IT7821073V0 - Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. - Google Patents
Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.Info
- Publication number
- IT7821073V0 IT7821073V0 IT7821073U IT2107378U IT7821073V0 IT 7821073 V0 IT7821073 V0 IT 7821073V0 IT 7821073 U IT7821073 U IT 7821073U IT 2107378 U IT2107378 U IT 2107378U IT 7821073 V0 IT7821073 V0 IT 7821073V0
- Authority
- IT
- Italy
- Prior art keywords
- clamp
- fixing
- semiconductor device
- heat sink
- sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT7821073U IT7821073V0 (it) | 1978-03-09 | 1978-03-09 | Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. |
FR7904950A FR2419659A7 (fr) | 1978-03-09 | 1979-02-27 | Mors de fixation a un dissipateur de chaleur d'un dispositif a semi-conducteur |
US06/018,638 US4259685A (en) | 1978-03-09 | 1979-03-08 | Clamp for securing an encased power frame to a heat sink |
DE19797906405U DE7906405U1 (de) | 1978-03-09 | 1979-03-08 | Klammer zum befestigen eines halbleiterbauelements an einem kuehlkoerper |
GB7908391A GB2018345B (en) | 1978-03-09 | 1979-03-09 | Clamp for fixing a semiconductor device to a heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT7821073U IT7821073V0 (it) | 1978-03-09 | 1978-03-09 | Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. |
Publications (1)
Publication Number | Publication Date |
---|---|
IT7821073V0 true IT7821073V0 (it) | 1978-03-09 |
Family
ID=11176322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT7821073U IT7821073V0 (it) | 1978-03-09 | 1978-03-09 | Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4259685A (it) |
DE (1) | DE7906405U1 (it) |
FR (1) | FR2419659A7 (it) |
GB (1) | GB2018345B (it) |
IT (1) | IT7821073V0 (it) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4530003A (en) * | 1981-02-02 | 1985-07-16 | Motorola, Inc. | Low-cost power device package with quick connect terminals and electrically isolated mounting means |
JPS58500463A (ja) * | 1981-03-23 | 1983-03-24 | モトロ−ラ・インコ−ポレ−テッド | めっきのしてないパッケ−ジを含む半導体デバイス |
US4460917A (en) * | 1982-06-03 | 1984-07-17 | Motorola, Inc. | Molded-in isolation bushing for semiconductor devices |
US4466441A (en) * | 1982-08-02 | 1984-08-21 | Medtronic, Inc. | In-line and bifurcated cardiac pacing lead connector |
US4611389A (en) * | 1983-11-03 | 1986-09-16 | Motorola, Inc. | Low-cost power device package with quick-connect terminals and electrically isolated mounting means |
IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
DE3409037A1 (de) * | 1984-03-13 | 1985-09-19 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrisches schaltgeraet |
US4604529A (en) * | 1984-09-28 | 1986-08-05 | Cincinnati Microwave, Inc. | Radar warning receiver with power plug |
DE3440334A1 (de) * | 1984-11-05 | 1986-05-15 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum befestigen eines halbleiterbauelementes an einem kuehlkoerper |
DE3505085A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit einem kunststoffgehaeuse |
IT1215267B (it) * | 1985-04-26 | 1990-01-31 | Ates Componenti Elettron | Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale. |
US4720771A (en) * | 1985-07-05 | 1988-01-19 | Chrysler Motors Corporation | Heat sink assembly for a circuit board mounted integrated circuit |
US4729426A (en) * | 1986-03-06 | 1988-03-08 | Thermalloy Incorporated | Bonded clip heat sink |
JPS62226647A (ja) * | 1986-03-24 | 1987-10-05 | スア−マロイ、インコ−パレイテイド | 固着装置 |
US4990987A (en) * | 1986-12-18 | 1991-02-05 | Gte Products Corporation | Over-temperature sensor and protector for semiconductor devices |
US4878108A (en) * | 1987-06-15 | 1989-10-31 | International Business Machines Corporation | Heat dissipation package for integrated circuits |
US4845590A (en) * | 1987-11-02 | 1989-07-04 | Chrysler Motors Corporation | Heat sink for electrical components |
US4891735A (en) * | 1987-11-02 | 1990-01-02 | Chrysler Motors Corporation | Heat sink for electrical components |
US4923179A (en) * | 1987-11-02 | 1990-05-08 | Chrysler Corporation | Spring panel heat sink for electrical components |
US4922601A (en) * | 1987-11-02 | 1990-05-08 | Chrysler Corporation | Method of making a heat sink for electrical components |
US5019942A (en) * | 1987-11-30 | 1991-05-28 | Thermalloy Incorporated | Insulating apparatus for electronic device assemblies |
US4888637A (en) * | 1988-01-15 | 1989-12-19 | Chrysler Motors Corporation | Multiple semiconductor heat sink/mounting assembly |
US4970579A (en) * | 1988-09-21 | 1990-11-13 | International Business Machines Corp. | Integrated circuit package with improved cooling means |
GB2224068A (en) * | 1988-10-20 | 1990-04-25 | Stc Plc | Equipment mounting |
US5825088A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance semiconductor package and mounting structure |
US5825089A (en) * | 1991-05-01 | 1998-10-20 | Spectrian, Inc. | Low thermal resistance spring biased RF semiconductor package mounting structure |
FR2679729B1 (fr) * | 1991-07-23 | 1994-04-29 | Alcatel Telspace | Dissipateur thermique. |
EP0654176B1 (de) * | 1993-06-07 | 1998-05-20 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
DE4331377A1 (de) * | 1993-09-15 | 1995-03-16 | Siemens Matsushita Components | Elektrisches Bauelement |
US5396404A (en) * | 1993-09-20 | 1995-03-07 | Delco Electronics Corp. | Heat sinking assembly for electrical components |
US5327324A (en) * | 1993-11-05 | 1994-07-05 | Ford Motor Company | Spring clip for a heat sink apparatus |
DE4432057A1 (de) * | 1994-09-09 | 1996-03-14 | Bosch Gmbh Robert | Vorrichtung zur Ableitung der thermischen Verlustleistung eines elektronischen oder elektromechanischen Bauelementes |
US5504653A (en) * | 1994-11-21 | 1996-04-02 | Delco Electronics Corp. | Heat sinking assembly for electrical components |
DE19508340A1 (de) * | 1995-03-09 | 1996-09-12 | Abb Management Ag | Befestigungsvorrichtung für elektronische Komponenten |
US5592021A (en) * | 1995-04-26 | 1997-01-07 | Martin Marietta Corporation | Clamp for securing a power device to a heatsink |
US5850104A (en) * | 1997-01-06 | 1998-12-15 | Spectrian, Inc. | Integral lid/clamp for high power transistor |
DE29709210U1 (de) * | 1997-05-26 | 1997-07-31 | MAN Roland Druckmaschinen AG, 63075 Offenbach | Verbindungselementekombination |
US6348727B1 (en) * | 1998-12-15 | 2002-02-19 | International Rectifier Corporation | High current semiconductor device package with plastic housing and conductive tab |
US6597065B1 (en) * | 2000-11-03 | 2003-07-22 | Texas Instruments Incorporated | Thermally enhanced semiconductor chip having integrated bonds over active circuits |
JP4154325B2 (ja) * | 2003-12-19 | 2008-09-24 | 株式会社日立産機システム | 電気回路モジュール |
JP4538359B2 (ja) * | 2005-03-31 | 2010-09-08 | 株式会社日立産機システム | 電気回路モジュール |
TWI425907B (zh) * | 2010-09-21 | 2014-02-01 | Delta Electronics Inc | 電子元件和散熱裝置之組合結構及其絕緣元件 |
DE102014018821B4 (de) | 2014-12-19 | 2019-07-25 | Jenoptik Optical Systems Gmbh | Diodenlaserbefestigung |
CN105376998B (zh) * | 2015-11-19 | 2018-04-13 | 重庆华万伦电器有限公司 | 弹力夹夹持式铝合金散热片 |
EP3444839A1 (en) * | 2017-08-18 | 2019-02-20 | Infineon Technologies Austria AG | Assembly and method for mounting an electronic component to a substrate |
US11076477B2 (en) * | 2017-10-03 | 2021-07-27 | Mks Instruments, Inc. | Cooling and compression clamp for short lead power devices |
EP4170708A1 (en) * | 2019-03-15 | 2023-04-26 | Infineon Technologies Austria AG | An electronic module comprising a semiconductor package with integrated clip and fastening element |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3548927A (en) * | 1968-11-29 | 1970-12-22 | Intern Electronic Research Co | Heat dissipating retainer for electronic component |
US3694703A (en) * | 1970-09-02 | 1972-09-26 | Staver Co Inc The | Heat dissipator for encased semiconductor device having heat tab extending therefrom |
US3786317A (en) * | 1972-11-09 | 1974-01-15 | Bell Telephone Labor Inc | Microelectronic circuit package |
US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
JPS5266376A (en) * | 1975-11-29 | 1977-06-01 | Hitachi Ltd | Device and manufacture of resin body type semiconductor |
DE2712543C2 (de) * | 1976-03-24 | 1982-11-11 | Hitachi, Ltd., Tokyo | Anordnung eines Halbleiterbauelements auf einer Montageplatte |
-
1978
- 1978-03-09 IT IT7821073U patent/IT7821073V0/it unknown
-
1979
- 1979-02-27 FR FR7904950A patent/FR2419659A7/fr not_active Expired
- 1979-03-08 DE DE19797906405U patent/DE7906405U1/de not_active Expired
- 1979-03-08 US US06/018,638 patent/US4259685A/en not_active Expired - Lifetime
- 1979-03-09 GB GB7908391A patent/GB2018345B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE7906405U1 (de) | 1979-07-26 |
GB2018345A (en) | 1979-10-17 |
GB2018345B (en) | 1982-03-31 |
US4259685A (en) | 1981-03-31 |
FR2419659A7 (fr) | 1979-10-05 |
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