JP7116178B2 - パワー半導体装置 - Google Patents
パワー半導体装置 Download PDFInfo
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- JP7116178B2 JP7116178B2 JP2020541057A JP2020541057A JP7116178B2 JP 7116178 B2 JP7116178 B2 JP 7116178B2 JP 2020541057 A JP2020541057 A JP 2020541057A JP 2020541057 A JP2020541057 A JP 2020541057A JP 7116178 B2 JP7116178 B2 JP 7116178B2
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Description
本発明の第1の実施の形態を図1~図4を参照しつつ説明する。
本発明の第1の実施の形態の変形例を図6を参照しつつ説明する。本変形例では、第1の実施の形態との相違点についてのみ説明するものとし、図面における第1の実施の形態と同様の部材には同じ符号を付し、説明を省略する。
なお、本発明は上記の実施の形態に限定されるものではなく、その要旨を逸脱しない範囲内の様々な変形例や他の技術との組み合わせが含まれる。また、本発明は、上記の実施の形態で説明した全ての構成を備えるものに限定されず、その構成の一部を削除したものも含まれる。
Claims (6)
- パワー半導体素子と、
前記パワー半導体素子を設置する金属製の第一導体部、前記パワー半導体素子に電流を伝達する1つ以上の主端子と前記パワー半導体素子にスイッチング制御信号を伝達する1つ以上の制御端子とを構成する金属製の第二導体部、及び、前記制御端子の先端部に設けられた金属製の第三導体部により一体化して構成された素子設置導体とを備え、
前記素子設置導体は、前記第一導体部の厚さよりも前記第二導体部の最も厚い部分の厚さが薄くなるように、かつ、前記第二導体部の最も薄い部分の厚さよりも前記第三導体部の最も厚い部分の厚さが薄くなるように形成されることで、前記第一導体部から前記第二導体部を介して第三導体部にいくのに従って段階的に薄くなるように形成されたことを特徴とするパワー半導体装置。 - 請求項1に記載のパワー半導体装置において、
前記第三導体部は、前記第三導体部の延在方向から逸れるように形成された第一曲げ部を有することを特徴とするパワー半導体装置。 - 請求項1に記載のパワー半導体装置において、
前記主端子は前記第二導体部により形成されるとともに、前記制御端子は前記第二導体部及び前記第三導体部により形成され、
前記主端子の第二導体部の側面は前記制御端子の第二導体部の側面と対向するように形成されたことを特徴とするパワー半導体装置。 - 請求項1に記載のパワー半導体装置において、
前記第一導体部の全体と前記第二導体部の一部とを封止する封止樹脂を備え、
前記主端子と前記制御端子は、前記封止樹脂から同一方向に突出するように形成されたことを特徴とするパワー半導体装置。 - 請求項4に記載のパワー半導体装置において、
前記第二導体部は、前記封止樹脂からの突出方向に対して屈曲する第二曲げ部を有することを特徴とするパワー半導体装置。 - 請求項1に記載のパワー半導体装置において、
前記主端子及び前記制御端子の第二導体部の側面の対向する部分には、前記主端子及び前記制御端子の相対位置を固定するタイバの切断面がそれぞれ形成されるパワー半導体装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018165620 | 2018-09-05 | ||
JP2018165620 | 2018-09-05 | ||
PCT/JP2019/029368 WO2020049891A1 (ja) | 2018-09-05 | 2019-07-26 | パワー半導体装置 |
Publications (2)
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JPWO2020049891A1 JPWO2020049891A1 (ja) | 2021-08-12 |
JP7116178B2 true JP7116178B2 (ja) | 2022-08-09 |
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JP2020541057A Active JP7116178B2 (ja) | 2018-09-05 | 2019-07-26 | パワー半導体装置 |
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Country | Link |
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US (1) | US11482476B2 (ja) |
JP (1) | JP7116178B2 (ja) |
CN (1) | CN112640099A (ja) |
DE (1) | DE112019003162T5 (ja) |
WO (1) | WO2020049891A1 (ja) |
Families Citing this family (1)
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US20200203255A1 (en) * | 2018-12-19 | 2020-06-25 | Abb Schweiz Ag | Cooling of power semiconductors |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012005322A (ja) | 2010-06-21 | 2012-01-05 | Hitachi Automotive Systems Ltd | パワー半導体装置及びそれを用いた電力変換装置 |
JP2014045157A (ja) | 2012-08-29 | 2014-03-13 | Hitachi Automotive Systems Ltd | パワー半導体モジュール |
WO2015136968A1 (ja) | 2014-03-10 | 2015-09-17 | トヨタ自動車株式会社 | 半導体装置 |
WO2016080521A1 (ja) | 2014-11-20 | 2016-05-26 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
WO2017056686A1 (ja) | 2015-09-30 | 2017-04-06 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2018073892A (ja) | 2016-10-26 | 2018-05-10 | 日立オートモティブシステムズ株式会社 | 回路体および回路体の製造方法 |
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JPS5834748U (ja) * | 1981-08-28 | 1983-03-07 | 日本電気ホームエレクトロニクス株式会社 | 気密端子 |
JPH07211839A (ja) * | 1994-01-18 | 1995-08-11 | Toppan Printing Co Ltd | リードフレーム |
JP5846123B2 (ja) | 2010-11-29 | 2016-01-20 | トヨタ自動車株式会社 | パワーモジュール |
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2019
- 2019-07-26 WO PCT/JP2019/029368 patent/WO2020049891A1/ja active Application Filing
- 2019-07-26 CN CN201980056162.8A patent/CN112640099A/zh active Pending
- 2019-07-26 DE DE112019003162.7T patent/DE112019003162T5/de active Pending
- 2019-07-26 JP JP2020541057A patent/JP7116178B2/ja active Active
- 2019-07-26 US US17/273,620 patent/US11482476B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012005322A (ja) | 2010-06-21 | 2012-01-05 | Hitachi Automotive Systems Ltd | パワー半導体装置及びそれを用いた電力変換装置 |
JP2014045157A (ja) | 2012-08-29 | 2014-03-13 | Hitachi Automotive Systems Ltd | パワー半導体モジュール |
WO2015136968A1 (ja) | 2014-03-10 | 2015-09-17 | トヨタ自動車株式会社 | 半導体装置 |
WO2016080521A1 (ja) | 2014-11-20 | 2016-05-26 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
WO2017056686A1 (ja) | 2015-09-30 | 2017-04-06 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2018073892A (ja) | 2016-10-26 | 2018-05-10 | 日立オートモティブシステムズ株式会社 | 回路体および回路体の製造方法 |
Also Published As
Publication number | Publication date |
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DE112019003162T5 (de) | 2021-03-25 |
US11482476B2 (en) | 2022-10-25 |
CN112640099A (zh) | 2021-04-09 |
US20210366812A1 (en) | 2021-11-25 |
WO2020049891A1 (ja) | 2020-03-12 |
JPWO2020049891A1 (ja) | 2021-08-12 |
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