WO2008126522A1 - 銅電解液及びそれを用いて得られた２層フレキシブル基板 - Google Patents

銅電解液及びそれを用いて得られた２層フレキシブル基板 Download PDF

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Publication number
WO2008126522A1
WO2008126522A1 PCT/JP2008/053987 JP2008053987W WO2008126522A1 WO 2008126522 A1 WO2008126522 A1 WO 2008126522A1 JP 2008053987 W JP2008053987 W JP 2008053987W WO 2008126522 A1 WO2008126522 A1 WO 2008126522A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
electrolyte solution
layer flexible
copper electrolyte
copper
Prior art date
Application number
PCT/JP2008/053987
Other languages
English (en)
French (fr)
Inventor
Mikio Hanafusa
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to KR1020097021455A priority Critical patent/KR101135332B1/ko
Priority to CN2008800080564A priority patent/CN101636527B/zh
Priority to JP2009508976A priority patent/JPWO2008126522A1/ja
Priority to US12/450,054 priority patent/US20100084275A1/en
Publication of WO2008126522A1 publication Critical patent/WO2008126522A1/ja
Priority to US13/437,372 priority patent/US20120189811A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

　耐折性、エッチング特性、レジストとの密着性に優れ、表面欠陥がない２層フレキシブル基板を提供する。 　添加剤として、塩化物イオンと、硫黄系有機化合物と、ポリエチレングリコールとを、好ましくは、塩化物イオンを５～２００ｐｐｍ、硫黄系有機化合物を２～１０００ｐｐｍ、ポリエチレングリコールを５～１５００ｐｐｍ含有することを特徴とする銅電解液。及び該銅電解液を用いて銅層を設けた２層フレキシブル基板であって、ＭＩＴ特性が１００回以上、銅層の表面粗さ（Ｒｚ）が１．４～３．０μｍであることを特徴とする２層フレキシブル基板。
PCT/JP2008/053987 2007-03-15 2008-03-05 銅電解液及びそれを用いて得られた２層フレキシブル基板 WO2008126522A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097021455A KR101135332B1 (ko) 2007-03-15 2008-03-05 구리전해액 및 그것을 이용하여 얻어진 2층 플렉시블 기판
CN2008800080564A CN101636527B (zh) 2007-03-15 2008-03-05 铜电解液和使用该铜电解液得到的两层挠性基板
JP2009508976A JPWO2008126522A1 (ja) 2007-03-15 2008-03-05 銅電解液及びそれを用いて得られた２層フレキシブル基板
US12/450,054 US20100084275A1 (en) 2007-03-15 2008-03-05 Copper electrolytic solution and two-layer flexible substrate obtained using the same
US13/437,372 US20120189811A1 (en) 2007-03-15 2012-04-02 Copper electrolytic solution and two-layer flexible substrate obtained using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007066382 2007-03-15
JP2007-066382 2007-03-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/437,372 Division US20120189811A1 (en) 2007-03-15 2012-04-02 Copper electrolytic solution and two-layer flexible substrate obtained using the same

Publications (1)

Publication Number Publication Date
WO2008126522A1 true WO2008126522A1 (ja) 2008-10-23

Family

ID=39863680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053987 WO2008126522A1 (ja) 2007-03-15 2008-03-05 銅電解液及びそれを用いて得られた２層フレキシブル基板

Country Status (6)

Country Link
US (2) US20100084275A1 (ja)
JP (1) JPWO2008126522A1 (ja)
KR (1) KR101135332B1 (ja)
CN (1) CN101636527B (ja)
TW (1) TW200844256A (ja)
WO (1) WO2008126522A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
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JP2013503965A (ja) * 2009-09-01 2013-02-04 イルジン カッパー ホイル カンパニー リミテッド 微細回路の形成のためのエンベデッド用銅箔
JP2014082320A (ja) * 2012-10-16 2014-05-08 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板、並びに２層フレキシブル基板を基材としたプリント配線板
WO2016017773A1 (ja) * 2014-07-31 2016-02-04 住友金属鉱山株式会社 タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法

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US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
JP6782561B2 (ja) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6006445B1 (ja) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6058182B1 (ja) * 2015-07-27 2017-01-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6339636B2 (ja) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6190500B2 (ja) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

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Publication number Priority date Publication date Assignee Title
JP2013503965A (ja) * 2009-09-01 2013-02-04 イルジン カッパー ホイル カンパニー リミテッド 微細回路の形成のためのエンベデッド用銅箔
JP2014082320A (ja) * 2012-10-16 2014-05-08 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板、並びに２層フレキシブル基板を基材としたプリント配線板
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JPWO2016017773A1 (ja) * 2014-07-31 2017-05-25 住友金属鉱山株式会社 タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法

Also Published As

Publication number Publication date
US20100084275A1 (en) 2010-04-08
CN101636527B (zh) 2011-11-09
TW200844256A (en) 2008-11-16
US20120189811A1 (en) 2012-07-26
KR101135332B1 (ko) 2012-04-17
CN101636527A (zh) 2010-01-27
JPWO2008126522A1 (ja) 2010-07-22
KR20090120515A (ko) 2009-11-24

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