JP2003526937A - フリップチップ接合構造 - Google Patents

フリップチップ接合構造

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Publication number
JP2003526937A
JP2003526937A JP2001566849A JP2001566849A JP2003526937A JP 2003526937 A JP2003526937 A JP 2003526937A JP 2001566849 A JP2001566849 A JP 2001566849A JP 2001566849 A JP2001566849 A JP 2001566849A JP 2003526937 A JP2003526937 A JP 2003526937A
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JP
Japan
Prior art keywords
chip
deformable material
bonding structure
flip
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001566849A
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English (en)
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JP4903966B2 (ja
Inventor
ラジェンドラ ペンドセ
Original Assignee
チップパック，インク．
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Publication of JP2003526937A publication Critical patent/JP2003526937A/ja
Application granted granted Critical
Publication of JP4903966B2 publication Critical patent/JP4903966B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】 【課題】 少ない圧力及び低い温度でチップと基板を強固に接合するフリップチップ接合構造を提供する。 【解決手段】 第１要素と第２要素の機械的な接合によって形成されるフリップチップ接合構造であって、第１要素が、低降伏強さ且つ高破断伸びを有する柔軟で変形可能な材料からなる集積回路上のバンプで、第２要素の表面には第１要素が加圧下可塑的に変形して流れ込み、機械的な噛み合わせを形成する凹凸が備えられているフリップチップ接合構造。

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】
本発明はフリップチップ接合構造に関し、更に詳しくは、機械的な変形と接合
される表面間にある凹凸の噛み合わせとによって形成される接合構造に関する。
【０００２】
【従来の技術・発明が解決しようとする課題】
集積回路（ＩＣ）のチップと基板とのフリップチップ接合は普通、電子パッケ
ージ組立品内においてなされている。このような接合の最も一般的な形態は、Ｉ
Ｃチップ上にあるバンプが基板上に形成されたパッドに冶金的に、通常バンプ材
料を溶融して接合される。この方法は強固な接合を提供するが、溶融および固化
工程中に橋絡（すなわち、隣接した接合箇所間のショート）するリスクがあるた
め、接合箇所のピッチを小さくすることが難しい。他の方法として、微粒子フィ
ルムあるいはペーストを用いる方法があり、ペーストあるいはフィルム中の導電
性微粒子が樹脂の収縮とともに電気的な接合を行う。この方法は、接合箇所のピ
ッチを減少できるが、微粒子接合の妨害感受性のため、長時間の信頼性に限界が
あり、規定時間を超えると性能が低下する。
【０００３】
【課題を解決するための手段】
本発明は、フィリップチップ接合構造を形成する方法であって、 低降伏強さ且つ高破断伸びを有する変形可能な材料からなる第１要素をＩＣチ
ップ上に配設し、前記第１要素と結合される部分に凹凸表面を有する第２要素を
基板上に配設する工程と、 前記第１要素の一部が前記第２要素の凹凸表面に可塑的な流れを起こすに足り
る力で、該第１要素及び第２要素を互いに押し付け合う工程とを含むことを特徴
とするフリップチップ接合構造を形成する方法を提供する。
【０００４】 一態様においては、前記第１要素は、ＩＣチップ上に形成されたバンプとされ
、典型的にはそのようなバンプのセットとされる。特に有用な第１要素の変形可
能な材料として、金が挙げられる。一態様においては、前記第２要素は、基板上
に形成されたリード、パッドおよびバイアオープニングとされる。該態様におい
ては、第２要素は、通常のめっき表面処理が施された表面パッドであって、本発
明に従って凹凸が設けられた表面パッドとされる。
【０００５】 又本発明は、本発明の方法によって製造されたフリップチップ接合構造を提供
する。
【０００６】 更に本発明は、チップに接続した第１要素と基板に接続した第２要素とを備え
るフリップチップ接合構造であって、第１要素が変形可能な材料であって、第１
及び第２要素が、第１要素の変形可能な材料の第２要素の表面の凹凸への機械的
な噛み合いによって接合されているフリップチップ接合構造を提供する。
【０００７】
【発明の実施の形態】
図１Ａ、１Ｂに概略的に表されているように、１０で示されるフリップチップ
接合構造は、第１要素１２と第２要素１４とを備える。第１要素１２はＩＣチッ
プ上に形成されたバンプが好ましく、第２要素１４は基板上に形成されたリード
及びパッドが好ましい。第１要素１２は、柔軟で変形可能な材料であって、低降
伏強さ及び高破断伸びをもつもので構成されているのがさらに好ましい。第２要
素１４は、通常のめっき表面仕上げがされ、該表面に凹凸１６（図では大げさに
表されている）が形成された基板パッドを含むものが更に好ましい。凹凸の寸法
は普通１μｍ〜２５μｍのオーダ−である。バンプは通常の規格材料、すなわち
、ある特定の形にされた、約２５０ｇの垂直荷重に等しい力がかかった時約２５
μｍを越える塑性変形に耐える材料である。本発明のバンプ用の材料として、金
は特に有用である。
【０００８】 接合は、第１要素１２と第２要素１４とを互いに押しつけあい、第１要素から
第２要素へ可塑的流れを起こすことによって行われる。第１要素１２の高さおよ
び柔軟さのため、接合が達成した後でもかなりの変形が起こる。従って、結合さ
せるべきバンプ／パッドペアの平面性が劣っていても、接合は首尾よくいく。接
合に必要な圧力及び温度は、継ぎ合せる材料の冶金的拡散が要求される従来の熱
圧着に必要とされる圧力及び温度に比べると非常に小さい。これらが低減するた
め、チップ上に起こるダメージが非常に少なくなる。特に同時に行う接合の数が
多い場合、ダメージは非常に少なくなる。
【０００９】 第２の実施の形態を図２Ａ、２Ｂに示す。第１要素２２が第２要素あるいはト
レース２８の側壁２４およびエッジ２６の周りに可塑的に流れることによって、
２０で示される微細噛み合い形状が形成される。第１要素２２の材料の流れは側
壁２４の周りに起こり、隣接するトレース間の領域には起こらず、同じ面内の垂
直方向に起こるのが好ましい。噛み合い形状２０は、接合力をあまり増大させず
、噛み合う表面積を増大させているため、より強固な接合を提供する。さらに、
チップ面に対して垂直方向に付加的に移動するため、複数の継ぎ合せ面の共平面
性が劣っていても、容認できる範囲が広い。最後に、該接合は、通常のチップ面
に対する水平の噛み合わせに加えて、チップ面に対して垂直方向の面に沿う噛み
合わせもあるので、ダイと基板間の垂直方向の相対運動に対して保護されている
。
【００１０】 第３の実施の形態を図３Ａ、３Ｂに示す。図中、接合は３０で示されている。
第１要素３２の材料が第２要素３４周りに可塑的に流れることによって、接合３
０が形成される。第２要素３４の幅は第１要素３２より小さく、従って、第１要
素３２の材料は、第２要素３４の両サイド３６、３８に可塑的に流れる。
【００１１】 第４の実施の形態を図４Ａ，４Ｂに示す。図中、接合は４０で示されている。
第２要素４２のリードの形はＶ字型で、サブトラクティブエッチング法によって
造られる、実際使用されている基板の中で最も典型的な “アンダーカット”リ
ードの形をしているという利点がある。接合４０は、第１要素４４の材料が第２
要素４２の周りに可塑的に流れることによって形成される。図示された構成は、
トレースの最小幅の制限、特に従来のワイヤボンディング法では必要であった水
平域４６の最小幅の制限がない。接合４０は、バイアパッドに直接、あるいはバ
イアホールを介して基板の次の低層に結合して形成することも意図されている。
【００１２】 図２Ａ、２Ｂ、３Ａ、３Ｂ、４Ａ、４Ｂ中の微細噛み合い形状によって、より
小さい力で接合を形成することができ、例えば、図１Ａ、１Ｂで示されている実
施の形態に比べて２だけ下がる。このように、圧縮力を低減させると加工中にチ
ップに加わるダメージがより少なくなる。
【００１３】 好ましい実施の形態として、接着性樹脂がチップと基板との隙間に塗布される
。こうすると、硬化した樹脂によって供給された圧力が、電気接続の長時間保持
特性をさらに改良する。接着性樹脂は、継ぎ合わせ面が接合する前に塗布され、
前記接合の形成時に硬化する。圧力をかけて樹脂材料を前記継ぎ合わせ面から取
り除き、所望の機械的に噛み合った接合を形成する。あるいは、樹脂はアンダー
フィル法によって、接合の後に塗布することもできる。
【００１４】 好ましい実施の形態において、第１要素１２、２２、３２、４２の材料として
、Ｃｕ、非電着性ＮｉＡｕおよびＡｕが好ましい。基板材料としては、片面ＦＲ
５ラミネート、２面ＢＴ−樹脂ラミネートが好ましい。
【００１５】 バンプは、前記したように、圧縮変形前は長方形の断面をもつものの他、種々
の形状がある。特に２つの有用なものとして、図５、図６に線図で示す。図５は
、“階段”形状のものを示し、チップに隣接する部分（べース）が、基板上のパ
ッドに対して押しつけられる部分（先端）より広くなっている。図６は、“スタ
ッドバンプ”形状を示し、ベースの周辺形状が円形で、先端より広くなっている
。これらの構造はどちらも、先端の寸法がより小さいので、バンプと基板上の凹
凸との追従性（コンプライアンス）が改良され、ベース形状がより広くなってい
るため、形状安定性が良好である。
【００１６】 第２要素は、前記したように、リードでもパッドでもよい。バンプは、バイア
ホールに電気的に接合している従来のハンダパッドに接合してもよい。別の実施
の形態として、第２要素そのものがバイアホールを含んでいてもよい。この実施
の形態によれば、ハンダパッドのようなパッドの上にバンプを押しつけるという
より、バンプをバイアホール内及び縁にある導電性材料に直接押しつけるため、
バイアホールから少し離れて、接合が形成される。こうするとチップ上の面積を
より効率的に使えることとなる。バイアホール中の開口は概して、バンプの先端
より小さく、従って、バンプはバイアホールに直接プレスされ、バイアホールの
中へと変形し始め、接合される。事実、バイアホールはこの構造において、凹凸
として働き、バンプはバイアホールより小さいのでバイアホール中に入り込み、
従って結合がバイアオープニングのリムの部分に形成される。
【図面の簡単な説明】
【図１Ａ】 本発明のチップ接合構造を備える組立品を製造する工程における
実施の形態を示す断面概略図。
【図１Ｂ】 本発明のチップ接合構造を備える組立品を製造する工程における
実施の形態を示す断面概略図。
【図２Ａ】 本発明のチップ接合構造を備える組立品を製造する工程における
第２の実施の形態を示す断面概略図。
【図２Ｂ】 本発明のチップ接合構造を備える組立品を製造する工程における
第２の実施の形態を示す断面概略図。
【図３Ａ】 本発明のチップ接合構造を備える組立品を製造する工程における
第３の実施の形態を示す断面概略図。
【図３Ｂ】 本発明のチップ接合構造を備える組立品を製造する工程における
第３の実施の形態を示す断面概略図。
【図４Ａ】 本発明のチップ接合構造を備える組立品を製造する工程における
第４の実施の形態を示す断面概略図。
【図４Ｂ】 本発明のチップ接合構造を備える組立品を製造する工程における
第４の実施の形態を示す断面概略図。
【図５】 本発明で有用な接合用バンプの別の形を示す断面概略図。
【図６】 本発明で有用な接合用バンプの又別の形を示す断面概略図。
【手続補正書】
【提出日】平成１４年１１月２７日（２００２．１１．２７）
【手続補正１】
【補正対象書類名】明細書
【補正対象項目名】特許請求の範囲
【補正方法】変更
【補正の内容】
【特許請求の範囲】
───────────────────────────────────────────────────── フロントページの続き (81)指定国 ＥＰ(ＡＴ，ＢＥ，ＣＨ，ＣＹ， ＤＥ，ＤＫ，ＥＳ，ＦＩ，ＦＲ，ＧＢ，ＧＲ，ＩＥ，Ｉ Ｔ，ＬＵ，ＭＣ，ＮＬ，ＰＴ，ＳＥ，ＴＲ)，ＪＰ，Ｋ Ｒ，ＳＧ

Claims (17)

    【特許請求の範囲】
  1. 【請求項１】 フィリップチップ接合構造を形成する方法であって、 低降伏強さ且つ高破断伸びを有する変形可能な材料からなる第１要素をＩＣチ
    ップ上に配設し、前記第１要素と結合される部分に凹凸表面を有する第２要素を
    基板上に配設する工程と、 前記第１要素の一部が前記第２要素の凹凸表面に可塑的な流れを起こすに足り
    る力で、該第１要素及び第２要素を互いに押し付け合う工程とを含むことを特徴
    とするフリップチップ接合構造を形成する方法。
  2. 【請求項２】 前記第１要素がＩＣチップ上に形成されたバンプである請求項
    １記載の方法。
  3. 【請求項３】 前記第１要素の変形可能な材料が金を含む請求項１記載の方法
    。
  4. 【請求項４】 前記第２要素が表面パッドである請求項１記載の方法。
  5. 【請求項５】 前記第２要素がリードである請求項１記載の方法。
  6. 【請求項６】 前記第２要素がバイアオープニングである請求項１記載の方法
    。
  7. 【請求項７】 第２要素はハンダ仕上げが施されている請求項１記載の方法。
  8. 【請求項８】 前記バンプがバンプのセットを含む請求項１記載の方法。
  9. 【請求項９】 請求項１記載の方法によって造られるフリップチップ接合構造
    。
  10. 【請求項１０】 チップに接続した第１要素と基板に接続した第２要素とを備
    えるフリップチップ接合構造であって、第１要素が変形可能な材料であって、第
    １及び第２要素が、第１要素の変形可能な材料の第２要素の凹凸表面への機械的
    な噛み合いによって接合されているフリップチップ接合構造。
  11. 【請求項１１】 前記第１要素が前記チップ上に形成されたバンプを含む請求
    項１０記載のフリップチップ接合構造。
  12. 【請求項１２】 前記第１要素の変形可能な材料が金を含む請求項１０記載の
    方法。
  13. 【請求項１３】 前記第２要素が表面パッドを含む請求項１０記載の方法。
  14. 【請求項１４】 前記第２要素がリードを含む請求項１０記載の方法。
  15. 【請求項１５】 前記第２要素がバイアオープニングを含む請求項１０記載の
    方法。
  16. 【請求項１６】 第２要素はハンダ仕上げが施されている請求項１０記載の方
    法。
  17. 【請求項１７】 前記バンプがバンプのセットを含む請求項１０記載の方法。
JP2001566849A 2000-03-10 2001-03-09 フリップチップ接合構造及びフリップチップ接合構造を形成する方法 Expired - Lifetime JP4903966B2 (ja)

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Application Number Priority Date Filing Date Title
US18857000P 2000-03-10 2000-03-10
US60/188,570 2000-03-10
US09/802,664 2001-03-09
PCT/US2001/007580 WO2001068311A1 (en) 2000-03-10 2001-03-09 Flip chip interconnection structure
US09/802,664 US6815252B2 (en) 2000-03-10 2001-03-09 Method of forming flip chip interconnection structure

Publications (2)

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EP1278612B1 (en) 2010-02-24
WO2001068311A1 (en) 2001-09-20
US20110260321A1 (en) 2011-10-27
KR20020089379A (ko) 2002-11-29
DE60141391D1 (de) 2010-04-08
US6815252B2 (en) 2004-11-09
US20140145340A1 (en) 2014-05-29
US20010055835A1 (en) 2001-12-27
US20040212098A1 (en) 2004-10-28
KR100817646B1 (ko) 2008-03-27
US8697490B2 (en) 2014-04-15

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