JP5557441B2 - 電力変換装置および電動車両 - Google Patents
電力変換装置および電動車両 Download PDFInfo
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- JP5557441B2 JP5557441B2 JP2008280682A JP2008280682A JP5557441B2 JP 5557441 B2 JP5557441 B2 JP 5557441B2 JP 2008280682 A JP2008280682 A JP 2008280682A JP 2008280682 A JP2008280682 A JP 2008280682A JP 5557441 B2 JP5557441 B2 JP 5557441B2
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Description
300A 両面電極モジュール
302 樹脂材料
304 CAN状放熱ベース
304A 外周湾曲部
305 フィン
314 直流正極配線板
316 直流負極配線板
320L,320U パワーモジュール制御端子
328 上アーム用IGBT
330 下アーム用IGBT
334 電気配線板
334A 絶縁層(絶縁シート)
334B 放熱面
334C 平面
337 金属接合材料
338 熱拡散板
Claims (12)
- 直流電力を交流電力に変換する半導体回路部と、前記半導体回路部を収納する有底の筒型形状のケースと、からなるパワーモジュールであって、
前記有底の筒型形状のケースは、それぞれの主面が対向する2枚のベース板を有し、
前記2枚のベース板は、連結部材を介して連結され、
前記連結部材は、前記ベース板の周囲を覆い、
前記連結部材の剛性は、前記ベース板の剛性より小さいことを特徴とするパワーモジュール。 - 直流電力を交流電力に変換する半導体回路部と、前記半導体回路部を収納する有底の筒型形状のケースと、からなるパワーモジュールであって、
前記有底の筒型形状のケースは、それぞれの主面が対向する2枚のベース板を有し、
前記2枚のベース板は、連結部材を介して連結され、
前記連結部材は、前記ベース板と同一材料であるとともに前記ベース板の周囲を覆い、
前記連結部材の厚さは、前記ベース板の厚さより小さいことを特徴とするパワーモジュール。 - 請求項1に記載されたパワーモジュールであって、
前記半導体回路部は、前記2枚のベース板の間に配置され、
前記連結部材は、前記2枚のベース板に接続され、かつ前記半導体回路部を収納するための収納領域を形成し、
前記連結部材は、前記2枚のベース板のうち一方のベース板の外周を囲む外周部を有し、
前記外周部の剛性は、前記ベース板の剛性よりも小さいことを特徴とするパワーモジュール。 - 請求項2に記載されたパワーモジュールであって、
前記半導体回路部は、前記2枚のベース板の間に配置され、
前記連結部材は、前記2枚のベース板に接続され、かつ前記半導体回路部を収納するための収納領域を形成し、
前記連結部材は、前記2枚のベース板のうち一方のベース板の外周を囲む外周部を有し、
前記外周部の厚さは、前記ベース板の厚さよりも小さいことを特徴とするパワーモジュール。 - 請求項1ないし4に記載されたいずれかのパワーモジュールであって、
前記2枚のベース板のうち一方のベース板と前記半導体回路部との間に介装される絶縁性部材と、を備え、
前記絶縁性部材は、前記一方のベース板に対して接着性を有するとともに前記半導体回路部に対して接着性を有するパワーモジュール。 - 請求項5に記載されたパワーモジュールであって、
前記絶縁性部材は、エポキシ樹脂に熱伝導性フィラーを混ぜ合わせた絶縁シートであるパワーモジュール。 - 請求項1ないし4に記載されたいずれかのパワーモジュールであって、
前記2枚のベース板の一方のベース板と前記半導体回路部との間に介装される第1絶縁性部材と、
前記2枚のベース板の他方のベース板と前記半導体回路部との間に介装される第2絶縁性部材と、を備え、
前記半導体回路部は、前記第1絶縁性部材及び前記第2絶縁性部材を介して前記2枚のベース板によって挟持されるパワーモジュール。 - 請求項1ないし7に記載されたいずれかのパワーモジュールであって、
前記2枚のベース板と前記連結部材は、一体に形成されるパワーモジュール。 - 請求項1ないし8に記載されたいずれかのパワーモジュールであって、
前記2枚のベース板は、前記半導体回路部が配置された側の面とは反対側の面にフィンを形成するパワーモジュール。 - 請求項1ないし9に記載されたいずれかのパワーモジュールであって、
前記半導体回路部は、電源の正極側に接続される第1半導体素子部と、前記電源の負極側に接続される第2半導体素子部と、を備え、
前記第1半導体素子部と前記第2半導体素子部との接続部から、複数相の交流電力のいずれか一相の交流電力が出力されるパワーモジュール。 - 請求項10に記載されたパワーモジュールであって、
前記第1半導体素子部と接続される第1配線部材と、
前記第2半導体素子部と接続される第2配線部材と、を備え、
前記第1配線部材及び前記第2配線部材は平板状に形成され、かつ少なくとも一部が積層状態となるように配置されるパワーモジュール。 - 請求項1ないし11に記載されたいずれかのパワーモジュールを用いた車両用電力変換装置であって、
冷却媒体を流すための流路を形成する冷却ジャケットを備え、
前記冷却ジャケットは、前記流路と繋がる複数の開口部を形成し、
前記パワーモジュールは複数設けられ、かつ当該複数のパワーモジュールのそれぞれは、前記複数の開口部のそれぞれを塞ぎ、
さらに前記パワーモジュールの前記2枚のベース板は、前記冷却媒体と直接接触する車両用電力変換装置。
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EP2844053A2 (en) | 2015-03-04 |
EP2346153A1 (en) | 2011-07-20 |
EP2346153B1 (en) | 2014-12-03 |
JP2010110143A (ja) | 2010-05-13 |
US20160149512A1 (en) | 2016-05-26 |
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US8946567B2 (en) | 2015-02-03 |
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