KR101309479B1 - 적층 칩 전자부품, 그 실장 기판 및 포장체 - Google Patents

적층 칩 전자부품, 그 실장 기판 및 포장체 Download PDF

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Publication number
KR101309479B1
KR101309479B1 KR1020120089522A KR20120089522A KR101309479B1 KR 101309479 B1 KR101309479 B1 KR 101309479B1 KR 1020120089522 A KR1020120089522 A KR 1020120089522A KR 20120089522 A KR20120089522 A KR 20120089522A KR 101309479 B1 KR101309479 B1 KR 101309479B1
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South Korea
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thickness
cover layer
ceramic body
lower cover
active layer
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KR1020120089522A
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English (en)
Korean (ko)
Inventor
안영규
박상수
박민철
정세화
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삼성전기주식회사
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Priority to US13/588,696 priority Critical patent/US9099242B2/en
Priority to EP14174616.4A priority patent/EP2827351B1/en
Priority to EP12275125.8A priority patent/EP2669915B1/en
Priority to TW101132128A priority patent/TWI455162B/zh
Priority to CN201410043307.XA priority patent/CN103787001B/zh
Priority to CN201310218442.9A priority patent/CN103456494B/zh
Priority to CN201210359200.7A priority patent/CN103456495B/zh
Priority to JP2012227732A priority patent/JP5319007B1/ja
Priority to JP2013123532A priority patent/JP5755685B2/ja
Priority to US13/918,512 priority patent/US9576728B2/en
Application granted granted Critical
Publication of KR101309479B1 publication Critical patent/KR101309479B1/ko
Priority to JP2014022441A priority patent/JP2014112712A/ja
Priority to JP2014087129A priority patent/JP2014158040A/ja
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020120089522A 2012-05-30 2012-08-16 적층 칩 전자부품, 그 실장 기판 및 포장체 Active KR101309479B1 (ko)

Priority Applications (12)

Application Number Priority Date Filing Date Title
US13/588,696 US9099242B2 (en) 2012-05-30 2012-08-17 Laminated chip electronic component, board for mounting the same, and packing unit thereof
EP14174616.4A EP2827351B1 (en) 2012-05-30 2012-08-23 Laminated ceramic chip electronic component
EP12275125.8A EP2669915B1 (en) 2012-05-30 2012-08-23 Laminated chip electronic component, board for mounting the same and packing unit
TW101132128A TWI455162B (zh) 2012-05-30 2012-09-04 積層晶片電子元件、用於製造該積層晶片電子元件之板體，及其封裝單元
CN201310218442.9A CN103456494B (zh) 2012-05-30 2012-09-24 片式层压电子元件、用于安装该元件的板及其封装单元
CN201210359200.7A CN103456495B (zh) 2012-05-30 2012-09-24 片式层压电子元件、用于安装该元件的板及其封装单元
CN201410043307.XA CN103787001B (zh) 2012-05-30 2012-09-24 封装单元
JP2012227732A JP5319007B1 (ja) 2012-05-30 2012-10-15 積層チップ電子部品、その実装基板及び包装体
JP2013123532A JP5755685B2 (ja) 2012-05-30 2013-06-12 積層チップ電子部品、積層チップ電子部品が実装された基板、および、包装ユニット
US13/918,512 US9576728B2 (en) 2012-05-30 2013-06-14 Laminated chip electronic component, board for mounting the same, and packing unit thereof
JP2014022441A JP2014112712A (ja) 2012-05-30 2014-02-07 包装ユニット
JP2014087129A JP2014158040A (ja) 2012-05-30 2014-04-21 包装ユニット

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20120057723 2012-05-30
KR1020120057723 2012-05-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120126533A Division KR101616596B1 (ko) 2012-05-30 2012-11-09 적층 칩 전자부품, 그 실장 기판 및 포장체

Publications (1)

Publication Number Publication Date
KR101309479B1 true KR101309479B1 (ko) 2013-09-23

Family

ID=49456330

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020120089522A Active KR101309479B1 (ko) 2012-05-30 2012-08-16 적층 칩 전자부품, 그 실장 기판 및 포장체
KR1020120126533A Active KR101616596B1 (ko) 2012-05-30 2012-11-09 적층 칩 전자부품, 그 실장 기판 및 포장체
KR1020140008460A Active KR101983167B1 (ko) 2012-05-30 2014-01-23 적층 칩 전자부품, 그 실장 기판 및 포장체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020120126533A Active KR101616596B1 (ko) 2012-05-30 2012-11-09 적층 칩 전자부품, 그 실장 기판 및 포장체
KR1020140008460A Active KR101983167B1 (ko) 2012-05-30 2014-01-23 적층 칩 전자부품, 그 실장 기판 및 포장체

Country Status (6)

Country Link
US (2) US9099242B2 (enExample)
EP (2) EP2669915B1 (enExample)
JP (4) JP5319007B1 (enExample)
KR (3) KR101309479B1 (enExample)
CN (3) CN103787001B (enExample)
TW (1) TWI455162B (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412520B2 (en) 2014-07-25 2016-08-09 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
KR20160132779A (ko) * 2015-05-11 2016-11-21 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서의 자세 판별 방법, 적층 세라믹 콘덴서의 자세 판별 장치, 일련의 적층 세라믹 콘덴서의 제조 방법, 및 일련의 적층 세라믹 콘덴서
KR101681410B1 (ko) * 2015-04-20 2016-11-30 삼성전기주식회사 커패시터 부품
US10553361B2 (en) 2017-12-22 2020-02-04 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor, method of manufacturing the same, and board having the same
KR102127803B1 (ko) 2019-04-26 2020-06-29 삼성전기주식회사 인터포저 및 이 인터포저를 포함하는 전자 부품
US11276528B2 (en) 2019-12-09 2022-03-15 Samsung Electro-Mechanics Co., Ltd. Electronic component
US12308172B2 (en) 2020-12-08 2025-05-20 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor and board component having the same

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