JP5439309B2 - 電力変換装置 - Google Patents
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- JP5439309B2 JP5439309B2 JP2010168813A JP2010168813A JP5439309B2 JP 5439309 B2 JP5439309 B2 JP 5439309B2 JP 2010168813 A JP2010168813 A JP 2010168813A JP 2010168813 A JP2010168813 A JP 2010168813A JP 5439309 B2 JP5439309 B2 JP 5439309B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
なお、上述した実施の形態では、パワーモジュール1の固定のために押さえ板17を使用している。これは、ケーシング13を鍛造で作製するため純アルミ系の非常に軟らかい材料を使用しているため、押さえ板17を用いないでフランジ部13bをボルト固定すると、シール部材16の反発力でフランジ部13bが変形してしまうためである。したがって、押さえ板17は鋼などの材料で作製するが、押さえ板17に発生する応力を下げるためにケーシング13のフランジ部13bにもボルトを通すボルト孔13cを設け、共締めする形態を採っている。また、図9,17に示すように、フランジ部13bにおけるボルト孔13cの位置をずらすことで、図5に示すようにパワーモジュール1を一直線に複数並べた際に、ボルトが互い違いに配置されることによって、実装時の全長を短くすることを狙ったものである。
Claims (6)
- パワー半導体素子のスイッチング動作によって電力を直流から交流に、交流から直流に変換する電力変換装置であって、
冷却媒体が流れる流路が形成され、前記流路と連通する開口部が形成された流路筐体と、
パワー半導体素子を収納するとともに前記開口部から前記流路内に挿入される筒部、前記筒部の外周の一方面に設けられた第1放熱フィン群、及び前記筒部の外周の一方面とは反対側の他方面に設けられた第2放熱フィン群を有するパワーモジュールと、
前記冷却媒体を前記第1放熱フィン群へと導く第1流路制御部材、前記筒部を挟んで前記第1流路制御部材と対向して配置されかつ前記冷却媒体を前記第2放熱フィン群へと導く第2流路制御部材、及び前記第1流路制御部材と前記第2流路制御部材とを連結するリング部を有するシール部材と、を備え、
前記シール部材は、前記筒部に装着されることを特徴とする電力変換装置。 - 請求項1に記載の電力変換装置において、
前記筒部は、前記開口部を塞ぐように前記流路筐体に固定されるフランジ部を備え、
前記リング部は前記流路筐体と前記フランジ部との間に設けられ、
前記第1流路部材および前記第2流路制御部材は、前記フランジ部と前記放熱フィン群との間の隙間に配置されることを特徴とする電力変換装置。 - 請求項2に記載の電力変換装置において、
前記第1流路制御部材は、該第1流路制御部材と前記第1放熱フィン群との最小間隔が、前記第1放熱フィン群のフィン間隔以下となるように配置され、
前記第2流路制御部材は、該第2流路制御部材と前記第2放熱フィン群との最小間隔が、前記第2放熱フィン群のフィン間隔以下となるように配置されていることを特徴とする電力変換装置。 - 請求項2または3に記載の電力変換装置において、
前記第1及び第2流路制御部材は、それぞれ、前記隙間内において、前記冷却媒体の流れ方向に沿って連続的に分布していることを特徴とする電力変換装置。 - 請求項4に記載の電力変換装置において、
前記第1流路制御部材の形状を、該第1流路制御部材と前記第1放熱フィン群との間隔が前記冷却媒体の流れ方向に沿って減少するような形状とし、
前記第2流路制御部材の形状を、該第2流路制御部材と前記第2放熱フィン群との間隔が前記冷却媒体の流れ方向に沿って減少するような形状としたことを特徴とする電力変換装置。 - 請求項4に記載の電力変換装置において、
前記第1流路制御部材の形状を、該第1流路制御部材と前記第1放熱フィン群との間隔が前記第1放熱フィン群の流れ方向中央において最小となり、かつ、前記流れ方向中央から離れるに従って増加するような形状とし、
前記第2流路制御部材の形状を、該第2流路制御部材と前記第2放熱フィン群との間隔が前記第2放熱フィン群の流れ方向中央において最小となり、かつ、前記流れ方向中央から離れるに従って増加するような形状としたことを特徴とする電力変換装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010168813A JP5439309B2 (ja) | 2010-07-28 | 2010-07-28 | 電力変換装置 |
EP11812431.2A EP2600516B1 (en) | 2010-07-28 | 2011-07-25 | Power converter |
PCT/JP2011/066853 WO2012014842A1 (ja) | 2010-07-28 | 2011-07-25 | 電力変換装置 |
US13/811,497 US9078376B2 (en) | 2010-07-28 | 2011-07-25 | Power conversion device |
CN201180036876.6A CN103026605B (zh) | 2010-07-28 | 2011-07-25 | 电力转换装置 |
Applications Claiming Priority (1)
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JP2010168813A JP5439309B2 (ja) | 2010-07-28 | 2010-07-28 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
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JP2012029539A JP2012029539A (ja) | 2012-02-09 |
JP5439309B2 true JP5439309B2 (ja) | 2014-03-12 |
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Country Status (5)
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US (1) | US9078376B2 (ja) |
EP (1) | EP2600516B1 (ja) |
JP (1) | JP5439309B2 (ja) |
CN (1) | CN103026605B (ja) |
WO (1) | WO2012014842A1 (ja) |
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JP5370448B2 (ja) * | 2011-09-19 | 2013-12-18 | 株式会社デンソー | 電力変換装置 |
JP5949286B2 (ja) * | 2012-07-31 | 2016-07-06 | 株式会社デンソー | 電力変換装置 |
JP2014072395A (ja) | 2012-09-28 | 2014-04-21 | Toyota Industries Corp | 冷却装置 |
JP6262422B2 (ja) | 2012-10-02 | 2018-01-17 | 昭和電工株式会社 | 冷却装置および半導体装置 |
EP2802198B1 (en) * | 2013-05-08 | 2017-07-26 | Kabushiki Kaisha Toshiba | Power conversion apparatus |
JP6101609B2 (ja) * | 2013-09-20 | 2017-03-22 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュール及びそれを用いた電力変換装置 |
WO2015053140A1 (ja) * | 2013-10-07 | 2015-04-16 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US20150138734A1 (en) * | 2013-11-18 | 2015-05-21 | Magna Electronics Inc. | 360 degree direct cooled power module |
JP6193173B2 (ja) * | 2014-04-17 | 2017-09-06 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP6286543B2 (ja) * | 2014-06-25 | 2018-02-28 | 株式会社日立製作所 | パワーモジュール装置、電力変換装置およびパワーモジュール装置の製造方法 |
JP6286039B2 (ja) * | 2014-06-26 | 2018-02-28 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュールおよびパワー半導体モジュールの製造方法 |
JP6302803B2 (ja) * | 2014-09-09 | 2018-03-28 | 日立オートモティブシステムズ株式会社 | パワー半導体モジュール及びその製造方法、電力変換装置 |
US9978692B2 (en) * | 2015-02-10 | 2018-05-22 | Mediatek Inc. | Integrated circuit, electronic device and method for transmitting data in electronic device |
US10037952B2 (en) * | 2015-02-10 | 2018-07-31 | Mediatek Inc. | Integrated circuit, electronic device and method for transmitting data in electronic device |
US10818573B2 (en) * | 2015-08-26 | 2020-10-27 | Hitachi Automotive Systems, Ltd. | Power semiconductor module with heat dissipation plate |
WO2017149801A1 (ja) * | 2016-03-02 | 2017-09-08 | 三菱電機株式会社 | 電力変換装置 |
US20190123659A1 (en) * | 2016-04-28 | 2019-04-25 | Hitachi Automotive Systems, Ltd. | Power Converter |
CN112005483A (zh) * | 2018-04-06 | 2020-11-27 | 日本电产株式会社 | 电力转换装置 |
JP7159620B2 (ja) * | 2018-05-30 | 2022-10-25 | 富士電機株式会社 | 半導体装置、冷却モジュール、電力変換装置及び電動車両 |
JP7208757B2 (ja) * | 2018-10-03 | 2023-01-19 | 川崎重工業株式会社 | 制御装置 |
JP7233014B2 (ja) * | 2018-12-26 | 2023-03-06 | パナソニックIpマネジメント株式会社 | 電力変換装置 |
JP6777203B2 (ja) * | 2019-08-09 | 2020-10-28 | 株式会社デンソー | 電力変換装置 |
JP2022188312A (ja) * | 2019-11-27 | 2022-12-21 | 日立Astemo株式会社 | パワーモジュールおよびパワーモジュールの製造方法 |
JP7419050B2 (ja) | 2019-12-16 | 2024-01-22 | 日立Astemo株式会社 | パワーモジュール、電力変換装置、およびパワーモジュールの製造方法 |
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2010
- 2010-07-28 JP JP2010168813A patent/JP5439309B2/ja active Active
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2011
- 2011-07-25 CN CN201180036876.6A patent/CN103026605B/zh active Active
- 2011-07-25 US US13/811,497 patent/US9078376B2/en active Active
- 2011-07-25 EP EP11812431.2A patent/EP2600516B1/en active Active
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Publication number | Publication date |
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EP2600516B1 (en) | 2020-09-30 |
JP2012029539A (ja) | 2012-02-09 |
EP2600516A1 (en) | 2013-06-05 |
US20130128646A1 (en) | 2013-05-23 |
US9078376B2 (en) | 2015-07-07 |
WO2012014842A1 (ja) | 2012-02-02 |
CN103026605A (zh) | 2013-04-03 |
CN103026605B (zh) | 2015-09-09 |
EP2600516A4 (en) | 2018-01-24 |
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