KR960036007A - 수지밀폐형 반도체 장치 및 그 제조 방법 - Google Patents
수지밀폐형 반도체 장치 및 그 제조 방법 Download PDFInfo
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- KR960036007A KR960036007A KR1019960004260A KR19960004260A KR960036007A KR 960036007 A KR960036007 A KR 960036007A KR 1019960004260 A KR1019960004260 A KR 1019960004260A KR 19960004260 A KR19960004260 A KR 19960004260A KR 960036007 A KR960036007 A KR 960036007A
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- Prior art keywords
- lead
- semiconductor device
- resin
- supporting portion
- sealed type
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000011347 resin Substances 0.000 claims abstract 21
- 229920005989 resin Polymers 0.000 claims abstract 21
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 abstract 1
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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Abstract
수지밀폐형 반도체장치는 방열체와, 반도체소자와, 이 반도체소자의 주위에 이격되어 뜬 상태에서 설치된 프레임리드와, 이 프레임리드로부터 연장하여 설치되어 리드지지부를 통해 설치면에 접착되는 복수의 리드를 포함한다. 리드는, 상부금형에 의해서 눌려지고, 방열체를 하부금형에 눌러서 수지가 들어가지 않도록 되어 있으며, 리드에는 박편부가 형성되어 있기 때문에, 리드지지부에서 벗겨지지 않도록 되어 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시형태와 관계되는 반도체장치의 제조방법을 나타내는 도면.
Claims (21)
- 반도체소자와, 상기 반도체소자를 설치하는 설치면을 갖는 소자적재부재와, 상기 설치면상에서 반도체소자를 피하는 영역에 설치되는 절연성의 리드지지부와, 상기 리드지지부에 접착되는 것으로 상기 소자적재부재에 고정되는 복수의 리드와, 금형을 사용하여, 상기 소작적재부재와 상기 반도체소자와 상기 리드의 일부를 수지로써 밀봉하는 수지패키지를 포함하며, 상기 리드는 수지밀봉되는 영역에 적어도 하나의 박편부가 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 박편부는, 상기 금형의 내측에서 리드지지부와의 접착위치상에 이르는 범위중의 어느 위치에 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제2항에 있어서, 상기 박편부는, 상기 리드지지부와의 접착위치의 경계선에 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 복수의 박편부는, 상기 금형의 내측으로부터 상기 리드지지부와의 접착위치의 앞까지 이르는 어느 한 위치에 형성되는 제1박편부와, 상기 리드지지부와의 접착위치의 경계선에 형성되는 제2박편부와, 상기 리드지지부와의 접착위치에 형성되는 제3박편부로 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제2항에 있어서, 상기 복수의 박편부는, 상기 금형의 내측으로부터 상기 리드지지부와의 접착위치의 앞까지 이르는 어느 한 위치에 형성되는 제1박편부와, 상기 리드지지부와의 접착위치의 경계선에 형성되는 제2박편부와, 상기 리드지지부와의 접착위치에 형성되는 제3박편부로 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제3항에 있어서, 상기 복수의 박편부는, 상기 금형의 내측으로부터 상기 리드지지부와의 접착위치의 앞까지 이르는 어느 한 위치에서 형성되는 제1박편부와, 상기 리드지지부와의 접착위치의 경계선에 형성되는 제2박편부와, 상기 리드지지부와의 접착위치에 형성되는 제3박편부로 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 리드의 한쪽의 면만으로부터의 패임에 의해 상기 박편부가 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제3항에 있어서, 상기 리드의 한쪽의 면만으로부터의 패임에 의해 상기 박편부가 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제6항에 있어서, 상기 리드의 한쪽의 면만으로부터의 패임에 의해 상기 박편부가 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 복수의 박편부 중 적어도 하나가 상기 리드의 한쪽의 면으로부터의 패임에 의해 형성되고, 나머지의 상기 박편부는 상기 리드의 다른쪽의 면으로부터의 패임에 의해 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제4항에 있어서, 상기 복수의 박편부 중 적어도 하나가 상기 리드의 한쪽으 리드의 다른쪽의 면으로부터의 패임에 의해 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제6항에 있어서, 상기 복수의 박편부 중 적어도 하나가 상기 리드의 한쪽의 면으로부터의 패임에 의해 형성되고, 나머지의 상기 박편부는 상기 리드의 다른쪽의 패임에 의해 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 소자적재부재로서 방열성이 높은 부재가 사용되는 것을 특징으로 하는 수지 밀폐형 반도체장치.
- 제7항에 있어서, 상기 소자적재부재로서 방열성이 높은 부재가 사용되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제12하에 있어서, 상기 소자적재부재로서 방열성이 높은 부재가 사용되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항에 있어서, 상기 반도체소자를 둘러싸고 상기 설치면으로부터 뜬 상태에서, 공용 리드로서의 프레임리드가 설치되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제12항에 있어서, 상기 반도체소자를 둘러싸고 상기 설치면으로부터 뜬 상태에서, 공용 리드로서의 프레임리드가 설치되는 것을 특지으로 하는 수지밀폐형 반도체장치.
- 제15항에 있어서, 상기 반도체소자를 둘러싸고 상기 설치면으로부터 뜬 상태에서, 공용 리드로서의 프레임리드가 설치되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 제1항 내지 제18항 중 어느 한 항에 있어서, 상기 리드는 상기 리드지지부와의 접착위치의 외측으로부터 해당 리드지지부와의 접착면의 방향으로 굽은 상태에서 상기 수지패키지에 밀봉되는 것을 특징으로 하는 수지밀폐형 반도체장치.
- 소자적재부재의 설치면에 반도체소자를 설치하는 공정과, 상기 설치면상에서 상기 반도체소자를 피하는 영역에 절연성의 리드지지부를 설치하는 공정과, 복수의 리드를 상기 리드지지부의 위에 접착하여 상기 소자적재부재의 고정하는 공정과, 소정 장소를 와이어본딩수단에 의해서 전기적으로 접속하는 공정과, 상기 공정에 의해서 얻어진 중간부재를 제1금형상에 배치하는 공정과, 상기 중간부재의 리드지지부로부터 외측으로 나오는 리드의 일부를, 제2금형에 의해서 상기 리드지지부와의 접착면 방향으로 누르는 공정과, 상기 제1 및 제2금형 내에서, 상기 중간부재를 수지로써 밀봉하여 수지패키지를 형성하는 고정을 포함하며, 상기 리드는 적어도, 상기 금형과 상기 접착위치의 사이에 박편부가 형성되는 것을 특징으로 하는 수지밀폐형 반도체장치의 제조방법.
- 제20항에 있어서, 상기 리드지지부로부터 외측으로 나오는 상기 리드의 일부는, 상기 제1금형으로부터 뜬 상태에서 상기 제1금형상에 배치되고, 상기 제1금형에 의해서 굽혀지는 것을 특징으로 하는 수지밀폐형 반도체장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
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JP8651695 | 1995-03-17 | ||
JP95-86516 | 1995-03-17 | ||
JP95-345328 | 1995-12-07 | ||
JP34532895A JP3309686B2 (ja) | 1995-03-17 | 1995-12-07 | 樹脂封止型半導体装置及びその製造方法 |
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KR960036007A true KR960036007A (ko) | 1996-10-28 |
KR100359399B1 KR100359399B1 (ko) | 2003-01-10 |
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KR1019960004260A KR100359399B1 (ko) | 1995-03-17 | 1996-02-16 | 수지밀폐형 반도체 장치 및 그 제조 방법 |
Country Status (9)
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US (1) | US5777380A (ko) |
EP (1) | EP0732744B1 (ko) |
JP (1) | JP3309686B2 (ko) |
KR (1) | KR100359399B1 (ko) |
CN (2) | CN1288748C (ko) |
DE (1) | DE69628964T2 (ko) |
HK (1) | HK1013734A1 (ko) |
SG (1) | SG54260A1 (ko) |
TW (1) | TW309649B (ko) |
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1995
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-
1996
- 1996-02-16 KR KR1019960004260A patent/KR100359399B1/ko not_active IP Right Cessation
- 1996-03-14 US US08/615,869 patent/US5777380A/en not_active Expired - Lifetime
- 1996-03-15 SG SG1996006521A patent/SG54260A1/en unknown
- 1996-03-15 CN CNB2003101245898A patent/CN1288748C/zh not_active Expired - Fee Related
- 1996-03-15 EP EP96104158A patent/EP0732744B1/en not_active Expired - Lifetime
- 1996-03-15 CN CNB961036176A patent/CN1138303C/zh not_active Expired - Fee Related
- 1996-03-15 DE DE69628964T patent/DE69628964T2/de not_active Expired - Fee Related
-
1998
- 1998-12-23 HK HK98115077A patent/HK1013734A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1013734A1 (en) | 1999-09-03 |
EP0732744B1 (en) | 2003-07-09 |
JP3309686B2 (ja) | 2002-07-29 |
TW309649B (ko) | 1997-07-01 |
JPH08321521A (ja) | 1996-12-03 |
CN1574312A (zh) | 2005-02-02 |
US5777380A (en) | 1998-07-07 |
CN1288748C (zh) | 2006-12-06 |
KR100359399B1 (ko) | 2003-01-10 |
EP0732744A3 (en) | 1997-08-27 |
EP0732744A2 (en) | 1996-09-18 |
DE69628964D1 (de) | 2003-08-14 |
CN1138303C (zh) | 2004-02-11 |
CN1140901A (zh) | 1997-01-22 |
DE69628964T2 (de) | 2004-05-27 |
SG54260A1 (en) | 1998-11-16 |
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