JP5520889B2 - パワー半導体モジュール及びそれを用いた電力変換装置 - Google Patents
パワー半導体モジュール及びそれを用いた電力変換装置 Download PDFInfo
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- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H01L2924/06—Polymers
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- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
前記中間接続導体は、前記ケースの前記収納空間において前記第1パッケージから延びるエミッタ側端子と前記第2パッケージから延びるコレクタ側端子とを接続される。
本実施形態に係る電力変換装置は、ハイブリッド用の自動車や純粋な電気自動車に適用可能であるが、代表例として、ハイブリッド自動車に適用した場合における制御構成と回路構成について、図1と図2を用いて説明する。
301,301′ パッケージ
304 冷却器
304A フランジ
304B 第1の放熱部
304C 第2の放熱部
305 薄肉部
306 挿入口
307B,307B′,307C,307C′ ベース部
308,308′ 接合面
309 フィン
317 バスバーコネクタ
333,333′ 絶縁部材
Claims (5)
- インバータ回路を構成する上アーム回路部を有する第1パッケージと、インバータ回路を構成する下アーム回路部を有する第2パッケージと、前記第1パッケージ及び前記第2パッケージを収納するための収納空間及び当該収納空間と繋がる開口を形成する金属製のケースと、前記上アーム回路部と前記下アーム回路部とを接続する中間接続導体と、を備え、
前記ケースは、第1放熱部と、前記収納空間を介して当該第1放熱部と対向する第2放熱部とを含んで構成され、
前記第1パッケージは、第1半導体チップと、当該第1半導体チップを挟み込む第1導体板及び第2導体板と、当該第1導体板と接続された第1コレクタ側端子と、当該第2導体板と接続された第1エミッタ側端子と、当該第1導体板及び当該第2導体板の一部と前記第1半導体チップを封止する第1封止材と、を有し、
前記第2パッケージは、第2半導体チップと、当該第2半導体チップを挟み込む第3導体板及び第4導体板と、当該第3導体板と接続されたコレクタ側端子と、当該第4導体板と接続された第2エミッタ側端子と、第3導体板及び第4導体板の一部と前記第2半導体チップを封止する第2封止材とを有し、
さらに前記第1パッケージは、当該第1パッケージと前記第2パッケージとの配置方向が前記第1放熱部と前記第2放熱部とのそれぞれの対向面と平行になるように配置され、
前記第1コレクタ側端子及び前記第2エミッタ側端子は前記ケースの前記開口から当該ケースの外部に突出しており、
前記中間接続導体は、前記ケースの前記収納空間において前記第1エミッタ側端子と前記第2コレクタ側端子とを接続するパワー半導体モジュール。 - 請求項1に記載されたパワー半導体モジュールであって、
前記第1放熱部又は前記第2放熱部の一方は、前記第1パッケージと対向する第1部分を囲むとともに当該第1部分よりも薄く形成された第1薄肉部と、前記第2パッケージと対向する第2部分を囲むとともに当該第2部分よりも薄く形成された第2薄肉部と、を含んで構成されるパワー半導体モジュール。 - 請求項1または2に記載されたいずれかのパワー半導体モジュールであって、
前記第1コレクタ側端子と接続される正極側バスバーと、前記第2エミッタ側端子と接続されるとともに当該正極側バスバーと絶縁部材を介して対向する部分を有する負極側バスバーと、を有するバスバーコネクタを備えるパワー半導体モジュール。 - 請求項1ないし3に記載されたいずれかのパワー半導体モジュールであって、
前記中間接続導体は、前記第1パッケージと前記第2パッケージを介して、前記ケースの前記開口とは反対側に配置されるパワー半導体モジュール。 - 請求項1ないし3に記載されたいずれかのパワー半導体モジュールを備える電力変換装置であって、
冷却冷媒を流すための流路を形成する冷却ジャケットを備え、
前記ケースは、前記第1放熱部及び前記第2放熱部が前記流路内に配置されるように前記冷却ジャケットに固定され、
前記第1放熱部及び前記第2放熱部は、冷却冷媒と直接接触する電力変換装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011140059A JP5520889B2 (ja) | 2011-06-24 | 2011-06-24 | パワー半導体モジュール及びそれを用いた電力変換装置 |
EP12802723.2A EP2725699B1 (en) | 2011-06-24 | 2012-06-15 | Power semiconductor module and electric power conversion device using same |
CN201280031133.4A CN103650318B (zh) | 2011-06-24 | 2012-06-15 | 功率半导体模块及使用它的电力转换装置 |
US14/126,955 US9433134B2 (en) | 2011-06-24 | 2012-06-15 | Power semiconductor module and power converter using the same |
PCT/JP2012/065345 WO2012176706A1 (ja) | 2011-06-24 | 2012-06-15 | パワー半導体モジュール及びそれを用いた電力変換装置 |
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JP2011140059A JP5520889B2 (ja) | 2011-06-24 | 2011-06-24 | パワー半導体モジュール及びそれを用いた電力変換装置 |
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JP2013009501A JP2013009501A (ja) | 2013-01-10 |
JP5520889B2 true JP5520889B2 (ja) | 2014-06-11 |
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US (1) | US9433134B2 (ja) |
EP (1) | EP2725699B1 (ja) |
JP (1) | JP5520889B2 (ja) |
CN (1) | CN103650318B (ja) |
WO (1) | WO2012176706A1 (ja) |
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JP5581131B2 (ja) * | 2010-06-30 | 2014-08-27 | 日立オートモティブシステムズ株式会社 | パワーモジュール及びそれを用いた電力変換装置 |
JP5520889B2 (ja) * | 2011-06-24 | 2014-06-11 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュール及びそれを用いた電力変換装置 |
JP5542765B2 (ja) * | 2011-09-26 | 2014-07-09 | 日立オートモティブシステムズ株式会社 | パワーモジュール |
JP5879292B2 (ja) * | 2013-03-28 | 2016-03-08 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP6186183B2 (ja) * | 2013-06-13 | 2017-08-23 | 株式会社日立製作所 | 電力変換装置 |
JP2015050257A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 車両用電力変換装置及び鉄道車両 |
US9099452B2 (en) * | 2013-11-08 | 2015-08-04 | International Rectifier Corporation | Semiconductor package with low profile switch node integrated heat spreader |
US10080313B2 (en) * | 2014-01-27 | 2018-09-18 | Hitachi, Ltd. | Power module and method for manufacturing the same |
DE102014201631B4 (de) * | 2014-01-30 | 2022-02-03 | Robert Bosch Gmbh | Anordnung zum Kontaktieren elektrischer Komponenten |
JP6200871B2 (ja) * | 2014-09-09 | 2017-09-20 | 日立オートモティブシステムズ株式会社 | パワーモジュール及び電力変換装置 |
DE112015004284T5 (de) * | 2014-11-13 | 2017-06-01 | Hitachi Automotive Systems, Ltd. | Leistungsumsetzer |
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