JP5649378B2 - 表示装置 - Google Patents
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- JP5649378B2 JP5649378B2 JP2010196444A JP2010196444A JP5649378B2 JP 5649378 B2 JP5649378 B2 JP 5649378B2 JP 2010196444 A JP2010196444 A JP 2010196444A JP 2010196444 A JP2010196444 A JP 2010196444A JP 5649378 B2 JP5649378 B2 JP 5649378B2
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- oxide semiconductor
- electrode layer
- insulating layer
- oxide
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
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- H—ELECTRICITY
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Description
本実施の形態では、薄膜トランジスタ及びその作製方法の一形態を説明する。
本実施の形態では、ボトムコンタクト型の薄膜トランジスタ及びその作製工程として、実施の形態1と異なる例を図2を用いて説明する。図2は、図1と工程が一部異なる点以外は同じであるため、薄膜トランジスタの構成において、同じ部位を示す部分には同じ符号を用い、同部位の詳細な説明は省略する。
本実施の形態では、ボトムコンタクト型の薄膜トランジスタ及びその作製工程として、実施の形態1及び2と異なる例について図3を用いて説明する。なお、図3は、図1と工程が一部異なる点以外は同じであるため、薄膜トランジスタの構成において、同じ部位を示す部分には同じ符号を用い、同部位の詳細な説明は省略する。
本実施の形態では、実施の形態1、2及び3に示した薄膜トランジスタを用いて同一基板上にアクティブマトリクス型の液晶表示装置、または発光装置を作製する一例を示す。
実施の形態1、2及び3に示した薄膜トランジスタを用いて表示機能を有する半導体装置(表示装置ともいう)を作製することができる。また、薄膜トランジスタを有する駆動回路部及び画素部を同じ基板上に一体形成し、システムオンパネルを形成することができる。
本実施の形態では、発光表示パネル(発光パネルともいう)の外観及び断面について、図7を用いて説明する。図7(A)は、第1の基板上に形成された薄膜トランジスタ及び発光素子を、第2の基板との間にシール材によって封止した、パネルの平面図であり、図7(B)は、図7(A)のH−Iにおける断面図に相当する。
本明細書に開示する表示装置は、さまざまな電子機器(遊技機も含む)に用いることができる。電子機器としては、例えば、テレビジョン装置(テレビ、またはテレビジョン受信機ともいう)、コンピュータ用などのモニタ、デジタルカメラ、デジタルビデオカメラ等のカメラ、デジタルフォトフレーム、携帯電話機(携帯電話、携帯電話装置ともいう)、携帯型ゲーム機、携帯情報端末、音響再生装置、パチンコ機などの大型ゲーム機などが挙げられる。
402 ゲート絶縁層
404 酸化物半導体層
417 導電層
422 ソース配線層
426 酸化物絶縁層
427 絶縁層
428 保護絶縁層
430 容量配線層
431 容量電極層
440 薄膜トランジスタ
442 接続電極層
443 チャネル形成領域
449 接続電極層
450 薄膜トランジスタ
452 接続電極層
453 カラーフィルタ層
456 平坦化絶縁層
458 オーバーコート層
459 隔壁
460 薄膜トランジスタ
470 薄膜トランジスタ
480 薄膜トランジスタ
421a ゲート電極層
421b ゲート電極層
421c ゲート配線層
424a 高抵抗ソース領域
424b 高抵抗ドレイン領域
424c 領域
424d 領域
424e 領域
424f 領域
425a ソース電極層
425b ドレイン電極層
426a 酸化物絶縁層
426b 酸化物絶縁層
444c 領域
444d 領域
445a ソース電極層
445b ドレイン電極層
446a 酸化物導電層
446b 酸化物導電層
451a ゲート電極層
451b ゲート電極層
455a ソース電極層
455b ドレイン電極層
457a 画素電極層
457b 電極
1100 携帯電話機
1101 筐体
1102 表示部
1103 操作ボタン
1104 外部接続ポート
1105 スピーカ
1106 マイク
1800 筐体
1801 筐体
1802 表示パネル
1803 スピーカ
1804 マイクロフォン
1805 操作キー
1806 ポインティングデバイス
1807 カメラ
1808 外部接続端子
1810 キーボード
1811 外部メモリスロット
4001 基板
4002 画素部
4003 信号線駆動回路
4004 走査線駆動回路
4005 シール材
4006 基板
4008 液晶層
4010 薄膜トランジスタ
4011 薄膜トランジスタ
4013 液晶素子
4015 接続端子電極
4016 端子電極
4018 FPC
4019 異方性導電膜
4020 保護絶縁層
4021 絶縁層
4030 画素電極
4031 対向電極
4032 絶縁層
4040 導電層
4041 絶縁層
4501 基板
4502 画素部
4505 シール材
4506 基板
4507 充填材
4509 薄膜トランジスタ
4510 薄膜トランジスタ
4511 発光素子
4512 電界発光層
4513 電極
4515 接続端子電極
4516 端子電極
4517 電極
4519 異方性導電膜
4520 隔壁
4540 導電層
4542 酸化物絶縁層
4543 オーバーコート層
4544 絶縁層
4545 カラーフィルタ層
4546 絶縁層
4548 接続電極層
4503a 信号線駆動回路
4503b 信号線駆動回路
4504a 走査線駆動回路
4504b 走査線駆動回路
4518a FPC
9600 テレビジョン装置
9601 筐体
9603 表示部
9605 スタンド
9607 表示部
9609 操作キー
9610 リモコン操作機
9700 デジタルフォトフレーム
9701 筐体
9703 表示部
9881 筐体
9882 表示部
9883 表示部
9884 スピーカ部
9885 操作キー
9886 記録媒体挿入部
9887 接続端子
9888 センサ
9889 マイクロフォン
9890 LEDランプ
9891 筐体
9893 連結部
Claims (3)
- 第1のトランジスタと第2のトランジスタと、を有し、
前記第1のトランジスタは、
第1のゲート電極層と、
前記第1のゲート電極層上の第1の絶縁層と、
前記第1の絶縁層上の第1の酸化物半導体層と、
前記第1の酸化物半導体層上の第2の絶縁層と、
前記第2の絶縁層上の第1のソース電極層及び第1のドレイン電極層と、を有し、
前記第2のトランジスタは、
第2のゲート電極層と、
前記第2のゲート電極層上の前記第1の絶縁層と、
前記第1の絶縁層上の第2の酸化物半導体層と、
前記第2の酸化物半導体層上の前記第2の絶縁層と、
前記第2の絶縁層上の第2のソース電極層及び第2のドレイン電極層と、を有し、
前記第1のゲート電極層と前記第2のゲート電極層とは、同一面上に設けられ、
前記第1のソース電極層及び前記第1のドレイン電極層上、並びに前記第2のソース電極層及び前記第2のドレイン電極層上の第3の絶縁層を有し、
前記第3の絶縁層上に、前記第1のソース電極層又は前記第1のドレイン電極層と電気的に接続される第1の電極を有し、
前記第1の電極上に接するEL層を有し、
前記第3の絶縁層上に、前記第2のゲート電極層と重なる領域を有する導電層を有し、
前記第2の絶縁層は、前記第1の酸化物半導体層の周縁を覆う第1の領域と、前記第1の酸化物半導体層上面と接する第2の領域と、前記第2の酸化物半導体層の周縁を覆う第3の領域と、前記第2の酸化物半導体層上面と接する第4の領域と、を有し、
前記第1のソース電極層又は前記第1のドレイン電極層は、前記第2の絶縁層の前記第1の領域と前記第2の領域との間において、前記第1の酸化物半導体層と電気的に接続され、
前記第2のソース電極層又は前記第2のドレイン電極層は、前記第2の絶縁層の前記第3の領域と前記第4の領域との間において、前記第2の酸化物半導体層と電気的に接続されることを特徴とする表示装置。 - 第1のトランジスタと第2のトランジスタと容量と、を有し、
前記第1のトランジスタは、
第1のゲート電極層と、
前記第1のゲート電極層上の第1の絶縁層と、
前記第1の絶縁層上の第1の酸化物半導体層と、
前記第1の酸化物半導体層上の第2の絶縁層と、
前記第2の絶縁層上の第1のソース電極層及び第1のドレイン電極層と、を有し、
前記第2のトランジスタは、
第2のゲート電極層と、
前記第2のゲート電極層上の前記第1の絶縁層と、
前記第1の絶縁層上の第2の酸化物半導体層と、
前記第2の酸化物半導体層上の前記第2の絶縁層と、
前記第2の絶縁層上の第2のソース電極層及び第2のドレイン電極層と、を有し、
前記容量は、第1の導電膜と、第2の導電膜と、前記第1の導電膜と前記第2の導電膜とに挟まれた前記第1の絶縁層とを有し、
前記第1のゲート電極層と前記第2のゲート電極層と前記第1の導電膜とは、同一面上に設けられ、
前記第2の導電膜上、前記第1のソース電極層及び前記第1のドレイン電極層上、並びに前記第2のソース電極層及び前記第2のドレイン電極層上の第3の絶縁層を有し、
前記第3の絶縁層上に、前記第1のソース電極層又は前記第1のドレイン電極層と電気的に接続される第1の電極を有し、
前記第1の電極上に接するEL層を有し、
前記第3の絶縁層上に、前記第2のゲート電極層と重なる領域を有する導電層を有し、
前記第2の絶縁層は、前記第1の酸化物半導体層の周縁を覆う第1の領域と、前記第1の酸化物半導体層上面と接する第2の領域と、前記第2の酸化物半導体層の周縁を覆う第3の領域と、前記第2の酸化物半導体層上面と接する第4の領域と、を有し、
前記第1のソース電極層又は前記第1のドレイン電極層は、前記第2の絶縁層の前記第1の領域と前記第2の領域との間において、前記第1の酸化物半導体層と電気的に接続され、
前記第2のソース電極層又は前記第2のドレイン電極層は、前記第2の絶縁層の前記第3の領域と前記第4の領域との間において、前記第2の酸化物半導体層と電気的に接続され、
前記第1の電極は、前記容量と重なる領域を有することを特徴とする表示装置。 - 請求項1または請求項2において、
前記第1及び前記第2の酸化物半導体層は、インジウムを含むことを特徴とする表示装置。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9555026B2 (en) | 2013-02-06 | 2017-01-31 | Otsuka Pharmaceutical Co., Ltd. | Solid dispersion comprising amorphous cilostazol |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5663214B2 (ja) * | 2009-07-03 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
WO2011027701A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
WO2012035984A1 (en) * | 2010-09-15 | 2012-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
WO2012102281A1 (en) * | 2011-01-28 | 2012-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2012117936A1 (ja) * | 2011-03-01 | 2012-09-07 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
KR20120138074A (ko) * | 2011-06-14 | 2012-12-24 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 및 박막 트랜지스터 표시판과 이들을 제조하는 방법 |
WO2013042696A1 (en) * | 2011-09-23 | 2013-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR102388690B1 (ko) | 2012-05-31 | 2022-04-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR20130136063A (ko) | 2012-06-04 | 2013-12-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법 |
JP6134598B2 (ja) | 2012-08-02 | 2017-05-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR101991338B1 (ko) * | 2012-09-24 | 2019-06-20 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그 제조방법 |
KR102109166B1 (ko) * | 2013-01-15 | 2020-05-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이를 구비하는 표시 기판 |
KR102080065B1 (ko) | 2013-04-30 | 2020-04-07 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
WO2014192210A1 (ja) * | 2013-05-29 | 2014-12-04 | パナソニック株式会社 | 薄膜トランジスタ装置とその製造方法、および表示装置 |
JP6286988B2 (ja) * | 2013-09-26 | 2018-03-07 | 凸版印刷株式会社 | 薄膜トランジスタの製造方法 |
KR102085099B1 (ko) * | 2013-10-15 | 2020-03-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판, 표시 장치 및 표시 장치의 제조 방법 |
JP6506545B2 (ja) * | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI560882B (en) | 2014-01-17 | 2016-12-01 | E Ink Holdings Inc | Semiconductor structure |
JP6216668B2 (ja) * | 2014-03-17 | 2017-10-18 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
US9337030B2 (en) | 2014-03-26 | 2016-05-10 | Intermolecular, Inc. | Method to grow in-situ crystalline IGZO using co-sputtering targets |
JP6722980B2 (ja) * | 2014-05-09 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 表示装置および発光装置、並びに電子機器 |
KR20150146409A (ko) * | 2014-06-20 | 2015-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 표시 장치, 입출력 장치, 및 전자 기기 |
TWM493712U (zh) * | 2014-08-01 | 2015-01-11 | Superc Touch Corp | 具有遮罩功能的感應電極之生物辨識裝置 |
CN104253159B (zh) * | 2014-08-19 | 2017-06-13 | 京东方科技集团股份有限公司 | 薄膜晶体管及制备方法、阵列基板及制备方法和显示装置 |
JP6412791B2 (ja) | 2014-12-18 | 2018-10-24 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置 |
US9633710B2 (en) | 2015-01-23 | 2017-04-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for operating semiconductor device |
US10403646B2 (en) * | 2015-02-20 | 2019-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US11155754B2 (en) * | 2015-07-24 | 2021-10-26 | Sumitomo Chemical Company, Limited | Composition and display device |
CN105046243B (zh) * | 2015-08-25 | 2019-12-20 | 业成光电(深圳)有限公司 | 显示装置 |
WO2017051791A1 (ja) * | 2015-09-24 | 2017-03-30 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP6904730B2 (ja) | 2016-03-08 | 2021-07-21 | 株式会社半導体エネルギー研究所 | 撮像装置 |
JP2018129430A (ja) * | 2017-02-09 | 2018-08-16 | 株式会社ジャパンディスプレイ | 半導体装置 |
JP6844845B2 (ja) | 2017-05-31 | 2021-03-17 | 三国電子有限会社 | 表示装置 |
TWI648581B (zh) * | 2018-01-24 | 2019-01-21 | 友達光電股份有限公司 | 畫素結構以及可切換顯示模式的驅動方法 |
JP7246681B2 (ja) | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
JP7190740B2 (ja) | 2019-02-22 | 2022-12-16 | 三国電子有限会社 | エレクトロルミネセンス素子を有する表示装置 |
TWI702457B (zh) * | 2019-04-23 | 2020-08-21 | 元太科技工業股份有限公司 | 反射式主動元件陣列基板及其製作方法與反射式顯示裝置及其製作方法 |
US11379231B2 (en) | 2019-10-25 | 2022-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Data processing system and operation method of data processing system |
JP7444436B2 (ja) | 2020-02-05 | 2024-03-06 | 三国電子有限会社 | 液晶表示装置 |
JP7387475B2 (ja) | 2020-02-07 | 2023-11-28 | キオクシア株式会社 | 半導体装置及び半導体記憶装置 |
EP4191331A4 (en) | 2020-07-27 | 2023-12-27 | Sony Group Corporation | IMAGING APPARATUS, METHOD FOR ADJUSTING THE FOCUS POSITION AND PROGRAM |
US11335775B2 (en) | 2020-08-27 | 2022-05-17 | Micron Technology, Inc. | Integrated assemblies and methods of forming integrated assemblies |
CN112530978B (zh) * | 2020-12-01 | 2024-02-13 | 京东方科技集团股份有限公司 | 开关器件结构及其制备方法、薄膜晶体管膜层、显示面板 |
Family Cites Families (181)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
JPH01117068A (ja) * | 1987-10-29 | 1989-05-09 | Toshiba Corp | 薄膜半導体素子 |
US5334859A (en) * | 1991-09-05 | 1994-08-02 | Casio Computer Co., Ltd. | Thin-film transistor having source and drain electrodes insulated by an anodically oxidized film |
GB9200293D0 (en) | 1992-01-08 | 1992-02-26 | Wyeth John & Brother Ltd | Piperazine derivatives |
JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
DE69635107D1 (de) | 1995-08-03 | 2005-09-29 | Koninkl Philips Electronics Nv | Halbleiteranordnung mit einem transparenten schaltungselement |
JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
TW494266B (en) * | 1996-05-13 | 2002-07-11 | Nanya Technology Corp | Manufacturing method of thin film transistor liquid crystal display |
JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
TWI232595B (en) | 1999-06-04 | 2005-05-11 | Semiconductor Energy Lab | Electroluminescence display device and electronic device |
JP4730994B2 (ja) * | 1999-06-04 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 電気光学装置及びその作製方法並びに電子装置 |
TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
JP3961172B2 (ja) * | 1999-11-26 | 2007-08-22 | アルプス電気株式会社 | 酸化物透明導電膜と酸化物透明導電膜形成用ターゲットおよび先の酸化物透明導電膜を備えた基板の製造方法と電子機器および液晶表示装置 |
JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
JP2002175053A (ja) * | 2000-12-07 | 2002-06-21 | Sony Corp | アクティブマトリクス型表示装置およびこれを用いた携帯端末 |
KR100865542B1 (ko) | 2000-12-06 | 2008-10-27 | 소니 가부시끼 가이샤 | 표시장치용 타이밍 발생회로 및 이것을 탑재한 표시장치 |
JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
US6906344B2 (en) | 2001-05-24 | 2005-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with plural channels and corresponding plural overlapping electrodes |
JP2003051599A (ja) * | 2001-05-24 | 2003-02-21 | Semiconductor Energy Lab Co Ltd | 半導体装置及び電子機器 |
JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
WO2003040441A1 (en) | 2001-11-05 | 2003-05-15 | Japan Science And Technology Agency | Natural superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
CN1445821A (zh) | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
JP4069648B2 (ja) * | 2002-03-15 | 2008-04-02 | カシオ計算機株式会社 | 半導体装置および表示駆動装置 |
JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
TWI276696B (en) | 2002-04-02 | 2007-03-21 | Sumitomo Titanium Corp | Silicon monoxide sintered product and sputtering target comprising the same |
JP4364481B2 (ja) * | 2002-04-22 | 2009-11-18 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
KR100490322B1 (ko) | 2003-04-07 | 2005-05-17 | 삼성전자주식회사 | 유기전계발광 표시장치 |
JP4305192B2 (ja) | 2003-04-25 | 2009-07-29 | セイコーエプソン株式会社 | 薄膜半導体装置の製造方法、電気光学装置の製造方法 |
JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
TWI395996B (zh) | 2003-07-14 | 2013-05-11 | Semiconductor Energy Lab | 半導體裝置及顯示裝置 |
US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
JP2005085830A (ja) * | 2003-09-05 | 2005-03-31 | Sony Corp | 薄膜デバイスの製造方法および薄膜デバイス |
JP4401826B2 (ja) * | 2004-03-10 | 2010-01-20 | キヤノン株式会社 | 電界効果型トランジスタおよびその製造方法 |
CN102867855B (zh) | 2004-03-12 | 2015-07-15 | 独立行政法人科学技术振兴机构 | 薄膜晶体管及其制造方法 |
US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
CA2585071A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Field effect transistor employing an amorphous oxide |
US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
AU2005302963B2 (en) | 2004-11-10 | 2009-07-02 | Cannon Kabushiki Kaisha | Light-emitting device |
RU2369940C2 (ru) | 2004-11-10 | 2009-10-10 | Кэнон Кабусики Кайся | Аморфный оксид и полевой транзистор с его использованием |
US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
TWI562380B (en) | 2005-01-28 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
TWI481024B (zh) | 2005-01-28 | 2015-04-11 | Semiconductor Energy Lab | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
US7544967B2 (en) | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
JP4870403B2 (ja) * | 2005-09-02 | 2012-02-08 | 財団法人高知県産業振興センター | 薄膜トランジスタの製法 |
JP2007073558A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタの製法 |
JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
KR100729043B1 (ko) | 2005-09-14 | 2007-06-14 | 삼성에스디아이 주식회사 | 투명 박막 트랜지스터 및 그의 제조방법 |
JP5064747B2 (ja) * | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
EP1995787A3 (en) | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method therof |
JP5078246B2 (ja) * | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
CN101577293B (zh) | 2005-11-15 | 2012-09-19 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
JP5089139B2 (ja) * | 2005-11-15 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7745798B2 (en) | 2005-11-15 | 2010-06-29 | Fujifilm Corporation | Dual-phosphor flat panel radiation detector |
JP5099740B2 (ja) * | 2005-12-19 | 2012-12-19 | 財団法人高知県産業振興センター | 薄膜トランジスタ |
KR100732849B1 (ko) | 2005-12-21 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기 발광 표시장치 |
TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
JP2007212699A (ja) | 2006-02-09 | 2007-08-23 | Idemitsu Kosan Co Ltd | 反射型tft基板及び反射型tft基板の製造方法 |
US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
JP2006293385A (ja) * | 2006-05-24 | 2006-10-26 | Semiconductor Energy Lab Co Ltd | 表示装置 |
KR100801961B1 (ko) | 2006-05-26 | 2008-02-12 | 한국전자통신연구원 | 듀얼 게이트 유기트랜지스터를 이용한 인버터 |
JP5386069B2 (ja) | 2006-06-02 | 2014-01-15 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、液晶表示装置、表示モジュール及び電子機器 |
US8330492B2 (en) | 2006-06-02 | 2012-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device |
JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
JP5026019B2 (ja) | 2006-08-08 | 2012-09-12 | 三菱電機株式会社 | 薄膜トランジスタ基板、薄膜トランジスタの製造方法、及び表示装置 |
JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
US7651896B2 (en) | 2006-08-30 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP5216276B2 (ja) * | 2006-08-30 | 2013-06-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
JP2008112136A (ja) * | 2006-10-04 | 2008-05-15 | Mitsubishi Electric Corp | 表示装置及びその製造方法 |
US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
TWI354967B (en) | 2006-10-27 | 2011-12-21 | Chimei Innolux Corp | Liquid crystal display |
US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
JP2008140684A (ja) | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
JP5305630B2 (ja) * | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
KR101146574B1 (ko) | 2006-12-05 | 2012-05-16 | 캐논 가부시끼가이샤 | 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치 |
WO2008069255A1 (en) | 2006-12-05 | 2008-06-12 | Canon Kabushiki Kaisha | Method for manufacturing thin film transistor using oxide semiconductor and display apparatus |
JP2008151963A (ja) | 2006-12-15 | 2008-07-03 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の駆動方法 |
KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
WO2008105347A1 (en) | 2007-02-20 | 2008-09-04 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
JP5196870B2 (ja) | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
US8436349B2 (en) | 2007-02-20 | 2013-05-07 | Canon Kabushiki Kaisha | Thin-film transistor fabrication process and display device |
JP5121254B2 (ja) | 2007-02-28 | 2013-01-16 | キヤノン株式会社 | 薄膜トランジスタおよび表示装置 |
KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
WO2008126879A1 (en) | 2007-04-09 | 2008-10-23 | Canon Kabushiki Kaisha | Light-emitting apparatus and production method thereof |
JP5197058B2 (ja) | 2007-04-09 | 2013-05-15 | キヤノン株式会社 | 発光装置とその作製方法 |
JP2009031742A (ja) | 2007-04-10 | 2009-02-12 | Fujifilm Corp | 有機電界発光表示装置 |
US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
JP5215589B2 (ja) * | 2007-05-11 | 2013-06-19 | キヤノン株式会社 | 絶縁ゲート型トランジスタ及び表示装置 |
KR100873081B1 (ko) * | 2007-05-29 | 2008-12-09 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
JP5138276B2 (ja) * | 2007-05-31 | 2013-02-06 | 株式会社ジャパンディスプレイイースト | 表示装置の製造方法 |
JP5361249B2 (ja) * | 2007-05-31 | 2013-12-04 | キヤノン株式会社 | 酸化物半導体を用いた薄膜トランジスタの製造方法 |
KR100882909B1 (ko) | 2007-06-27 | 2009-02-10 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조 방법, 이를 포함하는유기전계발광표시장치, 및 그의 제조 방법 |
KR101333594B1 (ko) | 2007-08-30 | 2013-11-26 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
WO2009034953A1 (ja) * | 2007-09-10 | 2009-03-19 | Idemitsu Kosan Co., Ltd. | 薄膜トランジスタ |
JP5354999B2 (ja) * | 2007-09-26 | 2013-11-27 | キヤノン株式会社 | 電界効果型トランジスタの製造方法 |
JP4759598B2 (ja) * | 2007-09-28 | 2011-08-31 | キヤノン株式会社 | 薄膜トランジスタ、その製造方法及びそれを用いた表示装置 |
JP2009099847A (ja) | 2007-10-18 | 2009-05-07 | Canon Inc | 薄膜トランジスタとその製造方法及び表示装置 |
CN101821797A (zh) | 2007-10-19 | 2010-09-01 | 株式会社半导体能源研究所 | 显示器件及其驱动方法 |
JP5213422B2 (ja) * | 2007-12-04 | 2013-06-19 | キヤノン株式会社 | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
KR100936874B1 (ko) * | 2007-12-18 | 2010-01-14 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터의 제조 방법 및 박막 트랜지스터를구비하는 유기전계발광 표시 장치의 제조 방법 |
JP5291928B2 (ja) | 2007-12-26 | 2013-09-18 | 株式会社日立製作所 | 酸化物半導体装置およびその製造方法 |
JP5264197B2 (ja) | 2008-01-23 | 2013-08-14 | キヤノン株式会社 | 薄膜トランジスタ |
US8387569B2 (en) * | 2008-01-24 | 2013-03-05 | Kenneth S. Davis | Raptor perch apparatus and system |
US20090188445A1 (en) * | 2008-01-24 | 2009-07-30 | Joan Viehouser Jacobsen | Equine cast cover and protective device |
US8586979B2 (en) * | 2008-02-01 | 2013-11-19 | Samsung Electronics Co., Ltd. | Oxide semiconductor transistor and method of manufacturing the same |
JP5540517B2 (ja) | 2008-02-22 | 2014-07-02 | 凸版印刷株式会社 | 画像表示装置 |
JP2009265271A (ja) | 2008-04-23 | 2009-11-12 | Nippon Shokubai Co Ltd | 電気光学表示装置 |
US9041202B2 (en) | 2008-05-16 | 2015-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
KR100963104B1 (ko) | 2008-07-08 | 2010-06-14 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
CN104576748B (zh) | 2009-06-30 | 2019-03-15 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
KR101810699B1 (ko) | 2009-06-30 | 2018-01-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제작 방법 |
WO2011001879A1 (en) | 2009-06-30 | 2011-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
KR101291395B1 (ko) | 2009-06-30 | 2013-07-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제조 방법 |
KR20210131462A (ko) | 2009-07-10 | 2021-11-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액정 표시 장치의 제작 방법 |
KR102011614B1 (ko) | 2009-07-10 | 2019-08-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
JP5663231B2 (ja) | 2009-08-07 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 発光装置 |
TWI596741B (zh) | 2009-08-07 | 2017-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
KR101767035B1 (ko) * | 2009-10-01 | 2017-08-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
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US9555026B2 (en) | 2013-02-06 | 2017-01-31 | Otsuka Pharmaceutical Co., Ltd. | Solid dispersion comprising amorphous cilostazol |
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