JP5591396B2 - 半導体モジュール、および半導体モジュールの製造方法 - Google Patents
半導体モジュール、および半導体モジュールの製造方法 Download PDFInfo
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- JP5591396B2 JP5591396B2 JP2013503247A JP2013503247A JP5591396B2 JP 5591396 B2 JP5591396 B2 JP 5591396B2 JP 2013503247 A JP2013503247 A JP 2013503247A JP 2013503247 A JP2013503247 A JP 2013503247A JP 5591396 B2 JP5591396 B2 JP 5591396B2
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Description
本発明の第2の態様によると、第1の態様の半導体モジュールにおいて、導体板は、半導体素子側に屈曲するように形成されて、並列配置された他の半導体素子ブロックの導体板と接続される連結部を備えるようにしても良い。
本発明の第3の態様によると、第1または2の態様の半導体モジュールにおいて、導体板は、絶縁性シート部材と接する面の端部に傾斜面または段差面が形成されており、樹脂組成部材が傾斜面または段差面と絶縁性シート部材との隙間に充填されている。
本発明の第4の態様によると、第1乃至3のいずれか一の態様の半導体モジュールにおいて、絶縁性シート部材の熱伝導率が樹脂組成部材の熱伝導率よりも高いのが好ましい。
本発明の第5の態様によると、第1乃至4のいずれか一の態様の半導体モジュールにおいて、半導体素子ブロック、絶縁性シート部材およびケース内周面と樹脂組成部材との間に、ポリアミド樹脂層を形成するのが好ましい。
本発明の第6の態様によると、第1乃至5のいずれか一の態様の半導体モジュールにおいて、収納空間における複数の半導体素子ブロックの位置を位置決めする、位置決め部を備えるのが好ましい。
本発明の第7の態様によると、第1の態様の半導体モジュールを製造するための製造方法であって、半導体素子ブロックに設けられた導体板に絶縁性シート部材を固着し、絶縁性シート部材が固着された複数の半導体素子ブロックを、絶縁性シート部材が対応する分離放熱部と対向するように収納空間に並列に配置し、分離放熱部のそれぞれをケース内側方向に押圧して支持壁を変形して、該分離放熱部を絶縁性シート部材に密着接合し、収納空間に樹脂組成部材を充填して複数の半導体素子ブロックを封止するものである。
本発明の第8の態様によると、第7の態様の半導体モジュールの製造方法において、支持壁を変形して、該分離放熱部を絶縁性シート部材に密着接合した後に、収納空間に収納された複数の半導体素子ブロックおよびケースの内周面にポリアミド樹脂を付着させて、ポリアミド樹脂層を形成し、その後、収納空間に樹脂組成部材を充填して複数の半導体素子ブロックを封止するものである。
図13は、図4に示したパワーモジュール300aの外観を示す斜視図である。図14は、図13のA−A断面図である。図15は、図13のB−B断面図である。以下では、パワーモジュール300aを例に説明するが、他のパワーモジュール300b〜300c,301a〜301cについてもパワーモジュール300aと同様の構造を有している。パワーモジュール300aは、図16に示した一組の上下アーム直列回路150を含む半導体素子ユニットを、放熱器としての機能を有するモジュールケース304に収納したものである。
図23は、上述した実施形態のリードフレームと絶縁シートと封止樹脂の構造に関する変形例を示したものである。図23は上述した図14と同様の断面図であるが、図23では、中間電極329の部分を通る部分の断面を示したものである。図23に示すように、中間電極329は、上アーム301aを構成するリードフレーム316と下アーム301bを構成するリードフレーム318の連結部に相当する。この領域には発熱源であるチップ(半導体素子)が搭載されていないため、高放熱な絶縁シート333で接着する必要はなく、封止樹脂334で絶縁を確保すればよい。
リードフレーム315,316,318,319の端部では、電界集中が生じやすく、その他の領域に比較して高い絶縁特性が必要である。変形例2では、そのような電界集中を抑制する構造について説明する。図24に示す例では、リードフレーム315,316,318,319の端部に加工(例えば、プレスやテーパーや曲げや切削加工など)を施すことにより、リードフレーム端部とケース304の内周面との距離を増加させ、沿面距離の増加による絶縁信頼性の向上を図るようにした。
本実施の形態では、ケース304は水密構造となっているため、液状の表面処理を行うことが容易である。例えば、ヤング率の低いポリアミド樹脂を塗布することで、リードフレーム内面や側面、チップや金属接合部160との密着強度を向上できる。この際、ポリアミド樹脂がリードフレームの絶縁樹脂の接着面に付着すると、熱抵抗が大幅に増加するという問題があるが、本実施の形態では、絶縁シート333を接着した後にポリアミド樹脂335を注入しケース304を振動させることで、上記問題は解決し容易に処理することが可能となった。
Claims (8)
- 枠部と該枠部を挟むように対向配置された一対の壁部とで形成される収納空間を有し、前記一対の壁部が放熱部と該放熱部を前記枠部に支持する支持壁とで構成されているケースと、
前記壁部に面して前記収納空間に並列して複数配置され、半導体素子の表裏両面に形成された電極面のそれぞれに導体板が接合されている半導体素子ブロックと、
前記それぞれの導体板と前記壁部の内周面との間にそれぞれが介在されて両者を絶縁する複数枚の絶縁性シート部材と、
前記収納空間に充填されて、前記複数の半導体素子ブロックを封止する樹脂組成部材と、を備え、
前記壁部の少なくとも一方に設けられた放熱部は、前記複数の半導体素子ブロックの各々に対向配置する複数の分離放熱部を含み、
前記複数の分離放熱部の周囲は前記支持壁によって囲まれ、 前記支持壁が、前記枠部から前記分離放熱部にかけてケース内側に窪むように変形して前記複数枚の絶縁性シート部材の各々が前記複数の導体板および前記複数の分離放熱部とそれぞれ密着接合している半導体モジュール。 - 請求項1に記載した半導体モジュールにおいて、
前記導体板は、半導体素子側に屈曲するように形成されて、並列配置された他の前記半導体素子ブロックの導体板と接続される連結部を備えている半導体モジュール。 - 請求項1または2に記載した半導体モジュールにおいて、
前記導体板は、前記絶縁性シート部材と接する面の端部に傾斜面または段差面が形成されており、
前記樹脂組成部材が前記傾斜面または段差面と前記絶縁性シート部材との隙間に充填されている半導体モジュール。 - 請求項1乃至3のいずれか一項に記載した半導体モジュールにおいて、
前記絶縁性シート部材の熱伝導率が前記樹脂組成部材の熱伝導率よりも高い半導体モジュール。 - 請求項1乃至4のいずれか一項に記載した半導体モジュールにおいて、
前記半導体素子ブロック、前記絶縁性シート部材およびケース内周面と前記樹脂組成部材との間に、ポリアミド樹脂層を形成した半導体モジュール。 - 請求項1乃至5のいずれか一項に記載した半導体モジュールにおいて、
前記収納空間における前記複数の半導体素子ブロックの位置を位置決めする、位置決め部を備えた半導体モジュール。 - 請求項1に記載の半導体モジュールを製造するための製造方法であって、
前記半導体素子ブロックに設けられた導体板に前記絶縁性シート部材を固着し、
前記絶縁性シート部材が固着された複数の前記半導体素子ブロックを、前記絶縁性シート部材が対応する前記分離放熱部と対向するように前記収納空間に並列に配置し、
前記分離放熱部のそれぞれをケース内側方向に押圧して前記支持壁を変形して、該分離放熱部を前記絶縁性シート部材に密着接合し、
前記収納空間に前記樹脂組成部材を充填して前記複数の半導体素子ブロックを封止する半導体モジュールの製造方法。 - 請求項7に記載の半導体モジュールの製造方法において、
前記支持壁を変形して、該分離放熱部を前記絶縁性シート部材に密着接合した後に、
前記収納空間に収納された前記複数の半導体素子ブロックおよび前記ケースの内周面にポリアミド樹脂を付着させて、ポリアミド樹脂層を形成し、
その後、前記収納空間に前記樹脂組成部材を充填して前記複数の半導体素子ブロックを封止する半導体モジュールの製造方法。
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