JP5380376B2 - パワー半導体装置 - Google Patents

パワー半導体装置 Download PDF

Info

Publication number
JP5380376B2
JP5380376B2 JP2010140723A JP2010140723A JP5380376B2 JP 5380376 B2 JP5380376 B2 JP 5380376B2 JP 2010140723 A JP2010140723 A JP 2010140723A JP 2010140723 A JP2010140723 A JP 2010140723A JP 5380376 B2 JP5380376 B2 JP 5380376B2
Authority
JP
Japan
Prior art keywords
connection terminal
power semiconductor
terminal
power
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010140723A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012005322A5 (ja
JP2012005322A (ja
Inventor
時人 諏訪
裕二朗 金子
佑輔 ▲高▼木
伸一 藤野
隆弘 志村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2010140723A priority Critical patent/JP5380376B2/ja
Priority to EP19175045.4A priority patent/EP3562020B1/en
Priority to EP11169980.7A priority patent/EP2416483B1/en
Priority to US13/163,950 priority patent/US9179581B2/en
Priority to CN201110176325.1A priority patent/CN102332831B/zh
Publication of JP2012005322A publication Critical patent/JP2012005322A/ja
Publication of JP2012005322A5 publication Critical patent/JP2012005322A5/ja
Priority to JP2013205250A priority patent/JP5744999B2/ja
Application granted granted Critical
Publication of JP5380376B2 publication Critical patent/JP5380376B2/ja
Priority to JP2015089935A priority patent/JP5973026B2/ja
Priority to US14/856,819 priority patent/US10034401B2/en
Priority to JP2016138115A priority patent/JP6663810B2/ja
Priority to US16/017,827 priority patent/US10512181B2/en
Priority to JP2019011798A priority patent/JP6818785B6/ja
Priority to US16/671,872 priority patent/US11432419B2/en
Priority to JP2020211955A priority patent/JP7012813B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
JP2010140723A 2010-06-21 2010-06-21 パワー半導体装置 Active JP5380376B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2010140723A JP5380376B2 (ja) 2010-06-21 2010-06-21 パワー半導体装置
EP19175045.4A EP3562020B1 (en) 2010-06-21 2011-06-15 Power semiconductor device and power conversion device
EP11169980.7A EP2416483B1 (en) 2010-06-21 2011-06-15 Power semiconductor device and power conversion device
US13/163,950 US9179581B2 (en) 2010-06-21 2011-06-20 Power semiconductor device and power conversion device
CN201110176325.1A CN102332831B (zh) 2010-06-21 2011-06-21 功率半导体装置及使用其的电力转换装置
JP2013205250A JP5744999B2 (ja) 2010-06-21 2013-09-30 パワー半導体装置、パワー半導体装置の製造方法
JP2015089935A JP5973026B2 (ja) 2010-06-21 2015-04-27 パワー半導体装置
US14/856,819 US10034401B2 (en) 2010-06-21 2015-09-17 Power semiconductor device and power conversion device
JP2016138115A JP6663810B2 (ja) 2010-06-21 2016-07-13 パワー半導体装置及びそれを用いた電力変換装置
US16/017,827 US10512181B2 (en) 2010-06-21 2018-06-25 Power semiconductor device and power conversion device
JP2019011798A JP6818785B6 (ja) 2010-06-21 2019-01-28 パワー半導体装置及びそれを用いた電力変換装置
US16/671,872 US11432419B2 (en) 2010-06-21 2019-11-01 Power semiconductor device and power conversion device
JP2020211955A JP7012813B2 (ja) 2010-06-21 2020-12-22 パワー半導体装置及びそれを用いた電力変換装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010140723A JP5380376B2 (ja) 2010-06-21 2010-06-21 パワー半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013205250A Division JP5744999B2 (ja) 2010-06-21 2013-09-30 パワー半導体装置、パワー半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2012005322A JP2012005322A (ja) 2012-01-05
JP2012005322A5 JP2012005322A5 (ja) 2012-11-01
JP5380376B2 true JP5380376B2 (ja) 2014-01-08

Family

ID=44720535

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2010140723A Active JP5380376B2 (ja) 2010-06-21 2010-06-21 パワー半導体装置
JP2013205250A Active JP5744999B2 (ja) 2010-06-21 2013-09-30 パワー半導体装置、パワー半導体装置の製造方法
JP2015089935A Active JP5973026B2 (ja) 2010-06-21 2015-04-27 パワー半導体装置
JP2016138115A Active JP6663810B2 (ja) 2010-06-21 2016-07-13 パワー半導体装置及びそれを用いた電力変換装置
JP2019011798A Active JP6818785B6 (ja) 2010-06-21 2019-01-28 パワー半導体装置及びそれを用いた電力変換装置
JP2020211955A Active JP7012813B2 (ja) 2010-06-21 2020-12-22 パワー半導体装置及びそれを用いた電力変換装置

Family Applications After (5)

Application Number Title Priority Date Filing Date
JP2013205250A Active JP5744999B2 (ja) 2010-06-21 2013-09-30 パワー半導体装置、パワー半導体装置の製造方法
JP2015089935A Active JP5973026B2 (ja) 2010-06-21 2015-04-27 パワー半導体装置
JP2016138115A Active JP6663810B2 (ja) 2010-06-21 2016-07-13 パワー半導体装置及びそれを用いた電力変換装置
JP2019011798A Active JP6818785B6 (ja) 2010-06-21 2019-01-28 パワー半導体装置及びそれを用いた電力変換装置
JP2020211955A Active JP7012813B2 (ja) 2010-06-21 2020-12-22 パワー半導体装置及びそれを用いた電力変換装置

Country Status (4)

Country Link
US (4) US9179581B2 (https=)
EP (2) EP3562020B1 (https=)
JP (6) JP5380376B2 (https=)
CN (1) CN102332831B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156800A (ja) * 2010-06-21 2015-08-27 日立オートモティブシステムズ株式会社 パワー半導体装置及びそれを用いた電力変換装置

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4848187B2 (ja) * 2006-01-17 2011-12-28 日立オートモティブシステムズ株式会社 電力変換装置
US10321585B2 (en) 2008-07-29 2019-06-11 Hitachi, Ltd. Power conversion apparatus and electric vehicle
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP5557585B2 (ja) * 2010-04-26 2014-07-23 日立オートモティブシステムズ株式会社 パワーモジュール
JP5581131B2 (ja) * 2010-06-30 2014-08-27 日立オートモティブシステムズ株式会社 パワーモジュール及びそれを用いた電力変換装置
US9472405B2 (en) 2011-02-02 2016-10-18 Rohm Co., Ltd. Semiconductor power device and method for producing same
JP5506740B2 (ja) 2011-05-31 2014-05-28 日立オートモティブシステムズ株式会社 電力変換装置
JP5502805B2 (ja) 2011-06-08 2014-05-28 日立オートモティブシステムズ株式会社 パワーモジュールおよびそれを用いた電力変換装置
JP5520889B2 (ja) 2011-06-24 2014-06-11 日立オートモティブシステムズ株式会社 パワー半導体モジュール及びそれを用いた電力変換装置
JP5651552B2 (ja) * 2011-07-22 2015-01-14 日立オートモティブシステムズ株式会社 電力変換装置
JP5338932B2 (ja) * 2011-07-26 2013-11-13 株式会社デンソー 電力変換装置
JP5508357B2 (ja) 2011-07-29 2014-05-28 日立オートモティブシステムズ株式会社 電力変換装置
JP5567530B2 (ja) 2011-08-19 2014-08-06 日立オートモティブシステムズ株式会社 摩擦攪拌接合構造およびパワー半導体装置
CN103023279B (zh) * 2011-09-27 2015-05-13 株式会社京浜 半导体控制装置
US9048721B2 (en) * 2011-09-27 2015-06-02 Keihin Corporation Semiconductor device
WO2013099545A1 (ja) * 2011-12-26 2013-07-04 三菱電機株式会社 電力用半導体装置及びその製造方法
US9578790B2 (en) * 2012-03-19 2017-02-21 Mitsubishi Electric Corporation Power conversion apparatus
JP5835466B2 (ja) * 2012-03-28 2015-12-24 富士電機株式会社 半導体装置
JP5838918B2 (ja) * 2012-06-13 2016-01-06 株式会社デンソー 電力変換装置
JP5747869B2 (ja) * 2012-06-18 2015-07-15 株式会社デンソー 電力変換装置
JP5699995B2 (ja) * 2012-07-02 2015-04-15 株式会社デンソー 電力変換装置
JP2014027797A (ja) * 2012-07-27 2014-02-06 Yazaki Corp 電気接続箱
JP5941787B2 (ja) * 2012-08-09 2016-06-29 日立オートモティブシステムズ株式会社 パワーモジュールおよびパワーモジュールの製造方法
JP5879233B2 (ja) * 2012-08-31 2016-03-08 日立オートモティブシステムズ株式会社 パワー半導体モジュール
US9566851B2 (en) * 2012-09-19 2017-02-14 Nissan Motor Co., Ltd. Mounting structure of high voltage unit for electric vehicle
JP5851372B2 (ja) * 2012-09-28 2016-02-03 日立オートモティブシステムズ株式会社 電力変換装置
JP2014074678A (ja) * 2012-10-05 2014-04-24 Tokai Rika Co Ltd 電流検出装置
KR101890752B1 (ko) 2012-11-01 2018-08-22 삼성전자 주식회사 균일한 병렬 스위치 특성을 갖는 파워모듈용 기판 및 이를 포함하는 파워모듈
ITMO20120321A1 (it) * 2012-12-21 2014-06-22 Meta System Spa Procedimento per la realizzazione e l'assemblaggio di schede elettroniche e dispositivo elettronico cosi' ottenibile
US9730365B2 (en) * 2012-12-30 2017-08-08 General Electric Company Heat sink apparatus and method for power semiconductor device module
JP5701412B2 (ja) * 2013-02-21 2015-04-15 株式会社デンソー 電力変換装置
JP5932704B2 (ja) * 2013-04-04 2016-06-08 株式会社日本自動車部品総合研究所 電力変換装置
JP6364704B2 (ja) * 2013-04-30 2018-08-01 株式会社明電舎 車載用電力変換装置
WO2015053140A1 (ja) * 2013-10-07 2015-04-16 日立オートモティブシステムズ株式会社 電力変換装置
US9160825B2 (en) * 2013-10-30 2015-10-13 Taiyo Yuden Co., Ltd. Communication module
JP5505915B1 (ja) * 2013-10-30 2014-05-28 太陽誘電株式会社 通信モジュール
JP6102691B2 (ja) * 2013-11-15 2017-03-29 株式会社デンソー 電力変換装置
US20150138734A1 (en) * 2013-11-18 2015-05-21 Magna Electronics Inc. 360 degree direct cooled power module
JP6112003B2 (ja) * 2013-12-18 2017-04-12 トヨタ自動車株式会社 冷却機能付き電子装置
JP5991345B2 (ja) * 2013-12-26 2016-09-14 株式会社デンソー 電力変換装置
EP3101688B1 (en) * 2014-01-27 2019-10-02 Hitachi, Ltd. Power module and manufacturing method therefor
KR20150111422A (ko) * 2014-03-21 2015-10-06 엘에스산전 주식회사 자동차용 전장 부품 케이스
JP6256145B2 (ja) * 2014-03-26 2018-01-10 株式会社デンソー 半導体装置及びその製造方法
US10564193B2 (en) * 2014-04-30 2020-02-18 Onbalance Technologies Inc. Energy monitoring and analysis system
JP6245075B2 (ja) * 2014-05-28 2017-12-13 アイシン・エィ・ダブリュ株式会社 車両用駆動装置
JP6354392B2 (ja) * 2014-07-03 2018-07-11 株式会社デンソー 半導体装置
US9829516B1 (en) * 2014-09-23 2017-11-28 Amazon Technologies, Inc. Non-intrusive transient power detection system
WO2016071963A1 (ja) * 2014-11-04 2016-05-12 三菱電機株式会社 電動機駆動装置および空気調和機
JP6312852B2 (ja) * 2014-11-04 2018-04-18 三菱電機株式会社 電動機駆動装置および空気調和機
CN107112898B (zh) 2014-11-18 2019-06-21 通用电气全球采购有限责任公司 母线和功率电子装置及制造引线端连接器的方法
JP6382097B2 (ja) 2014-12-24 2018-08-29 株式会社 日立パワーデバイス 半導体パワーモジュールおよびそれを用いた電力変換装置
WO2016117014A1 (ja) * 2015-01-19 2016-07-28 三菱電機株式会社 コントローラ
EP3297020A4 (en) * 2015-05-13 2018-11-21 Mitsubishi Electric Corporation Semiconductor module
DE102015209279A1 (de) * 2015-05-21 2016-11-24 Robert Bosch Gmbh Elektrische Kontaktanordnung
WO2017005505A1 (en) * 2015-07-09 2017-01-12 Broadband Power Solutions S.A. High power density inverter (ii)
US9584061B1 (en) * 2015-09-17 2017-02-28 Toyota Motor Engineering & Manufacturing North America, Inc. Electric drive systems including smoothing capacitor cooling devices and systems
FR3043880B1 (fr) * 2015-11-13 2017-12-29 Valeo Systemes De Controle Moteur Boitier pour un equipement electrique
KR101629397B1 (ko) * 2015-12-03 2016-06-13 연세대학교 산학협력단 비대칭 모듈러 멀티레벨 컨버터 제어 장치 및 방법
DE112016005528T5 (de) 2015-12-04 2018-08-30 Rohm Co., Ltd. Leistungsmodulvorrichtung, Kühlstruktur und elektrisches Fahrzeug oder elektrisches Hybridfahrzeug
JP6544222B2 (ja) * 2015-12-11 2019-07-17 住友電気工業株式会社 半導体モジュール及び半導体モジュールユニット
USD811437S1 (en) * 2016-03-30 2018-02-27 Siemens Aktiengesellschaft Motor controller
JP6209644B1 (ja) * 2016-04-27 2017-10-04 カルソニックカンセイ株式会社 半導体装置の冷却装置
JP6575930B2 (ja) * 2016-06-02 2019-09-18 株式会社オートネットワーク技術研究所 基板ユニット
WO2017221456A1 (ja) * 2016-06-21 2017-12-28 三菱電機株式会社 電力変換装置
CN107851636B (zh) * 2016-07-15 2020-08-14 新电元工业株式会社 半导体模块
DE102016120778B4 (de) 2016-10-31 2024-01-25 Infineon Technologies Ag Baugruppe mit vertikal beabstandeten, teilweise verkapselten Kontaktstrukturen
JP6702155B2 (ja) * 2016-11-22 2020-05-27 トヨタ自動車株式会社 インバータの車載構造
JP6594916B2 (ja) * 2017-01-12 2019-10-23 日立オートモティブシステムズ株式会社 電流検出装置
WO2018131336A1 (ja) * 2017-01-13 2018-07-19 日立オートモティブシステムズ株式会社 電力変換装置
JP6750514B2 (ja) 2017-01-18 2020-09-02 株式会社デンソー 半導体装置
JP2019033628A (ja) * 2017-08-09 2019-02-28 株式会社デンソー 電力変換装置
JP6640165B2 (ja) * 2017-09-29 2020-02-05 三菱電機株式会社 電力変換装置
CN110164858B (zh) * 2018-02-16 2023-05-05 株式会社电装 半导体器件
KR102532313B1 (ko) * 2018-03-07 2023-05-15 현대자동차주식회사 차량용 하이브리드 전력제어장치
JP7046742B2 (ja) * 2018-07-05 2022-04-04 日立Astemo株式会社 パワーモジュール
JP7116178B2 (ja) * 2018-09-05 2022-08-09 日立Astemo株式会社 パワー半導体装置
KR102554431B1 (ko) 2018-09-05 2023-07-13 삼성전자주식회사 반도체 장치 및 반도체 장치 제조 방법
JP7100569B2 (ja) * 2018-11-22 2022-07-13 日立Astemo株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
FR3091138B1 (fr) * 2018-12-21 2022-07-22 Valeo Siemens Eautomotive France Sas Ensemble électrique comprenant des moyens de blindage électromagnétique intégrés
FR3091137B1 (fr) * 2018-12-21 2021-01-15 Valeo Siemens Eautomotive France Sas Procédé d’assemblage d’un équipement électrique, notamment d’un onduleur
US11855528B2 (en) * 2018-12-26 2023-12-26 Panasonic Intellectual Property Management Co., Ltd. Power conversion apparatus
EP3687059A1 (de) * 2019-01-22 2020-07-29 Siemens Aktiengesellschaft Betreiben von schaltelementen eines mehrpegelenergiewandlers
JP7120083B2 (ja) * 2019-03-06 2022-08-17 株式会社デンソー 半導体装置
JP7003964B2 (ja) * 2019-04-05 2022-01-21 株式会社デンソー 電力変換装置
JP7180540B2 (ja) * 2019-05-28 2022-11-30 株式会社デンソー 電力変換ユニット
US10667413B1 (en) * 2019-07-01 2020-05-26 Sumitomo Wiring Systems, Ltd. Power distribution box assembly with terminal tower
DE102019214789A1 (de) 2019-09-26 2021-04-01 Zf Friedrichshafen Ag Steuergerät zum Betreiben eines Elektroantriebs für ein Fahrzeug und Verfahren zum Herstellen eines deratigen Steuergeräts
DE102019216679A1 (de) * 2019-10-29 2021-04-29 Zf Friedrichshafen Ag Elektronikmodul für einen Elektroantrieb eines Fahrzeugs mit gleichlangen Strompfaden für einen Highside-Schalter und einen Lowside-Schalter
JP7294455B2 (ja) * 2019-12-19 2023-06-20 東芝三菱電機産業システム株式会社 電力変換装置およびその製造方法
JP7279847B2 (ja) * 2020-03-05 2023-05-23 富士電機株式会社 電力変換装置
GB2594451B (en) * 2020-04-22 2022-09-14 Delphi Automotive Systems Lux Vehicle inverter sealing arrangement
US11967899B2 (en) * 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
JP7444711B2 (ja) * 2020-06-24 2024-03-06 株式会社日立製作所 パワーモジュール及びこれを用いた電力変換装置
EP3951851A1 (de) * 2020-08-05 2022-02-09 Siemens Aktiengesellschaft Leistungshalbleitermodulsystem und herstellungsverfahren für ein leistungshalbleitermodulsystem
CN112706631B (zh) * 2020-12-21 2022-04-26 中车永济电机有限公司 一种高功率密度水冷双向充电机装置
GB2602338B (en) * 2020-12-23 2023-03-15 Yasa Ltd A Method and Apparatus for Cooling One or More Power Devices
KR20230174271A (ko) * 2021-05-27 2023-12-27 발레오 이오토모티브 저머니 게엠베하 냉각 구조체, 이러한 냉각 구조체를 포함하는 파워 모듈, 이러한 파워 모듈을 포함하는 인버터와 같은 전력 컨버터
EP4434086A4 (en) * 2021-12-17 2025-07-23 Vishay Siliconix Llc SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR A SEMICONDUCTOR DEVICE
CN115038312A (zh) * 2022-06-24 2022-09-09 中国第一汽车股份有限公司 电机控制器的功率封装模块
KR20240029354A (ko) * 2022-08-26 2024-03-05 현대자동차주식회사 버스바 어셈블리 냉각 장치 및 이를 구비한 전력 변환 모듈
JP7837268B2 (ja) * 2022-12-01 2026-03-30 Ａｓｔｅｍｏ株式会社 電子機器及び電力変換装置
FR3149373B1 (fr) 2023-06-01 2025-05-16 Valeo Eautomotive Germany Gmbh Structure de refroidissement, convertisseur de puissance électrique comprenant une telle structure de refroidissement et véhicule
JP7505632B1 (ja) 2023-09-20 2024-06-25 富士電機株式会社 電力変換装置

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202578A (en) * 1989-09-11 1993-04-13 Kabushiki Kaisha Toshiba Module-type semiconductor device of high power capacity
JP3129020B2 (ja) 1992-04-09 2001-01-29 富士電機株式会社 半導体装置
JP2912526B2 (ja) * 1993-07-05 1999-06-28 三菱電機株式会社 半導体パワーモジュールおよび複合基板
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
JPH1010508A (ja) * 1996-06-25 1998-01-16 Toshiba Corp 液晶セルの組立装置
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP3642012B2 (ja) * 2000-07-21 2005-04-27 株式会社日立製作所 半導体装置，電力変換装置及び自動車
JP2002315357A (ja) * 2001-04-16 2002-10-25 Hitachi Ltd インバータ装置
JP3910383B2 (ja) 2001-07-17 2007-04-25 株式会社日立製作所 パワーモジュールおよびインバータ
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP2004208411A (ja) 2002-12-25 2004-07-22 Denso Corp ハーフブリッジ回路用半導体モジュール
JP2004265931A (ja) * 2003-02-14 2004-09-24 Hitachi Ltd 半導体素子駆動用集積回路及び電力変換装置
US6933593B2 (en) * 2003-08-14 2005-08-23 International Rectifier Corporation Power module having a heat sink
EP2216891B1 (en) * 2003-08-21 2012-01-04 Denso Corporation Mounting structure ofa semiconductor device
US7358442B2 (en) * 2003-09-30 2008-04-15 Rockwell Automation Technologies, Inc. Bus structure for power switching circuits
US7301755B2 (en) * 2003-12-17 2007-11-27 Siemens Vdo Automotive Corporation Architecture for power modules such as power inverters
JP4566678B2 (ja) * 2004-10-04 2010-10-20 日立オートモティブシステムズ株式会社 パワーモジュール
JP4547231B2 (ja) * 2004-10-22 2010-09-22 日立オートモティブシステムズ株式会社 電力変換装置
JP2006120970A (ja) * 2004-10-25 2006-05-11 Toyota Motor Corp 半導体モジュールとその製造方法
JP4569766B2 (ja) * 2005-05-31 2010-10-27 トヨタ自動車株式会社 半導体装置
JP4581885B2 (ja) 2005-07-22 2010-11-17 株式会社デンソー 半導体装置
JP4979909B2 (ja) 2005-08-19 2012-07-18 株式会社日立製作所 電力変換装置
JP4603956B2 (ja) 2005-08-26 2010-12-22 日立オートモティブシステムズ株式会社 電力変換装置
CN101819965B (zh) * 2006-06-09 2013-01-16 本田技研工业株式会社 半导体装置
JP2008118067A (ja) * 2006-11-08 2008-05-22 Hitachi Ltd パワーモジュール及びモータ一体型コントロール装置
JP4909712B2 (ja) * 2006-11-13 2012-04-04 日立オートモティブシステムズ株式会社 電力変換装置
JP2008227131A (ja) 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP5227532B2 (ja) * 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 インバータ回路用の半導体モジュール
JP4452952B2 (ja) * 2007-06-20 2010-04-21 日立オートモティブシステムズ株式会社 電力変換装置
JP4567029B2 (ja) * 2007-06-22 2010-10-20 日立オートモティブシステムズ株式会社 電力変換装置
JP4452953B2 (ja) * 2007-08-09 2010-04-21 日立オートモティブシステムズ株式会社 電力変換装置
JP4580997B2 (ja) 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
JP5067267B2 (ja) * 2008-06-05 2012-11-07 三菱電機株式会社 樹脂封止型半導体装置とその製造方法
JP4666185B2 (ja) * 2008-06-26 2011-04-06 三菱電機株式会社 半導体装置
JP4988665B2 (ja) * 2008-08-06 2012-08-01 日立オートモティブシステムズ株式会社 半導体装置および半導体装置を用いた電力変換装置
JP5098951B2 (ja) * 2008-10-22 2012-12-12 富士電機株式会社 半導体装置
JP5002568B2 (ja) 2008-10-29 2012-08-15 日立オートモティブシステムズ株式会社 電力変換装置
JP5557441B2 (ja) * 2008-10-31 2014-07-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP2010140723A (ja) 2008-12-10 2010-06-24 Autonetworks Technologies Ltd 車輌用スイッチシステム
JP5380376B2 (ja) * 2010-06-21 2014-01-08 日立オートモティブシステムズ株式会社 パワー半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015156800A (ja) * 2010-06-21 2015-08-27 日立オートモティブシステムズ株式会社 パワー半導体装置及びそれを用いた電力変換装置
JP2019071784A (ja) * 2010-06-21 2019-05-09 日立オートモティブシステムズ株式会社 パワー半導体装置及びそれを用いた電力変換装置

Also Published As

Publication number Publication date
US20110310585A1 (en) 2011-12-22
US9179581B2 (en) 2015-11-03
EP2416483B1 (en) 2019-08-07
JP7012813B2 (ja) 2022-01-28
JP2014027877A (ja) 2014-02-06
JP2016182037A (ja) 2016-10-13
CN102332831B (zh) 2014-08-20
JP6818785B2 (ja) 2021-01-20
US11432419B2 (en) 2022-08-30
EP2416483A2 (en) 2012-02-08
JP5973026B2 (ja) 2016-08-17
JP5744999B2 (ja) 2015-07-08
US10034401B2 (en) 2018-07-24
EP2416483A3 (en) 2017-06-28
JP2015156800A (ja) 2015-08-27
US10512181B2 (en) 2019-12-17
EP3562020A1 (en) 2019-10-30
JP2012005322A (ja) 2012-01-05
US20160007492A1 (en) 2016-01-07
JP2021052587A (ja) 2021-04-01
JP6663810B2 (ja) 2020-03-13
US20200068735A1 (en) 2020-02-27
JP2019071784A (ja) 2019-05-09
US20180303001A1 (en) 2018-10-18
EP3562020B1 (en) 2022-04-20
JP6818785B6 (ja) 2021-03-17
CN102332831A (zh) 2012-01-25

Similar Documents

Publication Publication Date Title
JP7012813B2 (ja) パワー半導体装置及びそれを用いた電力変換装置
JP5563383B2 (ja) 電力変換装置
JP5592496B2 (ja) 電力変換装置
JP5422466B2 (ja) 電力変換装置
JP5455888B2 (ja) 車両用電力変換装置
JP5422468B2 (ja) 電力変換装置
JP5588895B2 (ja) パワー半導体モジュール，パワー半導体モジュールの製造方法及び電力変換装置
JP2013031330A (ja) 電力変換装置
JP2014113053A (ja) 電力変換装置
JP5857092B2 (ja) 電力変換装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120912

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120912

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130830

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130930

R150 Certificate of patent or registration of utility model

Ref document number: 5380376

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250