JP4651906B2 - 基体上に金属層を堆積させるためのメッキ浴および方法 - Google Patents

基体上に金属層を堆積させるためのメッキ浴および方法 Download PDF

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Publication number
JP4651906B2
JP4651906B2 JP2002289346A JP2002289346A JP4651906B2 JP 4651906 B2 JP4651906 B2 JP 4651906B2 JP 2002289346 A JP2002289346 A JP 2002289346A JP 2002289346 A JP2002289346 A JP 2002289346A JP 4651906 B2 JP4651906 B2 JP 4651906B2
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JP
Japan
Prior art keywords
plating bath
metal
crown
acid
copper
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Expired - Fee Related
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JP2002289346A
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English (en)
Japanese (ja)
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JP2003183875A (ja
JP2003183875A5 (https=
Inventor
アンドリュー・ジェイ・コブリー
マーク・ジェイ・カペッカス
エリック・レディントン
ウェイド・ソンネンバーグ
レオン・アール・バースタッド
トーマス・バックリー
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
DuPont Electronic Materials International LLC
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Publication of JP2003183875A publication Critical patent/JP2003183875A/ja
Publication of JP2003183875A5 publication Critical patent/JP2003183875A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2002289346A 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法 Expired - Fee Related JP4651906B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970,348 US6736954B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate
US09/970348 2001-10-02

Related Child Applications (1)

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JP2009050353A Division JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法

Publications (3)

Publication Number Publication Date
JP2003183875A JP2003183875A (ja) 2003-07-03
JP2003183875A5 JP2003183875A5 (https=) 2007-03-08
JP4651906B2 true JP4651906B2 (ja) 2011-03-16

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2002289346A Expired - Fee Related JP4651906B2 (ja) 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法
JP2009050353A Pending JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法
JP2013217639A Pending JP2014037634A (ja) 2001-10-02 2013-10-18 基体上に金属層を堆積させるためのメッキ浴および方法

Family Applications After (2)

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JP2009050353A Pending JP2009149995A (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法
JP2013217639A Pending JP2014037634A (ja) 2001-10-02 2013-10-18 基体上に金属層を堆積させるためのメッキ浴および方法

Country Status (6)

Country Link
US (2) US6736954B2 (https=)
EP (1) EP1308540B1 (https=)
JP (3) JP4651906B2 (https=)
KR (1) KR20030028693A (https=)
DE (1) DE60141143D1 (https=)
TW (1) TWI227284B (https=)

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JP2014037634A (ja) 2014-02-27
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JP2009149995A (ja) 2009-07-09
US20030070934A1 (en) 2003-04-17
DE60141143D1 (de) 2010-03-11
US20040104124A1 (en) 2004-06-03
JP2003183875A (ja) 2003-07-03
EP1308540B1 (en) 2010-01-20
TWI227284B (en) 2005-02-01
EP1308540A1 (en) 2003-05-07

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