JP2016504751A - ポリマー内への薄型チップの埋込み - Google Patents

ポリマー内への薄型チップの埋込み Download PDF

Info

Publication number
JP2016504751A
JP2016504751A JP2015536868A JP2015536868A JP2016504751A JP 2016504751 A JP2016504751 A JP 2016504751A JP 2015536868 A JP2015536868 A JP 2015536868A JP 2015536868 A JP2015536868 A JP 2015536868A JP 2016504751 A JP2016504751 A JP 2016504751A
Authority
JP
Japan
Prior art keywords
polymer
thin
conductive material
chip
well region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015536868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016504751A5 (enExample
Inventor
ラファティ、コナー
ダラル、ミトゥル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MC10 Inc
Original Assignee
MC10 Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of JP2016504751A publication Critical patent/JP2016504751A/ja
Publication of JP2016504751A5 publication Critical patent/JP2016504751A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
    • H01L2224/0343—Manufacturing methods by blanket deposition of the material of the bonding area in solid form
    • H01L2224/03436—Lamination of a preform, e.g. foil, sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05155—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/05166—Titanium [Ti] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/05171—Chromium [Cr] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05099—Material
    • H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/05184—Tungsten [W] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8314—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2015536868A 2012-10-09 2013-10-09 ポリマー内への薄型チップの埋込み Pending JP2016504751A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261711629P 2012-10-09 2012-10-09
US61/711,629 2012-10-09
US13/844,638 US9171794B2 (en) 2012-10-09 2013-03-15 Embedding thin chips in polymer
US13/844,638 2013-03-15
PCT/US2013/064152 WO2014059032A1 (en) 2012-10-09 2013-10-09 Embedding thin chips in polymer

Publications (2)

Publication Number Publication Date
JP2016504751A true JP2016504751A (ja) 2016-02-12
JP2016504751A5 JP2016504751A5 (enExample) 2016-10-13

Family

ID=50477861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015536868A Pending JP2016504751A (ja) 2012-10-09 2013-10-09 ポリマー内への薄型チップの埋込み

Country Status (6)

Country Link
US (3) US9171794B2 (enExample)
EP (1) EP2907159A4 (enExample)
JP (1) JP2016504751A (enExample)
KR (1) KR20150067302A (enExample)
CN (1) CN104798196A (enExample)
WO (1) WO2014059032A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6191808B1 (ja) * 2016-04-20 2017-09-06 株式会社村田製作所 多層基板および電子機器
JP2017183649A (ja) * 2016-03-31 2017-10-05 大日本印刷株式会社 電子デバイス及びその製造方法
WO2017183394A1 (ja) * 2016-04-20 2017-10-26 株式会社村田製作所 多層基板および電子機器
JP2024076962A (ja) * 2022-11-25 2024-06-06 ズハイ アクセス セミコンダクター シーオー．，エルティーディー パッケージング基板及びその作製方法

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9969134B2 (en) 2006-11-03 2018-05-15 Trustees Of Tufts College Nanopatterned biopolymer optical device and method of manufacturing the same
WO2008127401A2 (en) * 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer optical waveguide and method of manufacturing the same
CA2704768A1 (en) 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer sensor and method of manufacturing the same
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US9702839B2 (en) 2011-03-11 2017-07-11 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
DE112012003250T5 (de) 2011-08-05 2014-04-30 Mc10, Inc. Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
JP6129838B2 (ja) 2011-09-01 2017-05-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 組織の状態を検出する電子装置
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
WO2017185050A1 (en) * 2016-04-21 2017-10-26 Sensoria, Inc. Sensor assemblies; sensor-enabled garments and objects; devices and systems for data collection
FR2988223B1 (fr) * 2012-03-19 2016-09-02 Solarwell Dispositif emettant de la lumiere contenant des nanocristaux colloidaux semiconducteurs anisotropes aplatis et procede de fabrication de tels dispositifs
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
EP2866645A4 (en) 2012-07-05 2016-03-30 Mc10 Inc CATHETER DEVICE WITH FLOW MEASUREMENT
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
WO2014058473A1 (en) 2012-10-09 2014-04-17 Mc10, Inc. Conformal electronics integrated with apparel
DE102012110358B4 (de) * 2012-10-30 2016-04-07 Leibniz-Institut für Neurobiologie Magdeburg Mikroelektrodenarray
US10840536B2 (en) * 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
CA2925387A1 (en) 2013-10-07 2015-04-16 Mc10, Inc. Conformal sensor systems for sensing and analysis
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
US10410962B2 (en) 2014-01-06 2019-09-10 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
WO2015134588A1 (en) 2014-03-04 2015-09-11 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
JP6661242B2 (ja) 2014-03-12 2020-03-11 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． アッセイの変化の定量化のための測定装置および方法
US10492703B2 (en) * 2014-03-28 2019-12-03 Board Of Regents, The University Of Texas System Epidermal sensor system and process
US9899330B2 (en) * 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
FR3030112B1 (fr) * 2014-12-12 2018-02-02 Stmicroelectronics (Crolles 2) Sas Assemblage d'une puce de circuits integres et d'une plaque
CN107530004A (zh) 2015-02-20 2018-01-02 Mc10股份有限公司 基于贴身状况、位置和/或取向的可穿戴式设备的自动检测和构造
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US10264669B2 (en) * 2015-05-01 2019-04-16 Research Triangle Institute Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
US10182284B2 (en) * 2015-06-11 2019-01-15 Facebook Technologies, Llc Connector assembly for detachable audio system
TWI555044B (zh) * 2015-06-25 2016-10-21 Wafer Mems Co Ltd A method for producing a passive element with a terminal electrode
TWI592955B (zh) 2015-06-25 2017-07-21 Wafer Mems Co Ltd Embedded passive components and methods of mass production
WO2017015000A1 (en) 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
WO2017031129A1 (en) 2015-08-19 2017-02-23 Mc10, Inc. Wearable heat flux devices and methods of use
US10499503B2 (en) * 2015-09-23 2019-12-03 Amogreentech Co., Ltd. Wearable device and method for manufacturing same
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
US10532211B2 (en) 2015-10-05 2020-01-14 Mc10, Inc. Method and system for neuromodulation and stimulation
WO2017070030A1 (en) 2015-10-21 2017-04-27 Massachusetts Institute Of Technology Nanowire fet imaging system and related techniques
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
EP3206229B1 (en) 2016-02-09 2020-10-07 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Methods of manufacturing flexible electronic devices
EP3829187A1 (en) 2016-02-22 2021-06-02 Medidata Solutions, Inc. System, devices, and method for on-body data and power transmission
CN108781313B (zh) 2016-02-22 2022-04-08 美谛达解决方案公司 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法
WO2017156502A1 (en) 2016-03-10 2017-09-14 Carnegie Mellon University Integrated electronic device with flexible and stretchable substrate
WO2017184705A1 (en) 2016-04-19 2017-10-26 Mc10, Inc. Method and system for measuring perspiration
US9930773B2 (en) 2016-06-21 2018-03-27 Microsoft Technology Licensing, Llc Flexible interconnect
WO2018013086A1 (en) * 2016-07-12 2018-01-18 Hewlett-Packard Development Company, L.P. Composite wafers
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10262255B2 (en) 2016-12-14 2019-04-16 Trackonomy Systems, Inc. Multifunction adhesive product for ubiquitous realtime tracking
US10902310B2 (en) 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
US11003978B2 (en) 2016-12-14 2021-05-11 Ajay Khoche Programmable network node roles in hierarchical communications network
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US10885420B2 (en) 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
US11538094B2 (en) * 2018-02-06 2022-12-27 James Pat Simmons Systems and methods for real-time item identification and sourcing
WO2020162935A1 (en) * 2019-02-06 2020-08-13 Wickersham Jill Anne Systems and methods for real-time item identification and sourcing
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
CN112165915A (zh) * 2018-05-31 2021-01-01 圣犹达医疗用品心脏病学部门有限公司 具有顺应电路的导管手柄
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11768262B2 (en) 2019-03-14 2023-09-26 Massachusetts Institute Of Technology Interface responsive to two or more sensor modalities
JP2020150168A (ja) * 2019-03-14 2020-09-17 キオクシア株式会社 半導体装置および半導体装置の製造方法
WO2020247354A1 (en) 2019-06-05 2020-12-10 Trackonomy Systems, Inc. Temperature monitoring in cold supply chains
MX2022003135A (es) 2019-09-13 2022-08-04 Trackonomy Systems Inc Método y dispositivo de fabricación de aditivo rollo a rollo.
US11464451B1 (en) 2020-03-11 2022-10-11 Huxley Medical, Inc. Patch for improved biometric data capture and related processes
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
US11864058B1 (en) 2020-10-04 2024-01-02 Trackonomy Systems, Inc. Flexible tracking device for cables and equipment
WO2022020822A1 (en) 2020-07-24 2022-01-27 Trackonomy Systems, Inc. Tearing to turn on wireless node with multiple cutouts for re-use
US12124904B2 (en) 2020-09-05 2024-10-22 Trackonomy Systems, Inc. Wireless sensor device with an attachable external sensor probe
US12047841B2 (en) 2020-09-21 2024-07-23 Trackonomy Systems, Inc. Detecting special events and strategically important areas in an IoT tracking system
US12490341B2 (en) 2020-10-03 2025-12-02 Trackonomy Systems, Inc. System and method of generating environmental profiles for determining logistics of assets
US11527148B1 (en) 2020-10-04 2022-12-13 Trackonomy Systems, Inc. Augmented reality for guiding users to assets in IOT applications
US12051916B1 (en) 2020-10-05 2024-07-30 Trackonomy Systems, Inc. Method for recharging wireless IOT devices and system thereof
WO2022126020A1 (en) 2020-12-12 2022-06-16 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device
US12225638B2 (en) * 2021-02-12 2025-02-11 William Marsh Rice University Integrated microheater array for efficient and localized heating of magnetic nanoparticles at microwave frequencies
US11660005B1 (en) 2021-06-04 2023-05-30 Huxley Medical, Inc. Processing and analyzing biometric data
US12178552B1 (en) 2021-06-04 2024-12-31 Huxley Medical, Inc. Systems and processes for detecting oxygen saturation and compensating for skin tone variation
US12279853B1 (en) 2021-08-24 2025-04-22 Huxley Medical, Inc. Photoplethysmography sensors and processes
US12114980B1 (en) 2021-08-24 2024-10-15 Huxley Medical, Inc. Photoplethysmography sensors and processes
US20240112969A1 (en) * 2022-08-31 2024-04-04 Industrial Technology Research Institute In-mold electronics device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US20030045025A1 (en) * 2000-01-26 2003-03-06 Coyle Anthony L. Method of fabricating a molded package for micromechanical devices
JP2005108942A (ja) * 2003-09-29 2005-04-21 Nitto Denko Corp フレキシブル配線回路基板の製造方法
JP2007294724A (ja) * 2006-04-26 2007-11-08 Toppan Printing Co Ltd 多層回路配線基板及び半導体装置
WO2008056499A1 (fr) * 2006-11-06 2008-05-15 Nec Corporation Dispositif semi-conducteur et son procédé de fabrication
US20080211087A1 (en) * 2006-12-20 2008-09-04 Infineon Technologies Ag Chip module and method for producing a chip module
JP2008244473A (ja) * 2007-03-26 2008-10-09 Endicott Interconnect Technologies Inc スタンドオフ付きフレキシブル電子回路パッケージ、及びその製造方法
US20110051384A1 (en) * 2006-02-02 2011-03-03 Arno Kriechbaum Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element
JP2011517370A (ja) * 2008-03-05 2011-06-02 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 伸張可能及び折畳み可能な電子デバイス
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
JP2012023237A (ja) * 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板

Family Cites Families (780)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716861A (en) 1971-03-22 1973-02-13 J Root Serpentine antenna mounted on a rotatable capacitive coupler
US3805427A (en) 1972-12-18 1974-04-23 H Epstein Medical alarm bracelet
US3838240A (en) 1973-04-04 1974-09-24 Rca Corp Bonding tool and method of bonding therewith
US4058418A (en) 1974-04-01 1977-11-15 Solarex Corporation Fabrication of thin film solar cells utilizing epitaxial deposition onto a liquid surface to obtain lateral growth
US3949410A (en) 1975-01-23 1976-04-06 International Business Machines Corporation Jet nozzle structure for electrohydrodynamic droplet formation and ink jet printing system therewith
CA1105565A (en) 1978-09-12 1981-07-21 Kaufman (John G.) Hospital Products Ltd. Electrosurgical electrode
US4278474A (en) 1980-03-25 1981-07-14 The United States Of America As Represented By The United States Department Of Energy Device for conversion of electromagnetic radiation into electrical current
US4416288A (en) 1980-08-14 1983-11-22 The Regents Of The University Of California Apparatus and method for reconstructing subsurface electrophysiological patterns
US4487162A (en) 1980-11-25 1984-12-11 Cann Gordon L Magnetoplasmadynamic apparatus for the separation and deposition of materials
US4471003A (en) 1980-11-25 1984-09-11 Cann Gordon L Magnetoplasmadynamic apparatus and process for the separation and deposition of materials
US4392451A (en) 1980-12-31 1983-07-12 The Boeing Company Apparatus for forming thin-film heterojunction solar cells employing materials selected from the class of I-III-VI2 chalcopyrite compounds
US4658153A (en) 1984-06-18 1987-04-14 Amnon Brosh Planar coil apparatus for providing a frequency output vs. position
US4761335A (en) 1985-03-07 1988-08-02 National Starch And Chemical Corporation Alpha-particle protection of semiconductor devices
US4855017A (en) 1985-05-03 1989-08-08 Texas Instruments Incorporated Trench etch process for a single-wafer RIE dry etch reactor
US4784720A (en) 1985-05-03 1988-11-15 Texas Instruments Incorporated Trench etch process for a single-wafer RIE dry etch reactor
US4663828A (en) 1985-10-11 1987-05-12 Energy Conversion Devices, Inc. Process and apparatus for continuous production of lightweight arrays of photovoltaic cells
US4763275A (en) 1986-02-20 1988-08-09 Carlin John A Force accumulating device for sporting protective gear
US4918811A (en) * 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4766670A (en) 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
JPH01223064A (ja) 1988-03-02 1989-09-06 Hitachi Ltd 駆動輪空転防止装置
US5439575A (en) 1988-06-30 1995-08-08 Board Of Trustees Of The University Of Illinois Hybrid method for depositing semi-conductive materials
CA1292572C (en) 1988-10-25 1991-11-26 Fernando C. Lebron Cardiac mapping system simulator
US4911169A (en) 1989-03-13 1990-03-27 Ferrari Robert K Biomedical electrode with limb band
US5178957A (en) 1989-05-02 1993-01-12 Minnesota Mining And Manufacturing Company Noble metal-polymer composites and flexible thin-film conductors prepared therefrom
US5250903A (en) 1989-05-31 1993-10-05 Amoco Corporation Method and apparatus using oscillatory magnetic field to determine state of charge of an electrolytic storage cell
US5086785A (en) 1989-08-10 1992-02-11 Abrams/Gentille Entertainment Inc. Angular displacement sensors
US5059424A (en) 1989-11-01 1991-10-22 Ndm Acquisition Corp. Hydrogel wound dressing product
US5118400A (en) 1990-01-29 1992-06-02 Spire Corporation Method of making biocompatible electrodes
US5108819A (en) 1990-02-14 1992-04-28 Eli Lilly And Company Thin film electrical component
DE59109246D1 (de) 1990-05-03 2003-04-03 Hoffmann La Roche Mikrooptischer Sensor
US5147519A (en) 1990-07-27 1992-09-15 Motorola, Inc. Method of manufacturing elastomers containing fine line conductors
US5206749A (en) 1990-12-31 1993-04-27 Kopin Corporation Liquid crystal display having essentially single crystal transistors pixels and driving circuits
US5475514A (en) 1990-12-31 1995-12-12 Kopin Corporation Transferred single crystal arrayed devices including a light shield for projection displays
US6387052B1 (en) 1991-01-29 2002-05-14 Edwards Lifesciences Corporation Thermodilution catheter having a safe, flexible heating element
US5560974A (en) 1991-03-22 1996-10-01 Kappler Safety Group, Inc. Breathable non-woven composite barrier fabric and fabrication process
AU654552B2 (en) 1991-04-05 1994-11-10 Medtronic, Inc. Subcutaneous multi-electrode sensing system
US5204144A (en) 1991-05-10 1993-04-20 Celestech, Inc. Method for plasma deposition on apertured substrates
JPH0587511A (ja) 1991-07-24 1993-04-06 Yamaha Corp 曲げ検出装置
US5246003A (en) 1991-08-28 1993-09-21 Nellcor Incorporated Disposable pulse oximeter sensor
US5272375A (en) 1991-12-26 1993-12-21 E. I. Du Pont De Nemours And Company Electronic assembly with optimum heat dissipation
US5539935A (en) 1992-01-10 1996-07-30 Rush, Iii; Gus A. Sports helmet
US5313094A (en) 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
US5491651A (en) 1992-05-15 1996-02-13 Key, Idea Development Flexible wearable computer
US5306917A (en) 1992-08-12 1994-04-26 Reliant Laser Corporation Electro-optical system for measuring and analyzing accumulated short-wave and long-wave ultraviolet radiation exposure
US5549108A (en) 1992-09-25 1996-08-27 Ep Technologies, Inc. Cardiac mapping and ablation systems
US5309910A (en) 1992-09-25 1994-05-10 Ep Technologies, Inc. Cardiac mapping and ablation systems
US5471982A (en) 1992-09-29 1995-12-05 Ep Technologies, Inc. Cardiac mapping and ablation systems
US5687737A (en) 1992-10-09 1997-11-18 Washington University Computerized three-dimensional cardiac mapping with interactive visual displays
DE4241045C1 (de) 1992-12-05 1994-05-26 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silicium
DK0676973T3 (da) 1992-12-31 1998-03-02 Alza Corp Elektrotransportsystem med bøjeligt organ
US6233491B1 (en) 1993-03-16 2001-05-15 Ep Technologies, Inc. Cardiac mapping and ablation systems
GB2276326B (en) 1993-03-23 1996-10-09 Mclaughlin James A Profiled biosignal electrode device
US5617870A (en) 1993-04-29 1997-04-08 Scimed Life Systems, Inc. Intravascular flow measurement system
US5477088A (en) 1993-05-12 1995-12-19 Rockett; Angus A. Multi-phase back contacts for CIS solar cells
US5326521A (en) 1993-05-26 1994-07-05 East Douglas A Method for preparing silicone mold tooling
US5860974A (en) 1993-07-01 1999-01-19 Boston Scientific Corporation Heart ablation catheter with expandable electrode and method of coupling energy to an electrode on a catheter shaft
AU7563294A (en) 1993-08-24 1995-03-21 Metrika Laboratories, Inc. Novel disposable electronic assay device
US5837546A (en) 1993-08-24 1998-11-17 Metrika, Inc. Electronic assay device and method
US5591941A (en) 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5793107A (en) 1993-10-29 1998-08-11 Vlsi Technology, Inc. Polysilicon pillar heat sinks for semiconductor on insulator circuits
US5360987A (en) 1993-11-17 1994-11-01 At&T Bell Laboratories Semiconductor photodiode device with isolation region
US5427096A (en) 1993-11-19 1995-06-27 Cmc Assemblers, Inc. Water-degradable electrode
US6864570B2 (en) 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5545291A (en) 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5824186A (en) 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5514242A (en) 1993-12-30 1996-05-07 Saint Gobain/Norton Industrial Ceramics Corporation Method of forming a heat-sinked electronic component
EP0676814B1 (en) 1994-04-06 2006-03-22 Denso Corporation Process of producing trench semiconductor device
US5434751A (en) 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5753529A (en) 1994-05-05 1998-05-19 Siliconix Incorporated Surface mount and flip chip technology for total integrated circuit isolation
US5454270A (en) 1994-06-06 1995-10-03 Motorola, Inc. Hermetically sealed pressure sensor and method thereof
US5567975A (en) 1994-06-30 1996-10-22 Santa Barbara Research Center Group II-VI radiation detector for simultaneous visible and IR detection
US5525815A (en) 1994-10-03 1996-06-11 General Electric Company Diamond film structure with high thermal conductivity
US5767578A (en) 1994-10-12 1998-06-16 Siliconix Incorporated Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation
US5625471A (en) 1994-11-02 1997-04-29 Litel Instruments Dual plate holographic imaging technique and masks
US6266623B1 (en) 1994-11-21 2001-07-24 Phatrat Technology, Inc. Sport monitoring apparatus for determining loft time, speed, power absorbed and other factors such as height
US5686697A (en) 1995-01-06 1997-11-11 Metatech Corporation Electrical circuit suspension system
US6176842B1 (en) 1995-03-08 2001-01-23 Ekos Corporation Ultrasound assembly for use with light activated drugs
US5917534A (en) 1995-06-29 1999-06-29 Eastman Kodak Company Light-emitting diode arrays with integrated photodetectors formed as a monolithic device and methods and apparatus for using same
US6639578B1 (en) 1995-07-20 2003-10-28 E Ink Corporation Flexible displays
US6459418B1 (en) 1995-07-20 2002-10-01 E Ink Corporation Displays combining active and non-active inks
US6023638A (en) 1995-07-28 2000-02-08 Scimed Life Systems, Inc. System and method for conducting electrophysiological testing using high-voltage energy pulses to stun tissue
US5872051A (en) 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
GB9611437D0 (en) 1995-08-03 1996-08-07 Secr Defence Biomaterial
JP3372258B2 (ja) 1995-08-04 2003-01-27 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン リソグラフィ・プロセス用のスタンプ
WO1997007429A1 (en) 1995-08-18 1997-02-27 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US5612513A (en) 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
NL1001890C2 (nl) 1995-12-13 1997-06-17 Cordis Europ Catheter met plaatvormige elektrode-reeks.
JP3316820B2 (ja) 1995-12-28 2002-08-19 シィグナス インコーポレィティド 被験者の生理的分析物の継続モニタリング装置及び方法
GB9601289D0 (en) 1996-01-23 1996-03-27 Nimbus Manufacturing Uk Limite Manufacture of optical data storage disc
SE9600334D0 (sv) 1996-01-30 1996-01-30 Radi Medical Systems Combined flow, pressure and temperature sensor
JP3957803B2 (ja) 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
US5880369A (en) 1996-03-15 1999-03-09 Analog Devices, Inc. Micromachined device with enhanced dimensional control
US5790151A (en) 1996-03-27 1998-08-04 Imaging Technology International Corp. Ink jet printhead and method of making
US6628987B1 (en) 2000-09-26 2003-09-30 Medtronic, Inc. Method and system for sensing cardiac contractions during vagal stimulation-induced cardiopalegia
US5968839A (en) 1996-05-13 1999-10-19 Metrika, Inc. Method and device producing a predetermined distribution of detectable change in assays
US6784023B2 (en) 1996-05-20 2004-08-31 Micron Technology, Inc. Method of fabrication of stacked semiconductor devices
US5978972A (en) 1996-06-14 1999-11-09 Johns Hopkins University Helmet system including at least three accelerometers and mass memory and method for recording in real-time orthogonal acceleration data of a head
DE19643550A1 (de) 1996-10-24 1998-05-14 Leybold Systems Gmbh Lichttransparentes, Wärmestrahlung reflektierendes Schichtensystem
US5691245A (en) 1996-10-28 1997-11-25 He Holdings, Inc. Methods of forming two-sided HDMI interconnect structures
US5817008A (en) 1996-10-31 1998-10-06 Spacelabs Medical, Inc. Conformal pulse oximetry sensor and monitor
GB9704737D0 (en) 1997-03-07 1997-04-23 Optel Instr Limited Biological measurement system
US6980196B1 (en) 1997-03-18 2005-12-27 Massachusetts Institute Of Technology Printable electronic display
US5998291A (en) 1997-04-07 1999-12-07 Raytheon Company Attachment method for assembly of high density multiple interconnect structures
US6063046A (en) 1997-04-11 2000-05-16 Allum; John H. Method and apparatus for the diagnosis and rehabilitation of balance disorders
AUPO662497A0 (en) 1997-05-05 1997-05-29 Cardiac Crc Nominees Pty Limited An epicardial electrode array
US5907189A (en) 1997-05-29 1999-05-25 Lsi Logic Corporation Conformal diamond coating for thermal improvement of electronic packages
DE19829309B4 (de) 1997-07-04 2008-02-07 Fuji Electric Co., Ltd., Kawasaki Verfahren zur Herstellung eines thermischen Oxidfilms auf Siliciumcarbid
US6024702A (en) 1997-09-03 2000-02-15 Pmt Corporation Implantable electrode manufactured with flexible printed circuit
US5928001A (en) 1997-09-08 1999-07-27 Motorola, Inc. Surface mountable flexible interconnect
FR2769640B1 (fr) 1997-10-15 1999-12-17 Sgs Thomson Microelectronics Amelioration de la resistance mecanique d'une tranche de silicium monocristallin
US6730047B2 (en) 1997-10-24 2004-05-04 Creative Sports Technologies, Inc. Head gear including a data augmentation unit for detecting head motion and providing feedback relating to the head motion
DE19748173A1 (de) 1997-10-31 1999-05-06 Ahlers Horst Dr Ing Habil Elektronikbauelemente einschließlich Sensoren
US6171730B1 (en) 1997-11-07 2001-01-09 Canon Kabushiki Kaisha Exposure method and exposure apparatus
US20050096513A1 (en) 1997-11-11 2005-05-05 Irvine Sensors Corporation Wearable biomonitor with flexible thinned integrated circuit
US6009632A (en) 1997-12-12 2000-01-04 Mercury Diagnostics, Inc. Alignment system for optical analyte testing meter components
EP1058837B1 (fr) 1997-12-31 2004-04-07 Société d'Applications Electroniques pour la Physique, la Science et l'Industrie Capteurs capacitifs de mesure d'humidite et procede de fabrication de tels capteurs
JP3219043B2 (ja) 1998-01-07 2001-10-15 日本電気株式会社 半導体装置のパッケージ方法および半導体装置
US5955781A (en) 1998-01-13 1999-09-21 International Business Machines Corporation Embedded thermal conductors for semiconductor chips
JP3359910B2 (ja) 1998-01-22 2002-12-24 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マイクロシステム及びマイクロシステムを製造する方法
GB9805214D0 (en) 1998-03-11 1998-05-06 Univ Glasgow Cell adhesion
US6316283B1 (en) 1998-03-25 2001-11-13 Asulab Sa Batch manufacturing method for photovoltaic cells
WO1999052588A1 (en) 1998-04-14 1999-10-21 Koninklijke Philips Electronics N.V. Electro-stimulation apparatus
US6181551B1 (en) 1998-04-15 2001-01-30 Dell Usa, L.P. Pin soldering enhancement and method
US6338727B1 (en) 1998-08-13 2002-01-15 Alsius Corporation Indwelling heat exchange catheter and method of using same
US5979972A (en) 1998-04-29 1999-11-09 Fleetwood Folding Trailers, Inc. Folding trailer with integral cargo platform
US6057212A (en) 1998-05-04 2000-05-02 International Business Machines Corporation Method for making bonded metal back-plane substrates
KR100275730B1 (ko) 1998-05-11 2000-12-15 윤종용 트렌치 소자분리 방법
JP3511895B2 (ja) 1998-06-05 2004-03-29 株式会社村田製作所 セラミック多層基板の製造方法
US6322963B1 (en) 1998-06-15 2001-11-27 Biosensor Systems Design., Inc. Sensor for analyte detection
US7209787B2 (en) 1998-08-05 2007-04-24 Bioneuronics Corporation Apparatus and method for closed-loop intracranial stimulation for optimal control of neurological disease
US6239980B1 (en) * 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
US6148127A (en) 1998-09-23 2000-11-14 Lucent Technologies Inc. Tunable dispersion compensator and optical system comprising same
EP1064652A1 (en) 1998-11-16 2001-01-03 Cambridge Scientific, Inc. Biopolymer-based holographic optical element
US6097984A (en) 1998-11-25 2000-08-01 Medtronic, Inc. System and method of stimulation for treating gastro-esophageal reflux disease
IT1310000B1 (it) 1999-01-26 2002-02-05 Consiglio Nazionale Ricerche Sensore a fibra ottica e trasduttore fotocromico per fotometria eradiometria e relativo metodo
US6236883B1 (en) 1999-02-03 2001-05-22 The Trustees Of Columbia University In The City Of New York Methods and systems for localizing reentrant circuits from electrogram features
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6850312B2 (en) 1999-03-16 2005-02-01 Alien Technology Corporation Apparatuses and methods for flexible displays
US6683663B1 (en) 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6281038B1 (en) 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies
US6555408B1 (en) 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
KR100686784B1 (ko) 1999-02-05 2007-02-23 알리엔 테크놀로지 코포레이션 어셈블리를 형성하는 방법 및 장치
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6606079B1 (en) 1999-02-16 2003-08-12 Alien Technology Corporation Pixel integrated circuit
US6380729B1 (en) 1999-02-16 2002-04-30 Alien Technology Corporation Testing integrated circuit dice
US6752505B2 (en) 1999-02-23 2004-06-22 Solid State Opto Limited Light redirecting films and film systems
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6316278B1 (en) 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
KR100434537B1 (ko) 1999-03-31 2004-06-05 삼성전자주식회사 다공질 실리콘 혹은 다공질 산화 실리콘을 이용한 두꺼운 희생층을 가진 다층 구조 웨이퍼 및 그 제조방법
US6433401B1 (en) 1999-04-06 2002-08-13 Analog Devices Imi, Inc. Microfabricated structures with trench-isolation using bonded-substrates and cavities
EE04249B1 (et) 1999-04-21 2004-02-16 Asper O� Meetod biopolümeermaatriksi lugemiseks ja fluorestsentsdetektor
US6276775B1 (en) 1999-04-29 2001-08-21 Hewlett-Packard Company Variable drop mass inkjet drop generator
US6225149B1 (en) 1999-05-03 2001-05-01 Feng Yuan Gan Methods to fabricate thin film transistors and circuits
US6150602A (en) 1999-05-25 2000-11-21 Hughes Electronics Corporation Large area solar cell extended life interconnect
US7426409B2 (en) 1999-06-25 2008-09-16 Board Of Regents, The University Of Texas System Method and apparatus for detecting vulnerable atherosclerotic plaque
JP3419348B2 (ja) 1999-06-28 2003-06-23 日本電気株式会社 集積回路素子接続用ケーブルおよびその製造方法
US20020082515A1 (en) 1999-07-01 2002-06-27 Campbell Thomas H. Thermography catheter
ATE450895T1 (de) 1999-07-21 2009-12-15 E Ink Corp Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
GB2355116B (en) 1999-10-08 2003-10-08 Nokia Mobile Phones Ltd An antenna assembly and method of construction
WO2001031082A1 (en) 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components
US6527964B1 (en) 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6623579B1 (en) 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6451191B1 (en) 1999-11-18 2002-09-17 3M Innovative Properties Company Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same
US6641860B1 (en) 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
US6220916B1 (en) 2000-01-21 2001-04-24 Philip D. Bart Toy band with pre-recorded message
US6533905B2 (en) 2000-01-24 2003-03-18 Tini Alloy Company Method for sputtering tini shape-memory alloys
AU2001240043A1 (en) 2000-03-06 2001-09-17 University Of Connecticut Apparatus and method for fabrication of photonic crystals
JP4360015B2 (ja) 2000-03-17 2009-11-11 セイコーエプソン株式会社 有機ｅｌ表示体の製造方法、半導体素子の配置方法、半導体装置の製造方法
ATE280976T1 (de) * 2000-03-24 2004-11-15 Infineon Technologies Ag Gehäuse für biometrische sensorchips
US6869430B2 (en) 2000-03-31 2005-03-22 Rita Medical Systems, Inc. Tissue biopsy and treatment apparatus and method
US7252664B2 (en) 2000-05-12 2007-08-07 Cardima, Inc. System and method for multi-channel RF energy delivery with coagulum reduction
AU775392B2 (en) 2000-05-24 2004-07-29 Silverbrook Research Pty Ltd Printed page tag encoder
US6360615B1 (en) 2000-06-06 2002-03-26 Technoskin, Llc Wearable effect-emitting strain gauge device
WO2001097276A1 (fr) 2000-06-14 2001-12-20 Sekisui Chemical Co., Ltd. Film muni de microparticules, film pour connexions electriques, et procede de depot de microparticules
US6787052B1 (en) 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
WO2001098838A2 (en) 2000-06-22 2001-12-27 Koninklijke Philips Electronics N.V. Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
US6403397B1 (en) 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
JP4120184B2 (ja) 2000-06-30 2008-07-16 セイコーエプソン株式会社 実装用微小構造体および光伝送装置
AU2001271799A1 (en) 2000-06-30 2002-01-14 President And Fellows Of Harvard College Electric microcontact printing method and apparatus
US6511478B1 (en) 2000-06-30 2003-01-28 Scimed Life Systems, Inc. Medical probe with reduced number of temperature sensor wires
US6723576B2 (en) 2000-06-30 2004-04-20 Seiko Epson Corporation Disposing method for semiconductor elements
DE60114318T2 (de) 2000-07-03 2006-07-13 Matsushita Electric Works, Ltd., Kadoma Kapazitiver Feuchtigkeitssensor und Verfahren zu dessen Herstellung
JP2004505294A (ja) 2000-07-21 2004-02-19 マイクロ　マネージド　フォトンズ　アクティーゼルスカブ 表面プラズモン・ポラリトン・バンドギャップ構造
US6938783B2 (en) * 2000-07-26 2005-09-06 Amerasia International Technology, Inc. Carrier tape
DE10037715A1 (de) 2000-08-02 2002-02-14 Endress Hauser Gmbh Co Vorrichtung zur Messung des Füllstands eines Füllguts in einem Behälter
US6836744B1 (en) 2000-08-18 2004-12-28 Fareid A. Asphahani Portable system for analyzing human gait
US6780696B1 (en) 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
JP2002092984A (ja) 2000-09-18 2002-03-29 Hitachi Maxell Ltd スタンパ及びその製造方法、並びにプラスチック基板
US6980184B1 (en) 2000-09-27 2005-12-27 Alien Technology Corporation Display devices and integrated circuits
US6640120B1 (en) 2000-10-05 2003-10-28 Scimed Life Systems, Inc. Probe assembly for mapping and ablating pulmonary vein tissue and method of using same
US6826509B2 (en) 2000-10-11 2004-11-30 Riddell, Inc. System and method for measuring the linear and rotational acceleration of a body part
US7526389B2 (en) 2000-10-11 2009-04-28 Riddell, Inc. Power management of a system for measuring the acceleration of a body part
US6814898B1 (en) 2000-10-17 2004-11-09 Seagate Technology Llc Imprint lithography utilizing room temperature embossing
US6775906B1 (en) 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
US6421016B1 (en) 2000-10-23 2002-07-16 Motorola, Inc. Antenna system with channeled RF currents
AU2002239286A1 (en) 2000-11-21 2002-06-03 Alien Technology Corporation Display device and methods of manufacture and control
US6750480B2 (en) 2000-11-27 2004-06-15 Kopin Corporation Bipolar transistor with lattice matched base layer
US6875176B2 (en) 2000-11-28 2005-04-05 Aller Physionix Limited Systems and methods for making noninvasive physiological assessments
US6743982B2 (en) 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
AUPR174800A0 (en) 2000-11-29 2000-12-21 Australian National University, The Semiconductor processing
GB0029312D0 (en) 2000-12-01 2001-01-17 Philips Corp Intellectual Pty Flexible electronic device
US20020070443A1 (en) * 2000-12-08 2002-06-13 Xiao-Chun Mu Microelectronic package having an integrated heat sink and build-up layers
US6603440B2 (en) 2000-12-14 2003-08-05 Protura Wireless, Inc. Arrayed-segment loop antenna
US6608360B2 (en) 2000-12-15 2003-08-19 University Of Houston One-chip micro-integrated optoelectronic sensor
US20070031607A1 (en) 2000-12-19 2007-02-08 Alexander Dubson Method and apparatus for coating medical implants
US6541098B2 (en) * 2000-12-22 2003-04-01 Avery Dennison Corporation Three-dimensional flexible adhesive film structures
US6666821B2 (en) 2001-01-08 2003-12-23 Medtronic, Inc. Sensor system
EP1372602B1 (en) 2001-01-09 2007-04-18 Microchips, Inc. Flexible microchip devices for ophthalmic and other applications
US7078582B2 (en) 2001-01-17 2006-07-18 3M Innovative Properties Company Stretch removable adhesive articles and methods
US6655286B2 (en) 2001-01-19 2003-12-02 Lucent Technologies Inc. Method for preventing distortions in a flexibly transferred feature pattern
US20030017848A1 (en) 2001-07-17 2003-01-23 Engstrom G. Eric Personalizing electronic devices and smart covering
US6944482B2 (en) 2001-01-22 2005-09-13 Wildseed Ltd. Visualization supplemented wireless mobile telephony
US20020110766A1 (en) 2001-02-09 2002-08-15 Industrial Technology Research Institute Process method of using excimer laser for forming micro spherical and non-spherical polymeric structure array
JP3665579B2 (ja) 2001-02-26 2005-06-29 ソニーケミカル株式会社 電気装置製造方法
KR20020093113A (ko) 2001-03-06 2002-12-12 코닌클리케 필립스 일렉트로닉스 엔.브이. 디스플레이 디바이스
US20020128700A1 (en) 2001-03-08 2002-09-12 Cross Thomas E. Lead with adjustable angular and spatial relationships between electrodes
CA2451882A1 (en) 2001-03-14 2002-09-19 University Of Massachusetts Nanofabrication
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6600363B2 (en) 2001-04-05 2003-07-29 Cornell Research Foundation, Inc. Folded floating-gate differential pair amplifier
US6667548B2 (en) 2001-04-06 2003-12-23 Intel Corporation Diamond heat spreading and cooling technique for integrated circuits
US6477417B1 (en) 2001-04-12 2002-11-05 Pacesetter, Inc. System and method for automatically selecting electrode polarity during sensing and stimulation
US6864435B2 (en) 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US7232460B2 (en) 2001-04-25 2007-06-19 Xillus, Inc. Nanodevices, microdevices and sensors on in-vivo structures and method for the same
KR100380107B1 (ko) 2001-04-30 2003-04-11 삼성전자주식회사 발열체를 갖는 회로 기판과 기밀 밀봉부를 갖는 멀티 칩패키지
DE10122324A1 (de) 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
US6533731B2 (en) 2001-05-15 2003-03-18 Lifecheck, Llc Method and apparatus for measuring heat flow
US6455931B1 (en) 2001-05-15 2002-09-24 Raytheon Company Monolithic microelectronic array structure having substrate islands and its fabrication
AU2002257289A1 (en) 2001-05-17 2002-11-25 The Board Of Trustees Of The Leland Stanford Junior University Device and method for three-dimensional spatial localization and functional interconnection of different types of cells
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6988667B2 (en) 2001-05-31 2006-01-24 Alien Technology Corporation Methods and apparatuses to identify devices
WO2002103760A2 (en) 2001-06-14 2002-12-27 Amberware Systems Corporation Method of selective removal of sige alloys
US6626940B2 (en) 2001-06-15 2003-09-30 Scimed Life Systems, Inc. Medical device activation system
US20030006527A1 (en) 2001-06-22 2003-01-09 Rabolt John F. Method of fabricating micron-and submicron-scale elastomeric templates for surface patterning
US6984934B2 (en) 2001-07-10 2006-01-10 The Trustees Of Princeton University Micro-lens arrays for display intensity enhancement
US6410971B1 (en) 2001-07-12 2002-06-25 Ferrotec (Usa) Corporation Thermoelectric module with thin film substrates
US6657289B1 (en) 2001-07-13 2003-12-02 Alien Technology Corporation Apparatus relating to block configurations and fluidic self-assembly processes
US6590346B1 (en) 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US6856830B2 (en) 2001-07-19 2005-02-15 Bin He Method and apparatus of three dimension electrocardiographic imaging
US6661037B2 (en) 2001-07-20 2003-12-09 Microlink Devices, Inc. Low emitter resistance contacts to GaAs high speed HBT
US6917061B2 (en) 2001-07-20 2005-07-12 Microlink Devices, Inc. AlGaAs or InGaP low turn-on voltage GaAs-based heterojunction bipolar transistor
AU2002322581A1 (en) 2001-07-20 2003-03-03 Microlink Devices, Inc. Graded base gaassb for high speed gaas hbt
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6770966B2 (en) 2001-07-31 2004-08-03 Intel Corporation Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
JP4638626B2 (ja) 2001-08-01 2011-02-23 北川工業株式会社 磁性体の成形方法、磁性体、およびプリント基板
US6949199B1 (en) 2001-08-16 2005-09-27 Seagate Technology Llc Heat-transfer-stamp process for thermal imprint lithography
US6863219B1 (en) 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6731353B1 (en) 2001-08-17 2004-05-04 Alien Technology Corporation Method and apparatus for transferring blocks
US6861757B2 (en) * 2001-09-03 2005-03-01 Nec Corporation Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
WO2003021679A2 (en) 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
JP2003077940A (ja) 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
AUPR795401A0 (en) 2001-09-28 2001-10-18 University Of Queensland, The Components based on melanin and melanin-like bio-molecules and processes for their production
US7193504B2 (en) 2001-10-09 2007-03-20 Alien Technology Corporation Methods and apparatuses for identification
US6936181B2 (en) 2001-10-11 2005-08-30 Kovio, Inc. Methods for patterning using liquid embossing
KR100944886B1 (ko) 2001-10-30 2010-03-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제조 방법
US7146221B2 (en) 2001-11-16 2006-12-05 The Regents Of The University Of California Flexible electrode array for artifical vision
US20040006264A1 (en) 2001-11-20 2004-01-08 Mojarradi Mohammad M. Neural prosthetic micro system
US7169669B2 (en) 2001-12-04 2007-01-30 Origin Energy Solar Pty. Ltd. Method of making thin silicon sheets for solar cells
US6844673B1 (en) 2001-12-06 2005-01-18 Alien Technology Corporation Split-fabrication for light emitting display structures
US20040092806A1 (en) 2001-12-11 2004-05-13 Sagon Stephen W Microelectrode catheter for mapping and ablation
JP4263400B2 (ja) 2001-12-21 2009-05-13 株式会社ブリヂストン 路面摩擦係数推定方法と路面摩擦係数推定装置
US6887450B2 (en) 2002-01-02 2005-05-03 Zyvex Corporation Directional assembly of carbon nanotube strings
US7998080B2 (en) 2002-01-15 2011-08-16 Orsan Medical Technologies Ltd. Method for monitoring blood flow to brain
DE10202123A1 (de) 2002-01-21 2003-07-31 Infineon Technologies Ag Verfahren und Vorrichtung zur Integration von Elektronik in Textilien
US6653030B2 (en) 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
CA2474054A1 (en) 2002-01-23 2003-07-31 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6608370B1 (en) 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
US6693384B1 (en) 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices
US20030149456A1 (en) 2002-02-01 2003-08-07 Rottenberg William B. Multi-electrode cardiac lead adapter with multiplexer
US20030162507A1 (en) 2002-02-20 2003-08-28 Vatt Gregory B. Semiconductor structure for high speed digital and radio frequency processing
JP3975272B2 (ja) 2002-02-21 2007-09-12 独立行政法人産業技術総合研究所 超微細流体ジェット装置
EP1340622B1 (en) 2002-03-01 2006-12-13 Dai Nippon Printing Co., Ltd. Thermally transferable image protective sheet, method for protective layer formation, and record produced by said method
US7158277B2 (en) 2002-03-07 2007-01-02 Acreo Ab Electrochemical device
JP3889700B2 (ja) 2002-03-13 2007-03-07 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープの製造方法
US6950220B2 (en) 2002-03-18 2005-09-27 E Ink Corporation Electro-optic displays, and methods for driving same
US20060134713A1 (en) 2002-03-21 2006-06-22 Lifescan, Inc. Biosensor apparatus and methods of use
JP3980918B2 (ja) 2002-03-28 2007-09-26 株式会社東芝 アクティブマトリクス基板及びその製造方法、表示装置
JP2003297974A (ja) 2002-03-29 2003-10-17 Seiko Epson Corp 半導体装置、電気光学装置および半導体装置の製造方法
US6872645B2 (en) 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US20040026684A1 (en) 2002-04-02 2004-02-12 Nanosys, Inc. Nanowire heterostructures for encoding information
US8328420B2 (en) 2003-04-22 2012-12-11 Marcio Marc Abreu Apparatus and method for measuring biologic parameters
JP4736324B2 (ja) 2002-04-22 2011-07-27 コニカミノルタホールディングス株式会社 半導体素子及びその製造方法
WO2003092077A2 (en) 2002-04-24 2003-11-06 E Ink Corporation Electronic displays
EP1357773A3 (en) 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
EP1506568B1 (en) 2002-04-29 2016-06-01 Samsung Electronics Co., Ltd. Direct-connect signaling system
DE10219120A1 (de) 2002-04-29 2003-11-20 Infineon Technologies Ag Oberflächenfunktionalisierte anorganische Halbleiterpartikel als elektrische Halbleiter für mikroelektronische Anwendungen
US6930608B2 (en) 2002-05-14 2005-08-16 Motorola, Inc Apparel having multiple alternative sensors and corresponding method
JP4052631B2 (ja) 2002-05-17 2008-02-27 株式会社東芝 アクティブマトリクス型表示装置
AU2003253690A1 (en) 2002-06-24 2004-01-06 Massachusetts Institute Of Technology Silk biomaterials and methods of use thereof
CA2525994C (en) 2002-06-24 2012-10-16 Tufts University Silk biomaterials and methods of use thereof
AU2003258969A1 (en) 2002-06-27 2004-01-19 Nanosys Inc. Planar nanowire based sensor elements, devices, systems and methods for using and making same
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
US6980777B2 (en) 2002-07-31 2005-12-27 Nokia Corporation Smart pouch cover for mobile device
MXPA04012948A (es) 2002-07-31 2005-09-12 Schering Ag Inhibidores antranilamidopiridinas vegfr-2 y vegfr-3.
US7371963B2 (en) 2002-07-31 2008-05-13 Kyocera Corporation Photovoltaic power generation system
US7102524B2 (en) 2002-08-02 2006-09-05 Symbol Technologies, Inc. Die frame apparatus and method of transferring dies therewith
CN100427850C (zh) 2002-08-07 2008-10-22 菲尼克斯咨询有限公司 调温穿戴物
US6965160B2 (en) * 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
NL1021298C2 (nl) 2002-08-19 2004-02-20 Tno Voertuigbediening die gebruikmaakt van een wegdek-band interactiemodel.
AU2003253192A1 (en) 2002-08-27 2004-04-30 Nanosys Gmbh Method for applying a hydrophobic coating to the surface of a porous substrate, maintaining its porosity
US6805809B2 (en) 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
CA2497451A1 (en) 2002-09-05 2004-03-18 Nanosys, Inc. Organic species that facilitate charge transfer to or from nanostructures
US6878871B2 (en) 2002-09-05 2005-04-12 Nanosys, Inc. Nanostructure and nanocomposite based compositions and photovoltaic devices
WO2004022637A2 (en) 2002-09-05 2004-03-18 Nanosys, Inc. Nanocomposites
WO2004027822A2 (en) 2002-09-05 2004-04-01 Nanosys, Inc. Oriented nanostructures and methods of preparing
US7227240B2 (en) 2002-09-10 2007-06-05 Semiconductor Components Industries, L.L.C. Semiconductor device with wire bond inductor and method
KR100512960B1 (ko) 2002-09-26 2005-09-07 삼성전자주식회사 플렉서블 ｍｅｍｓ 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 ｍｅｍｓ 무선 마이크로폰
US7051945B2 (en) 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
CA2499944A1 (en) 2002-09-30 2004-04-15 Nanosys, Inc. Integrated displays using nanowire transistors
TWI319201B (en) 2002-09-30 2010-01-01 Nanosys Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
KR101191632B1 (ko) 2002-09-30 2012-10-17 나노시스, 인크. 대형 나노 인에이블 매크로전자 기판 및 그 사용
US7698909B2 (en) 2002-10-01 2010-04-20 Nellcor Puritan Bennett Llc Headband with tension indicator
WO2004034025A2 (en) 2002-10-10 2004-04-22 Nanosys, Inc. Nano-chem-fet based biosensors
US20040081384A1 (en) 2002-10-25 2004-04-29 Datesman Aaron M. Multiple-mode planar-waveguide sensor, fabrication materials and techniques
US20040085469A1 (en) 2002-10-30 2004-05-06 Eastman Kodak Company Method to eliminate bus voltage drop effects for pixel source follower amplifiers
US7067903B2 (en) 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
AU2003302020B2 (en) 2002-11-14 2008-01-31 Ethicon Endo-Surgery, Inc. Methods and devices for detecting tissue cells
JP2004179258A (ja) 2002-11-25 2004-06-24 Hamamatsu Photonics Kk 紫外線センサ
US7204130B2 (en) 2002-12-03 2007-04-17 Ppg Industries Ohio, Inc. Windshield moisture detector
US20040200734A1 (en) 2002-12-19 2004-10-14 Co Man Sung Nanotube-based sensors for biomolecules
WO2004062697A2 (en) 2003-01-07 2004-07-29 Tufts University Silk fibroin materials and use thereof
WO2004062526A2 (en) 2003-01-16 2004-07-29 Galil Medical Ltd. Device, system, and method for detecting, localizing, and characterizing plaque-induced stenosis of a blood vessel
US7190051B2 (en) 2003-01-17 2007-03-13 Second Sight Medical Products, Inc. Chip level hermetic and biocompatible electronics package using SOI wafers
US6894265B2 (en) 2003-01-31 2005-05-17 Foveon, Inc. Vertical color filter sensor group and semiconductor integrated circuit fabrication method for fabricating same
US20040149921A1 (en) 2003-02-05 2004-08-05 Alexander Smyk Personal solar adviser
JP2006521278A (ja) 2003-03-11 2006-09-21 ナノシス・インコーポレイテッド ナノクリスタルを生成するためのプロセスおよびそれによって生成されるナノクリスタル
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US6855638B2 (en) 2003-03-24 2005-02-15 Union Semiconductor Technology Corporation Process to pattern thick TiW metal layers using uniform and selective etching
US7465678B2 (en) 2003-03-28 2008-12-16 The Trustees Of Princeton University Deformable organic devices
US20050227389A1 (en) 2004-04-13 2005-10-13 Rabin Bhattacharya Deformable organic devices
US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
EP1467224A1 (en) 2003-04-07 2004-10-13 CSEM Centre Suisse d'Electronique et de Microtechnique SA Optical proximity detector
EP1613796B1 (en) 2003-04-10 2017-03-22 Tufts University Concentrated aqueous silk fibroin solution and use thereof
US7056409B2 (en) 2003-04-17 2006-06-06 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7074294B2 (en) 2003-04-17 2006-07-11 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US20050038498A1 (en) 2003-04-17 2005-02-17 Nanosys, Inc. Medical device applications of nanostructured surfaces
JP4871726B2 (ja) 2003-04-28 2012-02-08 ナノシス・インク． 超疎液性表面、その作製法及び用途
US20040211458A1 (en) 2003-04-28 2004-10-28 General Electric Company Tandem photovoltaic cell stacks
US7337012B2 (en) 2003-04-30 2008-02-26 Lawrence Livermore National Security, Llc Stretchable polymer-based electronic device
US7803574B2 (en) 2003-05-05 2010-09-28 Nanosys, Inc. Medical device applications of nanostructured surfaces
TWI427709B (zh) 2003-05-05 2014-02-21 Nanosys Inc 用於增加表面面積之應用的奈米纖維表面
AU2003902270A0 (en) 2003-05-09 2003-05-29 Origin Energy Solar Pty Ltd Separating and assembling semiconductor strips
US7244326B2 (en) 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
US7374949B2 (en) 2003-05-29 2008-05-20 Bayer Healthcare Llc Diagnostic test strip for collecting and detecting an analyte in a fluid sample
US7265298B2 (en) 2003-05-30 2007-09-04 The Regents Of The University Of California Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
US7129935B2 (en) 2003-06-02 2006-10-31 Synaptics Incorporated Sensor patterns for a capacitive sensing apparatus
US7317532B2 (en) 2003-06-04 2008-01-08 Inverness Medical Switzerland Gmbh Flow sensing for determination of assay results
WO2005000483A1 (en) 2003-06-06 2005-01-06 Tufts University Method for forming inorganic coatings
US7494896B2 (en) 2003-06-12 2009-02-24 International Business Machines Corporation Method of forming magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer
CN1788481B (zh) 2003-06-12 2010-04-21 诺基亚有限公司 移动通信装置外壳及其操作方法
US7413919B2 (en) 2003-06-20 2008-08-19 Acellent Technologies, Inc. Method of manufacturing a structural health monitoring layer
US7033961B1 (en) 2003-07-15 2006-04-25 Rf Micro Devices, Inc. Epitaxy/substrate release layer
US7439158B2 (en) 2003-07-21 2008-10-21 Micron Technology, Inc. Strained semiconductor by full wafer bonding
KR101132076B1 (ko) 2003-08-04 2012-04-02 나노시스, 인크. 나노선 복합체 및 나노선 복합체로부터 전자 기판을제조하기 위한 시스템 및 프로세스
JP2005052212A (ja) 2003-08-05 2005-03-03 Axiom Co Ltd 肌センサ
EP1665120B1 (en) 2003-08-09 2013-04-17 Alien Technology Corporation Methods and apparatuses to identify devices
US7223609B2 (en) 2003-08-14 2007-05-29 Agilent Technologies, Inc. Arrays for multiplexed surface plasmon resonance detection of biological molecules
JP4554176B2 (ja) 2003-08-19 2010-09-29 株式会社ブリヂストン 路面状態推定方法
JP5449647B2 (ja) 2003-08-20 2014-03-19 フィロメトロン，インコーポレイティド ハイドレーションモニタリング
JP2005072528A (ja) 2003-08-28 2005-03-17 Shin Etsu Chem Co Ltd 薄層電界効果トランジスター及びその製造方法
US7029951B2 (en) 2003-09-12 2006-04-18 International Business Machines Corporation Cooling system for a semiconductor device and method of fabricating same
ES2564694T3 (es) 2003-09-12 2016-03-28 Vessix Vascular, Inc. Sistema de remodelación y / o ablación excéntrica seleccionable de material ateroesclerótico
WO2005029578A1 (en) 2003-09-24 2005-03-31 Koninklijke Philips Electronics N.V. Semiconductor device, method of manufacturing same, identification label and information carrier
EP1519220A1 (en) 2003-09-27 2005-03-30 3M Innovative Properties Company Electrochemical display device
GB0323286D0 (en) 2003-10-04 2003-11-05 Koninkl Philips Electronics Nv Device and method of making a device having a flexible layer structure
GB0323285D0 (en) 2003-10-04 2003-11-05 Koninkl Philips Electronics Nv Device and method of making a device having a patterned layer on a flexible substrate
US20050082526A1 (en) 2003-10-15 2005-04-21 International Business Machines Corporation Techniques for layer transfer processing
JP2005126595A (ja) 2003-10-24 2005-05-19 Dainippon Ink & Chem Inc ポリウレタン樹脂組成物、及びそれを用いてなるホットメルト接着剤
DE10349963A1 (de) 2003-10-24 2005-06-02 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Folie
US7689260B2 (en) 2003-11-06 2010-03-30 The Regents Of The University Of Colorado Shape-memory polymer coated electrodes
US20070058254A1 (en) 2003-11-11 2007-03-15 Tae Il Kim Advertising sheet using micro-prism retroreflective sheet and method for manufacturing the same
US20050113744A1 (en) 2003-11-21 2005-05-26 Cyberkinetics, Inc. Agent delivery systems and related methods under control of biological electrical signals
US7704684B2 (en) 2003-12-01 2010-04-27 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US20050124712A1 (en) 2003-12-05 2005-06-09 3M Innovative Properties Company Process for producing photonic crystals
US8774886B2 (en) 2006-10-04 2014-07-08 Dexcom, Inc. Analyte sensor
WO2005058083A2 (en) 2003-12-12 2005-06-30 Beck Gregory S Safety helmet with shock detector, helmet attachement device with shock detector & methods
US20090198293A1 (en) 2003-12-19 2009-08-06 Lawrence Cauller Microtransponder Array for Implant
US7632087B2 (en) 2003-12-19 2009-12-15 Wd Media, Inc. Composite stamper for imprint lithography
KR101281775B1 (ko) 2003-12-19 2013-07-15 더 유니버시티 오브 노쓰 캐롤라이나 엣 채플 힐 소프트 또는 임프린트 리소그래피를 이용하여 분리된마이크로- 및 나노- 구조를 제작하는 방법
DE10361940A1 (de) 2003-12-24 2005-07-28 Restate Patent Ag Degradationssteuerung biodegradierbarer Implantate durch Beschichtung
KR20050066128A (ko) 2003-12-26 2005-06-30 주식회사 팬택앤큐리텔 체인지 커버를 이용한 메모리카드의 교체구조 및 방법
US7150745B2 (en) 2004-01-09 2006-12-19 Barrx Medical, Inc. Devices and methods for treatment of luminal tissue
US20060003709A1 (en) 2004-06-30 2006-01-05 Nokia Corporation Protective enclosure for a mobile terminal
US8025960B2 (en) 2004-02-02 2011-09-27 Nanosys, Inc. Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production
WO2005083546A1 (en) 2004-02-27 2005-09-09 Simon Richard Daniel Wearable modular interface strap
DE602005025098D1 (de) 2004-03-08 2011-01-13 Univ Illinois Mikrofluidische elektrochemische reaktoren
DE102004011617B4 (de) 2004-03-10 2013-07-18 Hilti Aktiengesellschaft Planetengetriebe
US20050203366A1 (en) 2004-03-12 2005-09-15 Donoghue John P. Neurological event monitoring and therapy systems and related methods
TWI299358B (en) 2004-03-12 2008-08-01 Hon Hai Prec Ind Co Ltd Thermal interface material and method for making same
US7727228B2 (en) 2004-03-23 2010-06-01 Medtronic Cryocath Lp Method and apparatus for inflating and deflating balloon catheters
US7259030B2 (en) 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
AU2005232074A1 (en) 2004-03-29 2005-10-20 LumaChip, Inc. Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7052924B2 (en) 2004-03-29 2006-05-30 Articulated Technologies, Llc Light active sheet and methods for making the same
CN100383213C (zh) 2004-04-02 2008-04-23 清华大学 一种热界面材料及其制造方法
KR101185613B1 (ko) 2004-04-27 2012-09-24 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 소프트 리소그래피용 복합 패터닝 장치
US20080055581A1 (en) 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
WO2005106934A1 (en) 2004-04-28 2005-11-10 Iufc-Hyu Flexible electro-optical apparatus and method for manufacturing the same
US7302751B2 (en) 2004-04-30 2007-12-04 Hewlett-Packard Development Company, L.P. Method of fabricating a rat's nest RFID antenna
TWI255572B (en) 2004-05-05 2006-05-21 Advanced Connectek Inc A portable electrical power unit with transmission display
JP2005322858A (ja) 2004-05-11 2005-11-17 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US7473816B2 (en) 2004-05-18 2009-01-06 Lohmann & Rauscher, Inc. Multilayer moisture management fabric
JP5215661B2 (ja) 2004-05-21 2013-06-19 アガマトリックス インコーポレーテッド 電気化学的電池、及び電気化学的電池を作成する方法
US20050261561A1 (en) 2004-05-24 2005-11-24 Christopher W. Jones Blood testing and therapeutic compound delivery system
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
CN101120433B (zh) 2004-06-04 2010-12-08 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
EP1605502A1 (en) 2004-06-08 2005-12-14 Interuniversitair Microelektronica Centrum Vzw Transfer method for the manufacturing of electronic devices
US6987314B1 (en) * 2004-06-08 2006-01-17 Amkor Technology, Inc. Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
JP2008502739A (ja) 2004-06-11 2008-01-31 トラスティーズ オブ タフツ カレッジ 絹に基づく薬物送達システム
US7629691B2 (en) 2004-06-16 2009-12-08 Honeywell International Inc. Conductor geometry for electronic circuits fabricated on flexible substrates
EP1761792A2 (en) 2004-06-17 2007-03-14 Koninklijke Philips Electronics N.V. Flexible and wearable radio frequency coil garments for magnetic resonance imaging
US7425523B2 (en) 2004-07-05 2008-09-16 Dai Nippon Printing Co., Ltd. Thermal transfer recording material and thermal transfer recording method
JP2006044383A (ja) 2004-08-02 2006-02-16 Fuji Heavy Ind Ltd 車両のタイヤ情報表示装置
US7687886B2 (en) 2004-08-19 2010-03-30 Microlink Devices, Inc. High on-state breakdown heterojunction bipolar transistor
WO2006026748A1 (en) 2004-08-31 2006-03-09 Lifescan Scotland Limited Method of manufacturing an auto-calibrating sensor
WO2006029090A2 (en) 2004-09-02 2006-03-16 Proteus Biomedical, Inc. Methods and apparatus for tissue activation and monitoring
WO2006028996A2 (en) 2004-09-03 2006-03-16 Trustees Of Tufts College Emulsan-alginate microspheres and methods of use thereof
KR100643756B1 (ko) 2004-09-10 2006-11-10 삼성전자주식회사 유연소자, 유연압력센서, 및 이들의 제조방법
US20060068576A1 (en) 2004-09-30 2006-03-30 Burdick William E Jr Lithography transfer for high density interconnect circuits
JP2006108431A (ja) 2004-10-06 2006-04-20 Sharp Corp 半導体装置
US20080280360A1 (en) 2004-10-12 2008-11-13 Trustees Of Tufts College Method for Producing Biomaterial Scaffolds
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
JP2006118441A (ja) 2004-10-21 2006-05-11 Toyota Motor Corp 内燃機関の制御装置
US7621044B2 (en) 2004-10-22 2009-11-24 Formfactor, Inc. Method of manufacturing a resilient contact
US20060095121A1 (en) 2004-10-28 2006-05-04 Medtronic Vascular, Inc. Autologous platelet gel on a stent graft
WO2006050325A2 (en) 2004-10-29 2006-05-11 Worcester Polytechnic Institute System and method for multi-channel electrophysiologic signal data acquisition
GB2419940B (en) 2004-11-04 2007-03-07 Mesophotonics Ltd Metal nano-void photonic crystal for enhanced raman spectroscopy
JP4825488B2 (ja) 2004-11-09 2011-11-30 株式会社リコー 画像形成装置
US7695602B2 (en) 2004-11-12 2010-04-13 Xerox Corporation Systems and methods for transporting particles
JP2006186294A (ja) 2004-12-03 2006-07-13 Toppan Printing Co Ltd 薄膜トランジスタ及びその製造方法
US7999023B2 (en) 2004-12-03 2011-08-16 3M Innovative Properties Company Process for making pressure sensitive adhesive hydrogels
US20060127817A1 (en) 2004-12-10 2006-06-15 Eastman Kodak Company In-line fabrication of curved surface transistors
US20060129056A1 (en) 2004-12-10 2006-06-15 Washington University Electrocorticography telemitter
JP4517845B2 (ja) 2004-12-13 2010-08-04 日本電気株式会社 フレキシブルケーブル及び電子機器の製造方法
US7229901B2 (en) 2004-12-16 2007-06-12 Wisconsin Alumni Research Foundation Fabrication of strained heterojunction structures
US8118740B2 (en) 2004-12-20 2012-02-21 Ipventure, Inc. Moisture sensor for skin
US8195308B2 (en) 2004-12-22 2012-06-05 Proteus Biomedical, Inc. Implantable hermetically sealed structures
JP4137061B2 (ja) 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
US7960509B2 (en) 2005-01-14 2011-06-14 Trustees Of Tufts College Fibrous protein fusions and use thereof in the formation of advanced organic/inorganic composite materials
KR100688826B1 (ko) 2005-01-20 2007-03-02 삼성전기주식회사 리지드-플렉시블 인쇄회로기판 제조방법
US7374968B2 (en) 2005-01-28 2008-05-20 Hewlett-Packard Development Company, L.P. Method of utilizing a contact printing stamp
US7794742B2 (en) 2005-02-08 2010-09-14 University Of Washington Devices for promoting epithelial cell differentiation and keratinization
US20090291508A1 (en) 2008-05-20 2009-11-26 Rapid Pathogen Screening Inc. Nanoparticles in diagnostic tests
JP5507811B2 (ja) 2005-02-15 2014-05-28 ヴォウダフォン・グループ・ピーエルシー 無線通信のための向上したセキュリティ
AU2006218256B2 (en) 2005-02-28 2010-07-08 Commonwealth Scientific And Industrial Research Organisation Flexible electronic device
GB0505826D0 (en) 2005-03-22 2005-04-27 Uni Microelektronica Ct Vsw Methods for embedding of conducting material and devices resulting from said methods
WO2006104069A1 (ja) 2005-03-28 2006-10-05 Pioneer Corporation ゲート絶縁膜、有機トランジスタ、有機ｅｌ表示装置の製造方法、ディスプレイ
ES2380487T3 (es) 2005-03-28 2012-05-14 Vessix Vascular, Inc. Caracterización de tejido eléctrico intraluminal y energía RF ajustada para el tratamiento selectivo de ateroma y de otros tejidos diana
US9290579B2 (en) 2005-04-20 2016-03-22 Trustees Of Tufts College Covalently immobilized protein gradients in three-dimensional porous scaffolds
WO2006116030A2 (en) 2005-04-21 2006-11-02 Aonex Technologies, Inc. Bonded intermediate substrate and method of making same
WO2008103195A2 (en) 2005-04-28 2008-08-28 Second Sight Medical Products, Inc. Flexible circuit electrode array
US7300631B2 (en) 2005-05-02 2007-11-27 Bioscale, Inc. Method and apparatus for detection of analyte using a flexural plate wave device and magnetic particles
CN101198904B (zh) 2005-05-10 2011-04-13 陶氏康宁公司 亚微米印花转移光刻术
CA2608252A1 (en) 2005-05-13 2006-11-16 Imbibo Incorporated Method for customizing cover for electronic device
US8688189B2 (en) 2005-05-17 2014-04-01 Adnan Shennib Programmable ECG sensor patch
US20060266475A1 (en) 2005-05-24 2006-11-30 American Standard Circuits, Inc. Thermally conductive interface
US8024022B2 (en) 2005-05-25 2011-09-20 Alfred E. Mann Foundation For Scientific Research Hermetically sealed three-dimensional electrode array
WO2006130558A2 (en) 2005-06-01 2006-12-07 The Board Of Trustees Of The University Of Illinois Flexible structures for sensors and electronics
WO2006130721A2 (en) 2005-06-02 2006-12-07 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
TWI427802B (zh) 2005-06-02 2014-02-21 美國伊利諾大學理事會 可印刷半導體結構及製造和組合之相關方法
US7763353B2 (en) 2005-06-10 2010-07-27 Ut-Battelle, Llc Fabrication of high thermal conductivity arrays of carbon nanotubes and their composites
US20070103697A1 (en) * 2005-06-17 2007-05-10 Degertekin Fahrettin L Integrated displacement sensors for probe microscopy and force spectroscopy
WO2007002579A2 (en) 2005-06-23 2007-01-04 Bioveris Corporation Assay cartridges and methods for point of care instruments
US7226821B2 (en) * 2005-06-24 2007-06-05 Cardiac Pacemakers, Inc. Flip chip die assembly using thin flexible substrates
WO2007000037A1 (en) 2005-06-29 2007-01-04 Mitchell, Richard, J. Bendable high flux led array
WO2007003019A2 (en) 2005-07-01 2007-01-11 K.U. Leuven Research & Development Means for functional restoration of a damaged nervous system
US7479404B2 (en) 2005-07-08 2009-01-20 The Board Of Trustees Of The University Of Illinois Photonic crystal biosensor structure and fabrication method
US20070015357A1 (en) * 2005-07-15 2007-01-18 Government Of The Usa, As Represented By Secretary Of U.S. Army Process of adhesive bonding with patternable polymers for producing microstructure devices on a wafer assembly
US7268428B2 (en) * 2005-07-19 2007-09-11 International Business Machines Corporation Thermal paste containment for semiconductor modules
US7769472B2 (en) 2005-07-29 2010-08-03 Medtronic, Inc. Electrical stimulation lead with conformable array of electrodes
US20070027485A1 (en) 2005-07-29 2007-02-01 Kallmyer Todd A Implantable medical device bus system and method
CA2645934C (en) 2005-08-02 2014-04-29 Trustees Of Tufts College Methods for stepwise deposition of silk fibroin coatings
US20070043416A1 (en) 2005-08-19 2007-02-22 Cardiac Pacemakers, Inc. Implantable electrode array
US8657814B2 (en) 2005-08-22 2014-02-25 Medtronic Ablation Frontiers Llc User interface for tissue ablation system
KR100758699B1 (ko) 2005-08-29 2007-09-14 재단법인서울대학교산학협력재단 고종횡비 나노구조물 형성방법 및 이를 이용한 미세패턴형성방법
US8005526B2 (en) 2005-08-31 2011-08-23 The Regents Of The University Of Michigan Biologically integrated electrode devices
US8058951B2 (en) * 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
WO2007042963A1 (en) 2005-10-13 2007-04-19 Nxp B.V. Electronic device or circuit and method for fabricating the same
JP2007105316A (ja) 2005-10-14 2007-04-26 Konica Minolta Sensing Inc 生体情報測定器
KR100730152B1 (ko) 2005-10-14 2007-06-19 삼성에스디아이 주식회사 플렉시블 평판 표시장치
US20070233185A1 (en) 2005-10-20 2007-10-04 Thomas Anderson Systems and methods for sealing a vascular opening
US8097025B2 (en) 2005-10-25 2012-01-17 X-Spine Systems, Inc. Pedicle screw system configured to receive a straight or curved rod
EP1949437B2 (en) 2005-11-02 2021-08-04 Second Sight Medical Products, Inc. Implantable microelectronic device and method of manufacture
US8771805B2 (en) 2005-11-10 2014-07-08 Second Sight Medical Products, Inc. Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same
US7271393B2 (en) 2005-11-15 2007-09-18 Nokia Corporation UV radiation meter using visible light sensors
US7759167B2 (en) 2005-11-23 2010-07-20 Imec Method for embedding dies
US20070122819A1 (en) 2005-11-25 2007-05-31 Industrial Technology Research Institute Analyte assay structure in microfluidic chip for quantitative analysis and method for using the same
KR101199250B1 (ko) 2005-12-12 2012-11-09 삼성디스플레이 주식회사 연성회로필름 및 이를 갖는 표시패널 어셈블리
US20070139451A1 (en) 2005-12-20 2007-06-21 Somasiri Nanayakkara L Microfluidic device having hydrophilic microchannels
WO2007075928A2 (en) 2005-12-22 2007-07-05 Provex Technologies, Llc. Integrated patch and assay device with visual detection means
US9629567B2 (en) 2006-01-12 2017-04-25 Biosense Webster, Inc. Mapping of complex fractionated atrial electrogram
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
DE102006008501B3 (de) 2006-02-23 2007-10-25 Albert-Ludwigs-Universität Freiburg Sonde und Verfahren zur Datenübertragung zwischen einem Gehirn und einer Datenverarbeitungsvorrichtung
BRPI0707961A2 (pt) 2006-02-28 2011-05-10 Coloplast As mÉtodo para detectar o desprendimento de um curativo, curativo apropriado para aplicar o mÉtodo, conjunto sensor e blindagem para reduzir o acoplamento capacitivo a partir das vizinhanÇas ambientais para os eletrodos do curativo
EP1991723A2 (en) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
TW200813225A (en) 2006-03-06 2008-03-16 Univ Louisiana State Biocompatible scaffolds and adipose-derived stem cells
IL174211A0 (en) 2006-03-09 2007-07-04 Rotschild Carmel Method and system for using a cellular phone in water activities
US20070233208A1 (en) 2006-03-28 2007-10-04 Eastman Kodak Company Light therapy bandage with imbedded emitters
US20070227586A1 (en) 2006-03-31 2007-10-04 Kla-Tencor Technologies Corporation Detection and ablation of localized shunting defects in photovoltaics
DE602007007201D1 (de) 2006-04-07 2010-07-29 Koninkl Philips Electronics Nv Elastisch verformbare integrierte schaltung
US8126554B2 (en) 2006-05-17 2012-02-28 Cardiac Pacemakers, Inc. Implantable medical device with chemical sensor and related methods
JP2009537226A (ja) 2006-05-18 2009-10-29 エヌディーアイ メディカル， エルエルシー 機能的または治療的神経刺激を提供する携帯アッセンブリ、システム、および方法
TWI288067B (en) 2006-06-22 2007-10-11 Univ Chung Hua Microarray bioprobe device integrated with a semiconductor amplifier
EP1883107A3 (en) 2006-07-07 2014-04-09 Imec Method for forming packaged microelectronic devices and devices thus obtained
WO2008030666A2 (en) 2006-07-25 2008-03-13 The Board Of Trustees Of The University Of Illinois Multispectral plasmonic crystal sensors
KR101272332B1 (ko) 2006-07-26 2013-06-07 삼성디스플레이 주식회사 유기 발광 표시 장치
US7368930B2 (en) 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
DE102006037433B4 (de) 2006-08-09 2010-08-19 Ovd Kinegram Ag Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
US20080036097A1 (en) 2006-08-10 2008-02-14 Teppei Ito Semiconductor package, method of production thereof and encapsulation resin
TWI378747B (en) 2006-08-18 2012-12-01 Ind Tech Res Inst Flexible electronic assembly
CA2662521C (en) 2006-09-01 2016-08-09 Pacific Biosciences Of California, Inc. Substrates, systems and methods for analyzing materials
US8786033B2 (en) 2006-09-01 2014-07-22 IVI Holdings, Ltd. Biometric sensor and sensor panel, method for detecting biometric pattern using the same, and method for manufacturing the same
CN101681695B (zh) 2006-09-06 2013-04-10 伊利诺伊大学评议会 在用于可拉伸电子元件的半导体互连和纳米膜中的受控弯曲结构
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
US7751663B2 (en) * 2006-09-21 2010-07-06 Uni-Pixel Displays, Inc. Backside reflection optical display
US20080077225A1 (en) 2006-09-22 2008-03-27 Carlin Donald B Accuracy lumen sizing and stent expansion
EP1903000B1 (fr) 2006-09-25 2019-09-18 Sorin CRM SAS Composant biocompatible implantable incorporant un élément actif intégré tel qu'un capteur de mesure d'un paramètre physiologique, microsystème électromécanique ou circuit électronique
US20100028451A1 (en) 2006-09-26 2010-02-04 Trustees Of Tufts College Silk microspheres for encapsulation and controlled release
US20080074383A1 (en) 2006-09-27 2008-03-27 Dean Kenneth A Portable electronic device having appearance customizable housing
WO2008049087A2 (en) 2006-10-18 2008-04-24 Minnow Medical, Inc. System for inducing desirable temperature effects on body tissue
ES2560006T3 (es) 2006-10-18 2016-02-17 Vessix Vascular, Inc. Inducción de efectos de temperatura deseables sobre tejido corporal
EP2076193A4 (en) 2006-10-18 2010-02-03 Minnow Medical Inc MATCHED RF-ENERGY AND ELECTRO-TISSUE CHARACTERIZATION FOR THE SELECTIVE TREATMENT OF TARGET TISSUE
US8046039B2 (en) 2006-10-20 2011-10-25 Lg Electronics Inc. Mobile terminal and case for mobile terminal
WO2008127405A2 (en) 2006-11-03 2008-10-23 Trustees Of Tufts College Microfluidic device with a cylindrical microchannel and a method for fabricating same
WO2008118211A2 (en) 2006-11-03 2008-10-02 Trustees Of Tufts College Biopolymer photonic crystals and method of manufacturing the same
CA2704768A1 (en) 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer sensor and method of manufacturing the same
WO2008127401A2 (en) 2006-11-03 2008-10-23 Trustees Of Tufts College Biopolymer optical waveguide and method of manufacturing the same
US9969134B2 (en) 2006-11-03 2018-05-15 Trustees Of Tufts College Nanopatterned biopolymer optical device and method of manufacturing the same
US7868354B2 (en) 2006-11-08 2011-01-11 Duke University GaN-based nitric oxide sensors and methods of making and using the same
US8975073B2 (en) 2006-11-21 2015-03-10 The Charles Stark Draper Laboratory, Inc. Microfluidic device comprising silk films coupled to form a microchannel
US9314618B2 (en) 2006-12-06 2016-04-19 Spinal Modulation, Inc. Implantable flexible circuit leads and methods of use
US8979755B2 (en) 2006-12-08 2015-03-17 The Boeing Company Devices and systems for remote physiological monitoring
KR100849363B1 (ko) 2006-12-27 2008-07-29 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조 방법
WO2008085904A1 (en) 2007-01-05 2008-07-17 Charles Stark Draper Laboratory, Inc. Biodegradable electronic devices
CN105826345B (zh) 2007-01-17 2018-07-31 伊利诺伊大学评议会 通过基于印刷的组装制造的光学系统
WO2008088349A1 (en) 2007-01-19 2008-07-24 3M Innovative Properties Company Cable for a capacitive proximity sensor
JP2008202022A (ja) 2007-01-23 2008-09-04 Fujifilm Corp 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法
US8057390B2 (en) 2007-01-26 2011-11-15 The Regents Of The University Of Michigan High-resolution mapping of bio-electric fields
US7709812B2 (en) 2007-02-01 2010-05-04 Barrington L. Simon Ultraviolet radiation monitoring device and a method of using the same
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
US20080200973A1 (en) 2007-02-20 2008-08-21 General Electric Company Method and system using MRI compatibility defibrillation pads
EP2129772B1 (en) 2007-02-27 2016-07-27 Trustees Of Tufts College Tissue-engineered silk organs
US8761846B2 (en) 2007-04-04 2014-06-24 Motorola Mobility Llc Method and apparatus for controlling a skin texture surface on a device
WO2008128208A1 (en) 2007-04-12 2008-10-23 Magneto Inertial Sensing Technology, Inc. Infant sid monitor based on accelerometer
TWI339087B (en) 2007-04-18 2011-03-11 Ind Tech Res Inst Stretchable flexible printed circuit (fpc) and fabricating method thereof
WO2008136958A1 (en) 2007-04-30 2008-11-13 Opthera, Inc. Uva1-led phototherapy device and method
US7525304B1 (en) 2007-05-14 2009-04-28 Kla-Tencor Corporation Measurement of effective capacitance
US7693167B2 (en) 2007-05-22 2010-04-06 Rockwell Collins, Inc. Mobile nodal based communication system, method and apparatus
DK2211876T3 (en) 2007-05-29 2015-01-12 Tufts College PROCESS FOR silk fibroin-GELATION USING sonication
CN101689558B (zh) 2007-06-08 2012-07-18 皇家飞利浦电子股份有限公司 光输出设备
US8140154B2 (en) 2007-06-13 2012-03-20 Zoll Medical Corporation Wearable medical treatment device
US8877565B2 (en) 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
US20090000377A1 (en) 2007-06-29 2009-01-01 Shipps J Clay Brain impact measurement system
US20090015560A1 (en) 2007-07-13 2009-01-15 Motorola, Inc. Method and apparatus for controlling a display of a device
WO2009011709A1 (en) 2007-07-19 2009-01-22 The Board Of Trustees Of The University Of Illinois High resolution electrohydrodynamic jet printing for manufacturing systems
US7651891B1 (en) * 2007-08-09 2010-01-26 National Semiconductor Corporation Integrated circuit package with stress reduction
US9808557B2 (en) 2007-08-10 2017-11-07 Trustees Of Tufts College Tubular silk compositions and methods of use thereof
EP2178598A4 (en) 2007-08-17 2012-08-15 Isis Biopolymer Llc IONTOPHORETIC DRUG DISTRIBUTION SYSTEM
US8764653B2 (en) 2007-08-22 2014-07-01 Bozena Kaminska Apparatus for signal detection, processing and communication
US20090076345A1 (en) 2007-09-14 2009-03-19 Corventis, Inc. Adherent Device with Multiple Physiological Sensors
US20090088750A1 (en) 2007-09-28 2009-04-02 Tyco Healthcare Group Lp Insulating Boot with Silicone Overmold for Electrosurgical Forceps
DE102007046886B4 (de) 2007-09-28 2010-07-29 Dieter Miehlich EMS-Kleidungsstück und Elektrode sowie EMS-Modul dafür
US7739791B2 (en) 2007-10-26 2010-06-22 Delphi Technologies, Inc. Method of producing an overmolded electronic module with a flexible circuit pigtail
US9599891B2 (en) 2007-11-05 2017-03-21 Trustees Of Tufts College Fabrication of silk fibroin photonic structures by nanocontact imprinting
US20090149930A1 (en) 2007-12-07 2009-06-11 Thermage, Inc. Apparatus and methods for cooling a treatment apparatus configured to non-invasively deliver electromagnetic energy to a patient's tissue
CA2708758C (en) 2007-12-10 2015-02-10 Neuronano Ab Medical electrode, electrode bundle and electrode bundle array
US8290557B2 (en) 2007-12-12 2012-10-16 Medtronic, Inc. Implantable optical sensor and method for use
KR100919642B1 (ko) 2007-12-17 2009-09-30 한국전자통신연구원 지향성 음향 생성 장치 및 그를 이용한 휴대용 단말기
JP2009170173A (ja) 2008-01-11 2009-07-30 Denso Corp Ｅｌ素子及びその製造方法
GB0800797D0 (en) 2008-01-16 2008-02-27 Cambridge Entpr Ltd Neural interface
JP4530180B2 (ja) 2008-01-22 2010-08-25 Ｏｋｉセミコンダクタ株式会社 紫外線センサおよびその製造方法
US20110098583A1 (en) 2009-09-15 2011-04-28 Texas Instruments Incorporated Heart monitors and processes with accelerometer motion artifact cancellation, and other electronic systems
JP2011511668A (ja) 2008-02-07 2011-04-14 トラスティーズ オブ タフツ カレッジ ３次元絹ハイドロキシアパタイト組成物
US7838964B2 (en) 2008-02-25 2010-11-23 Fairchild Semiconductor Corporation Micromodules including integrated thin film inductors
US8728025B2 (en) 2008-03-10 2014-05-20 S.E.A. Medical Systems, Inc. Intravenous fluid monitoring
WO2009114689A1 (en) 2008-03-12 2009-09-17 The Trustees Of The University Of Pennsylvania Flexible and scalable sensor arrays for recording and modulating physiologic activity
US8206774B2 (en) 2008-03-13 2012-06-26 Trustees Of Tufts College Diazonium salt modification of silk polymer
US8152744B2 (en) 2008-03-25 2012-04-10 Comfort Lab. Inc. Shoe or insole fitting navigation system
RU2507637C2 (ru) 2008-03-26 2014-02-20 Конинклейке Филипс Электроникс Н.В. Устройство светоизлучающего диода
US8470701B2 (en) 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US9068282B2 (en) 2008-04-08 2015-06-30 Trustees Of Tufts College System and method for making biomaterial structures
US7619416B2 (en) 2008-04-17 2009-11-17 Universität Zürich Prorektorat Forschung Eidgenössische Technische Hochschule Coil assembly and multiple coil arrangement for magnetic resonance imaging
JP2009275060A (ja) * 2008-05-12 2009-11-26 Nitto Denko Corp 粘着シート、その粘着シートを使用した被着体の加工方法、及び粘着シート剥離装置
US8946683B2 (en) 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8207473B2 (en) 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
US20090322480A1 (en) 2008-06-30 2009-12-31 Robert Leon Benedict Rfid tag and method of vehicle attachment thereof
EP2337495A4 (en) 2008-09-19 2013-10-16 Sensors For Med & Science Inc ARRANGEMENT OF OPTICAL SENSORS
US8679888B2 (en) 2008-09-24 2014-03-25 The Board Of Trustees Of The University Of Illinois Arrays of ultrathin silicon solar microcells
EP2349366B1 (en) 2008-09-26 2013-08-28 Trustees Of Tufts College Active silk muco-adhesives, silk electrogelation process, and devices
US20100152629A1 (en) 2008-10-02 2010-06-17 Haas Jr Douglas D Integrated system to assist in the rehabilitation and/or exercising of a single leg after stroke or other unilateral injury
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
WO2010042957A2 (en) 2008-10-07 2010-04-15 Mc10, Inc. Systems, devices, and methods utilizing stretchable electronics to measure tire or road surface conditions
US20100271191A1 (en) 2008-10-07 2010-10-28 De Graff Bassel Systems, devices, and methods utilizing stretchable electronics to measure tire or road surface conditions
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
CN102271724B (zh) 2008-10-09 2015-10-14 塔夫茨大学信托人 含有甘油的改性丝膜
EP2344066B1 (en) 2008-10-10 2018-02-14 Carsten Nils Gutt Arrangement for implanting
US8056819B2 (en) 2008-10-14 2011-11-15 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Miniature and multi-band RF coil design
FR2937511B1 (fr) 2008-10-23 2014-05-16 Oreal Dispositif de distribution d'un produit avec ajustement automatique ou semi-automatique des proprietes du produit grace a un capteur d'ambiance integre
EP2345069B1 (en) 2008-10-27 2016-02-17 Nxp B.V. Method of manufacturing a biocompatible electrode
KR101013557B1 (ko) 2008-11-06 2011-02-14 주식회사 하이닉스반도체 플랙시블 반도체 패키지 및 이를 제조하기 위한 와이어 본딩 장치
EP2902293B1 (en) 2008-11-12 2020-03-04 Mc10, Inc. Methods of making extremely stretchable electronics
WO2010057142A2 (en) 2008-11-17 2010-05-20 Trustees Of Tufts College Surface modification of silk fibroin matrices with poly(ethylene glycol) useful as anti adhesion barriers and anti thrombotic materials
US20110101789A1 (en) 2008-12-01 2011-05-05 Salter Jr Thomas Steven Rf power harvesting circuit
WO2010065957A2 (en) 2008-12-05 2010-06-10 Trustees Of Tufts College Vascularized living skin constructs and methods of use thereof
JP5694947B2 (ja) 2008-12-11 2015-04-01 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 医療用途のための伸張性電子部品を使用する装置
JP2012515436A (ja) 2009-01-12 2012-07-05 エムシー１０ インコーポレイテッド 非平面撮像アレイの方法及び応用
GR1006723B (el) 2009-01-16 2010-03-09 ������������ ������������-������� ����������� ����������� ��������� ������� (���� ������� 5%) Ολοκληρωμενο ή τυπωμενο πηνιο σε σχημα μαργαριτας
US20100188799A1 (en) 2009-01-28 2010-07-29 Avx Corporation Controlled esr low inductance capacitor
EP2392196B1 (en) 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
KR100992411B1 (ko) 2009-02-06 2010-11-05 (주)실리콘화일 피사체의 근접여부 판단이 가능한 이미지센서
JP5717653B2 (ja) 2009-02-12 2015-05-13 タフツ ユニバーシティー／トラスティーズ オブ タフツ カレッジ 生物医学的用途およびバイオフォトニック用途のための絹フィブロイン構造体のナノインプリンティングの方法
EP2404171A4 (en) 2009-03-03 2016-01-27 Mc10 Inc SYSTEMS, METHODS AND DEVICES WITH EXPANDABLE INTEGRATED CIRCUITS FOR MEASUREMENT AND THERAPY ADMINISTRATION
CA2791580C (en) 2009-03-04 2017-12-05 Trustees Of Tufts College Silk fibroin systems for antibiotic delivery
RU2521734C2 (ru) 2009-03-13 2014-07-10 Конинклейке Филипс Электроникс Н.В. Датчик измерения температуры нулевого теплового потока
AU2010232407B2 (en) 2009-04-03 2014-10-30 Intrapace, Inc. Feedback systems and methods to enhance obstructive and other obesity treatments
US8476668B2 (en) 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US8332053B1 (en) 2009-04-28 2012-12-11 Hrl Laboratories, Llc Method for fabrication of a stretchable electronic skin
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
WO2011005381A2 (en) 2009-06-01 2011-01-13 Trustees Of Tufts College Vortex-induced silk fibroin gelation for encapsulation and delivery
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
US20100327387A1 (en) 2009-06-26 2010-12-30 Ichiro Kasai Avalanche Photodiode
US20110135674A1 (en) 2009-06-30 2011-06-09 Abbott Laboratories Markers of XMRV Infection and Uses Thereof
CN102474009B (zh) 2009-07-03 2015-01-07 株式会社村田制作所 天线及天线模块
US9188963B2 (en) 2009-07-06 2015-11-17 Autonomous Id Canada Inc. Gait-based authentication system
JP2011018805A (ja) * 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置の製造方法
JP2012532614A (ja) 2009-07-10 2012-12-20 タフツ ユニバーシティー／トラスティーズ オブ タフツ カレッジ バイオ絹糸タンパク質ベース核酸送達システム
CA2812635A1 (en) 2009-07-14 2011-01-20 Trustees Of Tufts College Electrospun silk material systems for wound healing
EP2275805A1 (en) 2009-07-16 2011-01-19 Acreo AB Moister sensor
EP2457087A4 (en) 2009-07-20 2015-09-02 Tufts University Trustees Of Tufts College COMPLETELY FROM PROTEINS, IMPLANTABLE AND REMOVABLE REFLECTORS
US8293486B2 (en) 2009-07-21 2012-10-23 Trustees Of Tufts College Functionalization of silk material by avidin-biotin interaction
TW201104540A (en) 2009-07-22 2011-02-01 Ritdisplay Corp Capacitive type touch sensor
EP2474054A4 (en) 2009-08-31 2013-03-13 Tufts University Trustees Of Tufts College SILK TRANSISTOR DEVICES
US20110071603A1 (en) 2009-09-24 2011-03-24 Joshua John Edward Moore Cyclic Heat Therapy Device
US9074302B2 (en) 2009-09-28 2015-07-07 Trustees Of Tufts College Methods of making drawn silk fibers
EP2483199B1 (en) 2009-09-29 2017-04-26 Trustees Of Tufts College Silk nanospheres and microspheres and methods of making same
WO2011041507A1 (en) 2009-10-01 2011-04-07 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Apparatus and method for nanocomposite sensors
US20110218756A1 (en) 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US20130192356A1 (en) 2009-10-01 2013-08-01 Mc10, Inc. Methods and apparatus for measuring technical parameters of equipment, tools, and components via conformal electronics
US20120065937A1 (en) 2009-10-01 2012-03-15 Mc10, Inc. Methods and apparatus for measuring technical parameters of equipment, tools and components via conformal electronics
KR101611422B1 (ko) 2009-11-17 2016-04-12 삼성전자주식회사 그래핀과 나노구조체의 복합 구조체 및 그 제조방법
US8390516B2 (en) 2009-11-23 2013-03-05 Harris Corporation Planar communications antenna having an epicyclic structure and isotropic radiation, and associated methods
CN102741865B (zh) 2009-11-30 2016-04-06 康宁股份有限公司 Rfid状况锁存
EP2513953B1 (en) 2009-12-16 2017-10-18 The Board of Trustees of the University of Illionis Electrophysiology using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US20130118255A1 (en) 2009-12-17 2013-05-16 Gilman Callsen Methods and apparatus for conformal sensing of force and/or change in motion
US8618914B2 (en) 2010-01-05 2013-12-31 The Regents Of The University Of California MEMS sensor enabled RFID system and method for operating the same
US9057994B2 (en) 2010-01-08 2015-06-16 The Board Of Trustees Of The University Of Illinois High resolution printing of charge
KR101732178B1 (ko) 2010-01-15 2017-05-04 삼성전자주식회사 나노 섬유-나노 와이어 복합체 및 그 제조방법
US8872663B2 (en) 2010-01-19 2014-10-28 Avery Dennison Corporation Medication regimen compliance monitoring systems and methods
US20110184320A1 (en) 2010-01-26 2011-07-28 Shipps J Clay Measurement system using body mounted physically decoupled sensor
US20110185611A1 (en) 2010-01-29 2011-08-04 Global Emergency Resources, Llc Apparatus and method for rapid identification and tracking of individuals in an emergency situation
US8930147B2 (en) 2010-02-05 2015-01-06 Prima-Temp, Inc. Multi-sensor patch and system
EP3695792B1 (en) 2010-03-12 2023-06-14 The Board of Trustees of the University of Illinois Waterproof stretchable optoelectronics
JP2012013676A (ja) 2010-03-15 2012-01-19 Seiko Instruments Inc 紫外線測定装置および紫外線計測機能付電子腕時計
EP2547258B1 (en) 2010-03-17 2015-08-05 The Board of Trustees of the University of Illionis Implantable biomedical devices on bioresorbable substrates
EP2556392A4 (en) 2010-04-07 2014-03-19 Mc10 Inc METHODS AND APPARATUSES FOR MEASURING TECHNICAL PARAMETERS OF EQUIPMENT, TOOLS AND COMPONENTS VIA ADAPTABLE ELECTRONIC SHEET
GB201005889D0 (en) 2010-04-08 2010-05-26 Cambridge Entpr Ltd Tuning of mechanical properties of polymers
JP6192032B2 (ja) 2010-04-22 2017-09-06 リーフ ヘルスケア インコーポレイテッド 患者の生理学的状況をモニタリングするシステム
KR101130697B1 (ko) 2010-05-07 2012-04-02 삼성전자주식회사 복수 층의 신축성 배선
PL3581105T3 (pl) 2010-05-08 2022-11-28 The Regents Of The University Of California Urządzenie do wczesnego wykrywania owrzodzenia przez skanowanie uwodnienia podnaskórkowego
US20110284268A1 (en) 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
CN103068346B (zh) 2010-06-11 2016-03-02 W·R·曼德尔 用于对人或哺乳动物的身体部分进行治疗性冷却和加温的装置
US8715204B2 (en) 2010-07-14 2014-05-06 Prima Temp, Inc. Wireless vaginal sensor probe
JP5744004B2 (ja) 2010-07-23 2015-07-01 パナソニック インテレクチュアル プロパティ コーポレーション オブアメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ Ｎｆｃ通信装置およびその制御方法
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8035284B2 (en) 2010-09-22 2011-10-11 Bridgelux, Inc. Distributed LED-based light source
US8836101B2 (en) 2010-09-24 2014-09-16 Infineon Technologies Ag Multi-chip semiconductor packages and assembly thereof
US8506158B2 (en) 2010-10-12 2013-08-13 P.S.L. Limited Watch
DE102010042567B3 (de) * 2010-10-18 2012-03-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Chip-Package und Chip-Package
TW201221165A (en) 2010-10-20 2012-06-01 Medtronic Ardian Luxembourg Catheter apparatuses having expandable mesh structures for renal neuromodulation and associated systems and methods
WO2012061153A1 (en) 2010-10-25 2012-05-10 Medtronic Ardian Luxembourg S.A.R.L. Devices, systems and methods for evaluation and feedback of neuromodulation treatment
US8520399B2 (en) * 2010-10-29 2013-08-27 Palo Alto Research Center Incorporated Stretchable electronics modules and circuits
US8562095B2 (en) 2010-11-01 2013-10-22 The Board Of Trustees Of The University Of Illinois High resolution sensing and control of electrohydrodynamic jet printing
US8456021B2 (en) 2010-11-24 2013-06-04 Texas Instruments Incorporated Integrated circuit device having die bonded to the polymer side of a polymer substrate
FR2968532B1 (fr) 2010-12-14 2013-04-26 Commissariat Energie Atomique Dispositif et procede de determination d'un taux d'excretion d'un fluide corporel par un individu ou un animal
US8391947B2 (en) 2010-12-30 2013-03-05 Biosense Webster (Israel), Ltd. Catheter with sheet array of electrodes
WO2012097163A1 (en) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
EP2484750A1 (en) 2011-02-07 2012-08-08 Ecole Polytechnique Fédérale de Lausanne (EPFL) Monitoring system for cell culture
US20120220835A1 (en) 2011-02-14 2012-08-30 Wayne Chung Wireless physiological sensor system and method
US8581731B2 (en) 2011-02-16 2013-11-12 Connor Kent Purks Circuits, systems, and methods for monitoring and reporting foot impact, foot placement, shoe life, and other running/walking characteristics
US9439599B2 (en) 2011-03-11 2016-09-13 Proteus Digital Health, Inc. Wearable personal body associated device with various physical configurations
US9702839B2 (en) 2011-03-11 2017-07-11 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
KR20120111661A (ko) 2011-04-01 2012-10-10 삼성전자주식회사 신축가능한 전도성 나노섬유, 이를 이용한 신축가능한 섬유전극 및 그 제조방법
JP2012218147A (ja) 2011-04-11 2012-11-12 Imec マイクロキャビティを封止するための方法
CN202068986U (zh) 2011-04-19 2011-12-14 江苏太阳鸟校园服饰有限公司 防紫外线的智能预警服装
US20120279762A1 (en) 2011-05-03 2012-11-08 Industry-Academic Cooperation Foundation, Yonsei University Composition for forming stretchable conductive pattern, method of producing the stretchable conductive pattern using the composition, and electronic device including stretchable conductive electrode
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
WO2012167096A2 (en) 2011-06-03 2012-12-06 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US20120316455A1 (en) 2011-06-10 2012-12-13 Aliphcom Wearable device and platform for sensory input
WO2013010113A1 (en) 2011-07-14 2013-01-17 The Board Of Trustees Of The University Of Illinois Non-contact transfer printing
EP2729067A4 (en) 2011-07-14 2014-10-29 Mc10 Inc DETECTION OF A FORCE EXERCISED ON A FOOT OR A FOOTWEAR ARTICLE
DE112012003250T5 (de) 2011-08-05 2014-04-30 Mc10, Inc. Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
US9176530B2 (en) 2011-08-17 2015-11-03 Apple Inc. Bi-stable spring with flexible display
US8702619B2 (en) 2011-08-26 2014-04-22 Symap Holding Limited Mapping sympathetic nerve distribution for renal ablation and catheters for same
US20130116520A1 (en) 2011-09-01 2013-05-09 Masoud Roham Single and multi node, semi-disposable wearable medical electronic patches for bio-signal monitoring and robust feature extraction
JP6129838B2 (ja) 2011-09-01 2017-05-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 組織の状態を検出する電子装置
WO2013034987A2 (en) 2011-09-08 2013-03-14 Offshore Incorporations (Cayman) Limited, Sensor device and system for fitness equipment
US8496842B2 (en) * 2011-09-12 2013-07-30 Texas Instruments Incorporated MEMS device fabricated with integrated circuit
CN103946680A (zh) 2011-09-28 2014-07-23 Mc10股份有限公司 用于检测表面的性质的电子器件
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US9603560B2 (en) 2012-01-26 2017-03-28 The University Of Akron Flexible electrode for detecting changes in temperature, humidity, and sodium ion concentration in sweat
US9320907B2 (en) 2012-02-02 2016-04-26 The United States Government, As Represented By The Department Of Veterans Affairs Integrated surface stimulation device for pain management and wound therapy
EP2626755B1 (en) 2012-02-10 2019-04-10 Nxp B.V. Calibration method, calibration device and measurement device
US20130215467A1 (en) 2012-02-21 2013-08-22 Zih Corp. Method and apparatus for implementing near field communications with a printer
US9184798B2 (en) 2012-03-12 2015-11-10 Broadcom Corporation Near field communications (NFC) device having adjustable gain
US8895864B2 (en) 2012-03-30 2014-11-25 Nokia Corporation Deformable apparatus and method
US20140121540A1 (en) 2012-05-09 2014-05-01 Aliphcom System and method for monitoring the health of a user
US20130316645A1 (en) 2012-05-23 2013-11-28 Health & Life Co., Ltd. Near field communication enabled medical device system
US20130321373A1 (en) 2012-05-31 2013-12-05 Semiconductor Energy Laboratory Co., Ltd. Electronic device, program, and recording medium
US8803089B2 (en) 2012-06-01 2014-08-12 Landauer, Inc. System and method for wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry
US20130331914A1 (en) 2012-06-11 2013-12-12 Martin Lee Thermal therapy system and method of use
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US8948832B2 (en) 2012-06-22 2015-02-03 Fitbit, Inc. Wearable heart rate monitor
EP2866645A4 (en) 2012-07-05 2016-03-30 Mc10 Inc CATHETER DEVICE WITH FLOW MEASUREMENT
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
BR112015006242A2 (pt) 2012-09-21 2017-07-04 Proteus Digital Health Inc aparelho vestível sem fio, sistema e método
WO2014058473A1 (en) 2012-10-09 2014-04-17 Mc10, Inc. Conformal electronics integrated with apparel
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US20140188426A1 (en) 2012-12-27 2014-07-03 Steven FASTERT Monitoring hit count for impact events
KR20150110570A (ko) 2013-01-08 2015-10-02 엠씨10, 인크 표면의 특성을 모니터링하기 위한 애플리케이션
CN105340369A (zh) 2013-02-06 2016-02-17 伊利诺伊大学评议会 具有容纳室的可拉伸的电子系统
US9516743B2 (en) * 2013-02-27 2016-12-06 Apple Inc. Electronic device with reduced-stress flexible display
US9438044B2 (en) 2013-03-04 2016-09-06 Hello Inc. Method using wearable device with unique user ID and telemetry system in communication with one or more social networks
US20150164377A1 (en) 2013-03-13 2015-06-18 Vaidhi Nathan System and method of body motion analytics recognition and alerting
US10456038B2 (en) 2013-03-15 2019-10-29 Cercacor Laboratories, Inc. Cloud-based physiological monitoring system
US20140308930A1 (en) 2013-04-12 2014-10-16 Bao Tran Timely, glanceable information on a wearable device
US20140350883A1 (en) 2013-05-10 2014-11-27 Abraham Carter Platform for Generating Sensor Data
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US20150019135A1 (en) 2013-06-03 2015-01-15 Mc10, Inc. Motion sensor and analysis
US10524661B2 (en) 2013-06-12 2020-01-07 Proactive Live, Inc. Sleep monitoring and stimulation
US20140375465A1 (en) 2013-06-21 2014-12-25 Mc10, Inc. Band with conformable electronics
US20150035743A1 (en) 2013-07-31 2015-02-05 Plantronics, Inc. Wrist Worn Platform for Sensors
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
CA2925387A1 (en) 2013-10-07 2015-04-16 Mc10, Inc. Conformal sensor systems for sensing and analysis
CN105849788A (zh) 2013-10-09 2016-08-10 Mc10股份有限公司 包括共形传感器的实用可穿戴设备
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
WO2015102951A2 (en) 2014-01-03 2015-07-09 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
JP2017504114A (ja) 2014-01-03 2017-02-02 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 低出力定量的測定用の集積装置
US10410962B2 (en) 2014-01-06 2019-09-10 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
CA2937759A1 (en) 2014-02-24 2015-08-27 Mc10, Inc. Conformal electronics with deformation indicators
WO2015134588A1 (en) 2014-03-04 2015-09-11 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
JP6661242B2 (ja) 2014-03-12 2020-03-11 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． アッセイの変化の定量化のための測定装置および方法
JP2017517289A (ja) 2014-03-28 2017-06-29 リニ，マリオ 体温調節装置及び方法
US20160015962A1 (en) 2014-07-16 2016-01-21 Mehdi Shokoueinejad Maragheh Smart Patch For Wound Management
US20160086909A1 (en) 2014-09-22 2016-03-24 Mc10, Inc. Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
KR20170084253A (ko) 2014-11-18 2017-07-19 엠씨10, 인크 전자 디바이스 활성화를 위한 시스템, 디바이스, 및 방법
US10393414B2 (en) 2014-12-19 2019-08-27 Palo Alto Research Center Incorporated Flexible thermal regulation device
EP3253282A4 (en) 2015-02-05 2018-09-26 Mc10, Inc. Method and system for interacting with an environment
CN107530004A (zh) 2015-02-20 2018-01-02 Mc10股份有限公司 基于贴身状况、位置和/或取向的可穿戴式设备的自动检测和构造
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
WO2016187536A1 (en) 2015-05-20 2016-11-24 Mc10 Inc. Ultra-thin wearable sensing device
CN107708991A (zh) 2015-06-15 2018-02-16 Mc10股份有限公司 用于皮肤安装装置的吸湿粘合剂
US20160371957A1 (en) 2015-06-22 2016-12-22 Mc10, Inc. Method and system for structural health monitoring
WO2017015000A1 (en) 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
WO2017031129A1 (en) 2015-08-19 2017-02-23 Mc10, Inc. Wearable heat flux devices and methods of use
US20170083312A1 (en) 2015-09-22 2017-03-23 Mc10, Inc. Method and system for crowd-sourced algorithm development
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
US10532211B2 (en) 2015-10-05 2020-01-14 Mc10, Inc. Method and system for neuromodulation and stimulation

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030045025A1 (en) * 2000-01-26 2003-03-06 Coyle Anthony L. Method of fabricating a molded package for micromechanical devices
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
JP2005108942A (ja) * 2003-09-29 2005-04-21 Nitto Denko Corp フレキシブル配線回路基板の製造方法
US20110051384A1 (en) * 2006-02-02 2011-03-03 Arno Kriechbaum Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element
JP2007294724A (ja) * 2006-04-26 2007-11-08 Toppan Printing Co Ltd 多層回路配線基板及び半導体装置
WO2008056499A1 (fr) * 2006-11-06 2008-05-15 Nec Corporation Dispositif semi-conducteur et son procédé de fabrication
US20080211087A1 (en) * 2006-12-20 2008-09-04 Infineon Technologies Ag Chip module and method for producing a chip module
JP2008244473A (ja) * 2007-03-26 2008-10-09 Endicott Interconnect Technologies Inc スタンドオフ付きフレキシブル電子回路パッケージ、及びその製造方法
JP2011517370A (ja) * 2008-03-05 2011-06-02 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 伸張可能及び折畳み可能な電子デバイス
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
JP2012023237A (ja) * 2010-07-15 2012-02-02 Nec Corp 機能素子内蔵基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183649A (ja) * 2016-03-31 2017-10-05 大日本印刷株式会社 電子デバイス及びその製造方法
JP6191808B1 (ja) * 2016-04-20 2017-09-06 株式会社村田製作所 多層基板および電子機器
WO2017183394A1 (ja) * 2016-04-20 2017-10-26 株式会社村田製作所 多層基板および電子機器
US10187975B2 (en) 2016-04-20 2019-01-22 Murata Manufacturing Co., Ltd. Multilayer substrate and electronic device
JP2024076962A (ja) * 2022-11-25 2024-06-06 ズハイ アクセス セミコンダクター シーオー．，エルティーディー パッケージング基板及びその作製方法
JP7659607B2 (ja) 2022-11-25 2025-04-09 ズハイ アクセス セミコンダクター シーオー．，エルティーディー パッケージング基板及びその作製方法

Also Published As

Publication number Publication date
EP2907159A1 (en) 2015-08-19
US20160111353A1 (en) 2016-04-21
US20140110859A1 (en) 2014-04-24
US10032709B2 (en) 2018-07-24
US9583428B2 (en) 2017-02-28
WO2014059032A1 (en) 2014-04-17
EP2907159A4 (en) 2016-06-01
KR20150067302A (ko) 2015-06-17
US9171794B2 (en) 2015-10-27
US20170200670A1 (en) 2017-07-13
CN104798196A (zh) 2015-07-22

Similar Documents

Publication Publication Date Title
JP2016504751A (ja) ポリマー内への薄型チップの埋込み
CA2959699C (en) Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same
EP3657915B1 (en) Method of manufacturing a component carrier using a separation component and a semi-finished product
US10297572B2 (en) Discrete flexible interconnects for modules of integrated circuits
EP3582593B1 (en) Method of manufacturing a component carrier with a stepped cavity and a stepped component assembly being embedded within the stepped cavity
EP3340752B1 (en) Method using an air permeable temporary carrier tape for embedding component in component carrier
EP3349552A1 (en) Embedding component in component carrier by rigid temporary carrier
US11895780B2 (en) Manufacturing method of package structure
JP2014130856A (ja) 配線基板の製造方法
US12414243B2 (en) Manufacturing method of package structure
US20200068721A1 (en) Package structure and manufacturing method thereof
US11410965B2 (en) Electronic device with embedded component carrier
EP3349247B1 (en) Patterned cover layer on base structure defining cavity and alignment marker
Zoschke et al. Flexible and Stretchable Systems for Healthcare and Mobility
EP3540766A1 (en) Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
US20140116613A1 (en) Method of Forming Thermal Conductive Pillar in Metal Core Printed Circuit Board

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160824

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160824

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171024

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180117

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180619