JP4538359B2 - 電気回路モジュール - Google Patents
電気回路モジュール Download PDFInfo
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- JP4538359B2 JP4538359B2 JP2005100486A JP2005100486A JP4538359B2 JP 4538359 B2 JP4538359 B2 JP 4538359B2 JP 2005100486 A JP2005100486 A JP 2005100486A JP 2005100486 A JP2005100486 A JP 2005100486A JP 4538359 B2 JP4538359 B2 JP 4538359B2
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
- B60L50/13—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines using AC generators and AC motors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
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- B60L50/00—Electric propulsion with power supplied within the vehicle
- B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
- B60L50/16—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines with provision for separate direct mechanical propulsion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
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- B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
- B60L58/10—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries
- B60L58/18—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries of two or more battery modules
- B60L58/20—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries of two or more battery modules having different nominal voltages
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
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- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/641—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/465—Bumps or wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10W90/00—Package configurations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
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- H—ELECTRICITY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
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- H—ELECTRICITY
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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- H—ELECTRICITY
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- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
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- Power Engineering (AREA)
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- Sustainable Energy (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
32の各相の各上下アームに対応する回路は、対応するパワー半導体素子3Up〜3Wnのソース電極側の電位を基準電位とし、絶縁電源38からの印加電圧、例えば13vの直流電圧により動作する。このため、駆動回路32のグランド端子E1〜E6は、対応するパワー半導体素子3Up〜3Wnのソース電極側と電気的に接続されている。尚、各相の下アーム側は接地電位が基準電位となる。
FRWを駆動する。このため、エンジンENGの回転出力は動力分配機構PSMを介して変速機T/Mに入力される。入力された回転出力は変速機T/Mによって変速される。変速された回転出力は差動装置FDFを介して前輪車軸FDSに伝達される。これにより、前輪FLW,FRWをWH−Fが回転駆動される。また、バッテリBATの充電状態を検出し、バッテリBATを充電する必要がある場合は、エンジンENGの回転出力を、動力分配機構PSMを介してモータジェネレータMG1に分配し、モータジェネレータMG1を回転駆動する。これにより、モータジェネレータMG1は発電機として動作する。この動作により、モータジェネレータMG1の固定子巻線に三相交流電力が発生する。この発生した三相交流電力はインバータ装置INVによって所定の直流電力に変換される。この変換によって得られた直流電力はバッテリBATに供給される。これにより、バッテリ
BATは充電される。
INVにはバッテリBATから直流電力が供給される。供給された直流電力はインバータ装置INVによって三相交流電力に変換され、この変換によって得られた交流電力がモータジェネレータMG2の固定子巻線に供給される。これにより、モータジェネレータMG2は駆動され、回転出力を発生する。発生した回転出力は、減速機RGによって減速されて差動装置RDFに入力される。入力された回転出力は差動装置RDFによって左右に分配され、左右の後輪車軸RDSにそれぞれ伝達される。これにより、後輪車軸RDSが回転駆動される。そして、後輪車軸RDSの回転駆動によって後輪RLW,RRWが回転駆動される。
MG1の回転出力は動力分配機構PSMを介して変速機T/Mに入力される。入力された回転出力は変速機T/Mによって変速される。変速された回転出力は差動装置FDFを介して前輪車軸FDSに伝達される。これにより、前輪FLW,FRWが回転駆動される。
EVAの上流側にはインテークブロワIBRが配置されている。インテークブロワIBRは外気或いは内気を空気流路AFWに送風する。空気流路AFW内でエバポレータEVAの下流側にはヒータユニットHEAが配置されている。ヒータユニットHEAは、エバポレータEVAによって冷却された空気を暖める。
AFWをヒータユニットHEA側に流れる。エバポレータEVAとヒータユニットHEAとの間の空気流路AFW内にはエアミックスドワAMDが設けられている。エアミックスドアAMDは、ヒータユニットHEAに流れる空気量とヒータユニットHEAをバイパスする空気量を制御するものであり、エバポレータEVAによって冷却された空気を分流させる。ヒータユニットHEA側に分流した空気はヒータユニットHEAによって暖められ、ヒータユニットHEAをバイパスした空気と混合される。これにより、車室CR内に送風される空気温度が制御される。混合した空気は、車室CR内に設けられた複数の吹出し口のいずれかから車室CR内に吹出される。これにより、車室CR内の温度が設定温度に制御される。
Claims (3)
- 複数の半導体装置と、
本体の中央部に細長の溝を有し、当該溝内の長手方向に沿って対向する両側壁に前記複数の半導体装置が配置され、当該複数の半導体装置の発熱を放熱する放熱部材と、
2つの押圧部と当該押圧部間を接続する接続部とを有し、前記放熱部材の溝の長手方向に沿って前記両側壁に配置された複数の半導体装置の間であって前記側壁とは反対側に配置され、前記半導体装置を前記各側壁方向へ弾性的に押圧するU字状固定治具と、
前記U字状固定治具の2つの押圧部間に配置され、前記押圧部の前記側壁とは反対側の面に沿って相互に対向するよう配置された直流正極側配線部材と直流負極側配線部材と、
前記直流正極側配線部材と前記直流負極側配線部材の間に挿入され、前記直流正極側配線部材と前記直流負極側配線部材との間を埋める弾性部材と、を備え、
前記放熱部材の前記溝内の一方の側壁に配置された前記半導体装置は前記直流正極側配線部材と電気的に接続され、前記放熱部材の前記溝内の他方の側壁に配置された半導体装置は前記直流負極側配線部材と電気的に接続されることを特徴とする電気回路モジュール。 - 請求項1に記載の電気回路モジュールにおいて、
前記弾性部材は、前記直流正極側配線部材と前記直流負極側配線部材とを前記U字状部材の各押圧部へ押圧することを特徴とする電気回路モジュール。 - 請求項1に記載の電気回路モジュールにおいて、
前記放熱部材の前記溝の開口部を覆う第2の固定治具を有することを特徴とする電気回路モジュール。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005100486A JP4538359B2 (ja) | 2005-03-31 | 2005-03-31 | 電気回路モジュール |
| CNB2006100064403A CN100481411C (zh) | 2005-03-31 | 2006-01-20 | 电路模块、搭载该电路模块的电力变换装置及车载电机系统 |
| EP06003451.9A EP1708260A3 (en) | 2005-03-31 | 2006-02-20 | Electric circuit module as well as power converter and vehicle-mounted electric system that include the module |
| US11/357,115 US7745952B2 (en) | 2005-03-31 | 2006-02-21 | Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005100486A JP4538359B2 (ja) | 2005-03-31 | 2005-03-31 | 電気回路モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006286676A JP2006286676A (ja) | 2006-10-19 |
| JP4538359B2 true JP4538359B2 (ja) | 2010-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005100486A Expired - Fee Related JP4538359B2 (ja) | 2005-03-31 | 2005-03-31 | 電気回路モジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7745952B2 (ja) |
| EP (1) | EP1708260A3 (ja) |
| JP (1) | JP4538359B2 (ja) |
| CN (1) | CN100481411C (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11949341B2 (en) | 2019-06-14 | 2024-04-02 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Power converter and electric motor braking method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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2005
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-
2006
- 2006-01-20 CN CNB2006100064403A patent/CN100481411C/zh not_active Expired - Fee Related
- 2006-02-20 EP EP06003451.9A patent/EP1708260A3/en not_active Withdrawn
- 2006-02-21 US US11/357,115 patent/US7745952B2/en not_active Expired - Fee Related
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| US11949341B2 (en) | 2019-06-14 | 2024-04-02 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Power converter and electric motor braking method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1708260A2 (en) | 2006-10-04 |
| JP2006286676A (ja) | 2006-10-19 |
| CN100481411C (zh) | 2009-04-22 |
| US7745952B2 (en) | 2010-06-29 |
| US20060232942A1 (en) | 2006-10-19 |
| CN1841715A (zh) | 2006-10-04 |
| EP1708260A3 (en) | 2013-05-01 |
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