195066A2 (en) 2017-04-21 2018-10-25 Kateeva, Inc. Compositions and techniques for forming organic thin films
US10637101B2 (en) 2017-05-03 2020-04-28 International Business Machines Corporation Miniaturized electronics package with patterned thin film solid state battery
CN107063829B (zh) * 2017-05-24 2023-07-25 华中科技大学 一种哑铃状样本制备模具以及样本聚合方法
CN107482129A (zh) * 2017-07-25 2017-12-15 武汉华星光电半导体显示技术有限公司 有机电致发光器件的封装方法、封装结构及显示装置
FR3069701B1 (fr) * 2017-07-31 2019-12-20 Centre National De La Recherche Scientifique Masque perfectionne de protection d'un materiau semiconducteur pour des applications de gravure localisee
KR102495845B1 (ko) 2017-12-26 2023-02-06 삼성디스플레이 주식회사 디스플레이 장치
US20190229299A1 (en) * 2018-01-24 2019-07-25 Wuhan China Star Optoelecronics Semiconductor Display Technology Co., LTd. Thin-film packaging method for an oled device and oled device
CN108305954B (zh) * 2018-01-24 2020-07-31 武汉华星光电半导体显示技术有限公司 Oled器件的薄膜封装方法及oled器件
US10811330B1 (en) 2018-02-02 2020-10-20 Verily Life Sciences Llc Miniaturized electronic devices and related methods
CN108400257B (zh) * 2018-03-02 2020-06-05 京东方科技集团股份有限公司 显示面板及其制备方法和显示装置
EP3762989A4 (de) 2018-03-07 2021-12-15 Space Charge, LLC Dünnfilm-festkörper-energiespeichervorrichtungen
US10957886B2 (en) 2018-03-14 2021-03-23 Front Edge Technology, Inc. Battery having multilayer protective casing
US11085111B2 (en) * 2018-10-11 2021-08-10 The Boeing Company Laminate composite structural components and methods for the same
US10923680B2 (en) 2018-10-11 2021-02-16 The Boeing Company Multifunctional composite panels and methods for the same
KR20200119454A (ko) 2019-04-09 2020-10-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR20200119452A (ko) 2019-04-09 2020-10-20 삼성디스플레이 주식회사 디스플레이 장치
KR20200128309A (ko) 2019-05-03 2020-11-12 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
JP2021034261A (ja) 2019-08-27 2021-03-01 株式会社ジャパンディスプレイ 表示装置
US11539088B2 (en) 2020-03-09 2022-12-27 International Business Machines Corporation Ultra-thin microbattery packaging and handling
US11735791B2 (en) * 2020-04-10 2023-08-22 Ensurge Micropower Asa Solid-state battery and method of making the same
JP2023018774A (ja) * 2021-07-28 2023-02-09 株式会社リコー 光電変換素子、電子機器、及び電源モジュール

Family Cites Families (349)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US85652A (en) * 1869-01-05 Improvement in corn-planters
US125822A (en) * 1872-04-16 Improvement in straw-cutters
US38590A (en) * 1863-05-19 Improved machine for boring and mortising blind-stiles
US98647A (en) * 1870-01-04 Improvement in wheeled harrows
US15620A (en) * 1856-08-26 John robertson
US127973A (en) * 1872-06-18 Improvement in screens for coal-gas purifiers
US140347A (en) * 1873-07-01 Improvement in drop-lights for chandeliers
US2382432A (en) 1940-08-02 1945-08-14 Crown Cork & Seal Co Method and apparatus for depositing vaporized metal coatings
US2384500A (en) 1942-07-08 1945-09-11 Crown Cork & Seal Co Apparatus and method of coating
US3475307A (en) 1965-02-04 1969-10-28 Continental Can Co Condensation of monomer vapors to increase polymerization rates in a glow discharge
FR1393629A (fr) 1965-09-13 1965-03-26 Continental Oil Co Procédé et appareil pour enduire des feuilles en matières solides
US3496427A (en) 1966-01-13 1970-02-17 Gen Electric Semiconductor device with composite encapsulation
US3607365A (en) 1969-05-12 1971-09-21 Minnesota Mining & Mfg Vapor phase method of coating substrates with polymeric coating
US3661117A (en) 1969-12-03 1972-05-09 Stanford Research Inst Apparatus for depositing thin lines
US3941630A (en) * 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
US4055530A (en) 1975-02-27 1977-10-25 Standard Oil Company (Indiana) Aqueous dispersion of addition polymer of an alpha-beta-ethylenically unsaturated monomer and suspended polypropylene particles
US4098965A (en) 1977-01-24 1978-07-04 Polaroid Corporation Flat batteries and method of making the same
US4266223A (en) 1978-12-08 1981-05-05 W. H. Brady Co. Thin panel display
JPS55129345A (en) 1979-03-29 1980-10-07 Ulvac Corp Electron beam plate making method by vapor phase film formation and vapor phase development
US4313254A (en) * 1979-10-30 1982-02-02 The Johns Hopkins University Thin-film silicon solar cell with metal boride bottom electrode
US4581337A (en) 1983-07-07 1986-04-08 E. I. Du Pont De Nemours And Company Polyether polyamines as linking agents for particle reagents useful in immunoassays
US4426275A (en) 1981-11-27 1984-01-17 Deposition Technology, Inc. Sputtering device adaptable for coating heat-sensitive substrates
JPS58156848A (ja) 1982-03-15 1983-09-17 Fuji Photo Film Co Ltd イオン選択電極及びその製造法
JPS5980095A (ja) 1982-10-30 1984-05-09 Matsushita Electric Works Ltd 遠隔調光制御システム
JPS59138440A (ja) 1983-01-27 1984-08-08 豊田合成株式会社 セラミツクス被膜層を有する樹脂成形体
US4521458A (en) 1983-04-01 1985-06-04 Nelson Richard C Process for coating material with water resistant composition
JPS6010498A (ja) 1983-06-30 1985-01-19 Asahi Glass Co Ltd シフトレジスタ
DE3324106A1 (de) 1983-07-05 1985-01-17 Draiswerke Gmbh, 6800 Mannheim Verfahren zum beleimen von holz-spaenen und dergl. mit fluessigleim und vorrichtung zur durchfuehrung des verfahrens
US4710426A (en) 1983-11-28 1987-12-01 Polaroid Corporation, Patent Dept. Solar radiation-control articles with protective overlayer
US4557978A (en) 1983-12-12 1985-12-10 Primary Energy Research Corporation Electroactive polymeric thin films
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
US4842893A (en) 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
DE3484793D1 (de) 1983-12-19 1991-08-14 Spectrum Control Inc Miniaturisierter monolithischer mehrschichtkondensator sowie geraet und verfahren zur herstellung.
DE3571772D1 (en) 1984-03-21 1989-08-31 Ulvac Corp Improvements in or relating to the covering of substrates with synthetic resin films
DE3427057A1 (de) * 1984-07-23 1986-01-23 Standard Elektrik Lorenz Ag, 7000 Stuttgart Anlage zum herstellen von halbleiter-schichtstrukturen durch epitaktisches wachstum
JPH0128819Y2 (de) 1984-10-27 1989-09-01
US4722515A (en) 1984-11-06 1988-02-02 Spectrum Control, Inc. Atomizing device for vaporization
US4695618A (en) 1986-05-23 1987-09-22 Ameron, Inc. Solventless polyurethane spray compositions and method for applying them
US4954371A (en) 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
WO1987007848A1 (en) 1986-06-23 1987-12-30 Spectrum Control, Inc. Flash evaporation of monomer fluids
JPH0519120Y2 (de) 1986-12-16 1993-05-20
JPS63136316U (de) 1987-02-26 1988-09-07
DE3707214A1 (de) 1987-03-06 1988-09-15 Hoechst Ag Beschichtete kunststoffolie und daraus hergestelltes kunststofflaminat
US4768666A (en) 1987-05-26 1988-09-06 Milton Kessler Tamper proof container closure
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
US4847469A (en) 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
JPS6441192U (de) 1987-09-04 1989-03-13
JPH0193129A (ja) * 1987-10-02 1989-04-12 Mitsubishi Electric Corp 化学気相成長装置
GB2210826B (en) 1987-10-19 1992-08-12 Bowater Packaging Ltd Barrier packaging materials
JPH01210092A (ja) 1988-02-18 1989-08-23 Sonitsuku Fueroo Kk 精密洗浄の乾燥方法
US4931158A (en) 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
US4977013A (en) 1988-06-03 1990-12-11 Andus Corporation Tranparent conductive coatings
JP2742057B2 (ja) 1988-07-14 1998-04-22 シャープ株式会社 薄膜ｅｌパネル
US4889609A (en) 1988-09-06 1989-12-26 Ovonic Imaging Systems, Inc. Continuous dry etching system
JPH02183230A (ja) 1989-01-09 1990-07-17 Sharp Corp 有機非線形光学材料及びその製造方法
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
JP2678055B2 (ja) 1989-03-30 1997-11-17 シャープ株式会社 有機化合物薄膜の製法
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
US5047131A (en) 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
US5036249A (en) 1989-12-11 1991-07-30 Molex Incorporated Electroluminescent lamp panel and method of fabricating same
JPH03183759A (ja) 1989-12-12 1991-08-09 Toyobo Co Ltd 積層プラスチックフイルムおよびその製造方法
CA2038117A1 (en) 1990-03-29 1991-09-30 Mahfuza B. Ali Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith
JPH03290375A (ja) 1990-04-09 1991-12-20 Sumitomo Electric Ind Ltd 被覆炭素繊維強化複合材料
US5711816A (en) 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5204314A (en) 1990-07-06 1993-04-20 Advanced Technology Materials, Inc. Method for delivering an involatile reagent in vapor form to a CVD reactor
US5047687A (en) 1990-07-26 1991-09-10 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
US5059861A (en) 1990-07-26 1991-10-22 Eastman Kodak Company Organic electroluminescent device with stabilizing cathode capping layer
FR2666190B1 (fr) 1990-08-24 1996-07-12 Thomson Csf Procede et dispositif d'encapsulation hermetique de composants electroniques.
JP2793048B2 (ja) 1991-02-22 1998-09-03 三井化学株式会社 有機発光素子の封止方法
US5481337A (en) * 1991-05-13 1996-01-02 Canon Kabushiki Kaisha Method and apparatus for correcting image formation in accordance with a potential measurement and a density measurement selected along an axial direction of a photosensitive drum
JP2755844B2 (ja) 1991-09-30 1998-05-25 シャープ株式会社 プラスチック基板液晶表示素子
JP3359649B2 (ja) 1991-11-27 2002-12-24 東洋アルミニウム株式会社 高防湿静電破壊防止袋
US5336324A (en) 1991-12-04 1994-08-09 Emcore Corporation Apparatus for depositing a coating on a substrate
US5372851A (en) 1991-12-16 1994-12-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chemically adsorbed film
US5203898A (en) 1991-12-16 1993-04-20 Corning Incorporated Method of making fluorine/boron doped silica tubes
JPH05182759A (ja) 1991-12-26 1993-07-23 Pioneer Video Corp 有機ｅｌ素子
US5759329A (en) 1992-01-06 1998-06-02 Pilot Industries, Inc. Fluoropolymer composite tube and method of preparation
US5393607A (en) * 1992-01-13 1995-02-28 Mitsui Toatsu Chemiclas, Inc. Laminated transparent plastic material and polymerizable monomer
US5402314A (en) * 1992-02-10 1995-03-28 Sony Corporation Printed circuit board having through-hole stopped with photo-curable solder resist
JP3203623B2 (ja) 1992-03-06 2001-08-27 ソニー株式会社 有機電解液電池
JP2958186B2 (ja) 1992-04-20 1999-10-06 シャープ株式会社 プラスチック基板液晶表示素子
US5427638A (en) 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
US5652192A (en) 1992-07-10 1997-07-29 Battelle Memorial Institute Catalyst material and method of making
GB9215928D0 (en) 1992-07-27 1992-09-09 Cambridge Display Tech Ltd Manufacture of electroluminescent devices
US5260095A (en) 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
DE4232390A1 (de) 1992-09-26 1994-03-31 Roehm Gmbh Verfahren zum Erzeugen von siliciumoxidischen kratzfesten Schichten auf Kunststoffen durch Plasmabeschichtung
JPH06111936A (ja) 1992-09-29 1994-04-22 Nec Kansai Ltd 電界発光灯の製造方法
JPH06136159A (ja) 1992-10-27 1994-05-17 Kanegafuchi Chem Ind Co Ltd 透明導電性フィルムおよびその製造法
JPH06182935A (ja) 1992-12-18 1994-07-05 Bridgestone Corp ガスバリア性ゴム積層物及びその製造方法
JPH06223966A (ja) 1993-01-28 1994-08-12 Toshiba Corp 有機分散型ｅｌパネル
GB9311092D0 (en) 1993-01-28 1993-07-14 Du Pont Int Extrusion process
EP0608620B1 (de) * 1993-01-28 1996-08-14 Applied Materials, Inc. Vorrichtung für ein Vakuumverfahren mit verbessertem Durchsatz
DE69426227T2 (de) * 1993-05-17 2001-03-29 Kyoei Automatic Control Techno Messung eines dynamischen Gewichts mit einer zwangsbewegten Grundplatte
DE4321537A1 (de) * 1993-06-29 1995-01-12 Happich Gmbh Gebr Dachreling für Fahrzeuge
US5357063A (en) 1993-07-12 1994-10-18 Battelle Memorial Institute Method and apparatus for acoustic energy identification of objects buried in soil
US5510173A (en) * 1993-08-20 1996-04-23 Southwall Technologies Inc. Multiple layer thin films with improved corrosion resistance
KR100241470B1 (ko) 1993-10-04 2000-02-01 지. 쇼 데이비드 커패시터 유전체 및 산소 배리어의 형성에 유용한 가교 결합된 아크릴레이트 코팅 물질
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
US20040241454A1 (en) 1993-10-04 2004-12-02 Shaw David G. Barrier sheet and method of making same
JPH07147189A (ja) 1993-11-25 1995-06-06 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
JPH07192866A (ja) 1993-12-26 1995-07-28 Ricoh Co Ltd 有機薄膜型電界発光素子
JP2846571B2 (ja) 1994-02-25 1999-01-13 出光興産株式会社 有機エレクトロルミネッセンス素子
US5451449A (en) 1994-05-11 1995-09-19 The Mearl Corporation Colored iridescent film
US5934856A (en) 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
US5795399A (en) 1994-06-30 1998-08-18 Kabushiki Kaisha Toshiba Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product
US5654084A (en) 1994-07-22 1997-08-05 Martin Marietta Energy Systems, Inc. Protective coatings for sensitive materials
US5464667A (en) 1994-08-16 1995-11-07 Minnesota Mining And Manufacturing Company Jet plasma process and apparatus
TW295677B (de) 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3385292B2 (ja) 1994-09-02 2003-03-10 株式会社クラレ 多層構造体およびその用途
JP3274292B2 (ja) 1994-09-30 2002-04-15 富士写真フイルム株式会社 カセット用収納ケース
US6087007A (en) 1994-09-30 2000-07-11 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Heat-Resistant optical plastic laminated sheet and its producing method
DE4438359C2 (de) 1994-10-27 2001-10-04 Schott Glas Behälter aus Kunststoff mit einer Sperrbeschichtung
US6083628A (en) 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
JPH08171988A (ja) 1994-12-20 1996-07-02 Showa Shell Sekiyu Kk エレクトロルミネッセンス素子
JP3565929B2 (ja) 1994-12-27 2004-09-15 大日本印刷株式会社 液晶表示素子用プラスチック基板
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
JPH08203669A (ja) 1995-01-30 1996-08-09 Seikosha Co Ltd Ｅｌ両面発光表示体
JP3531259B2 (ja) * 1995-02-21 2004-05-24 三菱瓦斯化学株式会社 ラベル型脱酸素剤
US5620524A (en) 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
US5877895A (en) 1995-03-20 1999-03-02 Catalina Coatings, Inc. Multicolor interference coating
US5811183A (en) 1995-04-06 1998-09-22 Shaw; David G. Acrylate polymer release coated sheet materials and method of production thereof
GB9507862D0 (en) 1995-04-18 1995-05-31 Cambridge Display Tech Ltd Fabrication of organic light-emitting devices
GB9507817D0 (en) 1995-04-18 1995-05-31 Philips Electronics Uk Ltd Touch sensing devices and methods of making such
US5771562A (en) 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
US5554220A (en) 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
JPH08325713A (ja) 1995-05-30 1996-12-10 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5629389A (en) 1995-06-06 1997-05-13 Hewlett-Packard Company Polymer-based electroluminescent device with improved stability
RU2163246C2 (ru) 1995-06-30 2001-02-20 Коммонвелт Сайентифик Энд Индастриал Рисерч Организейшн Способ модификации, по меньшей мере, части поверхности полимера
US5681615A (en) 1995-07-27 1997-10-28 Battelle Memorial Institute Vacuum flash evaporated polymer composites
JPH0959763A (ja) 1995-08-25 1997-03-04 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5723219A (en) 1995-12-19 1998-03-03 Talison Research Plasma deposited film networks
DE19603746A1 (de) 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem
WO1997016053A1 (de) 1995-10-20 1997-05-01 Robert Bosch Gmbh Elektrolumineszierendes schichtsystem
JP3533790B2 (ja) 1995-11-10 2004-05-31 富士電機ホールディングス株式会社 有機薄膜発光素子
JP3484891B2 (ja) 1995-11-21 2004-01-06 三菱化学株式会社 ガスバリア性オレフィン系樹脂積層体
US5811177A (en) * 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5684084A (en) 1995-12-21 1997-11-04 E. I. Du Pont De Nemours And Company Coating containing acrylosilane polymer to improve mar and acid etch resistance
US6195142B1 (en) * 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
US5660961A (en) 1996-01-11 1997-08-26 Xerox Corporation Electrophotographic imaging member having enhanced layer adhesion and freedom from reflection interference
US5738920A (en) 1996-01-30 1998-04-14 Becton, Dickinson And Company Blood collection tube assembly
US5955161A (en) 1996-01-30 1999-09-21 Becton Dickinson And Company Blood collection tube assembly
US5683771A (en) 1996-01-30 1997-11-04 Becton, Dickinson And Company Blood collection tube assembly
US5763033A (en) 1996-01-30 1998-06-09 Becton, Dickinson And Company Blood collection tube assembly
TW434301B (en) 1996-01-30 2001-05-16 Becton Dickinson Co Non-ideal barrier coating composition comprising organic and inorganic materials
US5716683A (en) 1996-01-30 1998-02-10 Becton, Dickinson And Company Blood collection tube assembly
US6106627A (en) 1996-04-04 2000-08-22 Sigma Laboratories Of Arizona, Inc. Apparatus for producing metal coated polymers
US5731948A (en) 1996-04-04 1998-03-24 Sigma Labs Inc. High energy density capacitor
JPH10725A (ja) 1996-06-18 1998-01-06 Toppan Printing Co Ltd 包装用ガスバリア積層体
JPH1013083A (ja) 1996-06-27 1998-01-16 Tosoh Corp 電磁波吸収体
US5731661A (en) 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5902688A (en) 1996-07-16 1999-05-11 Hewlett-Packard Company Electroluminescent display device
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
US5948552A (en) 1996-08-27 1999-09-07 Hewlett-Packard Company Heat-resistant organic electroluminescent device
WO1998010116A1 (en) 1996-09-05 1998-03-12 Talison Research Ultrasonic nozzle feed for plasma deposited film networks
US5861658A (en) 1996-10-03 1999-01-19 International Business Machines Corporation Inorganic seal for encapsulation of an organic layer and method for making the same
KR19980033213A (ko) 1996-10-31 1998-07-25 조셉제이.스위니 스퍼터링 챔버내의 미립자 물질 발생 감소 방법
US5895228A (en) * 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
US5821692A (en) 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US5912069A (en) 1996-12-19 1999-06-15 Sigma Laboratories Of Arizona Metal nanolaminate composite
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US5872355A (en) 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
US6117266A (en) 1997-12-19 2000-09-12 Interuniversifair Micro-Elektronica Cenirum (Imec Vzw) Furnace for continuous, high throughput diffusion processes from various diffusion sources
US6027239A (en) * 1997-04-30 2000-02-22 Endevco Corporation On-board engine trim balance display and interface
JP3290375B2 (ja) 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
US5920080A (en) 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US6198220B1 (en) 1997-07-11 2001-03-06 Emagin Corporation Sealing structure for organic light emitting devices
JP3743876B2 (ja) 1997-07-16 2006-02-08 カシオ計算機株式会社 電界発光素子及びその製造方法
FR2766200B1 (fr) 1997-07-17 1999-09-24 Toray Plastics Europ Sa Films polyester composites metallises a proprietes barriere
JPH1145779A (ja) 1997-07-25 1999-02-16 Tdk Corp 有機ｅｌ素子の製造方法および装置
US6512561B1 (en) 1997-08-29 2003-01-28 Sharp Kabushiki Kaisha Liquid crystal display with at least one phase compensation element
US6203898B1 (en) * 1997-08-29 2001-03-20 3M Innovatave Properties Company Article comprising a substrate having a silicone coating
US6224948B1 (en) * 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US5994174A (en) 1997-09-29 1999-11-30 The Regents Of The University Of California Method of fabrication of display pixels driven by silicon thin film transistors
US5965907A (en) 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
US5902641A (en) 1997-09-29 1999-05-11 Battelle Memorial Institute Flash evaporation of liquid monomer particle mixture
US6469437B1 (en) 1997-11-03 2002-10-22 The Trustees Of Princeton University Highly transparent organic light emitting device employing a non-metallic cathode
DE69813144T2 (de) 1997-11-07 2003-12-04 Rohm & Haas Kunstoffsubstrate zur Verwendung in elektronischen Anzeigesystemen
US6194487B1 (en) 1997-11-14 2001-02-27 Sharp Kabushiki Kaisha Method of manufacturing modified particles
JP3400324B2 (ja) 1997-11-17 2003-04-28 住友ベークライト株式会社 導電性フィルム
KR100249784B1 (ko) * 1997-11-20 2000-04-01 정선종 고분자복합막을이용한유기물혹은고분자전기발광소자의패키징방법
US6045864A (en) 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
EP1044104B1 (de) 1997-12-31 2005-05-11 Kimberly-Clark Worldwide, Inc. Atmungsfähige folien mit mikroschichten aus zersetzbaren kunststoffen und thermoplastischen elastomeren
US6569515B2 (en) 1998-01-13 2003-05-27 3M Innovative Properties Company Multilayered polymer films with recyclable or recycled layers
DE19802740A1 (de) 1998-01-26 1999-07-29 Leybold Systems Gmbh Verfahren zur Behandlung von Oberflächen von Substraten aus Kunststoff
US6178082B1 (en) 1998-02-26 2001-01-23 International Business Machines Corporation High temperature, conductive thin film diffusion barrier for ceramic/metal systems
US5996498A (en) 1998-03-12 1999-12-07 Presstek, Inc. Method of lithographic imaging with reduced debris-generated performance degradation and related constructions
US6004660A (en) 1998-03-12 1999-12-21 E.I. Du Pont De Nemours And Company Oxygen barrier composite film structure
US6066826A (en) 1998-03-16 2000-05-23 Yializis; Angelo Apparatus for plasma treatment of moving webs
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
GB2335884A (en) 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
US6361885B1 (en) 1998-04-10 2002-03-26 Organic Display Technology Organic electroluminescent materials and device made from such materials
US6146462A (en) 1998-05-08 2000-11-14 Astenjohnson, Inc. Structures and components thereof having a desired surface characteristic together with methods and apparatuses for producing the same
DE29811905U1 (de) * 1998-07-03 1998-11-26 Uzin Utz Ag Fußbodenaufbau
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
US6635989B1 (en) 1998-08-03 2003-10-21 E. I. Du Pont De Nemours And Company Encapsulation of polymer-based solid state devices with inorganic materials
US6352777B1 (en) 1998-08-19 2002-03-05 The Trustees Of Princeton University Organic photosensitive optoelectronic devices with transparent electrodes
US6040017A (en) 1998-10-02 2000-03-21 Sigma Laboratories, Inc. Formation of multilayered photonic polymer composites
US6084702A (en) 1998-10-15 2000-07-04 Pleotint, L.L.C. Thermochromic devices
WO2000026973A1 (en) 1998-11-02 2000-05-11 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
US6322860B1 (en) 1998-11-02 2001-11-27 Rohm And Haas Company Plastic substrates for electronic display applications
US6837950B1 (en) * 1998-11-05 2005-01-04 Interface, Inc. Separation of floor covering components for recycling
US6207238B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition for high and/or low index of refraction polymers
US6228436B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making light emitting polymer composite material
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6217947B1 (en) 1998-12-16 2001-04-17 Battelle Memorial Institute Plasma enhanced polymer deposition onto fixtures
TW439308B (en) * 1998-12-16 2001-06-07 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6228434B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6274204B1 (en) 1998-12-16 2001-08-14 Battelle Memorial Institute Method of making non-linear optical polymer
US6207239B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition of conjugated polymer
AU1669400A (en) 1998-12-17 2000-07-03 Cambridge Display Technology Limited Organic light-emitting devices
US6670438B1 (en) 1998-12-18 2003-12-30 The Regents Of The University Of California Methods, compositions, and biomimetic catalysts for in vitro synthesis of silica, polysilsequioxane, polysiloxane, and polymetallo-oxanes
WO2001087825A1 (en) 2000-04-04 2001-11-22 The Regents Of The University Of California Methods, compositions and bi-functional catalysts for synthesis of silica, glass, silicones
JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機ｅｌ素子
JP3817081B2 (ja) * 1999-01-29 2006-08-30 パイオニア株式会社 有機ｅｌ素子の製造方法
US6118218A (en) 1999-02-01 2000-09-12 Sigma Technologies International, Inc. Steady-state glow-discharge plasma at atmospheric pressure
US6172810B1 (en) 1999-02-26 2001-01-09 3M Innovative Properties Company Retroreflective articles having polymer multilayer reflective coatings
US6358570B1 (en) * 1999-03-31 2002-03-19 Battelle Memorial Institute Vacuum deposition and curing of oligomers and resins
CN1348609A (zh) * 1999-04-28 2002-05-08 E·I·内穆尔杜邦公司 具有改进的抗氧和抗湿降解性的挠性有机电子器件
JP4261680B2 (ja) 1999-05-07 2009-04-30 株式会社クレハ 防湿性多層フィルム
JP2000354477A (ja) * 1999-06-14 2000-12-26 Mitsubishi Gas Chem Co Inc 耐マイクロ波性脱酸素剤包装体
US6387732B1 (en) * 1999-06-18 2002-05-14 Micron Technology, Inc. Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
US6083313A (en) 1999-07-27 2000-07-04 Advanced Refractory Technologies, Inc. Hardcoats for flat panel display substrates
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6548912B1 (en) * 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6460369B2 (en) 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
JP2001249221A (ja) 1999-12-27 2001-09-14 Nitto Denko Corp 透明積層体とその製造方法およびプラズマデイスプレイパネル用フイルタ
JP2001295388A (ja) * 2000-04-10 2001-10-26 Dainippon Printing Co Ltd 断熱性シートおよび断熱性部材
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
US20020003403A1 (en) * 2000-04-25 2002-01-10 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
US6465953B1 (en) 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6416872B1 (en) 2000-08-30 2002-07-09 Cp Films, Inc. Heat reflecting film with low visible reflectance
US7094690B1 (en) 2000-08-31 2006-08-22 Micron Technology, Inc. Deposition methods and apparatuses providing surface activation
JP4608182B2 (ja) 2000-09-06 2011-01-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｏｌｅｄデバイスのカプセル化
CN1341644A (zh) 2000-09-07 2002-03-27 上海博德基因开发有限公司 一种新的多肽——人核内非均－核蛋白32.01和编码这种多肽的多核苷酸
EP1209252A3 (de) 2000-09-15 2002-11-27 Shipley Co. L.L.C. Vorrichtung zum kontinuierlichen Beschichten
JP2002100469A (ja) * 2000-09-25 2002-04-05 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6541098B2 (en) 2000-12-22 2003-04-01 Avery Dennison Corporation Three-dimensional flexible adhesive film structures
JP4856308B2 (ja) 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
CN101397649B (zh) 2001-02-01 2011-12-28 株式会社半导体能源研究所 能够将有机化合物沉积在衬底上的装置
US6614057B2 (en) * 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US6468595B1 (en) 2001-02-13 2002-10-22 Sigma Technologies International, Inc. Vaccum deposition of cationic polymer systems
WO2002071506A1 (en) 2001-02-15 2002-09-12 Emagin Corporation Thin film encapsulation of organic light emitting diode devices
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6881447B2 (en) 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
US6624568B2 (en) * 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
TWI222838B (en) * 2001-04-10 2004-10-21 Chi Mei Optoelectronics Corp Packaging method of organic electroluminescence light-emitting display device
JP2002343580A (ja) 2001-05-11 2002-11-29 Pioneer Electronic Corp 発光ディスプレイ装置及びその製造方法
JP3678361B2 (ja) 2001-06-08 2005-08-03 大日本印刷株式会社 ガスバリアフィルム
US6397776B1 (en) 2001-06-11 2002-06-04 General Electric Company Apparatus for large area chemical vapor deposition using multiple expanding thermal plasma generators
KR100413450B1 (ko) * 2001-07-20 2003-12-31 엘지전자 주식회사 표시소자의 보호막 구조
CN1317421C (zh) 2001-08-20 2007-05-23 诺华等离子公司 气体和蒸气低渗透性的涂层
US6888307B2 (en) 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
JP2003077651A (ja) * 2001-08-30 2003-03-14 Sharp Corp 有機エレクトロルミネッセンス素子の製造方法
US6803245B2 (en) 2001-09-28 2004-10-12 Osram Opto Semiconductors Gmbh Procedure for encapsulation of electronic devices
US6737753B2 (en) 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
TW519853B (en) * 2001-10-17 2003-02-01 Chi Mei Electronic Corp Organic electro-luminescent display and its packaging method
US6888305B2 (en) 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
US6948448B2 (en) * 2001-11-27 2005-09-27 General Electric Company Apparatus and method for depositing large area coatings on planar surfaces
US6681716B2 (en) 2001-11-27 2004-01-27 General Electric Company Apparatus and method for depositing large area coatings on non-planar surfaces
US6765351B2 (en) * 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
KR100472502B1 (ko) 2001-12-26 2005-03-08 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
US7012363B2 (en) 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US7112351B2 (en) 2002-02-26 2006-09-26 Sion Power Corporation Methods and apparatus for vacuum thin film deposition
JP2003258189A (ja) * 2002-03-01 2003-09-12 Toshiba Corp 半導体装置及びその製造方法
JP2003253434A (ja) 2002-03-01 2003-09-10 Sanyo Electric Co Ltd 蒸着方法及び表示装置の製造方法
JP2003272827A (ja) 2002-03-13 2003-09-26 Matsushita Electric Ind Co Ltd 有機発光素子及びその製造方法
JP4180831B2 (ja) 2002-03-25 2008-11-12 パイオニア株式会社 有機エレクトロルミネッセンス表示パネル及び製造方法
JP2003292394A (ja) * 2002-03-29 2003-10-15 Canon Inc 液相成長方法および液相成長装置
US6891330B2 (en) * 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
US20050174045A1 (en) 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US6897474B2 (en) * 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
NL1020635C2 (nl) 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het vervaardigen van een polymere OLED.
NL1020634C2 (nl) * 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het passiveren van een halfgeleider substraat.
US6743524B2 (en) 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
KR100477745B1 (ko) 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널
US7221093B2 (en) 2002-06-10 2007-05-22 Institute Of Materials Research And Engineering Patterning of electrodes in OLED devices
DE10230607A1 (de) 2002-07-08 2004-02-05 Abb Patent Gmbh Verfahren zur Überwachung einer Messeinrichtung, insbesondere einer Durchflussmesseinrichtung, sowie eine Messeinrichtung selbst
JP4130555B2 (ja) 2002-07-18 2008-08-06 住友精密工業株式会社 ガス加湿装置
US6734625B2 (en) * 2002-07-30 2004-05-11 Xerox Corporation Organic light emitting device (OLED) with multiple capping layers passivation region on an electrode
US6710542B2 (en) * 2002-08-03 2004-03-23 Agilent Technologies, Inc. Organic light emitting device with improved moisture seal
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
TWI236862B (en) 2002-09-03 2005-07-21 Au Optronics Corp Package for OLED device
US8704211B2 (en) * 2004-06-30 2014-04-22 General Electric Company High integrity protective coatings
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US20040229051A1 (en) 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US6994933B1 (en) * 2002-09-16 2006-02-07 Oak Ridge Micro-Energy, Inc. Long life thin film battery and method therefor
US7056584B2 (en) * 2002-10-11 2006-06-06 General Electric Company Bond layer for coatings on plastic substrates
JP3953404B2 (ja) 2002-10-21 2007-08-08 インターナショナル・ビジネス・マシーンズ・コーポレーション 有機エレクトロ・ルミネッセンス素子、該有機エレクトロ・ルミネッセンス素子の製造方法、および有機エレクトロ・ルミネッセンス表示装置
US7086918B2 (en) 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7338820B2 (en) 2002-12-19 2008-03-04 3M Innovative Properties Company Laser patterning of encapsulated organic light emitting diodes
NL1022269C2 (nl) 2002-12-24 2004-06-25 Otb Group Bv Werkwijze voor het vervaardigen van een organic electroluminescent display device, substraat ten gebruike bij een dergelijke werkwijze, alsmede een organic electroluminescent display device verkregen met de werkwijze.
WO2004061993A2 (en) 2002-12-27 2004-07-22 Add-Vision, Inc. Method for encapsulation of light emitting polyme devices and apparatus made by same
JP2004224815A (ja) 2003-01-20 2004-08-12 Fuji Photo Film Co Ltd ガスバリア性積層フィルムの製造方法及びガスバリア性積層フィルム
JP4491196B2 (ja) 2003-03-31 2010-06-30 富士フイルム株式会社 ガスバリア性積層フィルム及びその製造方法、並びに該フィルムを用いた基板及び画像表示素子
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7029765B2 (en) * 2003-04-22 2006-04-18 Universal Display Corporation Organic light emitting devices having reduced pixel shrinkage
US7820255B2 (en) 2003-05-29 2010-10-26 Konica Minolta Holdings, Inc. Transparent film for display substrate, display substrate using the film and method of manufacturing the same, liquid crystal display, organic electroluminescence display, and touch panel
ITMI20031281A1 (it) 2003-06-24 2004-12-25 Whirlpool Co Apparecchio refrigerante domestico con supporti amovibili dei ripiani.
NL1024090C2 (nl) 2003-08-12 2005-02-15 Otb Group Bv Werkwijze voor het aanbrengen van een dunne-film-afsluitlaagsamenstel op een device met microstructuren, alsmede een device voorzien van een dergelijk dunne-film-afsluitlaagsamenstel.
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
US7282244B2 (en) * 2003-09-05 2007-10-16 General Electric Company Replaceable plate expanded thermal plasma apparatus and method
US7635525B2 (en) * 2003-09-30 2009-12-22 Fujifilm Corporation Gas barrier laminate film and method for producing the same
US7297414B2 (en) * 2003-09-30 2007-11-20 Fujifilm Corporation Gas barrier film and method for producing the same
US7052355B2 (en) * 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
US20050093437A1 (en) * 2003-10-31 2005-05-05 Ouyang Michael X. OLED structures with strain relief, antireflection and barrier layers
US8722160B2 (en) 2003-10-31 2014-05-13 Aeris Capital Sustainable Ip Ltd. Inorganic/organic hybrid nanolaminate barrier film
US7271534B2 (en) * 2003-11-04 2007-09-18 3M Innovative Properties Company Segmented organic light emitting device
US7432124B2 (en) 2003-11-04 2008-10-07 3M Innovative Properties Company Method of making an organic light emitting device
US7075103B2 (en) 2003-12-19 2006-07-11 General Electric Company Multilayer device and method of making
US7792489B2 (en) 2003-12-26 2010-09-07 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic appliance, and method for manufacturing light emitting device
JP2005251671A (ja) * 2004-03-08 2005-09-15 Fuji Photo Film Co Ltd 表示装置
US20050238846A1 (en) 2004-03-10 2005-10-27 Fuji Photo Film Co., Ltd. Gas barrier laminate film, method for producing the same and image display device utilizing the film
US20050212419A1 (en) 2004-03-23 2005-09-29 Eastman Kodak Company Encapsulating oled devices
US8405193B2 (en) 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US7220687B2 (en) * 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
US7033850B2 (en) * 2004-06-30 2006-04-25 Eastman Kodak Company Roll-to-sheet manufacture of OLED materials
US7342356B2 (en) 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
DE102004063619A1 (de) 2004-12-27 2006-07-06 Cfs Kempten Gmbh Schrumpfbare Mehrschichtfolie mit einer Releaseschicht
US20060198986A1 (en) 2005-03-01 2006-09-07 Keckeisen Michael S Multilayer packaging with peelable coupon
US20060246811A1 (en) 2005-04-28 2006-11-02 Eastman Kodak Company Encapsulating emissive portions of an OLED device
US20060250084A1 (en) 2005-05-04 2006-11-09 Eastman Kodak Company OLED device with improved light output
EP1719809A3 (de) 2005-05-06 2007-05-30 Eastman Chemical Company Druckempfindliche Klebstofflaminate
US7621794B2 (en) 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
EP1857270B1 (de) 2006-05-17 2013-04-17 Curwood, Inc. Myoglobin-Blühmittel sowie Folien, Verpackungen und Verfahren zum Verpacken
DE102006037478A1 (de) 2006-08-10 2008-02-14 Merck Patent Gmbh 2-(Heterocyclylbenzyl)-pyridazinonderivate
US8084102B2 (en) 2007-02-06 2011-12-27 Sion Power Corporation Methods for co-flash evaporation of polymerizable monomers and non-polymerizable carrier solvent/salt mixtures/solutions
KR101433778B1 (ko) 2007-05-18 2014-08-27 헨켈 아게 운트 코. 카게아아 탄성 라미네이트 접착제에 의해 보호된 유기 전자 장치
JP5501587B2 (ja) 2007-09-28 2014-05-21 株式会社船井電機新応用技術研究所 エレクトロクロミック表示デバイス
US8187718B2 (en) 2008-04-14 2012-05-29 Fujifilm Corporation Barrier laminate, barrier film substrate and device

Also Published As

Publication number Publication date
US20040265508A9 (en) 2004-12-30
US20070210459A1 (en) 2007-09-13
JP4303591B2 (ja) 2009-07-29
EP1432528B1 (de) 2008-11-12
CN1678409A (zh) 2005-10-05
WO2003028903A3 (en) 2004-03-11
US6866901B2 (en) 2005-03-15
EP1432528A2 (de) 2004-06-30
US20120118855A1 (en) 2012-05-17
WO2003028903A2 (en) 2003-04-10
JP2005504652A (ja) 2005-02-17
CN1327974C (zh) 2007-07-25
US8955217B2 (en) 2015-02-17
DE60229866D1 (de) 2008-12-24
AU2002330080A1 (en) 2003-04-14
US20030064171A1 (en) 2003-04-03
US20050176181A1 (en) 2005-08-11

Similar Documents

Publication Publication Date Title
ATE413931T1 (de) Verfahren zum randdichten von sperrfilmen
ATE418087T1 (de) Eingekapselte anzeigevorrichtung
ATE527713T1 (de) Versiegelung einer membran-elektroden-baugruppe
MY151050A (en) Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
TW200518354A (en) Device package and methods for the fabrication and testing thereof
SG142140A1 (en) Display device and method of manufacturing thereof
TWI257134B (en) Semiconductor device and manufacturing method thereof, and liquid crystal module and semiconductor module having the same
DE60140359D1 (de) Eingekapselte mikroelektronische bauelemente
JP2005504652A5 (de)
ATE485598T1 (de) Verfahren zum verschliessen einer mikrokavität und gehäuse mit mindestens einer mikrokavität
TWI268729B (en) Protected organic electronic devices and methods for making the same
MY140302A (en) A strip tape, a packaging container having such a strip tape, and a method of producing such a strip tape
MXPA03001756A (es) Barrera encapsulada para peliculas flexibles y un metodo para hacer la misma.
ATE378129T1 (de) Barrierschichten auf einem substrat enthaltenden laminat
ATE548293T1 (de) Flexible folienverpackung mit entfernbarem streifen
AR009746A1 (es) Una pelicula multi-capa para formar sellos hermeticos en envases.
BG104209A (en) Photogalvanic module and method for its peparation
WO2005058586A3 (en) Film for packing liquids or the like and method for manufacturing such a film
TW200628580A (en) Multi-layer pressure sensitive adhesive for optical assembly
TW200732794A (en) Liquid crystal panel, method for producing liquid crystal panel, and electronic apparatus
FI20020998A (fi) Menetelmä kalvon muodostamiseksi
TW200603270A (en) Method to form a film
TW358237B (en) Manufacturing method of a semiconductor device
TW200619015A (en) Piled glass and method of manufacturing the same
DK1235541T3 (da) Fremgangsmåde ved fremstilling af en indretning til forbindelse mellem beholder og indhold, en tilsvarende forbindelsesindretning og en brugsklar samling med en sådan indretning

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties