KR102932705B1 - 반도체 장치 - Google Patents
반도체 장치Info
- Publication number
- KR102932705B1 KR102932705B1 KR1020237038815A KR20237038815A KR102932705B1 KR 102932705 B1 KR102932705 B1 KR 102932705B1 KR 1020237038815 A KR1020237038815 A KR 1020237038815A KR 20237038815 A KR20237038815 A KR 20237038815A KR 102932705 B1 KR102932705 B1 KR 102932705B1
- Authority
- KR
- South Korea
- Prior art keywords
- transistor
- oxide semiconductor
- layer
- electrode layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/611—Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
- Dram (AREA)
- Physical Vapour Deposition (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020267005750A KR20260036398A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-091539 | 2012-04-13 | ||
| JP2012091539 | 2012-04-13 | ||
| KR1020227044339A KR20230004930A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| PCT/JP2013/061131 WO2013154195A1 (en) | 2012-04-13 | 2013-04-05 | Semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227044339A Division KR20230004930A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020267005750A Division KR20260036398A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230157542A KR20230157542A (ko) | 2023-11-16 |
| KR102932705B1 true KR102932705B1 (ko) | 2026-02-27 |
Family
ID=49324274
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237038815A Active KR102932705B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020147030819A Ceased KR20150005949A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020207012859A Active KR102254731B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020267005750A Pending KR20260036398A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020217037808A Active KR102479944B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020217014742A Active KR102330543B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020227044339A Abandoned KR20230004930A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147030819A Ceased KR20150005949A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020207012859A Active KR102254731B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020267005750A Pending KR20260036398A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020217037808A Active KR102479944B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020217014742A Active KR102330543B1 (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
| KR1020227044339A Abandoned KR20230004930A (ko) | 2012-04-13 | 2013-04-05 | 반도체 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (9) | US8946702B2 (https=) |
| JP (9) | JP5973374B2 (https=) |
| KR (7) | KR102932705B1 (https=) |
| SG (1) | SG10201610711UA (https=) |
| TW (3) | TWI573271B (https=) |
| WO (1) | WO2013154195A1 (https=) |
Families Citing this family (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102932705B1 (ko) | 2012-04-13 | 2026-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| DE112013002407B4 (de) | 2012-05-10 | 2024-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| KR102113160B1 (ko) | 2012-06-15 | 2020-05-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8901557B2 (en) | 2012-06-15 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9349593B2 (en) | 2012-12-03 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| DE112013006219T5 (de) | 2012-12-25 | 2015-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und deren Herstellungsverfahren |
| US9391096B2 (en) | 2013-01-18 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI618252B (zh) | 2013-02-12 | 2018-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9231111B2 (en) | 2013-02-13 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9318484B2 (en) | 2013-02-20 | 2016-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US10304859B2 (en) | 2013-04-12 | 2019-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an oxide film on an oxide semiconductor film |
| US9893192B2 (en) | 2013-04-24 | 2018-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102244460B1 (ko) * | 2013-10-22 | 2021-04-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US9455349B2 (en) * | 2013-10-22 | 2016-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor with reduced impurity diffusion |
| US9590111B2 (en) | 2013-11-06 | 2017-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| JP6496132B2 (ja) * | 2013-12-02 | 2019-04-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2016027597A (ja) * | 2013-12-06 | 2016-02-18 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6537264B2 (ja) | 2013-12-12 | 2019-07-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9349751B2 (en) * | 2013-12-12 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TWI666770B (zh) | 2013-12-19 | 2019-07-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| KR20240042562A (ko) | 2013-12-26 | 2024-04-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102529174B1 (ko) | 2013-12-27 | 2023-05-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6488124B2 (ja) * | 2013-12-27 | 2019-03-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102325158B1 (ko) * | 2014-01-30 | 2021-11-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 전자 기기, 및 반도체 장치의 제작 방법 |
| JP6308583B2 (ja) * | 2014-01-31 | 2018-04-11 | 国立研究開発法人物質・材料研究機構 | 薄膜トランジスタ、薄膜トランジスタの製造方法および半導体装置 |
| US20150263140A1 (en) * | 2014-03-14 | 2015-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2017103260A (ja) * | 2014-03-31 | 2017-06-08 | 株式会社東芝 | トランジスタ、および、トランジスタの製造方法 |
| JP2015204368A (ja) * | 2014-04-14 | 2015-11-16 | 日本放送協会 | 薄膜トランジスタおよび表示装置 |
| TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
| CN112038410A (zh) * | 2014-07-15 | 2020-12-04 | 株式会社半导体能源研究所 | 半导体装置及其制造方法以及包括半导体装置的显示装置 |
| KR20160034200A (ko) * | 2014-09-19 | 2016-03-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US9634097B2 (en) | 2014-11-25 | 2017-04-25 | Sandisk Technologies Llc | 3D NAND with oxide semiconductor channel |
| US20160155759A1 (en) * | 2014-11-28 | 2016-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| TWI732383B (zh) | 2015-02-06 | 2021-07-01 | 日商半導體能源研究所股份有限公司 | 裝置及其製造方法以及電子裝置 |
| DE112016001033T5 (de) * | 2015-03-03 | 2017-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Verfahren zum Herstellen derselben oder Anzeigevorrichtung mit derselben |
| JP6683503B2 (ja) * | 2015-03-03 | 2020-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6705663B2 (ja) * | 2015-03-06 | 2020-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| KR102582523B1 (ko) | 2015-03-19 | 2023-09-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 기기 |
| KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US9842938B2 (en) * | 2015-03-24 | 2017-12-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including semiconductor device |
| US10096715B2 (en) | 2015-03-26 | 2018-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing the same, and electronic device |
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| CN104779258A (zh) * | 2015-04-16 | 2015-07-15 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法和显示装置 |
| KR102439505B1 (ko) * | 2015-06-11 | 2022-09-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 |
| JP6736351B2 (ja) * | 2015-06-19 | 2020-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9935633B2 (en) * | 2015-06-30 | 2018-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit, semiconductor device, electronic component, and electronic device |
| KR102389622B1 (ko) * | 2015-09-17 | 2022-04-25 | 삼성디스플레이 주식회사 | 투명 표시 장치 및 투명 표시 장치의 제조 방법 |
| TWI672796B (zh) | 2015-10-30 | 2019-09-21 | 聯華電子股份有限公司 | 半導體元件 |
| US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| JP6853663B2 (ja) * | 2015-12-28 | 2021-03-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2017153882A1 (en) | 2016-03-11 | 2017-09-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and display device including the semiconductor device |
| US10008502B2 (en) * | 2016-05-04 | 2018-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
| KR102330605B1 (ko) * | 2016-06-22 | 2021-11-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102403389B1 (ko) | 2016-09-12 | 2022-06-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| DE112017004841B4 (de) * | 2016-09-27 | 2025-04-17 | Sharp Kabushiki Kaisha | Halbleitervorrichtung und Verfahren zu deren Herstellung |
| US9997606B2 (en) | 2016-09-30 | 2018-06-12 | International Business Machines Corporation | Fully depleted SOI device for reducing parasitic back gate capacitance |
| KR20190069465A (ko) * | 2016-10-25 | 2019-06-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 표시 모듈, 전자 기기, 및 터치 패널 입력 시스템 |
| US10930535B2 (en) * | 2016-12-02 | 2021-02-23 | Applied Materials, Inc. | RFID part authentication and tracking of processing components |
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| JP2019067938A (ja) * | 2017-10-02 | 2019-04-25 | シャープ株式会社 | 薄膜トランジスタ |
| US9991171B1 (en) * | 2017-10-25 | 2018-06-05 | United Microelectronics Corp. | Semiconductor device and integrated circuit |
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| KR102247029B1 (ko) * | 2018-07-16 | 2021-04-30 | 한양대학교 산학협력단 | c축 배향된 결정성 산화물 반도체막을 구비하는 수직형 비휘발성 메모리 소자 |
| JP7190729B2 (ja) | 2018-08-31 | 2022-12-16 | 三国電子有限会社 | キャリア注入量制御電極を有する有機エレクトロルミネセンス素子 |
| JP7246681B2 (ja) | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
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| WO2021094878A1 (ja) * | 2019-11-15 | 2021-05-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP7444436B2 (ja) | 2020-02-05 | 2024-03-06 | 三国電子有限会社 | 液晶表示装置 |
| KR102371366B1 (ko) * | 2020-08-10 | 2022-03-04 | 재단법인대구경북과학기술원 | 반도체 트랜지스터 |
| US12113115B2 (en) * | 2021-02-09 | 2024-10-08 | Taiwan Semiconductor Manufacturing Company Limited | Thin film transistor including a compositionally-graded gate dielectric and methods for forming the same |
| JP2023007092A (ja) * | 2021-07-01 | 2023-01-18 | シャープディスプレイテクノロジー株式会社 | アクティブマトリクス基板およびその製造方法 |
| US12439641B2 (en) * | 2021-11-19 | 2025-10-07 | Tokyo Electron Limited | Compact 3D design and connections with optimum 3D transistor stacking |
| KR20260024500A (ko) * | 2024-08-12 | 2026-02-23 | 삼성디스플레이 주식회사 | 표시패널 및 이를 포함하는 표시장치 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010531059A (ja) * | 2007-06-19 | 2010-09-16 | サムスン エレクトロニクス カンパニー リミテッド | 酸化物半導体及びこれを含む薄膜トランジスタ |
| JP2010251735A (ja) * | 2009-03-27 | 2010-11-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2011120221A (ja) * | 2009-10-30 | 2011-06-16 | Semiconductor Energy Lab Co Ltd | 駆動回路、当該駆動回路を具備する表示装置、及び当該表示装置を具備する電子機器 |
| JP2011135063A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2011228688A (ja) * | 2010-04-02 | 2011-11-10 | Semiconductor Energy Lab Co Ltd | 成膜装置、及び半導体装置の作製方法 |
| JP2012059860A (ja) * | 2010-09-08 | 2012-03-22 | Fujifilm Corp | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
Family Cites Families (250)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160173A (ja) | 1984-01-30 | 1985-08-21 | Sharp Corp | 薄膜トランジスタ |
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JPH1012889A (ja) | 1996-06-18 | 1998-01-16 | Semiconductor Energy Lab Co Ltd | 半導体薄膜および半導体装置 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| WO2002016679A1 (en) | 2000-08-18 | 2002-02-28 | Tohoku Techno Arch Co., Ltd. | Polycrystalline semiconductor material and method of manufacture thereof |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| JP2002162646A (ja) | 2000-09-14 | 2002-06-07 | Sony Corp | 反射型液晶表示装置 |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| KR20070116888A (ko) | 2004-03-12 | 2007-12-11 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| US7642038B2 (en) | 2004-03-24 | 2010-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming pattern, thin film transistor, display device, method for manufacturing thereof, and television apparatus |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7382421B2 (en) | 2004-10-12 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Thin film transistor with a passivation layer |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| CA2585063C (en) | 2004-11-10 | 2013-01-15 | Canon Kabushiki Kaisha | Light-emitting device |
| JP5138163B2 (ja) | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| BRPI0517560B8 (pt) | 2004-11-10 | 2018-12-11 | Canon Kk | transistor de efeito de campo |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| JP5126729B2 (ja) | 2004-11-10 | 2013-01-23 | キヤノン株式会社 | 画像表示装置 |
| EP2453481B1 (en) | 2004-11-10 | 2017-01-11 | Canon Kabushiki Kaisha | Field effect transistor with amorphous oxide |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI505473B (zh) | 2005-01-28 | 2015-10-21 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7608531B2 (en) | 2005-01-28 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP5006598B2 (ja) | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | 電界効果型トランジスタ |
| EP3614442A3 (en) | 2005-09-29 | 2020-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having oxide semiconductor layer and manufactoring method thereof |
| JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| KR20090115222A (ko) | 2005-11-15 | 2009-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
| JP5250929B2 (ja) | 2005-11-30 | 2013-07-31 | 凸版印刷株式会社 | トランジスタおよびその製造方法 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| US7827800B2 (en) | 2006-10-19 | 2010-11-09 | Pratt & Whitney Canada Corp. | Combustor heat shield |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR101312259B1 (ko) | 2007-02-09 | 2013-09-25 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| JP5196870B2 (ja) | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
| US8436349B2 (en) | 2007-02-20 | 2013-05-07 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
| JP2008235871A (ja) | 2007-02-20 | 2008-10-02 | Canon Inc | 薄膜トランジスタの形成方法及び表示装置 |
| WO2008105347A1 (en) | 2007-02-20 | 2008-09-04 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| JP5244331B2 (ja) * | 2007-03-26 | 2013-07-24 | 出光興産株式会社 | 非晶質酸化物半導体薄膜、その製造方法、薄膜トランジスタの製造方法、電界効果型トランジスタ、発光装置、表示装置及びスパッタリングターゲット |
| JP4727684B2 (ja) | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| JP2008276212A (ja) | 2007-04-05 | 2008-11-13 | Fujifilm Corp | 有機電界発光表示装置 |
| JP5197058B2 (ja) | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| JP5215589B2 (ja) | 2007-05-11 | 2013-06-19 | キヤノン株式会社 | 絶縁ゲート型トランジスタ及び表示装置 |
| KR101345376B1 (ko) * | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| EP2153468B1 (en) | 2007-05-31 | 2010-12-01 | Canon Kabushiki Kaisha | Manufacturing method of thin film transistor using oxide semiconductor |
| WO2008156312A2 (en) | 2007-06-19 | 2008-12-24 | Samsung Electronics Co., Ltd. | Oxide semiconductors and thin film transistors comprising the same |
| US8354674B2 (en) | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| TWI453915B (zh) | 2007-09-10 | 2014-09-21 | Idemitsu Kosan Co | Thin film transistor |
| JP5489446B2 (ja) | 2007-11-15 | 2014-05-14 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| JP5213422B2 (ja) | 2007-12-04 | 2013-06-19 | キヤノン株式会社 | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
| JP5215158B2 (ja) | 2007-12-17 | 2013-06-19 | 富士フイルム株式会社 | 無機結晶性配向膜及びその製造方法、半導体デバイス |
| US7812348B2 (en) | 2008-02-29 | 2010-10-12 | Semiconductor Energy Laboratory Co., Ltd. | Thin-film transistor and display device |
| JP4555358B2 (ja) | 2008-03-24 | 2010-09-29 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよび表示装置 |
| KR100941850B1 (ko) | 2008-04-03 | 2010-02-11 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| JP5325446B2 (ja) | 2008-04-16 | 2013-10-23 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| KR101496148B1 (ko) | 2008-05-15 | 2015-02-27 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| JP5430248B2 (ja) | 2008-06-24 | 2014-02-26 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよび表示装置 |
| WO2009157573A1 (en) | 2008-06-27 | 2009-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, semiconductor device and electronic device |
| KR100963026B1 (ko) | 2008-06-30 | 2010-06-10 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| KR100963027B1 (ko) | 2008-06-30 | 2010-06-10 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| KR100963104B1 (ko) | 2008-07-08 | 2010-06-14 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| KR101603775B1 (ko) | 2008-07-14 | 2016-03-18 | 삼성전자주식회사 | 채널층 및 그를 포함하는 트랜지스터 |
| EP2146379B1 (en) | 2008-07-14 | 2015-01-28 | Samsung Electronics Co., Ltd. | Transistor comprising ZnO based channel layer |
| JP2010040552A (ja) | 2008-07-31 | 2010-02-18 | Idemitsu Kosan Co Ltd | 薄膜トランジスタ及びその製造方法 |
| TWI770659B (zh) | 2008-07-31 | 2022-07-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| TWI500160B (zh) | 2008-08-08 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP5345456B2 (ja) | 2008-08-14 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタ |
| US8129718B2 (en) | 2008-08-28 | 2012-03-06 | Canon Kabushiki Kaisha | Amorphous oxide semiconductor and thin film transistor using the same |
| US9082857B2 (en) | 2008-09-01 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising an oxide semiconductor layer |
| JP5345359B2 (ja) | 2008-09-18 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP2010087223A (ja) * | 2008-09-30 | 2010-04-15 | Toppan Printing Co Ltd | 薄膜トランジスタおよびアクティブマトリクスディスプレイ |
| KR101579050B1 (ko) * | 2008-10-03 | 2015-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| JP5361651B2 (ja) * | 2008-10-22 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| WO2010047217A1 (en) * | 2008-10-24 | 2010-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US8106400B2 (en) | 2008-10-24 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5616012B2 (ja) * | 2008-10-24 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI496295B (zh) | 2008-10-31 | 2015-08-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| US8344387B2 (en) | 2008-11-28 | 2013-01-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5538797B2 (ja) | 2008-12-12 | 2014-07-02 | キヤノン株式会社 | 電界効果型トランジスタ及び表示装置 |
| JP5781720B2 (ja) | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| TWI476915B (zh) | 2008-12-25 | 2015-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| TWI474408B (zh) * | 2008-12-26 | 2015-02-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| KR101648927B1 (ko) * | 2009-01-16 | 2016-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| JP5606682B2 (ja) | 2009-01-29 | 2014-10-15 | 富士フイルム株式会社 | 薄膜トランジスタ、多結晶酸化物半導体薄膜の製造方法、及び薄膜トランジスタの製造方法 |
| JP5371467B2 (ja) | 2009-02-12 | 2013-12-18 | 富士フイルム株式会社 | 電界効果型トランジスタ及び電界効果型トランジスタの製造方法 |
| CN101840936B (zh) | 2009-02-13 | 2014-10-08 | 株式会社半导体能源研究所 | 包括晶体管的半导体装置及其制造方法 |
| US8704216B2 (en) | 2009-02-27 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| TWI476917B (zh) | 2009-04-16 | 2015-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| JP5240059B2 (ja) | 2009-05-14 | 2013-07-17 | トヨタ自動車株式会社 | 排気還流装置の異常検出装置 |
| JP4415062B1 (ja) | 2009-06-22 | 2010-02-17 | 富士フイルム株式会社 | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
| JP4571221B1 (ja) | 2009-06-22 | 2010-10-27 | 富士フイルム株式会社 | Igzo系酸化物材料及びigzo系酸化物材料の製造方法 |
| WO2011004723A1 (en) * | 2009-07-10 | 2011-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method the same |
| CN102473734B (zh) * | 2009-07-31 | 2015-08-12 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| KR101981441B1 (ko) | 2009-07-31 | 2019-05-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2011013523A1 (en) | 2009-07-31 | 2011-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102057299B1 (ko) | 2009-07-31 | 2019-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 디바이스 및 그 형성 방법 |
| WO2011013502A1 (en) | 2009-07-31 | 2011-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101746198B1 (ko) * | 2009-09-04 | 2017-06-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
| CN105679834A (zh) | 2009-09-16 | 2016-06-15 | 株式会社半导体能源研究所 | 晶体管及显示设备 |
| KR20220127372A (ko) | 2009-09-24 | 2022-09-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막 및 반도체 장치 |
| CN105185837B (zh) | 2009-10-08 | 2018-08-03 | 株式会社半导体能源研究所 | 半导体器件、显示装置和电子电器 |
| KR101772639B1 (ko) | 2009-10-16 | 2017-08-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101591613B1 (ko) | 2009-10-21 | 2016-02-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20260036405A (ko) | 2009-10-29 | 2026-03-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011052385A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101752518B1 (ko) | 2009-10-30 | 2017-06-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2494597A4 (en) | 2009-10-30 | 2015-03-18 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
| KR101876473B1 (ko) | 2009-11-06 | 2018-07-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| KR102220606B1 (ko) * | 2009-11-06 | 2021-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2011065329A1 (ja) | 2009-11-27 | 2011-06-03 | 株式会社日立製作所 | 酸化物半導体装置およびその製造方法 |
| CN102668028B (zh) * | 2009-11-28 | 2015-09-02 | 株式会社半导体能源研究所 | 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法 |
| KR101824124B1 (ko) | 2009-11-28 | 2018-02-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| CN102640272B (zh) | 2009-12-04 | 2015-05-20 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| KR101396102B1 (ko) | 2009-12-04 | 2014-05-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102929405B1 (ko) | 2009-12-04 | 2026-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101833198B1 (ko) | 2009-12-04 | 2018-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 이를 포함하는 전자 기기 |
| JP5497417B2 (ja) * | 2009-12-10 | 2014-05-21 | 富士フイルム株式会社 | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
| KR101804589B1 (ko) | 2009-12-11 | 2018-01-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| EP2513966B1 (en) | 2009-12-18 | 2020-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2011074409A1 (en) * | 2009-12-18 | 2011-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2011138934A (ja) * | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| CN102668098B (zh) | 2009-12-28 | 2015-07-22 | 株式会社半导体能源研究所 | 制造半导体装置的方法 |
| KR101701208B1 (ko) | 2010-01-15 | 2017-02-02 | 삼성디스플레이 주식회사 | 표시 기판 |
| WO2011089808A1 (en) | 2010-01-20 | 2011-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9000442B2 (en) * | 2010-01-20 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device |
| KR101893904B1 (ko) | 2010-01-29 | 2018-08-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 기억 장치 |
| WO2011096275A1 (en) * | 2010-02-05 | 2011-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9391209B2 (en) | 2010-02-05 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101775180B1 (ko) * | 2010-02-12 | 2017-09-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 구동 방법 |
| JP5740169B2 (ja) * | 2010-02-19 | 2015-06-24 | 株式会社半導体エネルギー研究所 | トランジスタの作製方法 |
| JP2011187506A (ja) | 2010-03-04 | 2011-09-22 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
| WO2011114866A1 (en) | 2010-03-17 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| KR20110107934A (ko) * | 2010-03-26 | 2011-10-05 | 연세대학교 산학협력단 | 탄소나노튜브/ZnO 투명태양전지 및 그 제조방법 |
| US8884282B2 (en) | 2010-04-02 | 2014-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101465192B1 (ko) * | 2010-04-09 | 2014-11-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5606787B2 (ja) * | 2010-05-18 | 2014-10-15 | 富士フイルム株式会社 | 薄膜トランジスタの製造方法、並びに、薄膜トランジスタ、イメージセンサー、x線センサー及びx線デジタル撮影装置 |
| JP5705559B2 (ja) * | 2010-06-22 | 2015-04-22 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び、半導体装置の製造方法 |
| US8883555B2 (en) * | 2010-08-25 | 2014-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, manufacturing method of electronic device, and sputtering target |
| JP5727892B2 (ja) * | 2010-08-26 | 2015-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR102115344B1 (ko) | 2010-08-27 | 2020-05-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치, 반도체 장치 |
| US8634228B2 (en) * | 2010-09-02 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of semiconductor device |
| KR101932576B1 (ko) * | 2010-09-13 | 2018-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| TWI562379B (en) * | 2010-11-30 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and method for manufacturing semiconductor device |
| JP2012142562A (ja) * | 2010-12-17 | 2012-07-26 | Semiconductor Energy Lab Co Ltd | 半導体記憶装置 |
| US9024317B2 (en) * | 2010-12-24 | 2015-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor circuit, method for driving the same, storage device, register circuit, display device, and electronic device |
| US8921948B2 (en) * | 2011-01-12 | 2014-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8916867B2 (en) * | 2011-01-20 | 2014-12-23 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor element and semiconductor device |
| JP2012160679A (ja) | 2011-02-03 | 2012-08-23 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| JP6045176B2 (ja) * | 2011-04-15 | 2016-12-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2013016243A (ja) * | 2011-06-09 | 2013-01-24 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
| US9166055B2 (en) | 2011-06-17 | 2015-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR20130007426A (ko) | 2011-06-17 | 2013-01-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| SG10201505586UA (en) | 2011-06-17 | 2015-08-28 | Semiconductor Energy Lab | Semiconductor device and method for manufacturing the same |
| US9214474B2 (en) | 2011-07-08 | 2015-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US8952377B2 (en) | 2011-07-08 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US8748886B2 (en) | 2011-07-08 | 2014-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP5263347B2 (ja) | 2011-07-19 | 2013-08-14 | 富士通株式会社 | ストレージシステムの制御方法、ストレージシステム、及びストレージ装置 |
| JP6013685B2 (ja) | 2011-07-22 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| CN106847929B (zh) * | 2011-09-29 | 2020-06-23 | 株式会社半导体能源研究所 | 半导体装置 |
| US10002968B2 (en) | 2011-12-14 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| US8796683B2 (en) | 2011-12-23 | 2014-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20130105392A (ko) * | 2012-03-14 | 2013-09-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| US8901556B2 (en) * | 2012-04-06 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film, method for manufacturing semiconductor device, and semiconductor device |
| US9276121B2 (en) * | 2012-04-12 | 2016-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6059566B2 (ja) * | 2012-04-13 | 2017-01-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR102932705B1 (ko) * | 2012-04-13 | 2026-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP6108103B2 (ja) | 2013-06-06 | 2017-04-05 | トヨタ自動車株式会社 | 巻線装置及び巻線方法 |
| JP7101049B2 (ja) | 2018-06-06 | 2022-07-14 | 朋和産業株式会社 | 食品用包装袋 |
| JP7114059B2 (ja) | 2018-06-07 | 2022-08-08 | 三甲株式会社 | トレー |
| JP6991930B2 (ja) | 2018-06-07 | 2022-01-13 | 相互印刷株式会社 | プレススルーパックの包装体 |
| JP6594576B1 (ja) | 2018-06-07 | 2019-10-23 | キヤノン株式会社 | 光学系、それを備える撮像装置及び撮像システム |
| JP6788174B1 (ja) | 2019-06-11 | 2020-11-25 | 馨 林谷 | 母板に雑草粘着液排除孔のある刈り払い刃。 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010531059A (ja) * | 2007-06-19 | 2010-09-16 | サムスン エレクトロニクス カンパニー リミテッド | 酸化物半導体及びこれを含む薄膜トランジスタ |
| JP2010251735A (ja) * | 2009-03-27 | 2010-11-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2011120221A (ja) * | 2009-10-30 | 2011-06-16 | Semiconductor Energy Lab Co Ltd | 駆動回路、当該駆動回路を具備する表示装置、及び当該表示装置を具備する電子機器 |
| JP2011135063A (ja) * | 2009-11-28 | 2011-07-07 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2011228688A (ja) * | 2010-04-02 | 2011-11-10 | Semiconductor Energy Lab Co Ltd | 成膜装置、及び半導体装置の作製方法 |
| JP2012059860A (ja) * | 2010-09-08 | 2012-03-22 | Fujifilm Corp | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
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