IT7821073V0 - Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. - Google Patents

Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.

Info

Publication number
IT7821073V0
IT7821073V0 IT7821073U IT2107378U IT7821073V0 IT 7821073 V0 IT7821073 V0 IT 7821073V0 IT 7821073 U IT7821073 U IT 7821073U IT 2107378 U IT2107378 U IT 2107378U IT 7821073 V0 IT7821073 V0 IT 7821073V0
Authority
IT
Italy
Prior art keywords
clamp
fixing
semiconductor device
heat sink
sink
Prior art date
Application number
IT7821073U
Other languages
English (en)
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT7821073U priority Critical patent/IT7821073V0/it
Publication of IT7821073V0 publication Critical patent/IT7821073V0/it
Priority to FR7904950A priority patent/FR2419659A7/fr
Priority to DE19797906405U priority patent/DE7906405U1/de
Priority to US06/018,638 priority patent/US4259685A/en
Priority to GB7908391A priority patent/GB2018345B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
IT7821073U 1978-03-09 1978-03-09 Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. IT7821073V0 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT7821073U IT7821073V0 (it) 1978-03-09 1978-03-09 Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
FR7904950A FR2419659A7 (fr) 1978-03-09 1979-02-27 Mors de fixation a un dissipateur de chaleur d'un dispositif a semi-conducteur
DE19797906405U DE7906405U1 (de) 1978-03-09 1979-03-08 Klammer zum befestigen eines halbleiterbauelements an einem kuehlkoerper
US06/018,638 US4259685A (en) 1978-03-09 1979-03-08 Clamp for securing an encased power frame to a heat sink
GB7908391A GB2018345B (en) 1978-03-09 1979-03-09 Clamp for fixing a semiconductor device to a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT7821073U IT7821073V0 (it) 1978-03-09 1978-03-09 Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.

Publications (1)

Publication Number Publication Date
IT7821073V0 true IT7821073V0 (it) 1978-03-09

Family

ID=11176322

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7821073U IT7821073V0 (it) 1978-03-09 1978-03-09 Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.

Country Status (5)

Country Link
US (1) US4259685A (it)
DE (1) DE7906405U1 (it)
FR (1) FR2419659A7 (it)
GB (1) GB2018345B (it)
IT (1) IT7821073V0 (it)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
EP0074378A4 (en) * 1981-03-23 1985-04-25 Motorola Inc SEMICONDUCTOR ARRANGEMENT CONTAINING A UNPLATED UNIT.
US4460917A (en) * 1982-06-03 1984-07-17 Motorola, Inc. Molded-in isolation bushing for semiconductor devices
US4466441A (en) * 1982-08-02 1984-08-21 Medtronic, Inc. In-line and bifurcated cardiac pacing lead connector
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
DE3409037A1 (de) * 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet
US4604529A (en) * 1984-09-28 1986-08-05 Cincinnati Microwave, Inc. Radar warning receiver with power plug
DE3440334A1 (de) * 1984-11-05 1986-05-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper
DE3505085A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
IT1215267B (it) * 1985-04-26 1990-01-31 Ates Componenti Elettron Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale.
US4720771A (en) * 1985-07-05 1988-01-19 Chrysler Motors Corporation Heat sink assembly for a circuit board mounted integrated circuit
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
JPS62226647A (ja) * 1986-03-24 1987-10-05 スア−マロイ、インコ−パレイテイド 固着装置
US4990987A (en) * 1986-12-18 1991-02-05 Gte Products Corporation Over-temperature sensor and protector for semiconductor devices
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US5019942A (en) * 1987-11-30 1991-05-28 Thermalloy Incorporated Insulating apparatus for electronic device assemblies
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
GB2224068A (en) * 1988-10-20 1990-04-25 Stc Plc Equipment mounting
US5825088A (en) * 1991-05-01 1998-10-20 Spectrian, Inc. Low thermal resistance semiconductor package and mounting structure
US5825089A (en) * 1991-05-01 1998-10-20 Spectrian, Inc. Low thermal resistance spring biased RF semiconductor package mounting structure
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
WO1994029901A1 (de) * 1993-06-07 1994-12-22 Melcher Ag Befestigungsvorrichtung für halbleiter-schaltelemente
DE4331377A1 (de) * 1993-09-15 1995-03-16 Siemens Matsushita Components Elektrisches Bauelement
US5396404A (en) * 1993-09-20 1995-03-07 Delco Electronics Corp. Heat sinking assembly for electrical components
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
DE4432057A1 (de) * 1994-09-09 1996-03-14 Bosch Gmbh Robert Vorrichtung zur Ableitung der thermischen Verlustleistung eines elektronischen oder elektromechanischen Bauelementes
US5504653A (en) * 1994-11-21 1996-04-02 Delco Electronics Corp. Heat sinking assembly for electrical components
DE19508340A1 (de) * 1995-03-09 1996-09-12 Abb Management Ag Befestigungsvorrichtung für elektronische Komponenten
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US5850104A (en) * 1997-01-06 1998-12-15 Spectrian, Inc. Integral lid/clamp for high power transistor
DE29709210U1 (de) * 1997-05-26 1997-07-31 Roland Man Druckmasch Verbindungselementekombination
US6348727B1 (en) * 1998-12-15 2002-02-19 International Rectifier Corporation High current semiconductor device package with plastic housing and conductive tab
US6597065B1 (en) * 2000-11-03 2003-07-22 Texas Instruments Incorporated Thermally enhanced semiconductor chip having integrated bonds over active circuits
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
JP4538359B2 (ja) * 2005-03-31 2010-09-08 株式会社日立産機システム 電気回路モジュール
TWI425907B (zh) * 2010-09-21 2014-02-01 Delta Electronics Inc 電子元件和散熱裝置之組合結構及其絕緣元件
DE102014018821B4 (de) 2014-12-19 2019-07-25 Jenoptik Optical Systems Gmbh Diodenlaserbefestigung
CN105376998B (zh) * 2015-11-19 2018-04-13 重庆华万伦电器有限公司 弹力夹夹持式铝合金散热片
EP3444839A1 (en) * 2017-08-18 2019-02-20 Infineon Technologies Austria AG Assembly and method for mounting an electronic component to a substrate
US11076477B2 (en) * 2017-10-03 2021-07-27 Mks Instruments, Inc. Cooling and compression clamp for short lead power devices
EP3709346B1 (en) * 2019-03-15 2023-01-18 Infineon Technologies Austria AG An electronic module comprising a semiconductor package with integrated clip and fastening element

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
US3548927A (en) * 1968-11-29 1970-12-22 Intern Electronic Research Co Heat dissipating retainer for electronic component
US3694703A (en) * 1970-09-02 1972-09-26 Staver Co Inc The Heat dissipator for encased semiconductor device having heat tab extending therefrom
US3786317A (en) * 1972-11-09 1974-01-15 Bell Telephone Labor Inc Microelectronic circuit package
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS5266376A (en) * 1975-11-29 1977-06-01 Hitachi Ltd Device and manufacture of resin body type semiconductor
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte

Also Published As

Publication number Publication date
US4259685A (en) 1981-03-31
FR2419659A7 (fr) 1979-10-05
GB2018345A (en) 1979-10-17
GB2018345B (en) 1982-03-31
DE7906405U1 (de) 1979-07-26

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