JP2010110143A - 電力変換装置および電動車両 - Google Patents
電力変換装置および電動車両 Download PDFInfo
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- JP2010110143A JP2010110143A JP2008280682A JP2008280682A JP2010110143A JP 2010110143 A JP2010110143 A JP 2010110143A JP 2008280682 A JP2008280682 A JP 2008280682A JP 2008280682 A JP2008280682 A JP 2008280682A JP 2010110143 A JP2010110143 A JP 2010110143A
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- power
- power module
- semiconductor circuit
- module
- semiconductor
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims abstract description 136
- 238000010292 electrical insulation Methods 0.000 claims abstract description 13
- 239000003990 capacitor Substances 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 38
- 239000002826 coolant Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 8
- 238000009499 grossing Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 238000001816 cooling Methods 0.000 description 81
- 239000000498 cooling water Substances 0.000 description 76
- 230000005855 radiation Effects 0.000 description 70
- 239000004020 conductor Substances 0.000 description 58
- 230000017525 heat dissipation Effects 0.000 description 52
- 239000010410 layer Substances 0.000 description 38
- 238000003466 welding Methods 0.000 description 26
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 230000002093 peripheral effect Effects 0.000 description 16
- 238000012546 transfer Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 238000009429 electrical wiring Methods 0.000 description 9
- 239000011810 insulating material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000010248 power generation Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000962 AlSiC Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
- B60L50/16—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines with provision for separate direct mechanical propulsion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
- B60L50/51—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells characterised by AC-motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
- B60L50/60—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells using power supplied by batteries
- B60L50/64—Constructional details of batteries specially adapted for electric vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/539—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters with automatic control of output wave form or frequency
- H02M7/5395—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters with automatic control of output wave form or frequency by pulse-width modulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2200/00—Type of vehicles
- B60L2200/26—Rail vehicles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
- B60L2210/40—DC to AC converters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
- H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
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Abstract
本発明が解決しようとする課題は、パワーモジュール及び電力変換装置の生産性を向上させることである。
【解決手段】
上記課題を解決するために、本発明に係るパワーモジュール及び当該パワーモジュールを用いた電力変換装置は、それぞれの主面が対向する2枚のベース板と、前記2枚のベース板の間に配置された半導体回路部と、前記2枚のベース板に接続され、かつ前記半導体回路部を収納するための収納領域を形成する連結部材と、前記ベース板と前記半導体回路部との間に介装され、かつ当該ベース板と当該半導体回路部との電気的絶縁を確保するための絶縁性部材と、を備え、前記連結部材の剛性又は厚さは、前記ベース板の剛性又は厚さより小さいことを特徴とする。
【選択図】図6
Description
300A 両面電極モジュール
302 樹脂材料
304 CAN状放熱ベース
304A 外周湾曲部
305 フィン
314 直流正極配線板
316 直流負極配線板
320L,320U パワーモジュール制御端子
328 上アーム用IGBT
330 下アーム用IGBT
334 電気配線板
334A 絶縁層(絶縁シート)
334B 放熱面
334C 平面
337 金属接合材料
338 熱拡散板
Claims (18)
- 電力変換装置に用いられ、直流電力と交流電力を相互に変換するパワーモジュールであって、
それぞれの主面が対向する2枚のベース板と、
前記2枚のベース板の間に配置された半導体回路部と、
前記2枚のベース板に接続され、かつ前記半導体回路部を収納するための収納領域を形成する連結部材と、
前記ベース板と前記半導体回路部との間に介装され、かつ当該ベース板と当該半導体回路部との電気的絶縁を確保するための絶縁性部材と、を備え、
前記連結部材の剛性は、前記ベース板の剛性より小さいことを特徴とするパワーモジュール。 - 請求項1に記載されたパワーモジュールであって、
前記連結部材の厚さは、前記ベース板の厚さより小さいパワーモジュール。 - 電力変換装置に用いられ、直流電力と交流電力を相互に変換するパワーモジュールであって、
それぞれの主面が対向する2枚のベース板と、
前記2枚のベース板の間に配置された半導体回路部と、
前記2枚のベース板に接続され、かつ前記半導体回路部を収納するための収納領域を形成する連結部材と、
前記ベース板と前記半導体回路部との間に介装され、かつ当該ベース板と当該半導体回路部との電気的絶縁を確保するための絶縁性部材と、を備え、
前記連結部材の厚さは、前記ベース板の厚さより小さいことを特徴とするパワーモジュール。 - 請求項1または3に記載された、いずれかのパワーモジュールであって、
前記2枚のベース板は、前記連結部材が弾性変形することにより、前記絶縁性部材を介して前記半導体回路部を挟持するパワーモジュール。 - 請求項1または3に記載された、いずれかのパワーモジュールであって、
前記ベース板と前記連結部材は、一体に形成されるパワーモジュール。 - 請求項3に記載されたパワーモジュールであって、
前記連結部材の剛性は、前記ベース板の剛性より小さいパワーモジュール。 - 請求項1または3に記載された、いずれかのパワーモジュールであって、
前記2枚のベース板は、前記半導体回路部が配置された側の面とは反対側の面にフィンを形成し、かつ当該フィンが形成された面は、冷却媒体と直接接触するパワーモジュール。 - 電力変換装置に用いられ、直流電力と交流電力を相互に変換するパワーモジュールであって、
筒型のケースと、
前記ケース内に形成された収納領域に収納された半導体回路部と、
前記ケースの内壁と当該半導体回路部との電気的絶縁を確保するための絶縁性部材と、を備え、
前記半導体回路部は前記ケースの内壁に挟まれて支持され、
前記絶縁性部材は、前記ケースの内壁と前記半導体回路部の間に介装されるとともに、当該絶縁性部材は、熱処理により、当該半導体回路部と当該ケース内壁との接着力を向上させる材料であるパワーモジュール。 - 請求項8に記載されたパワーモジュールであって、
前記ケースは、その外壁にフィンを形成し、かつ当該ケースの外壁は、冷却媒体と直接接触するパワーモジュール。 - 請求項8に記載されたパワーモジュールであって、
前記絶縁性部材は、前記半導体回路部が前記ケース内壁に挟まれた状態で、熱処理されることにより、当該半導体回路部と当該ケース内壁との接着力を向上させるパワーモジュール。 - 請求項8に記載されたパワーモジュールであって、
前記ケースの外壁に、当該ケースとは別体のフィンが接続され、
前記ケース及び前記フィンのそれぞれの接続面は所定以上の表面粗さであるパワーモジュール。 - 請求項1または3または8に記載された、いずれかのパワーモジュールであって、
前記半導体回路部は、半導体素子と、当該半導体素子と電気的に接続された配線部材とを備え、
前記配線部材は前記半導体素子と前記絶縁性部材の間に介装され、かつ当該配線部材の一部は前記収納領域の外側へ延びており、その先端に電極を形成するパワーモジュール。 - 請求項1または3または8に記載された、いずれかのパワーモジュールであって、
前記半導体回路部は、電源の正極側に接続される第1半導体素子部と、前記電源の負極側に接続される第2半導体素子部と、を備え、
前記第1半導体素子部と前記第2半導体素子部との接続部から、複数相の交流電力のいずれか一相の交流電力が出力されるパワーモジュール。 - 請求項1または3または8に記載された、いずれかのパワーモジュールであって、
前記半導体回路部は、
電源の正極側に接続される第1半導体素子部と、前記電源の負極側に接続される第2半導体素子部と、
前記第1半導体素子部と接続されており、かつその一部が前記収納領域の外側へ延びる第1配線部材と、
前記第2半導体素子部と接続されており、かつその一部が前記収納領域の外側へ延びる第2配線部材と、を備え、
前記第1半導体素子部と前記第2半導体素子部との接続部から、複数相の交流電力のいずれか一相の交流電力が出力され、
さらに、前記第1配線部材及び前記第2配線部材は平板状に形成され、かつ少なくとも一部が積層状態となるように配置されるパワーモジュール。 - 請求項1または3または8に記載された、いずれかのパワーモジュールを用いた車両用電力変換装置であって、
前記パワーモジュールを複数備え、当該複数のパワーモジュールによって3相の交流電力を生成し、該3相の交流電力を車両駆動用の電動機に出力する車両用電力変換装置。 - 請求項1または3または8に記載された、いずれかのパワーモジュールを用いた車両用電力変換装置であって、
前記パワーモジュールを複数備え、
内部に冷却媒体を流すための流路を形成する流路形成体を備えた筐体を備え、
前記流路形成体は複数の開口部を備え、当該複数の開口部に、前記複数のパワーモジュールをそれぞれ挿入し、
当該複数のパワーモジュールは、前記絶縁性部材と前記半導体回路部との接触面が前記流路内に流れる前記冷却媒体の流れ方向と略平行になるように、前記流路内に配置される車両用電力変換装置。 - 請求項1または3または8に記載された、いずれかのパワーモジュールを用いた車両用電力変換装置であって、
内部に冷却媒体を流すための流路を形成する流路形成体を備えた筐体を備え、
前記流路形成体は開口部を備え、当該開口部に前記パワーモジュールを挿入し、
前記パワーモジュールは、前記連結部材が前記流路内に流れる前記冷却媒体の流れ方向と対向するように前記流路内に配置され、
前記連結部材の端部は、テーパ形状を為し、又は所定値以上の曲率を有する車両用電力変換装置。 - 請求項1に記載されたパワーモジュールを用いた車両用電力変換装置であって、
前記直流電力を平滑化するためのコンデンサモジュールと、
内部に冷却媒体が流れる流路形成体と、を備え、
前記コンデンサモジュールは、その所定の面が前記2枚のベース板といずれか一方のベース板と対向するように配置され、
前記流路形成体は、前記コンデンサモジュールと前記パワーモジュールとの間に配置され、
前記コンデンサモジュールから延びる配線板は、前記流路形成体を跨いで、前記半導体回路部から延びる配線板と電気的に接続される車両用電力変換装置。
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JP2008280682A JP5557441B2 (ja) | 2008-10-31 | 2008-10-31 | 電力変換装置および電動車両 |
EP18172344.6A EP3399853B1 (en) | 2008-10-31 | 2009-10-30 | Power module, power converter device, and electrically powered vehicle |
PCT/JP2009/068704 WO2010050594A1 (ja) | 2008-10-31 | 2009-10-30 | パワーモジュール、電力変換装置および電動車両 |
CN201310240571.8A CN103378747B (zh) | 2008-10-31 | 2009-10-30 | 电力转换装置 |
US12/920,296 US8946567B2 (en) | 2008-10-31 | 2009-10-30 | Power module, power converter device, and electrically powered vehicle |
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CN2009801052227A CN101946395B (zh) | 2008-10-31 | 2009-10-30 | 功率模块、电力转换装置以及电动车辆 |
CN201510969150.8A CN105539168B (zh) | 2008-10-31 | 2009-10-30 | 功率模块及车辆用电力转换装置 |
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US14/574,086 US9407163B2 (en) | 2008-10-31 | 2014-12-17 | Power module, power converter device, and electrically powered vehicle |
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US15/636,170 US10348214B2 (en) | 2008-10-31 | 2017-06-28 | Power module, power converter device, and electrically powered vehicle |
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US10348214B2 (en) | 2019-07-09 |
US20160308456A1 (en) | 2016-10-20 |
CN105539168B (zh) | 2019-08-30 |
EP3399853B1 (en) | 2019-12-11 |
CN101946395B (zh) | 2013-07-17 |
US20190393799A1 (en) | 2019-12-26 |
US9729076B2 (en) | 2017-08-08 |
CN101946395A (zh) | 2011-01-12 |
US11139748B2 (en) | 2021-10-05 |
WO2010050594A1 (ja) | 2010-05-06 |
EP2346153A4 (en) | 2013-09-11 |
US9407163B2 (en) | 2016-08-02 |
US20110299265A1 (en) | 2011-12-08 |
US8946567B2 (en) | 2015-02-03 |
CN103378747A (zh) | 2013-10-30 |
EP2844053A2 (en) | 2015-03-04 |
CN103378747B (zh) | 2016-08-10 |
EP3399853A1 (en) | 2018-11-07 |
EP2844053B1 (en) | 2018-06-20 |
JP5557441B2 (ja) | 2014-07-23 |
CN105539168A (zh) | 2016-05-04 |
EP2346153B1 (en) | 2014-12-03 |
EP2844053A3 (en) | 2015-04-22 |
US20170302191A1 (en) | 2017-10-19 |
EP2346153A1 (en) | 2011-07-20 |
US20160149512A1 (en) | 2016-05-26 |
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