JP5557100B2 - 電動モータ駆動用の半導体素子 - Google Patents
電動モータ駆動用の半導体素子 Download PDFInfo
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- 238000007689 inspection Methods 0.000 claims description 108
- 238000002161 passivation Methods 0.000 claims description 10
- 239000000523 sample Substances 0.000 description 40
- 238000004519 manufacturing process Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 11
- 101150073536 FET3 gene Proteins 0.000 description 3
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Description
電動モータ駆動用のスイッチング素子には、動力源としての電動モータを駆動するために大電流が流れるようになっている。このため、電動モータ駆動用のスイッチング素子の検査に際して、一般的なプローブではなく、専用のプローブが用いられることがある。このプローブは、一般のプローブと異なり、例えば、先端部に、電極の表面に触れる先鋭な接触部が多数設けられた剣山形状を有しているか、または、先端部が極めて太い形状を有している。したがって、プローブのうち電極の表面に触れる部分の範囲が広い。そのため、プローブの先端部は、ボンディングワイヤが接合される領域に接触しないように、電極の表面に対して厳密に位置決めされた上で、電極の表面に接触させる必要がある。
一方で、自動検査装置を用いてスイッチング素子を検査することが考えられる。この場合、電極の表面をカメラで撮影し、画像処理装置によって、ボンディングワイヤが接合される領域と、検査用のプローブが接触される領域とを識別した上で、ロボットアーム等でプローブを動かし、検査用のプローブが接触される領域にプローブを接触させることが考えられる。
また、この構成では、大電流が流れるソース電極での接合不良を抑制できる。
図1は、本発明の一実施形態に係る半導体素子を含む素子実装基板1の主要部の模式的な平面図である。図1を参照して、素子実装基板1は、例えば、電動パワーステアリング装置の電動モータ50を駆動するためのパワー基板である。この素子実装基板1は、図示しないバスバー等の接続部材を介して、電動モータ50のU相コイル51、V相コイル52およびW相コイル53に電力を供給するようになっている。この電力により、電動モータ50が駆動する。
基板本体2は、例えば複数の絶縁層の間のそれぞれに導体層が形成された多層回路基板である。基板本体2の表面には、パッド4が形成されている。パッド4上にFET3が実装されている。
ソース電極5は、所定の電極であって、単一の(1つのみ設けられている)電極である。ソース電極5は、FET3の表面3aに露出している。ソース電極5は、FET3の表面3aに形成されたパッドである電極面8を含んでいる。電極面8は、主電極面10と、主電極面10とは独立して且つ離隔して配置された検査用電極面20とを有している。より具体的には、主電極面10と、検査用電極面20とは、FET3を平面視したときに、独立して且つ離隔して配置されている。
主電極面10は、複数(本実施形態において、例えば、3つ)設けられており、第1、第2および第3主電極面11,12,13を含んでいる。なお、以下では、各主電極面11,12,13を総称していうときは、単に主電極面10という。
各主電極面11,12,13には、導電部材としてのボンディングワイヤ31の一端31aが、ワイヤボンディングによって接合されている。各ボンディングワイヤ31の他端31bは、基板本体2に形成されたパッド32に接合されている。各主電極面11,12,13には、同じ数(例えば、本実施形態において2)のボンディングワイヤ31が接合されている。各ボンディングワイヤ31には、電動モータ50の駆動電流が流れるようになっている。
各検査用電極面21,22,23は、各主電極面11,12,13と同様の形状、すなわち、平面視で矩形形状に形成されている。各検査用電極面21,22,23には、後述する検査装置40のプローブ46が接触することで形成された微小な圧痕としての凹部33が多数形成されている。
また、平面視において、第1並び方向X1と直交する第2並び方向X2に関して、これら第1主電極面11、第1検査用電極面21および第2主電極面12と並ぶように、第2検査用電極面22、第3主電極面13および第3検査用電極面23が配置されている。第2検査用電極面22,第3主電極面13および第3検査用電極面23は、第1並び方向X1に沿って交互に等間隔に配置されている。
次に、FET3の検査について説明する。FET3は、単品の状態、または基板本体2に実装された状態であって、ワイヤボンディングが行われる前に検査されるようになっている。
また、第1主電極面11,第1検査用電極面21および第2主電極面12を、第1並び方向X1に沿って交互に配置している。ここで、各主電極面11,12は、ボンディングワイヤ31と接続されているので、発熱量が多い。この発熱量の多い複数の主電極面11,12同士を、第1並び方向X1に関して、より離隔して配置できる。これにより、FET3の駆動時における各主電極面11,12の熱を放出し易くできる。したがって、FET3の熱を効率よく放出できる。しかも、主電極面10と検査用電極面20とを第1並び方向X1に沿って交互に配置するという簡易な構成であるので、製造コストを抑制できる。
例えば、プローブユニットは、プローブを1つのみを有していてもよい。この場合、プローブは、例えば、先端部が太い棒状でもよい。さらに、主電極面10と検査用電極面20とは、パシベーション膜34以外の他の絶縁部材によって仕切られていてもよい。また、主電極面10と検査用電極面20とは、それぞれ1つのみ設けられていてもよい。
Claims (2)
- ソース電極を備えた電動モータ駆動用の半導体素子において、
前記ソース電極は、前記電動モータの駆動電流が流れる導電部材が接合される複数の主電極面と、各主電極面とは独立して且つ離隔して配置され、前記半導体素子を検査する検査装置の接触部と接触するための複数の検査用電極面とを含んでおり、
前記複数の主電極面は千鳥足状に配置されており、
前記複数の検査用電極面は、前記主電極面と前記検査用電極面とが交互に並ぶような千鳥足状に配置されていることを特徴とする、電動モータ駆動用の半導体素子。 - 前記主電極面と前記検査用電極面とは、パシベーション膜によって仕切られていることを特徴とする、請求項1に記載の電動モータ駆動用の半導体素子。
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CN201110195759.6A CN102347314B (zh) | 2010-07-23 | 2011-07-08 | 电动马达驱动用半导体元件 |
US13/181,053 US8648340B2 (en) | 2010-07-23 | 2011-07-12 | Semiconductor device for driving electric motor |
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JP2536419B2 (ja) * | 1993-07-23 | 1996-09-18 | 日本電気株式会社 | 半導体集積回路装置 |
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JP3022819B2 (ja) * | 1997-08-27 | 2000-03-21 | 日本電気アイシーマイコンシステム株式会社 | 半導体集積回路装置 |
US20020016070A1 (en) * | 2000-04-05 | 2002-02-07 | Gerald Friese | Power pads for application of high current per bond pad in silicon technology |
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