KR20150067302A - 폴리머에 박형 칩들을 내장하는 방법 - Google Patents

폴리머에 박형 칩들을 내장하는 방법 Download PDF

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KR20150067302A
KR20150067302A KR1020157011793A KR20157011793A KR20150067302A KR 20150067302 A KR20150067302 A KR 20150067302A KR 1020157011793 A KR1020157011793 A KR 1020157011793A KR 20157011793 A KR20157011793 A KR 20157011793A KR 20150067302 A KR20150067302 A KR 20150067302A
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microns
polymer
chip
thin
standoff
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Korean (ko)
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코너 래퍼티
미툴 달랄
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엠씨10, 인크
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    • H01L2224/8314—Guiding structures outside the body
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
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    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020157011793A 2012-10-09 2013-10-09 폴리머에 박형 칩들을 내장하는 방법 Ceased KR20150067302A (ko)

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US13/844,638 US9171794B2 (en) 2012-10-09 2013-03-15 Embedding thin chips in polymer
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US20140110859A1 (en) 2014-04-24
US10032709B2 (en) 2018-07-24
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US20170200670A1 (en) 2017-07-13
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