JP2003183875A5 - - Google Patents

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JP2003183875A5
JP2003183875A5 JP2002289346A JP2002289346A JP2003183875A5 JP 2003183875 A5 JP2003183875 A5 JP 2003183875A5 JP 2002289346 A JP2002289346 A JP 2002289346A JP 2002289346 A JP2002289346 A JP 2002289346A JP 2003183875 A5 JP2003183875 A5 JP 2003183875A5
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JP4651906B2 (ja
JP2003183875A (ja
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Priority claimed from US09/970,348 external-priority patent/US6736954B2/en
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JP2002289346A 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法 Expired - Fee Related JP4651906B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970,348 US6736954B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate
US09/970348 2001-10-02

Related Child Applications (1)

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JP2009050353A Division JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法

Publications (3)

Publication Number Publication Date
JP2003183875A JP2003183875A (ja) 2003-07-03
JP2003183875A5 true JP2003183875A5 (https=) 2007-03-08
JP4651906B2 JP4651906B2 (ja) 2011-03-16

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JP2002289346A Expired - Fee Related JP4651906B2 (ja) 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法
JP2009050353A Pending JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法
JP2013217639A Pending JP2014037634A (ja) 2001-10-02 2013-10-18 基体上に金属層を堆積させるためのメッキ浴および方法

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JP2009050353A Pending JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法
JP2013217639A Pending JP2014037634A (ja) 2001-10-02 2013-10-18 基体上に金属層を堆積させるためのメッキ浴および方法

Country Status (6)

Country Link
US (2) US6736954B2 (https=)
EP (1) EP1308540B1 (https=)
JP (3) JP4651906B2 (https=)
KR (1) KR20030028693A (https=)
DE (1) DE60141143D1 (https=)
TW (1) TWI227284B (https=)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7122108B2 (en) * 2001-10-24 2006-10-17 Shipley Company, L.L.C. Tin-silver electrolyte
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US7279423B2 (en) * 2002-10-31 2007-10-09 Intel Corporation Forming a copper diffusion barrier
US20070037005A1 (en) * 2003-04-11 2007-02-15 Rohm And Haas Electronic Materials Llc Tin-silver electrolyte
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
KR100557549B1 (ko) * 2003-12-29 2006-03-03 삼성전기주식회사 플립칩 범프 패드 형성 방법 및 그 구조
DE602005022650D1 (de) * 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Verbessertes Plattierungsverfahren
US20060037861A1 (en) * 2004-08-23 2006-02-23 Manos Paul D Electrodeposition process
JP4589695B2 (ja) * 2004-10-29 2010-12-01 ディップソール株式会社 錫又は錫合金めっき浴及びそれを用いためっき方法
JP2006283169A (ja) * 2005-04-04 2006-10-19 Okuno Chem Ind Co Ltd 酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法
US20090104463A1 (en) * 2006-06-02 2009-04-23 Rohm And Haas Electronic Materials Llc Gold alloy electrolytes
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
US20060280860A1 (en) * 2005-06-09 2006-12-14 Enthone Inc. Cobalt electroless plating in microelectronic devices
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
JP5094418B2 (ja) * 2006-01-13 2012-12-12 株式会社ネオス 金属腐食防止剤組成物
JP4862445B2 (ja) * 2006-03-22 2012-01-25 Ｊｆｅスチール株式会社 電気亜鉛めっき鋼板の製造方法
ES2669050T3 (es) * 2006-03-31 2018-05-23 Atotech Deutschland Gmbh Depósito de cromo cristalino
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
EP1897975B1 (en) * 2006-09-07 2012-03-14 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US8366901B2 (en) * 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
WO2008126522A1 (ja) * 2007-03-15 2008-10-23 Nippon Mining & Metals Co., Ltd. 銅電解液及びそれを用いて得られた２層フレキシブル基板
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US7858146B2 (en) 2007-06-29 2010-12-28 Rohm And Haas Electronic Materials Llc Method of electrolessly depositing metal on the walls of through-holes
BRPI0817924B1 (pt) 2007-10-02 2019-02-12 Atotech Deutschland Gmbh Depósito de liga de cromo funcional cristalino eletrodepositado, banho de eletrodeposição para eletrodepositar um depósito de liga de cromo funcional cristalinonanogranular, e processo para eletrodepositar um depósito de liga de cromo cristalino funcional nanogranular em um substrato
US9512012B2 (en) * 2007-12-08 2016-12-06 Comsats Institute Of Information Technology Sonoelectrolysis for metal removal
US9657400B2 (en) * 2008-06-10 2017-05-23 General Electric Company Electrolyzer assembly method and system
US9045839B2 (en) * 2008-06-10 2015-06-02 General Electric Company Methods and systems for in-situ electroplating of electrodes
US20090301868A1 (en) * 2008-06-10 2009-12-10 General Electric Company Methods and systems for assembling electrolyzer stacks
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
US8277620B2 (en) * 2008-09-30 2012-10-02 General Electric Company Electrolyzer module forming method and system
US9080242B2 (en) * 2008-09-30 2015-07-14 General Electric Company Pressurized electrolysis stack with thermal expansion capability
JP4855494B2 (ja) * 2009-04-14 2012-01-18 日本エレクトロプレイテイング・エンジニヤース株式会社 イリジウムめっき液及びそのめっき方法
US20110120543A1 (en) * 2009-11-20 2011-05-26 Levy David H Method for selective deposition and devices
KR20130108978A (ko) * 2010-06-11 2013-10-07 알쉬메 구리 도금 조성물 및 이 조성물을 사용한 반도체 기판에서 공동을 충진하기 위한 공정
FR2961220B1 (fr) * 2010-06-11 2012-08-17 Alchimer Composition d'electrodeposition de cuivre et procede de remplissage d'une cavite d'un substrat semi-conducteur utilisant cette composition
US20120064225A1 (en) * 2010-09-13 2012-03-15 Applied Materials, Inc. Spray deposition module for an in-line processing system
US8512541B2 (en) * 2010-11-16 2013-08-20 Trevor Pearson Electrolytic dissolution of chromium from chromium electrodes
JP5620798B2 (ja) * 2010-12-01 2014-11-05 メタローテクノロジーズジャパン株式会社 金バンプ形成用非シアン系電解金めっき浴、及び金バンプ形成方法
DE102011105207B4 (de) * 2011-06-17 2015-09-10 Umicore Galvanotechnik Gmbh Elektrolyt und seine Verwendung zur Abscheidung von Schwarz-Ruthenium-Überzügen und so erhaltene Überzüge und Artikel
TWI473282B (zh) * 2011-06-29 2015-02-11 國立屏東科技大學 具有活性焊料塗層的導線及其使用方法
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
JP5851233B2 (ja) * 2011-12-22 2016-02-03 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP5843606B2 (ja) * 2011-12-27 2016-01-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
US9269998B2 (en) 2013-03-13 2016-02-23 Fluidic, Inc. Concave gas vent for electrochemical cell
US9325037B2 (en) 2013-03-13 2016-04-26 Fluidic, Inc. Hetero-ionic aromatic additives for electrochemical cells comprising a metal fuel
US9512529B2 (en) 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
CN103290438B (zh) * 2013-06-25 2015-12-02 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
ES2766775T3 (es) 2013-09-05 2020-06-15 Macdermid Enthone Inc Composición acuosa de electrolito que tiene una emisión aérea reducida
KR101633725B1 (ko) * 2014-05-13 2016-06-27 (주)피엔티 합금박 제조 장치
CN104313667B (zh) * 2014-10-17 2017-03-29 长安大学 TC4钛合金表面制备ZrO2/Cu复合镀层的方法
US20160114870A1 (en) * 2014-10-26 2016-04-28 John Kattine Surface Anti-Fouling Structure, Composition, and Method
GB2533915A (en) * 2014-11-28 2016-07-13 Daido Metal Co Overlay for sliding elements of machines such as internal combustion engines
CN104894625A (zh) * 2015-06-17 2015-09-09 沈阳飞机工业（集团）有限公司 一种提高复杂工件镉镀层均匀性的电镀方法
US10793956B2 (en) * 2015-08-29 2020-10-06 Mitsubishi Materials Corporation Additive for high-purity copper electrolytic refining and method of producing high-purity copper
JP6733313B2 (ja) * 2015-08-29 2020-07-29 三菱マテリアル株式会社 高純度銅電解精錬用添加剤と高純度銅製造方法
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
US11228066B2 (en) 2016-07-22 2022-01-18 Form Energy, Inc. Mist elimination system for electrochemical cells
JP2019521497A (ja) 2016-07-22 2019-07-25 ナントエナジー，インク． 電気化学セル内の水分及び二酸化炭素管理システム
CN109666952B (zh) * 2017-10-16 2020-12-04 中国科学院过程工程研究所 一种电沉积生产金属银的方法
CN108560025B (zh) * 2018-06-14 2020-01-21 九江德福科技股份有限公司 一种电解铜箔的制备方法
CN119481486A (zh) 2018-06-29 2025-02-18 福恩能源公司 滚动膜片密封件
CN112805868A (zh) 2018-06-29 2021-05-14 福恩能源公司 金属空气电化学电池构架
CN109666954A (zh) * 2019-03-05 2019-04-23 惠州市鸿泰达电子材料有限公司 一种镀锡添加剂及其制备方法
CN114207915A (zh) 2019-06-28 2022-03-18 福恩能源公司 金属-空气电池组的设备架构
CN114514340B (zh) 2019-07-26 2025-03-21 朗姆研究公司 先进封装应用的差别对比镀覆
CN110629259B (zh) * 2019-11-04 2021-08-10 惠州市荣安达化工有限公司 一种含有石墨烯的pcb铜复合电镀液
CN111118558B (zh) * 2019-12-27 2021-06-04 江苏赛夫特半导体材料检测技术有限公司 一种半导体用镀铜添加剂
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping
CN111321435B (zh) * 2020-04-17 2022-03-01 广州鑫睿表面技术有限公司 一种酸性电镀锡液及其制备方法与应用
WO2021226399A1 (en) 2020-05-06 2021-11-11 Form Energy, Inc. Decoupled electrode electrochemical energy storage system
CN113564644A (zh) * 2021-06-29 2021-10-29 武汉钢铁有限公司 一种提高镀层附着力的电镀锡液、制备方法及镀锡板
KR20240141800A (ko) 2022-01-28 2024-09-27 폼 에너지 인코퍼레이티드 양면 밀봉형 기체 확산 전극

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328273A (en) 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
JPS5039054B1 (https=) * 1971-02-17 1975-12-13
JPS5039057B1 (https=) * 1971-03-02 1975-12-13
US3956079A (en) 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3960677A (en) * 1974-09-27 1976-06-01 The Harshaw Chemical Company Acid zinc electroplating
AU508254B2 (en) * 1976-10-04 1980-03-13 M And T Chemicals Inc. Cyclosulphones as electroplating additive
JPS5377843A (en) * 1976-12-22 1978-07-10 Janome Sewing Machine Co Ltd Tinncobalt alloy electroplating liquid
DE3011697A1 (de) 1980-03-26 1981-10-01 Shipley Co., Inc., Newton, Mass. Saures chemisches verzinnungsbad
DE3012168A1 (de) 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
JPS609117B2 (ja) 1980-06-19 1985-03-07 セイコーエプソン株式会社 金合金メッキ浴
US4432843A (en) * 1982-07-29 1984-02-21 Omi International Corporation Trivalent chromium electroplating baths and processes using thiazole addition agents
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4891069A (en) * 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
JPH0781196B2 (ja) 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
JPH0246675B2 (ja) * 1986-07-04 1990-10-16 Nippon Kagaku Sangyo Kk Sanseidometsukyoku
DE3721985A1 (de) * 1987-06-30 1989-01-12 Schering Ag Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege
JPH01309992A (ja) * 1988-06-08 1989-12-14 Seiko Instr Inc インジウムメッキ方法
SU1652383A1 (ru) * 1989-01-04 1991-05-30 Институт Химии И Химической Технологии Ан Литсср Способ очистки сернокислого электролита меднени
JP2529021B2 (ja) * 1990-08-30 1996-08-28 日本エレクトロプレイテイング・エンジニヤース株式会社 金の置換・電食防止剤を含んだシアン系の金メッキ液
DE4126502C1 (https=) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5200057A (en) * 1991-11-05 1993-04-06 Mcgean-Rohco, Inc. Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys
JP3365866B2 (ja) * 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
JPH08199385A (ja) 1995-01-20 1996-08-06 Hitachi Chem Co Ltd 電気めっき方法
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
JP3579550B2 (ja) * 1996-09-30 2004-10-20 株式会社大和化成研究所 電気・電子回路部品
JP3306768B2 (ja) * 1996-09-30 2002-07-24 三菱マテリアル株式会社 鉛及び鉛−錫合金めっき浴
WO1998027585A1 (en) * 1996-12-16 1998-06-25 International Business Machines Corporation Electroplated interconnection structures on integrated circuit chips
JP3306770B2 (ja) * 1997-06-06 2002-07-24 三菱マテリアル株式会社 鉛及び鉛−錫合金めっき浴
US6236773B1 (en) * 1998-12-15 2001-05-22 Texas Instruments Incorporated Single wavelength semiconductor laser with grating-assisted dielectric waveguide coupler
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP3898334B2 (ja) * 1998-04-15 2007-03-28 日本エレクトロプレイテイング・エンジニヤース株式会社 金メッキ液及びその金メッキ液を用いたメッキ方法
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
DE19828545C1 (de) * 1998-06-26 1999-08-12 Cromotec Oberflaechentechnik G Galvanisches Bad, Verfahren zur Erzeugung strukturierter Hartchromschichten und Verwendung
JP2000080494A (ja) * 1998-09-03 2000-03-21 Ebara Corp 銅ダマシン配線用めっき液
ATE282248T1 (de) * 1999-01-21 2004-11-15 Atotech Deutschland Gmbh Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen
US6267863B1 (en) * 1999-02-05 2001-07-31 Lucent Technologies Inc. Electroplating solution for electroplating lead and lead/tin alloys
JP2000248397A (ja) * 1999-02-26 2000-09-12 Electroplating Eng Of Japan Co 硫酸銅めっき液及びそれを用いた電解めっき方法
JP2000256898A (ja) * 1999-03-03 2000-09-19 Permelec Electrode Ltd ウェーハの銅めっき方法
DE50013952D1 (de) * 1999-06-17 2007-02-22 Degussa Galvanotechnik Gmbh Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP3302949B2 (ja) * 1999-08-03 2002-07-15 株式会社日鉱マテリアルズ 黒色ルテニウムめっき液
JP3498306B2 (ja) * 1999-09-16 2004-02-16 石原薬品株式会社 ボイドフリー銅メッキ方法
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP4256994B2 (ja) * 1999-10-05 2009-04-22 日本エレクトロプレイテイング・エンジニヤース株式会社 回路基板の実装方法及び金めっき液並びに金めっき方法
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
JP3601005B2 (ja) * 1999-10-27 2004-12-15 小島化学薬品株式会社 パラジウムめっき液
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
JP4570213B2 (ja) * 2000-01-12 2010-10-27 古河電気工業株式会社 パラジウムめっき液
JP3465077B2 (ja) * 2000-03-08 2003-11-10 石原薬品株式会社 錫、鉛及び錫−鉛合金メッキ浴
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate

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