JP2011108827A - 積層セラミックコンデンサの実装構造及び積層セラミックコンデンサ - Google Patents
積層セラミックコンデンサの実装構造及び積層セラミックコンデンサ Download PDFInfo
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- JP2011108827A JP2011108827A JP2009262024A JP2009262024A JP2011108827A JP 2011108827 A JP2011108827 A JP 2011108827A JP 2009262024 A JP2009262024 A JP 2009262024A JP 2009262024 A JP2009262024 A JP 2009262024A JP 2011108827 A JP2011108827 A JP 2011108827A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 abstract description 52
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 33
- 238000011156 evaluation Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
【解決手段】 積層セラミックコンデンサ1は、内部電極4A,4Bが誘電体層3を介して交互に積層されてなるコンデンサ素体5を有している。コンデンサ1は、内部電極4A,4Bが回路基板2の実装面2aに対して平行となるように回路基板2のランド8に実装されている。また、コンデンサ1の高さ寸法をT、コンデンサ1の幅寸法をW、ランド8におけるコンデンサ1の幅寸法Wに対応する方向の寸法をWp、素体2の外装部6の厚みをTf、誘電体層3の比誘電率をεrとしたときに、Tf/T>0.1、300≦εr≦2800、0.6≦Wp/W≦1.0を満足している。
【選択図】図1
Description
Tf/T>0.1 …(A)
300≦εr≦2800 …(B)
0.6≦Wp/W≦1.0 …(C)
を満足している。
Ld/L>1.0
を満足することが好ましい。
図3に示すように、Tf/T比を0.128とし、内部電極の配置方向を回路基板の実装面に対して平行とすると共に、誘電体層の比誘電率εrを250〜3000の範囲で種々変えて、回路基板に発生する音圧を測定して音鳴き(共振音)を評価し、更に積層セラミックコンデンサの容量を評価した。
図4に示すように、誘電体層の比誘電率εrを2150とし、内部電極の配置方向を回路基板の実装面に対して平行とすると共に、積層セラミックコンデンサの高さ寸法Tを2300〜2700μmの範囲で種々変え、素体の外装部の厚みTfを220〜420μmの範囲で種々変えることで、Tf/T比を種々変えて、回路基板に発生する音圧を測定して音鳴きを評価し、更に積層セラミックコンデンサの容量を評価した。
図5に示すように、誘電体層の比誘電率εrを2500,2150,2400とし、Tf/T比を0.071,0.128,0.060とすると共に、内部電極の配置方向を回路基板の実装面に対して平行にした場合と、内部電極の配置方向を回路基板の実装面に対して垂直にした場合とで、回路基板に発生する音圧を測定して音鳴きを評価し、更に積層セラミックコンデンサの容量を評価した。
図6に示すように、内部電極の配置方向を回路基板の実装面に対して平行とすると共に、ランドにおけるコンデンサの幅寸法Wに対応する方向の寸法Wpを1250〜3300μmの範囲で種々変えることで、Wp/W比を種々変えて、回路基板に発生する音圧を測定して音鳴きを評価し、更に回路基板に対するコンデンサの固着強度を評価した。このとき、誘電体層の比誘電率εrは2150、層間厚みは4.0μm、層数は340、コンデンサの幅寸法Wは2500μmである。
Claims (3)
- 複数の誘電体層と複数の内部電極とが交互に積層されてなる素体を有する積層セラミックコンデンサを、少なくとも2つのランドが実装面に設けられた基板に実装する積層セラミックコンデンサの実装構造であって、
前記積層セラミックコンデンサは、前記内部電極が前記実装面に対して平行となるように前記2つのランドに実装されており、
前記積層セラミックコンデンサの高さ寸法をT、前記素体の外装厚みをTf、前記誘電体層の比誘電率をεrとしたときに、Tf/T>0.1、300≦εr≦2800を満たし、
前記積層セラミックコンデンサの幅寸法をW、前記ランドにおける前記積層セラミックコンデンサの幅寸法に対応する方向の寸法をWpとしたときに、0.6≦Wp/W≦1.0を満たすことを特徴とする積層セラミックコンデンサの実装構造。 - 前記積層セラミックコンデンサの長さ寸法をL、前記2つのランドの外側端間の距離をLdとしたときに、Ld/L>1.0を満たすことを特徴とする請求項1記載の積層セラミックコンデンサの実装構造。
- 複数の誘電体層と複数の内部電極とが交互に積層されてなる素体を有する積層セラミックコンデンサであって、
高さ寸法をT、前記素体の外装厚みをTf、前記誘電体層の比誘電率をεrとしたときに、Tf/T>0.1、300≦εr≦2800を満たすことを特徴とする積層セラミックコンデンサ。
Priority Applications (2)
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JP2009262024A JP5458821B2 (ja) | 2009-11-17 | 2009-11-17 | 積層セラミックコンデンサ |
US12/943,430 US8674234B2 (en) | 2009-11-17 | 2010-11-10 | Multilayer ceramic capacitor mounting structure and multilayer ceramic capacitor |
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JP2009262024A JP5458821B2 (ja) | 2009-11-17 | 2009-11-17 | 積層セラミックコンデンサ |
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JP2011108827A true JP2011108827A (ja) | 2011-06-02 |
JP5458821B2 JP5458821B2 (ja) | 2014-04-02 |
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JP (1) | JP5458821B2 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012248846A (ja) * | 2011-05-26 | 2012-12-13 | Samsung Electro-Mechanics Co Ltd | 積層セラミックコンデンサの回路基板の実装構造 |
JP2013008970A (ja) * | 2011-06-23 | 2013-01-10 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
JP2013038332A (ja) * | 2011-08-10 | 2013-02-21 | Tdk Corp | 積層型コンデンサ |
KR101309326B1 (ko) * | 2012-05-30 | 2013-09-16 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101309479B1 (ko) | 2012-05-30 | 2013-09-23 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
JP2013251374A (ja) * | 2012-05-31 | 2013-12-12 | Tdk Corp | 積層コンデンサ |
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JP2018061058A (ja) * | 2012-09-27 | 2018-04-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層チップ電子部品、その実装基板及び包装体 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008254988A (ja) * | 2007-04-09 | 2008-10-23 | Taiyo Yuden Co Ltd | 誘電体セラミックス及びその製造方法並びに積層セラミックコンデンサ |
JP2009059888A (ja) * | 2007-08-31 | 2009-03-19 | Murata Mfg Co Ltd | 積層セラミックコンデンサ |
JP2009071106A (ja) * | 2007-09-14 | 2009-04-02 | Murata Mfg Co Ltd | 積層セラミックコンデンサ |
JP2009164560A (ja) * | 2007-12-14 | 2009-07-23 | Epson Imaging Devices Corp | 実装構造体、電気光学装置及び電子機器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4695921A (en) * | 1985-11-04 | 1987-09-22 | The United States Of America As Represented By The Secretary Of The Navy | Film chip capacitor |
US5889445A (en) * | 1997-07-22 | 1999-03-30 | Avx Corporation | Multilayer ceramic RC device |
JP2000133909A (ja) | 1998-10-22 | 2000-05-12 | Matsushita Electric Ind Co Ltd | チップコンデンサのプリント配線基板実装構造 |
JP4468597B2 (ja) | 2001-01-29 | 2010-05-26 | オリンパス株式会社 | 電気機器 |
JP2002232110A (ja) | 2001-02-02 | 2002-08-16 | Tohoku Pioneer Corp | 積層セラミックコンデンサを実装した回路基板 |
KR100514575B1 (ko) * | 2001-04-12 | 2005-09-13 | 티디케이가부시기가이샤 | 적층 세라믹 전자 부품의 제조 방법 |
JP4296472B2 (ja) | 2002-10-31 | 2009-07-15 | ソニー株式会社 | 情報処理装置及び電源回路 |
JP4483659B2 (ja) * | 2005-04-04 | 2010-06-16 | Tdk株式会社 | 電子部品、誘電体磁器組成物およびその製造方法 |
JP3861927B1 (ja) * | 2005-07-07 | 2006-12-27 | 株式会社村田製作所 | 電子部品、電子部品の実装構造および電子部品の製造方法 |
US20090151991A1 (en) * | 2007-12-14 | 2009-06-18 | Epson Imaging Devices Corporation | Mounting structure, electrooptic device, and electronic apparatus |
-
2009
- 2009-11-17 JP JP2009262024A patent/JP5458821B2/ja active Active
-
2010
- 2010-11-10 US US12/943,430 patent/US8674234B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008254988A (ja) * | 2007-04-09 | 2008-10-23 | Taiyo Yuden Co Ltd | 誘電体セラミックス及びその製造方法並びに積層セラミックコンデンサ |
JP2009059888A (ja) * | 2007-08-31 | 2009-03-19 | Murata Mfg Co Ltd | 積層セラミックコンデンサ |
JP2009071106A (ja) * | 2007-09-14 | 2009-04-02 | Murata Mfg Co Ltd | 積層セラミックコンデンサ |
JP2009164560A (ja) * | 2007-12-14 | 2009-07-23 | Epson Imaging Devices Corp | 実装構造体、電気光学装置及び電子機器 |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012248846A (ja) * | 2011-05-26 | 2012-12-13 | Samsung Electro-Mechanics Co Ltd | 積層セラミックコンデンサの回路基板の実装構造 |
US9148955B2 (en) | 2011-05-26 | 2015-09-29 | Samsung Electro-Mechanics Co., Ltd. | Mounting structure of circuit board having multi-layered ceramic capacitor thereon |
JP2013008970A (ja) * | 2011-06-23 | 2013-01-10 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
JP2013038332A (ja) * | 2011-08-10 | 2013-02-21 | Tdk Corp | 積層型コンデンサ |
KR101309479B1 (ko) | 2012-05-30 | 2013-09-23 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101983131B1 (ko) * | 2012-05-30 | 2019-05-29 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR20130135014A (ko) * | 2012-05-30 | 2013-12-10 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR20130135015A (ko) * | 2012-05-30 | 2013-12-10 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
US20130321981A1 (en) | 2012-05-30 | 2013-12-05 | Young Ghyu Ahn | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
US8638543B2 (en) | 2012-05-30 | 2014-01-28 | Samsung Electro-Mechanics Co., Ltd. | Laminated chip electronic component, board for mounting the same, and packing unit thereof |
KR101616596B1 (ko) * | 2012-05-30 | 2016-04-28 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101309326B1 (ko) * | 2012-05-30 | 2013-09-16 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
KR101504001B1 (ko) * | 2012-05-30 | 2015-03-18 | 삼성전기주식회사 | 적층 칩 전자부품, 그 실장 기판 및 포장체 |
JP2013251374A (ja) * | 2012-05-31 | 2013-12-12 | Tdk Corp | 積層コンデンサ |
JP2018061058A (ja) * | 2012-09-27 | 2018-04-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層チップ電子部品、その実装基板及び包装体 |
US20140185186A1 (en) * | 2012-12-27 | 2014-07-03 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting the same |
US9208950B2 (en) * | 2012-12-27 | 2015-12-08 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting the same |
CN103903854A (zh) * | 2012-12-27 | 2014-07-02 | 三星电机株式会社 | 多层陶瓷电容器和用于安装该多层陶瓷电容器的板 |
CN104282436A (zh) * | 2013-07-05 | 2015-01-14 | 三星电机株式会社 | 多层陶瓷电容器及其制造方法以及安装电路板 |
US9589725B2 (en) | 2013-07-05 | 2017-03-07 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, mounting circuit board thereof, and manufacturing method of the same |
JP2015015445A (ja) * | 2013-07-05 | 2015-01-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ及びその実装基板並びに製造方法 |
KR20180016269A (ko) | 2016-08-05 | 2018-02-14 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품 |
US10014114B2 (en) | 2016-08-05 | 2018-07-03 | Murata Manufacturing Co., Ltd. | Mounting substrate |
US10340083B2 (en) | 2016-08-05 | 2019-07-02 | Murata Manufacturing Co., Ltd. | Electronic component |
US10405435B2 (en) | 2016-08-05 | 2019-09-03 | Murata Manufacturing Co., Ltd. | Electronic component |
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US8674234B2 (en) | 2014-03-18 |
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