TWI455162B - 積層晶片電子元件、用於製造該積層晶片電子元件之板體，及其封裝單元 - Google Patents
積層晶片電子元件、用於製造該積層晶片電子元件之板體，及其封裝單元 Download PDFInfo
- Publication number
- TWI455162B TWI455162B TW101132128A TW101132128A TWI455162B TW I455162 B TWI455162 B TW I455162B TW 101132128 A TW101132128 A TW 101132128A TW 101132128 A TW101132128 A TW 101132128A TW I455162 B TWI455162 B TW I455162B
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- Taiwan
- Prior art keywords
- thickness
- cladding layer
- ceramic body
- layer
- chip electronic
- Prior art date
Links
- 238000012856 packing Methods 0.000 title 1
- 238000005253 cladding Methods 0.000 claims description 134
- 239000000919 ceramic Substances 0.000 claims description 103
- 239000003990 capacitor Substances 0.000 claims description 74
- 125000006850 spacer group Chemical group 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 188
- 235000012431 wafers Nutrition 0.000 description 67
- 230000000694 effects Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120057723 | 2012-05-30 | ||
| KR1020120089522A KR101309479B1 (ko) | 2012-05-30 | 2012-08-16 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201349268A TW201349268A (zh) | 2013-12-01 |
| TWI455162B true TWI455162B (zh) | 2014-10-01 |
Family
ID=49456330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101132128A TWI455162B (zh) | 2012-05-30 | 2012-09-04 | 積層晶片電子元件、用於製造該積層晶片電子元件之板體，及其封裝單元 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9099242B2 (enExample) |
| EP (2) | EP2669915B1 (enExample) |
| JP (4) | JP5319007B1 (enExample) |
| KR (3) | KR101309479B1 (enExample) |
| CN (3) | CN103787001B (enExample) |
| TW (1) | TWI455162B (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5998724B2 (ja) * | 2012-08-03 | 2016-09-28 | Tdk株式会社 | 積層セラミックコンデンサ |
| KR101474065B1 (ko) * | 2012-09-27 | 2014-12-17 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
| KR101452054B1 (ko) * | 2012-12-03 | 2014-10-22 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP5987812B2 (ja) * | 2013-01-25 | 2016-09-07 | 株式会社村田製作所 | 積層コンデンサ、テーピング積層コンデンサ連及び積層コンデンサの実装構造 |
| JP6798766B2 (ja) * | 2013-06-19 | 2020-12-09 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP6247188B2 (ja) | 2013-10-31 | 2017-12-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 積層セラミックキャパシタ |
| KR20140038916A (ko) * | 2013-10-31 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP5790817B2 (ja) * | 2013-11-05 | 2015-10-07 | 株式会社村田製作所 | コンデンサ、コンデンサの実装構造体及びテーピング電子部品連 |
| KR101525696B1 (ko) | 2013-11-14 | 2015-06-03 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판 |
| KR102078012B1 (ko) * | 2014-01-10 | 2020-02-17 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| CN105900195B (zh) * | 2014-01-17 | 2018-10-26 | 京瓷株式会社 | 层叠型电子部件及其安装构造体 |
| KR102004781B1 (ko) * | 2014-01-27 | 2019-07-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP6011573B2 (ja) * | 2014-03-24 | 2016-10-19 | 株式会社村田製作所 | 電子部品 |
| KR20150114747A (ko) * | 2014-04-02 | 2015-10-13 | 삼성전기주식회사 | 칩형 코일 부품 및 그 실장 기판 |
| JP6481446B2 (ja) * | 2014-06-13 | 2019-03-13 | 株式会社村田製作所 | 積層コンデンサの実装構造体 |
| KR101630050B1 (ko) | 2014-07-25 | 2016-06-13 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| JP2014212350A (ja) | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2014212351A (ja) | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2014212349A (ja) | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2015008312A (ja) | 2014-08-13 | 2015-01-15 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2016040816A (ja) | 2014-08-13 | 2016-03-24 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2016040817A (ja) | 2014-08-13 | 2016-03-24 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2015026844A (ja) | 2014-08-13 | 2015-02-05 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2016040819A (ja) | 2014-08-13 | 2016-03-24 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2014212352A (ja) | 2014-08-13 | 2014-11-13 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2014220529A (ja) | 2014-08-13 | 2014-11-20 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| JP2014232898A (ja) | 2014-09-18 | 2014-12-11 | 株式会社村田製作所 | 積層セラミックコンデンサ、これを含む積層セラミックコンデンサ連、および、積層セラミックコンデンサの実装体 |
| KR102097325B1 (ko) * | 2014-09-23 | 2020-04-06 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| KR102037268B1 (ko) * | 2014-10-15 | 2019-10-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
| JP6256306B2 (ja) * | 2014-11-05 | 2018-01-10 | 株式会社村田製作所 | 電子部品内蔵基板およびその製造方法 |
| JP6218725B2 (ja) | 2014-12-26 | 2017-10-25 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR101659209B1 (ko) * | 2015-02-10 | 2016-09-22 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 이를 구비한 기판 |
| KR101681410B1 (ko) * | 2015-04-20 | 2016-11-30 | 삼성전기주식회사 | 커패시터 부품 |
| JP6361570B2 (ja) * | 2015-05-11 | 2018-07-25 | 株式会社村田製作所 | 積層セラミックコンデンサの姿勢判別方法、積層セラミックコンデンサの姿勢判別装置、および積層セラミックコンデンサ連の製造方法 |
| JP2017069417A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社村田製作所 | 積層コンデンサ |
| KR101823246B1 (ko) * | 2016-06-21 | 2018-01-29 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
| KR102029529B1 (ko) * | 2016-12-19 | 2019-10-07 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
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| WO2018212119A1 (ja) * | 2017-05-15 | 2018-11-22 | 株式会社村田製作所 | 積層型電子部品および積層型電子部品の製造方法 |
| KR102426214B1 (ko) | 2017-12-22 | 2022-07-28 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
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| US20210090809A1 (en) | 2019-09-20 | 2021-03-25 | Samsung Electro-Mechanics Co., Ltd. | Board having multilayer capacitor mounted thereon and multilayer capacitor package |
| CN110662352A (zh) * | 2019-10-28 | 2020-01-07 | 维沃移动通信有限公司 | 一种电路板装置及其加工方法和移动终端 |
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| KR102268390B1 (ko) | 2019-12-09 | 2021-06-23 | 삼성전기주식회사 | 전자 부품 |
| CN111157879B (zh) * | 2020-01-03 | 2022-09-13 | 深圳市景旺电子股份有限公司 | 印制电路板的层偏检测方法及层偏检测结构 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20140151103A1 (en) | 2014-06-05 |
| JP2013251522A (ja) | 2013-12-12 |
| KR101616596B1 (ko) | 2016-04-28 |
| KR20130135014A (ko) | 2013-12-10 |
| TW201349268A (zh) | 2013-12-01 |
| JP2013251551A (ja) | 2013-12-12 |
| EP2669915A1 (en) | 2013-12-04 |
| CN103787001A (zh) | 2014-05-14 |
| CN103456494A (zh) | 2013-12-18 |
| CN103787001B (zh) | 2016-09-28 |
| EP2827351B1 (en) | 2017-02-22 |
| JP5319007B1 (ja) | 2013-10-16 |
| JP2014112712A (ja) | 2014-06-19 |
| JP5755685B2 (ja) | 2015-07-29 |
| CN103456495B (zh) | 2017-04-12 |
| US9576728B2 (en) | 2017-02-21 |
| US20130319741A1 (en) | 2013-12-05 |
| KR20140028092A (ko) | 2014-03-07 |
| EP2827351A1 (en) | 2015-01-21 |
| CN103456495A (zh) | 2013-12-18 |
| US9099242B2 (en) | 2015-08-04 |
| JP2014158040A (ja) | 2014-08-28 |
| KR101309479B1 (ko) | 2013-09-23 |
| CN103456494B (zh) | 2017-05-03 |
| KR101983167B1 (ko) | 2019-05-29 |
| EP2669915B1 (en) | 2017-06-28 |
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