JP6620844B2 - 多層プリント配線板及び多層プリント配線板の製造方法 - Google Patents
多層プリント配線板及び多層プリント配線板の製造方法 Download PDFInfo
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- JP6620844B2 JP6620844B2 JP2018114424A JP2018114424A JP6620844B2 JP 6620844 B2 JP6620844 B2 JP 6620844B2 JP 2018114424 A JP2018114424 A JP 2018114424A JP 2018114424 A JP2018114424 A JP 2018114424A JP 6620844 B2 JP6620844 B2 JP 6620844B2
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- H—ELECTRICITY
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- B32B2260/02—Composition of the impregnated, bonded or embedded layer
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
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- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C08J2447/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Derivatives of such polymers
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- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
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- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
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Description
[式(II)中、R2及びR3はそれぞれ独立に炭素数4〜50のアルキレン基を示し、R4は炭素数4〜50のアルキル基を示し、R5は炭素数2〜50のアルキル基を示す。]
[6]前記マレイミド基含有化合物が、マレイミド基が芳香環に結合した構造を有する、[5]に記載の樹脂組成物。
[式(VI)中、A4は下記式(VII)、(VIII)、(IX)又は(X)で表される残基を示し、A5は下記式(XI)で表される残基を示す。]
[式(VIII)中、R11及びR12は各々独立に、水素原子、炭素数1〜5の脂肪族炭化水素基又はハロゲン原子を示し、A6は炭素数1〜5のアルキレン基若しくはアルキリデン基、エーテル基、スルフィド基、スルホニル基、ケトン基、単結合又は下記式(VIII−1)で表される残基を示す。]
[式(VIII−1)中、R13及びR14は各々独立に、水素原子、炭素数1〜5の脂肪族炭化水素基又はハロゲン原子を示し、A7は炭素数1〜5のアルキレン基、イソプロピリデン基、エーテル基、スルフィド基、スルホニル基、ケトン基又は単結合を示す。]
[式(X)中、R15及びR16は各々独立に、水素原子又は炭素数1〜5の脂肪族炭化水素基を示し、jは1〜8の整数である。]
[式(XI)中、R17及びR18は各々独立に、水素原子、炭素数1〜5の脂肪族炭化水素基、炭素数1〜5のアルコキシ基、水酸基又はハロゲン原子を示し、A8は炭素数1〜5のアルキレン基若しくはアルキリデン基、エーテル基、スルフィド基、スルホニル基、ケトン基、フルオレニレン基、単結合、下記式(XI−1)で表される残基又は下記式(XI−2)で表される残基を示す。]
[式(XI−1)中、R19及びR20は各々独立に、水素原子、炭素数1〜5の脂肪族炭化水素基又はハロゲン原子を示し、A9は炭素数1〜5のアルキレン基、イソプロピリデン基、m−フェニレンジイソプロピリデン基、p−フェニレンジイソプロピリデン基、エーテル基、スルフィド基、スルホニル基、ケトン基又は単結合を示す。]
[式(XI−2)中、R21は各々独立に、水素原子、炭素数1〜5の脂肪族炭化水素基又はハロゲン原子を示し、A10及びA11は炭素数1〜5のアルキレン基、イソプロピリデン基、エーテル基、スルフィド基、スルホニル基、ケトン基又は単結合を示す。]
[10][1]〜[8]のいずれかに記載の樹脂組成物と、繊維基材と、から構成されるプリプレグ。
[11][1]〜[8]のいずれかに記載の樹脂組成物の硬化物を含む樹脂層と、導体層と、を有する積層板。
[12][1]〜[8]のいずれかに記載の樹脂組成物の硬化物を含む樹脂層と、少なくとも3層の回路層とを備える、多層プリント配線板。
[13]前記回路層の数が3〜20層である、[11]に記載の多層プリント配線板。
[14][12]又は[13]に記載の多層プリント配線板のミリ波レーダーへの応用。
[15][1]〜[8]のいずれかに記載の樹脂組成物の硬化物を含む樹脂層と、回路層とを備える、ミリ波レーダー用プリント配線板。
本実施形態の樹脂組成物は、マレイミド基、少なくとも2つのイミド結合を有する2価の基及び飽和又は不飽和の2価の炭化水素基を有する化合物を含有する。
本実施形態に係る(a)マレイミド基、(b)少なくとも2つのイミド結合を有する2価の基及び(c)飽和又は不飽和の2価の炭化水素基を有する化合物を(A)成分ということがある。また、(a)マレイミド基を構造(a)、(b)少なくとも2つのイミド結合を有する2価の基を構造(b)、(c)飽和又は不飽和の2価の炭化水素基を構造(c)ということがある。(A)成分を用いることで、高周波特性及び導体との高い接着性を有する樹脂組成物を得ることができる。
ポンプ:L−6200型[株式会社日立ハイテクノロジーズ製]
検出器:L−3300型RI[株式会社日立ハイテクノロジーズ製]
カラムオーブン:L−655A−52[株式会社日立ハイテクノロジーズ製]
ガードカラム及びカラム:TSK Guardcolumn HHR−L+TSKgel G4000HHR+TSKgel G2000HHR[すべて東ソー株式会社製、商品名]
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
流量:1.00mL/分
測定温度:40℃
本実施形態の樹脂組成物は、(A)成分とは異なるマレイミド基含有化合物を更に含有することができる。該マレイミド基含有化合物を(B)成分ということがある。なお、(A)成分及び(B)マレイミド基含有化合物の双方に該当し得る化合物は、(A)成分に帰属するものとする。(B)成分を用いることで、樹脂組成物は、特に低熱膨張特性に優れるものとなる。すなわち、本実施形態の樹脂組成物は、(A)成分と(B)成分とを併用することにより、良好な誘電特性を維持しつつ、低熱膨張特性等を更に向上させることができる。この理由として、(A)成分と(B)マレイミド基含有化合物とを含有する樹脂組成物から得られる硬化物は、低誘電特性を備える(A)成分からなる構造単位と、低熱膨張である(B)マレイミド基含有化合物からなる構造単位とを備えるポリマーを含有するためだと推測される。
本実施形態の樹脂組成物は、(A)成分の硬化を促進するための触媒を更に含有してもよい。触媒の含有量は特に限定されないが、樹脂組成物の全質量に対して0.1〜5質量%であってもよい。触媒としては、例えば、過酸化物、アゾ化合物等を用いることができる。
本実施形態の樹脂組成物は、(A)成分及び(B)成分とは異なる熱硬化性樹脂を更に含有することができる。なお、(A)成分又は(B)成分に該当し得る化合物は、(C)熱硬化性樹脂に帰属しないものとする。(C)熱硬化性樹脂としては、例えば、エポキシ樹脂、シアネートエステル樹脂等が挙げられる。(C)熱硬化性樹脂を含むことで、樹脂組成物の低熱膨張特性等を更に向上させることができる。
本実施形態の樹脂組成物は、(C)熱硬化性樹脂の硬化剤を更に含有してもよい。これにより、樹脂組成物の硬化物を得る際の反応を円滑に進めることができるとともに、得られる樹脂組成物の硬化物の物性を適度に調節することが可能となる。
本実施形態の樹脂組成物には、(C)熱硬化性樹脂の種類に応じて硬化促進剤を更に配合してもよい。エポキシ樹脂の硬化促進剤としては、例えば、潜在性の熱硬化剤である各種イミダゾール類、BF3アミン錯体、リン系硬化促進剤等が挙げられる。硬化促進剤を配合する場合、樹脂組成物の保存安定性、半硬化の樹脂組成物の取扱性及びはんだ耐熱性の観点から、イミダゾール類及びリン系硬化促進剤が好ましい。
本実施形態の樹脂組成物は、無機充填材を更に含有してもよい。任意に適切な無機充填剤を含有させることで、樹脂組成物の低熱膨張特性、高弾性率性、耐熱性、難燃性等を向上させることができる。無機充填材としては特に制限されないが、例えば、シリカ、アルミナ、酸化チタン、マイカ、ベリリア、チタン酸バリウム、チタン酸カリウム、チタン酸ストロンチウム、チタン酸カルシウム、炭酸アルミニウム、水酸化マグネシウム、水酸化アルミニウム、ケイ酸アルミニウム、炭酸カルシウム、ケイ酸カルシウム、ケイ酸マグネシウム、窒化ケイ素、窒化ホウ素、焼成クレー、タルク、ホウ酸アルミニウム、炭化ケイ素等が挙げられる。これらは1種類を単独で用いても、2種類以上を併用してもよい。
本実施形態の樹脂組成物は、樹脂フィルムの取扱い性を高める観点から、熱可塑性樹脂を更に含有してもよい。熱可塑性樹脂の種類は特に限定されず、分子量も限定されないが、(A)成分との相溶性をより高める点から、数平均分子量(Mn)が200〜60000であることが好ましい。
本実施形態の樹脂組成物には、難燃剤を更に配合してもよい。難燃剤としては特に限定されないが、臭素系難燃剤、リン系難燃剤、金属水酸化物等が好適に用いられる。臭素系難燃剤としては、臭素化ビスフェノールA型エポキシ樹脂、臭素化フェノールノボラック型エポキシ樹脂等の臭素化エポキシ樹脂;ヘキサブロモベンゼン、ペンタブロモトルエン、エチレンビス(ペンタブロモフェニル)、エチレンビステトラブロモフタルイミド、1,2−ジブロモ−4−(1,2−ジブロモエチル)シクロヘキサン、テトラブロモシクロオクタン、ヘキサブロモシクロドデカン、ビス(トリブロモフェノキシ)エタン、臭素化ポリフェニレンエーテル、臭素化ポリスチレン、2,4,6−トリス(トリブロモフェノキシ)−1,3,5−トリアジン等の臭素化添加型難燃剤;トリブロモフェニルマレイミド、トリブロモフェニルアクリレート、トリブロモフェニルメタクリレート、テトラブロモビスフェノールA型ジメタクリレート、ペンタブロモベンジルアクリレート、臭素化スチレン等の不飽和二重結合基含有の臭素化反応型難燃剤などが挙げられる。これらの難燃剤は1種類を単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
本実施形態では、上記の樹脂組成物を用いて、樹脂フィルムを製造することができる。なお、樹脂フィルムとは未硬化又は半硬化のフィルム状の樹脂組成物を指す。
本実施形態のプリプレグは、上述の樹脂組成物と、繊維基材とから構成される。
本実施形態によれば、上述の樹脂組成物の硬化物を含む樹脂層と、導体層と、を有する積層板を提供することができる。例えば、上記樹脂フィルム、樹脂層付き支持体又はプリプレグを用い、金属張積層板を製造することができる。
本実施形態によれば、上述の樹脂組成物の硬化物を含む樹脂層と、少なくとも3層の回路層とを備える、多層プリント配線板を提供することができる。回路層の数の上限値は特に限定されず、3層〜20層であってもよい。多層プリント配線板は、例えば、上記の樹脂フィルム、樹脂層付き支持体、プリプレグ又は金属張積層板を用いて製造することもできる。
下記手順に従って、各種の樹脂組成物を調製した。実施例1〜8、実施例A1〜A4及び比較例1〜4の樹脂組成物の調製に用いた各原材料の使用量(質量部)は、表1及び表2にまとめて示す。
(1)BMI−1500[Mw:約1500、Designer Molecules Inc.製、商品名]
(2)BMI−1700[Mw:約1700、Designer Molecules Inc.製、商品名]
(3)BMI−3000[Mw:約3000、Designer Molecules Inc.製、商品名]
(4)BMI−5000[Mw:約5000、Designer Molecules Inc.製、商品名]
(5)BMI−1000[ビス(4−マレイミドフェニル]メタン、大和化成工業株式会社製、商品名)
(6)BMI−4000[2,2−ビス(4−(4−マレイミドフェノキシ)フェニル)プロパン、大和化成工業株式会社製、商品名]
(7)BMI−2300[ポリフェニルメタンマレイミド、大和化成工業株式会社製、商品名]
(8)MIR−3000[ビフェニルアラルキル型マレイミド、日本化薬株式会社製、商品名]
(9)B−3000[ブタジエンホモポリマー、Mn:約3000、日本曹達株式会社製、商品名]
(10)PPO640[ポリフェニレンエーテル、Mn:約16000、SABICイノベーティブプラスチックス社製、商品名]
(11)NC−3000H[ビフェニルアラルキル型エポキシ樹脂、日本化薬株式会社製、商品名]
(12)BADCY[2,2−ビス(4−シアナトフェニル)プロパン、ロンザ社製、商品名]
(13)KA1165[ノボラック型フェノール樹脂、DIC株式会社製、商品名]、
(14)PCP[p−クミルフェノール、和光純薬工業株式会社製、商品名]、
(15)H1041[Mn6万未満のスチレン−ブタジエン共重合体の水素添加物、スチレン含有比率:30%、Mn:58000、旭化成ケミカルズ株式会社製、商品名「タフテックH1041」]
(16)シリカスラリー[球状溶融シリカ、表面処理:フェニルアミノシランカップリング剤(1質量%/スラリー中の全固形分)、分散媒:メチルイソブチルケトン(MIBK)、固形分濃度:70質量%、平均粒子径:0.5μm、密度:2.2g/cm3、株式会社アドマテックス製、商品名「SC−2050KNK」]
(17)パーヘキシン25B[2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン、日油株式会社製、商品名]
(18)2E4MZ[2−エチル−4メチル−イミダゾール、四国化成工業株式会社製、商品名]
(19)ナフテン酸亜鉛[東京化成工業株式会社製]
実施例及び比較例で得られた樹脂組成物を、コンマコーターを用いて、支持基材として厚さ38μmのPETフィルム(G2−38、帝人株式会社製)上に塗工し(乾燥温度:130℃)、半硬化状態の樹脂層を備える樹脂層付き支持体であるPETフィルム付き半硬化樹脂フィルムを作製した。半硬化樹脂フィルム(樹脂層)の厚さは50μmであった。
実施例及び比較例の半硬化樹脂フィルムの外観及び取扱性を評価した。結果を表3及び表4に示す。
A:半硬化樹脂フィルムの表面にムラ、スジ等がない。
B:半硬化樹脂フィルムの表面に多少なりともムラ、スジ等があり、表面平滑性に欠ける。
(1)25℃における表面のべたつき(タック)の有無。
(2)カッターナイフで切断した際の状態の樹脂割れ又は粉落ちの有無。
A:上記(1)及び(2)のいずれも無い。
B:上記(1)及び(2)のいずれか一方でも有る。
上述した樹脂層付き支持体を用い、以下の手順で多層プリント配線板を作製した。
回路パターンが形成されたガラス布基材エポキシ樹脂銅張積層板を内層回路基板とし、その両面に、上記樹脂層付き支持体からPETフィルムを剥離した半硬化樹脂フィルムを1枚乗せ、その上に厚さ12μmの電解銅箔(日本電解株式会社製、商品名「YGP−12」)を配置した後、その上に鏡板を乗せ、200℃/3.0MPa/70分のプレス条件で加熱及び加圧成形して、4層プリント配線板を作製した。
A:回路にボイド、カスレが存在しない。
B:ボイド、カスレが多少なりとも存在する。
上述の樹脂層付き支持体からPETフィルムを剥離した樹脂フィルムを2枚重ねた後、その両面に、厚さ18μmのロープロファイル銅箔(M面Rz:3μm、古河電気工業株式会社製、商品名「F3−WS」)をその粗化面(M面)が接するように配置し、その上に鏡板を乗せ、200℃/3.0MPa/70分のプレス条件で加熱及び加圧成形して、両面金属張硬化樹脂フィルム(厚さ:0.1mm)を作製した。
耐折曲げ性は、両面金属張硬化樹脂フィルムの外層銅箔をエッチングしたものを180度折り曲げることにより、下記基準により評価した。
A:折り曲げた際、割れ又はクラックが発生しない。
B:折り曲げた際、割れ又はクラックが多少なりとも発生する。
誘電特性である比誘電率及び誘電正接は、両面金属張硬化樹脂フィルムの外層銅箔をエッチングし、長さ60mm、幅2mm、厚み約1mmに切断したものを試験片として空洞共振器摂動法により測定した。測定器にはアジレントテクノロジー社製ベクトル型ネットワークアナライザE8364B、空洞共振器には株式会社関東電子応用開発製CP129(10GHz帯共振器)及びCP137(20GHz帯共振器)、測定プログラムにはCPMA−V2をそれぞれ使用した。条件は、周波数10GHz及び20GHz、測定温度25℃とした。
銅箔引きはがし強さは、銅張積層板試験規格JIS−C−6481に準拠して測定した。測定温度は25℃とした。
はんだ耐熱性は、両面金属張硬化樹脂フィルムの片側の銅箔をエッチングし、50mm角に切断したものを試験片として、その常態及びプレッシャークッカーテスト(PCT)装置(条件:121℃、2.2気圧)において、所定時間(1、3、5時間)処理した後のものを288℃の溶融はんだ上に20秒間フロートし、処理時間が異なる3枚の硬化樹脂フィルムのそれぞれの外観を下記基準により目視で評価した。なお、表3及び表4においては、1時間の処理を行ったものをPCT−1hと表記し、3時間の処理を行ったものをPCT−3hと表記し、5時間の処理を行ったものをPCT−5hと表記する。
A:フィルム内部及びフィルムと銅箔間に膨れ又はミーズリングの発生が認められない。
B:フィルム内部及びフィルムと銅箔間に膨れ又はミーズリングの発生が見られる。
吸水率は、両面金属張硬化樹脂フィルムの両面の銅箔をエッチングし、50mm角に切断したものを試験片として、その常態及びプレッシャークッカーテスト(PCT)装置(条件:121℃、2.2気圧)中に所定時間(5時間)処理し、処理前後の質量を測定することで、処理前後の増加割合(重量%)を算出した。
熱膨張係数(板厚方向)は、両面金属張硬化樹脂フィルムの両面の銅箔をエッチングし、5mm角に切断したものを試験片として、熱機械分析装置TMA(TAインスツルメント社製、Q400)(温度範囲:30〜150℃、荷重:5g)により、IPC規格(IPC−TM−650 2.4.24)に準拠して測定した。
(実施例1)
図2に示す工程で内層回路基板11を作製した後、実施例1の樹脂フィルムを用いて図1に示す工程でミリ波アンテナ回路層を1層含む計7層構造のミリ波レーダー用プリント配線板を作製した。
実施例2の樹脂フィルムを用い、図3に示す工程でミリ波アンテナ回路層を2層含む計8層構造のミリ波レーダー用プリント配線板を作製した。
実施例2の樹脂フィルムに代えて、フッ素系樹脂材料を用い、従来の手法である図4で示す工程でミリ波アンテナ回路層を2層含む計8層構造のミリ波レーダー用プリント配線板を作製した。
Claims (10)
- 多層プリント配線板であって、
少なくとも2層の回路層を有する内層回路基板であって、ガラスエポキシ基板、金属基板、ポリエステル基板、ポリイミド基板、BTレジン基板、又は、熱硬化型ポリフェニレンエーテル基板である、内層回路基板と、
前記内層回路基板に積層された樹脂フィルムの硬化物を含む樹脂層と、
前記樹脂層の上に配置されるアンテナ回路層と、を備え、
前記アンテナ回路層がその上に配置される前記樹脂層は、熱硬化性樹脂組成物の硬化物を含み、前記樹脂層の前記樹脂フィルムが、マレイミド基、少なくとも2つのイミド結合を有する2価の基及び飽和又は不飽和の2価の炭化水素基を有する化合物を含有する樹脂組成物を前記熱硬化性樹脂組成物として含み、当該熱硬化性樹脂組成物の硬化物の10GHzでの比誘電率が3.6以下である多層プリント配線板において、
IPC−TM−650 2.4.24に準拠して測定される、前記樹脂フィルムを構成する前記熱硬化性樹脂組成物の硬化物の熱膨張係数は、10〜90ppm/℃である、
多層プリント配線板。 - IPC−TM−650 2.4.24に準拠して測定される、前記熱硬化性樹脂組成物の硬化物の熱膨張係数は、10〜40ppm/℃である、請求項1に記載の多層プリント配線板。
- 前記樹脂フィルムの厚さが1μm〜200μmである、請求項1又は2に記載の多層プリント配線板。
- 前記アンテナ回路層が前記樹脂層によって前記内層回路基板に直接接着されている、請求項1〜3の何れか一項に記載の多層プリント配線板。
- 前記アンテナ回路層の上に更に積層される樹脂フィルムの硬化物を含む別の樹脂層と、
前記別の樹脂層の上に配置される別のアンテナ回路層と、を更に備え、
前記別の樹脂層の前記樹脂フィルムは熱硬化性樹脂組成物を含んで構成され、当該熱硬化性樹脂組成物の硬化物の10GHzでの比誘電率が3.6以下である、請求項1〜4の何れか一項に記載の多層プリント配線板。 - 前記熱硬化性樹脂組成物の硬化物の10GHzでの比誘電率が1.0以上3.0以下である、請求項1〜5の何れか一項に記載の多層プリント配線板。
- 前記熱硬化性樹脂組成物の硬化物の誘電正接が0.004以下である、請求項1〜6の何れか一項に記載の多層プリント配線板。
- 前記樹脂層によって接着された前記アンテナ回路層の前記内層回路基板からの引き剥がし強さが0.6kN/m以上である、請求項1〜7の何れか一項に記載の多層プリント配線板。
- 多層プリント配線板の製造方法であって、
(a)内層回路基板に樹脂フィルムを積層する工程であって、前記内層回路基板がガラスエポキシ基板、金属基板、ポリエステル基板、ポリイミド基板、BTレジン基板、又は、熱硬化型ポリフェニレンエーテル基板である、積層する工程と、
(b)前記樹脂フィルムを加熱及び加圧により硬化して樹脂層を形成する工程と、
(c)前記樹脂層上にアンテナ回路層を形成する工程と、を備え、
前記アンテナ回路層がその上に形成される前記樹脂層の前記樹脂フィルムは、未硬化又は半硬化の熱硬化性樹脂組成物を含むフィルムであり、前記樹脂層の前記樹脂フィルムが、マレイミド基、少なくとも2つのイミド結合を有する2価の基及び飽和又は不飽和の2価の炭化水素基を有する化合物を含有する樹脂組成物を前記熱硬化性樹脂組成物として含み、当該熱硬化性樹脂組成物の硬化物の10GHzでの比誘電率が3.6以下である多層プリント配線板の製造方法において、
IPC−TM−650 2.4.24に準拠して測定される、前記樹脂フィルムを構成する前記熱硬化性樹脂組成物の硬化物の熱膨張係数が10〜90ppm/℃である、
多層プリント配線板の製造方法。 - 前記工程(a)において、前記樹脂フィルム上に更に金属箔を積層し、
前記工程(c)において、前記金属箔から前記アンテナ回路を形成する、
請求項9に記載の多層プリント配線板の製造方法。
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CN113717526A (zh) | 2021-11-30 |
TW201639902A (zh) | 2016-11-16 |
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TWI775544B (zh) | 2022-08-21 |
CN107207724B (zh) | 2021-09-21 |
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