JP6439750B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6439750B2 JP6439750B2 JP2016101245A JP2016101245A JP6439750B2 JP 6439750 B2 JP6439750 B2 JP 6439750B2 JP 2016101245 A JP2016101245 A JP 2016101245A JP 2016101245 A JP2016101245 A JP 2016101245A JP 6439750 B2 JP6439750 B2 JP 6439750B2
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- Prior art keywords
- upper arm
- lower arm
- pair
- heat sink
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Description
一対の放熱板としての、一対の上アーム板(14H,18H)、及び、一対の下アーム板(14L,18L)と、
スイッチング素子が形成されており、一面及び一面と板厚方向に反対の裏面にそれぞれ形成された主電極(13a,13b)と、裏面において主電極とは別の位置に形成された信号用のパッド(13c)と、を有し、一面の主電極が一対の放熱板の一方に電気的に接続され、裏面の主電極が放熱板の他方に電気的に接続された半導体チップとしての、板厚方向に直交する第1方向に並んで配置されるとともに、一対の上アーム板の間において互いに並列接続され、一対の上アーム板とともに上アーム回路(10H)を構成する複数の上アームチップ(120H,121H)、及び、板厚方向に直交する第2方向に並んで配置されるとともに、一対の下アーム板の間において互いに並列接続され、一対の下アーム板とともに下アーム回路(10L)を構成する、上アームチップと同数の下アームチップ(120L,121L)と、
対応する半導体チップのパッドに、電気的に接続された信号端子(24)と、
上アームチップの低電位側に配置された上アーム板と、下アームチップの高電位側に配置された下アーム板とを電気的に接続する継手部(20)と、
一対の上アーム板の少なくとも一部、一対の下アーム板の少なくとも一部、半導体チップ、継手部、及び信号端子の一部を一体的に封止する封止樹脂体(11)と、
を備え、
各上アームチップのパッドが、第1方向及び板厚方向の両方向に直交する方向において、裏面の主電極に対して互いに同じ側に形成されるとともに、各上アームチップに対応する信号端子が、互いに同じ方向に延設され、
各下アームチップのパッドが、第2方向及び板厚方向の両方向に直交する方向において、裏面の主電極に対して互いに同じ側に形成されるとともに、各下アームチップに対応する信号端子が、互いに同じ方向に延設され、
継手部は、上アーム板における第1方向の一端であって下アーム板に近い側の端部に連なるとともに、下アーム板における第2方向の一端であって上アーム板に近い側の端部に連なり、
一対の上アーム板において複数の上アームチップを並列接続している並列接続部(140H,180H)のインダクタンス、及び、一対の下アーム板において複数の下アームチップを並列接続している並列接続部(140L,180L)のインダクタンスのそれぞれが、継手部を含み、上アーム回路と下アーム回路とを直列接続する直列接続部(26)のインダクタンスよりも小さい。
先ず、図1に基づき、半導体装置が適用される電力変換装置の一例について説明する。
(数1)L=0.0002×l×[ln{2l/(w+t)}+1/2+0.22(w+t)/l]
このように、インダクタンスLと長さlとの間には、概ね比例関係が成立する。インダクタンスLと1/wとの間には、概ね比例関係が成立する。インダクタンスLと1/tとの間には、概ね比例関係が成立する。したがって、上記した長さA1<A2、幅B1>B2、厚みC1>C2の少なくともひとつの関係を満たすことで、L1<L2の関係を成立させればよい。
本実施形態は、先行実施形態を参照できる。このため、先行実施形態に示した半導体装置10と共通する部分についての説明は省略する。
本実施形態は、先行実施形態を参照できる。このため、先行実施形態に示した半導体装置10と共通する部分についての説明は省略する。
Claims (9)
- 一対の放熱板としての、一対の上アーム板(14H,18H)、及び、一対の下アーム板(14L,18L)と、
スイッチング素子が形成されており、一面及び前記一面と板厚方向に反対の裏面にそれぞれ形成された主電極(13a,13b)と、前記裏面において前記主電極とは別の位置に形成された信号用のパッド(13c)と、を有し、前記一面の主電極が一対の前記放熱板の一方に電気的に接続され、前記裏面の主電極が前記放熱板の他方に電気的に接続された半導体チップとしての、前記板厚方向に直交する第1方向に並んで配置されるとともに、一対の前記上アーム板の間において互いに並列接続され、一対の前記上アーム板とともに上アーム回路(10H)を構成する複数の上アームチップ(120H,121H)、及び、前記板厚方向に直交する第2方向に並んで配置されるとともに、一対の前記下アーム板の間において互いに並列接続され、一対の前記下アーム板とともに下アーム回路(10L)を構成する、前記上アームチップと同数の下アームチップ(120L,121L)と、
対応する前記半導体チップのパッドに、電気的に接続された信号端子(24)と、
前記上アームチップの低電位側に配置された前記上アーム板と、前記下アームチップの高電位側に配置された前記下アーム板とを電気的に接続する継手部(20)と、
一対の前記上アーム板の少なくとも一部、一対の前記下アーム板の少なくとも一部、前記半導体チップ、前記継手部、及び前記信号端子の一部を一体的に封止する封止樹脂体(11)と、
を備え、
各上アームチップのパッドが、前記第1方向及び前記板厚方向の両方向に直交する方向において、前記裏面の主電極に対して互いに同じ側に形成されるとともに、各上アームチップに対応する前記信号端子が、互いに同じ方向に延設され、
各下アームチップのパッドが、前記第2方向及び前記板厚方向の両方向に直交する方向において、前記裏面の主電極に対して互いに同じ側に形成されるとともに、各下アームチップに対応する前記信号端子が、互いに同じ方向に延設され、
前記継手部は、前記上アーム板における前記第1方向の一端であって前記下アーム板に近い側の端部に連なるとともに、前記下アーム板における前記第2方向の一端であって前記上アーム板に近い側の端部に連なり、
一対の前記上アーム板において複数の前記上アームチップを並列接続している並列接続部(140H,180H)のインダクタンス、及び、一対の前記下アーム板において複数の前記下アームチップを並列接続している並列接続部(140L,180L)のインダクタンスのそれぞれが、前記継手部を含み、前記上アーム回路と前記下アーム回路とを直列接続する直列接続部(26)のインダクタンスよりも小さい半導体装置。 - 前記第1方向と前記第2方向が同じ方向であり、
すべての前記信号端子が、互いに同じ方向に延設されている請求項1に記載の半導体装置。 - 並列接続された複数の前記上アームチップと、並列接続された複数の前記下アームチップとが、一列に配置されている請求項2に記載の半導体装置。
- 前記上アーム板の並列接続部における前記第1方向の長さ、及び、前記下アーム板の並列接続部における前記第2方向の長さのそれぞれが、電流経路である前記直列接続部の経路長よりも短い請求項1〜3いずれか1項に記載の半導体装置。
- 前記上アーム板の並列接続部における前記第1方向の長さ、及び、前記下アーム板の並列接続部における前記第2方向の長さのそれぞれが、前記継手部の延設長さよりも短い請求項4に記載の半導体装置。
- 前記上アーム板の並列接続部における前記第1方向に直交する幅、及び、前記下アーム板の並列接続部における前記第2方向に直交する幅のそれぞれが、低電位側の前記上アーム板と高電位側の前記下アーム板とをつなぐ前記継手部の延設方向に直交する幅よりも広い請求項1〜5いずれか1項に記載の半導体装置。
- 前記上アーム板の並列接続部及び前記下アーム板の並列接続部のそれぞれの厚みが、前記継手部における電流の流れ方向に直交する厚みよりも厚い請求項1〜6いずれか1項に記載の半導体装置。
- 前記継手部の表面が、凹凸形状となっている請求項1〜7いずれか1項に記載の半導体装置。
- 前記継手部は、貫通孔(204)を有する請求項1〜8いずれか1項に記載の半導体装置。
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US16/088,093 US10535577B2 (en) | 2016-05-20 | 2017-04-27 | Semiconductor device |
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WO2017199723A1 (ja) | 2017-11-23 |
CN109417066A (zh) | 2019-03-01 |
US20190088568A1 (en) | 2019-03-21 |
JP2017208498A (ja) | 2017-11-24 |
US10535577B2 (en) | 2020-01-14 |
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