TW201125458A - Multilayer printed wiring board and method for manufacturing same - Google Patents

Multilayer printed wiring board and method for manufacturing same Download PDF

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Publication number
TW201125458A
TW201125458A TW100109519A TW100109519A TW201125458A TW 201125458 A TW201125458 A TW 201125458A TW 100109519 A TW100109519 A TW 100109519A TW 100109519 A TW100109519 A TW 100109519A TW 201125458 A TW201125458 A TW 201125458A
Authority
TW
Taiwan
Prior art keywords
layer
semiconductor element
wiring board
printed wiring
multilayer printed
Prior art date
Application number
TW100109519A
Other languages
English (en)
Chinese (zh)
Other versions
TWI373999B (https=
Inventor
Sotaro Ito
Michimasa Takahashi
Yukinobu Mikado
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW201125458A publication Critical patent/TW201125458A/zh
Application granted granted Critical
Publication of TWI373999B publication Critical patent/TWI373999B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW100109519A 2005-10-14 2006-10-14 Multilayer printed wiring board and method for manufacturing same TW201125458A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300349 2005-10-14

Publications (2)

Publication Number Publication Date
TW201125458A true TW201125458A (en) 2011-07-16
TWI373999B TWI373999B (https=) 2012-10-01

Family

ID=37942925

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100109519A TW201125458A (en) 2005-10-14 2006-10-14 Multilayer printed wiring board and method for manufacturing same
TW095137843A TW200731908A (en) 2005-10-14 2006-10-14 Multilayer printed wiring board and method for manufacturing same

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095137843A TW200731908A (en) 2005-10-14 2006-10-14 Multilayer printed wiring board and method for manufacturing same

Country Status (7)

Country Link
US (5) US8101868B2 (https=)
EP (1) EP1945013A4 (https=)
JP (1) JP5188809B2 (https=)
KR (1) KR20080046275A (https=)
CN (2) CN101288350B (https=)
TW (2) TW201125458A (https=)
WO (1) WO2007043714A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502718B (zh) * 2011-12-22 2015-10-01 雷神公司 透過調整圖案化利用低損互連之異質晶片整合
TWI787777B (zh) * 2021-04-01 2022-12-21 歆熾電氣技術股份有限公司 基板及電路基板

Families Citing this family (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1278413C (zh) * 2000-09-25 2006-10-04 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
US7759582B2 (en) * 2005-07-07 2010-07-20 Ibiden Co., Ltd. Multilayer printed wiring board
US7834273B2 (en) 2005-07-07 2010-11-16 Ibiden Co., Ltd. Multilayer printed wiring board
US8101868B2 (en) 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
EP1962569A1 (en) 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
JP3942190B1 (ja) * 2006-04-25 2007-07-11 国立大学法人九州工業大学 両面電極構造の半導体装置及びその製造方法
US20080123335A1 (en) * 2006-11-08 2008-05-29 Jong Kun Yoo Printed circuit board assembly and display having the same
JP4962228B2 (ja) * 2006-12-26 2012-06-27 株式会社ジェイテクト 多層回路基板およびモータ駆動回路基板
JP4380718B2 (ja) * 2007-03-15 2009-12-09 ソニー株式会社 半導体装置の製造方法
KR100861619B1 (ko) * 2007-05-07 2008-10-07 삼성전기주식회사 방열 인쇄회로기판 및 그 제조방법
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Industrial Co Ltd Circuit board and method for manufacturing the same
JP5101169B2 (ja) * 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
KR101530868B1 (ko) * 2007-09-11 2015-06-23 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법
US8084692B2 (en) * 2007-10-25 2011-12-27 International Business Machines Corporation Reducing noise coupling in high speed digital systems
EP2136610A4 (en) * 2008-01-25 2011-07-13 Ibiden Co Ltd MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
AT10247U8 (de) * 2008-05-30 2008-12-15 Austria Tech & System Tech Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte
EP2286446A1 (en) * 2008-06-02 2011-02-23 Nxp B.V. Electronic device and method of manufacturing an electronic device
KR100996914B1 (ko) * 2008-06-19 2010-11-26 삼성전기주식회사 칩 내장 인쇄회로기판 및 그 제조방법
JP5203108B2 (ja) * 2008-09-12 2013-06-05 新光電気工業株式会社 配線基板及びその製造方法
DE102008063863A1 (de) * 2008-12-19 2010-07-01 Martin Schneider Elektronisches Bauteil mit aufgenommenem elektronischen Bauelement
US20110156261A1 (en) * 2009-03-24 2011-06-30 Christopher James Kapusta Integrated circuit package and method of making same
US9299661B2 (en) * 2009-03-24 2016-03-29 General Electric Company Integrated circuit package and method of making same
JP5280945B2 (ja) * 2009-06-19 2013-09-04 新光電気工業株式会社 半導体装置及びその製造方法
JP5515450B2 (ja) * 2009-06-24 2014-06-11 富士通株式会社 プリント基板の製造方法
TWI418272B (zh) * 2009-08-25 2013-12-01 三星電機股份有限公司 處理核心基板之空腔的方法
JP5588137B2 (ja) * 2009-09-14 2014-09-10 新光電気工業株式会社 半導体装置の製造方法
JP5272999B2 (ja) * 2009-09-30 2013-08-28 凸版印刷株式会社 光基板の製造方法
JP2011146547A (ja) * 2010-01-15 2011-07-28 Murata Mfg Co Ltd 回路モジュール
JP5436259B2 (ja) * 2010-02-16 2014-03-05 日本特殊陶業株式会社 多層配線基板の製造方法及び多層配線基板
US8633597B2 (en) * 2010-03-01 2014-01-21 Qualcomm Incorporated Thermal vias in an integrated circuit package with an embedded die
US8541693B2 (en) * 2010-03-31 2013-09-24 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP2011233854A (ja) * 2010-04-26 2011-11-17 Nepes Corp ウェハレベル半導体パッケージ及びその製造方法
KR101085727B1 (ko) 2010-05-25 2011-11-21 삼성전기주식회사 임베디드 인쇄회로기판 및 이의 제조 방법
KR101085733B1 (ko) 2010-05-28 2011-11-21 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
KR101117155B1 (ko) * 2010-07-01 2012-03-07 삼성전기주식회사 임베디드 기판 제조방법
KR20120026855A (ko) 2010-09-10 2012-03-20 삼성전기주식회사 임베디드 볼 그리드 어레이 기판 및 그 제조 방법
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
JP2013038374A (ja) 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
TW201240169A (en) * 2011-03-18 2012-10-01 Lextar Electronics Corp Semiconductor devices
TWI435205B (zh) * 2011-05-12 2014-04-21 Subtron Technology Co Ltd 蓋板結構及其製作方法
KR101231286B1 (ko) * 2011-06-01 2013-02-07 엘지이노텍 주식회사 부품 내장형 인쇄회로기판 및 그 제조 방법
US20130000968A1 (en) * 2011-06-30 2013-01-03 Broadcom Corporation 1-Layer Interposer Substrate With Through-Substrate Posts
JP2013030593A (ja) * 2011-07-28 2013-02-07 J Devices:Kk 半導体装置、該半導体装置を垂直に積層した半導体モジュール構造及びその製造方法
JP5100878B1 (ja) * 2011-09-30 2012-12-19 株式会社フジクラ 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
JP5754333B2 (ja) * 2011-09-30 2015-07-29 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法
KR20130051708A (ko) * 2011-11-10 2013-05-21 삼성전기주식회사 반도체 패키지 및 그 제조 방법
US9040837B2 (en) * 2011-12-14 2015-05-26 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US20130256007A1 (en) * 2012-03-28 2013-10-03 Ibiden Co., Ltd. Wiring board with built-in electronic component and method for manufacturing the same
CN102623426B (zh) * 2012-03-31 2015-04-22 苏州晶方半导体科技股份有限公司 半导体封装方法
CN102686029B (zh) * 2012-04-24 2015-09-02 宜兴硅谷电子科技有限公司 电路板盲槽的制作方法
CN204231766U (zh) * 2012-06-14 2015-03-25 株式会社村田制作所 高频模块
JP6353184B2 (ja) * 2012-07-26 2018-07-04 味の素株式会社 保護フィルム付き接着シート、積層体の製造方法、及びプリント配線板の製造方法
CN103579008B (zh) * 2012-07-26 2017-11-10 中芯国际集成电路制造(上海)有限公司 一种焊盘结构及其制备方法
US9721878B2 (en) * 2012-09-28 2017-08-01 Intel Corporation High density second level interconnection for bumpless build up layer (BBUL) packaging technology
US9484621B2 (en) * 2012-11-02 2016-11-01 Nokia Technologies Oy Portable electronic device body having laser perforation apertures and associated fabrication method
KR20140068653A (ko) * 2012-11-28 2014-06-09 삼성전기주식회사 인쇄회로기판 및 이의 제조방법
JP2014116548A (ja) * 2012-12-12 2014-06-26 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
KR101472640B1 (ko) 2012-12-31 2014-12-15 삼성전기주식회사 회로 기판 및 회로 기판 제조방법
EP2775523A1 (en) * 2013-03-04 2014-09-10 Dialog Semiconductor GmbH Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
US9461025B2 (en) 2013-03-12 2016-10-04 Taiwan Semiconductor Manfacturing Company, Ltd. Electric magnetic shielding structure in packages
US9763317B2 (en) * 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
CN105027692B (zh) 2013-05-17 2018-01-30 株式会社村田制作所 元器件内置多层基板的制造方法以及元器件内置多层基板
JP2015032649A (ja) * 2013-08-01 2015-02-16 イビデン株式会社 配線板の製造方法および配線板
JP6373642B2 (ja) * 2013-08-05 2018-08-15 ローム株式会社 半導体装置
CN104470211B (zh) * 2013-09-24 2018-02-27 深南电路股份有限公司 Pcb板加工方法及pcb板
WO2015064642A1 (ja) * 2013-10-30 2015-05-07 京セラ株式会社 配線基板およびこれを用いた実装構造体
EP3075006A1 (de) 2013-11-27 2016-10-05 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenstruktur
JP6303443B2 (ja) * 2013-11-27 2018-04-04 Tdk株式会社 Ｉｃ内蔵基板の製造方法
AT515101B1 (de) 2013-12-12 2015-06-15 Austria Tech & System Tech Verfahren zum Einbetten einer Komponente in eine Leiterplatte
US9554472B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9434135B2 (en) 2013-12-19 2016-09-06 Intel Corporation Panel with releasable core
US9554468B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9522514B2 (en) 2013-12-19 2016-12-20 Intel Corporation Substrate or panel with releasable core
US11523520B2 (en) 2014-02-27 2022-12-06 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for making contact with a component embedded in a printed circuit board
US9806051B2 (en) * 2014-03-04 2017-10-31 General Electric Company Ultra-thin embedded semiconductor device package and method of manufacturing thereof
JP2015185564A (ja) * 2014-03-20 2015-10-22 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015220281A (ja) * 2014-05-15 2015-12-07 イビデン株式会社 プリント配線板
JP6317629B2 (ja) 2014-06-02 2018-04-25 株式会社東芝 半導体装置
TWI660476B (zh) * 2014-07-11 2019-05-21 Siliconware Precision Industries Co., Ltd. 封裝結構及其製法
JP2016082163A (ja) * 2014-10-21 2016-05-16 イビデン株式会社 プリント配線板
US9578744B2 (en) * 2014-12-22 2017-02-21 Stmicroelectronics, Inc. Leadframe package with pre-applied filler material
JP6473619B2 (ja) * 2014-12-25 2019-02-20 イビデン株式会社 キャビティ付き配線板の製造方法
JP2016143725A (ja) * 2015-01-30 2016-08-08 イビデン株式会社 プリント配線板およびその製造方法
JP2016143727A (ja) * 2015-01-30 2016-08-08 イビデン株式会社 プリント配線板およびその製造方法
DE102015104641B4 (de) * 2015-03-26 2025-03-13 At & S Austria Technologie & Systemtechnik Ag Träger mit passiver Kühlfunktion für ein Halbleiterbauelement
CN104779216B (zh) * 2015-04-09 2018-03-23 无锡中感微电子股份有限公司 一种电池保护板和电子设备
JP2017050313A (ja) * 2015-08-31 2017-03-09 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2017050315A (ja) * 2015-08-31 2017-03-09 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
CN108028233B (zh) * 2015-09-23 2023-02-24 英特尔公司 用于实现多芯片倒装芯片封装的衬底、组件和技术
KR101933409B1 (ko) * 2015-12-16 2019-04-05 삼성전기 주식회사 전자 부품 패키지 및 그 제조방법
EP3211976A1 (en) * 2016-02-29 2017-08-30 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Printed circuit board with antenna structure and method for its production
JP6771308B2 (ja) * 2016-05-02 2020-10-21 三菱電機株式会社 回路基板および半導体集積回路の実装構造
CN107404804B (zh) * 2016-05-20 2020-05-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
JP6819682B2 (ja) * 2016-06-06 2021-01-27 昭和電工マテリアルズ株式会社 多層配線板の製造方法
DE102016111914A1 (de) * 2016-06-29 2018-01-04 Snaptrack, Inc. Bauelement mit Dünnschicht-Abdeckung und Verfahren zur Herstellung
KR101942727B1 (ko) * 2016-09-12 2019-01-28 삼성전기 주식회사 팬-아웃 반도체 패키지
EP3349247B1 (en) * 2017-01-13 2020-12-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Patterned cover layer on base structure defining cavity and alignment marker
DE102018207127B4 (de) 2017-05-11 2026-04-30 Schweizer Electronic Ag Verfahren zum Ankontaktieren einer metallischen Kontaktfläche in einer Leiterplatte und Leiterplatte
KR101901713B1 (ko) * 2017-10-27 2018-09-27 삼성전기 주식회사 팬-아웃 반도체 패키지
KR101942744B1 (ko) 2017-11-03 2019-01-28 삼성전기 주식회사 팬-아웃 반도체 패키지
TWI645195B (zh) * 2017-11-14 2018-12-21 旺矽科技股份有限公司 Probe card
JP7007882B2 (ja) * 2017-12-08 2022-01-25 新光電気工業株式会社 配線基板及びその製造方法
KR20190075647A (ko) * 2017-12-21 2019-07-01 삼성전자주식회사 팬-아웃 반도체 패키지
DE112018006091T5 (de) * 2017-12-27 2020-08-20 Murata Manufacturing Co., Ltd. Halbleiter-verbund-bauelement und darin verwendete package-platine
JP2019121774A (ja) * 2017-12-28 2019-07-22 株式会社フジクラ 金属片付き配線基板および金属片付き配線基板の製造方法
JP6978335B2 (ja) * 2018-02-02 2021-12-08 新光電気工業株式会社 電子部品内蔵基板及びその製造方法と電子部品装置
US10748831B2 (en) * 2018-05-30 2020-08-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor packages having thermal through vias (TTV)
KR102513087B1 (ko) * 2018-11-20 2023-03-23 삼성전자주식회사 팬-아웃 반도체 패키지
JP7147885B2 (ja) * 2019-02-05 2022-10-05 株式会社村田製作所 樹脂多層基板および樹脂多層基板の製造方法
TWI686108B (zh) 2019-02-26 2020-02-21 嘉聯益科技股份有限公司 線路板模組及其散熱板結構
JP2020150026A (ja) * 2019-03-11 2020-09-17 株式会社村田製作所 多層配線基板
WO2020246812A1 (ko) 2019-06-04 2020-12-10 엘지이노텍 주식회사 인쇄회로기판
US11121076B2 (en) * 2019-06-27 2021-09-14 Texas Instruments Incorporated Semiconductor die with conversion coating
CN110416248B (zh) 2019-08-06 2022-11-04 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示装置
US11849546B2 (en) * 2019-09-25 2023-12-19 Kyocera Corporation Printed wiring board and manufacturing method for printed wiring board
EP3799539B1 (de) * 2019-09-27 2022-03-16 Siemens Aktiengesellschaft Schaltungsträger, package und verfahren zu ihrer herstellung
KR102710005B1 (ko) * 2019-10-21 2024-09-26 엘지이노텍 주식회사 회로기판
CN111554676B (zh) * 2020-05-19 2022-03-29 上海先方半导体有限公司 一种局部带宽增强的转接板封装结构及制作方法
DE112021002573T5 (de) * 2020-07-08 2023-03-09 Panasonic intellectual property Management co., Ltd Harzlage, prepreg, isolierendes harzelement und leiterplatte
KR102888075B1 (ko) * 2020-09-18 2025-11-19 엘지이노텍 주식회사 회로기판, 패키지 기판 및 이의 제조 방법
CN114286508A (zh) * 2020-09-28 2022-04-05 深南电路股份有限公司 一种线路板及其制造方法
CN114501840B (zh) * 2020-10-26 2024-07-05 鹏鼎控股(深圳)股份有限公司 电路板组件的制作方法及电路板组件
CN114521041B (zh) * 2020-11-18 2025-03-21 深南电路股份有限公司 一种线路板及其制造方法
CN112616259B (zh) * 2021-02-25 2021-06-08 四川英创力电子科技股份有限公司 含有台阶插件孔的印制电路板及其制作方法
JP7535463B2 (ja) * 2021-03-01 2024-08-16 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法
TWI777741B (zh) * 2021-08-23 2022-09-11 欣興電子股份有限公司 內埋元件基板及其製作方法
CN116456619B (zh) * 2022-01-10 2024-06-14 无锡深南电路有限公司 印制电路板的制作方法
CN115295502B (zh) * 2022-07-21 2026-04-10 深南电路股份有限公司 立体封装结构及其制作方法
CN118866837B (zh) * 2024-09-25 2024-12-27 长电集成电路(绍兴)有限公司 封装结构及其制备方法、半导体器件、电子设备

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946051A (ja) * 1982-09-09 1984-03-15 Hitachi Ltd 絶縁型半導体装置
US4640010A (en) 1985-04-29 1987-02-03 Advanced Micro Devices, Inc. Method of making a package utilizing a self-aligning photoexposure process
JPH05175407A (ja) * 1991-12-25 1993-07-13 Sumitomo Bakelite Co Ltd 半導体搭載基板
US5506755A (en) 1992-03-11 1996-04-09 Kabushiki Kaisha Toshiba Multi-layer substrate
US5306670A (en) 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
JPH0823149A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp 半導体装置及びその製造方法
EP0774888B1 (en) * 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
JP3588230B2 (ja) 1997-07-31 2004-11-10 京セラ株式会社 配線基板の製造方法
US6239980B1 (en) 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
WO2000063970A1 (en) 1999-04-16 2000-10-26 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
JP2000312063A (ja) * 1999-04-28 2000-11-07 Kyocera Corp 配線基板及びその製造方法
JP4592891B2 (ja) 1999-11-26 2010-12-08 イビデン株式会社 多層回路基板および半導体装置
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
JP3809053B2 (ja) * 2000-01-20 2006-08-16 新光電気工業株式会社 電子部品パッケージ
CN100336426C (zh) * 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
JP4854845B2 (ja) 2000-02-25 2012-01-18 イビデン株式会社 多層プリント配線板
JP4854847B2 (ja) 2000-02-25 2012-01-18 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
JP2002016327A (ja) * 2000-04-24 2002-01-18 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
US6292366B1 (en) * 2000-06-26 2001-09-18 Intel Corporation Printed circuit board with embedded integrated circuit
CN1278413C (zh) * 2000-09-25 2006-10-04 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
JP4248157B2 (ja) * 2000-12-15 2009-04-02 イビデン株式会社 多層プリント配線板
US6621012B2 (en) 2001-02-01 2003-09-16 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board
JP2002353633A (ja) * 2001-05-25 2002-12-06 Shin Kobe Electric Mach Co Ltd 多層プリント配線板の製造法及び多層プリント配線板
JP2003100937A (ja) 2001-09-26 2003-04-04 Hitachi Ltd 高周波モジュール
JP3492348B2 (ja) * 2001-12-26 2004-02-03 新光電気工業株式会社 半導体装置用パッケージの製造方法
JP3937840B2 (ja) 2002-01-10 2007-06-27 株式会社日立製作所 高周波モジュール
DE10225431A1 (de) * 2002-06-07 2004-01-08 Siemens Dematic Ag Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul
US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
JP2004064052A (ja) 2002-07-27 2004-02-26 Samsung Electro Mech Co Ltd ノイズ遮蔽型積層基板とその製造方法
CN1210789C (zh) 2002-09-19 2005-07-13 威盛电子股份有限公司 具有散热结构的半导体封装元件
JP4103549B2 (ja) 2002-10-31 2008-06-18 株式会社デンソー 多層配線基板の製造方法及び多層配線基板
JP4209178B2 (ja) * 2002-11-26 2009-01-14 新光電気工業株式会社 電子部品実装構造及びその製造方法
WO2004077560A1 (ja) * 2003-02-26 2004-09-10 Ibiden Co., Ltd. 多層プリント配線板
JP3709882B2 (ja) * 2003-07-22 2005-10-26 松下電器産業株式会社 回路モジュールとその製造方法
JP2005072328A (ja) 2003-08-26 2005-03-17 Kyocera Corp 多層配線基板
TWI221330B (en) * 2003-08-28 2004-09-21 Phoenix Prec Technology Corp Method for fabricating thermally enhanced semiconductor device
JP2005101031A (ja) 2003-09-22 2005-04-14 Rohm Co Ltd 半導体集積回路装置、及び電子機器
TWI283155B (en) 2004-02-02 2007-06-21 Phoenix Prec Technology Corp Substrate structure integrated with passive component
JP2005183466A (ja) 2003-12-16 2005-07-07 Ibiden Co Ltd 多層プリント配線板
JP4298559B2 (ja) 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2006019441A (ja) * 2004-06-30 2006-01-19 Shinko Electric Ind Co Ltd 電子部品内蔵基板の製造方法
KR100645643B1 (ko) 2004-07-14 2006-11-15 삼성전기주식회사 수동소자칩 내장형의 인쇄회로기판의 제조방법
JP4575071B2 (ja) * 2004-08-02 2010-11-04 新光電気工業株式会社 電子部品内蔵基板の製造方法
JP2006073763A (ja) 2004-09-01 2006-03-16 Denso Corp 多層基板の製造方法
US8101868B2 (en) 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
EP1962569A1 (en) 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
TWI334747B (en) 2006-12-22 2010-12-11 Unimicron Technology Corp Circuit board structure having embedded electronic components
EP2136610A4 (en) 2008-01-25 2011-07-13 Ibiden Co Ltd MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
US7884461B2 (en) 2008-06-30 2011-02-08 Advanced Clip Engineering Technology Inc. System-in-package and manufacturing method of the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI502718B (zh) * 2011-12-22 2015-10-01 雷神公司 透過調整圖案化利用低損互連之異質晶片整合
TWI787777B (zh) * 2021-04-01 2022-12-21 歆熾電氣技術股份有限公司 基板及電路基板

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US9027238B2 (en) 2015-05-12
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US20120106108A1 (en) 2012-05-03
CN102752958A (zh) 2012-10-24

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