KR100999207B1 - 2층 플렉서블 기판 - Google Patents
2층 플렉서블 기판 Download PDFInfo
- Publication number
- KR100999207B1 KR100999207B1 KR1020087010338A KR20087010338A KR100999207B1 KR 100999207 B1 KR100999207 B1 KR 100999207B1 KR 1020087010338 A KR1020087010338 A KR 1020087010338A KR 20087010338 A KR20087010338 A KR 20087010338A KR 100999207 B1 KR100999207 B1 KR 100999207B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- copper
- flexible substrate
- film
- insulator film
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
첨가제 | 도금온도 (℃) |
표면거칠기 (Ra)(㎛) |
평균결정입자지름(㎛) | 결함의 개수 | 에칭율 | |
실시예 1 | SPS(30ppm) PEG(50ppm) |
40 | 0.15 | 0.6 | 0 | 4.0 |
실시예 2 | SPS(30ppm) PEG(50ppm) |
50 | 0.24 | 0.4 | 0 | 4.3 |
비교예 1 | SPS(15ppm) PEG(50ppm) JGB(30ppm) |
50 | 0.09 | 1.6 | 5 | 2.4 |
비교예 2 | SPS(30ppm) PEG(50ppm) JGB(30ppm) |
50 | 0.07 | 0.9 | 10 | 3.6 |
비교예 3 | SPS(30ppm) | 50 | 0.26 | 미측정 | 0 | 1.6 |
Claims (2)
- 기초 금속층을 형성한 절연체 필름의 한면 또는 양면 상에, 접착제를 이용하지 않고 도금에 의해 구리층을 형성한 2층 플렉서블 기판으로서, 구리층의 표면 거칠기(Ra)가 0.10∼0.25㎛이고, 또한 구리층 단면의 절연체 필름으로부터 1㎛까지의 구리의 평균 결정입자 지름이 0.8㎛ 이하인 것을 특징으로 하는 2층 플렉서블 기판.
- 제 1 항에 있어서, 상기 절연체 필름이 폴리이미드 필름인 것을 특징으로 하는 2층 플렉서블 기판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005292183 | 2005-10-05 | ||
JPJP-P-2005-00292183 | 2005-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080061387A KR20080061387A (ko) | 2008-07-02 |
KR100999207B1 true KR100999207B1 (ko) | 2010-12-07 |
Family
ID=37906036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087010338A KR100999207B1 (ko) | 2005-10-05 | 2006-08-22 | 2층 플렉서블 기판 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8568856B2 (ko) |
JP (1) | JP4771552B2 (ko) |
KR (1) | KR100999207B1 (ko) |
CN (1) | CN100588309C (ko) |
TW (1) | TWI343767B (ko) |
WO (1) | WO2007039992A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2008126522A1 (ja) * | 2007-03-15 | 2010-07-22 | 日鉱金属株式会社 | 銅電解液及びそれを用いて得られた2層フレキシブル基板 |
CN101909877B (zh) * | 2007-12-27 | 2013-03-06 | Jx日矿日石金属株式会社 | 双层覆铜层压板的制造方法及双层覆铜层压板 |
JP5544872B2 (ja) * | 2009-12-25 | 2014-07-09 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP5706386B2 (ja) * | 2012-10-16 | 2015-04-22 | 住友金属鉱山株式会社 | 2層フレキシブル基板、並びに2層フレキシブル基板を基材としたプリント配線板 |
CN106575172B (zh) * | 2014-07-31 | 2022-04-29 | 住友金属矿山股份有限公司 | 触控面板用导电性基板、触控面板用导电性基板的制造方法 |
KR102698875B1 (ko) | 2018-12-13 | 2024-08-27 | 엘지이노텍 주식회사 | 인쇄회로기판 |
JP2021034591A (ja) * | 2019-08-26 | 2021-03-01 | キオクシア株式会社 | 半導体装置およびその製造方法 |
JP7446331B2 (ja) * | 2020-04-01 | 2024-03-08 | 住友電気工業株式会社 | フレキシブルプリント配線板及びその製造方法 |
CN116057206A (zh) * | 2020-08-07 | 2023-05-02 | 东洋钢钣株式会社 | 覆铜层叠体及其制造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01225392A (ja) * | 1988-03-04 | 1989-09-08 | Matsushita Electric Works Ltd | 多層プリント配線基板の製造方法 |
JP2708130B2 (ja) * | 1989-06-19 | 1998-02-04 | 日本電解 株式会社 | プリント回路用銅箔の粗面形成方法 |
JPH0330938A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Chem Co Ltd | フレキシブル銅張積層板 |
JPH0645729A (ja) * | 1992-07-24 | 1994-02-18 | Mitsubishi Electric Corp | プリント配線板の製造方法 |
JP2762386B2 (ja) * | 1993-03-19 | 1998-06-04 | 三井金属鉱業株式会社 | 銅張り積層板およびプリント配線板 |
JPH10193505A (ja) | 1997-01-09 | 1998-07-28 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板の製造方法 |
JP2000034594A (ja) * | 1998-07-15 | 2000-02-02 | Japan Energy Corp | 銅めっき方法及び銅めっき液 |
WO2001097578A1 (fr) | 2000-06-16 | 2001-12-20 | Unitika Ltd. | Procede de preparation de substrat destine a un tableau de connexions imprime souple et substrat destine a un tableau de connexions imprime souple |
JP2002299777A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板及びその製造方法 |
JP2003324258A (ja) * | 2002-05-01 | 2003-11-14 | Nippon Mektron Ltd | プリント配線板用銅張板 |
JP3563730B2 (ja) * | 2002-06-07 | 2004-09-08 | 松下電器産業株式会社 | フレキシブルプリント回路基板 |
TWI234210B (en) * | 2002-12-03 | 2005-06-11 | Sanyo Electric Co | Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet |
JP2004237596A (ja) * | 2003-02-06 | 2004-08-26 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板およびその製造方法 |
JP2005113183A (ja) * | 2003-10-06 | 2005-04-28 | Fujikura Ltd | 電解銅箔およびその製造方法、並びに銅張り積層板 |
TWI263461B (en) * | 2003-12-26 | 2006-10-01 | Ind Tech Res Inst | Enhanced flexible copper foil structure and fabrication method thereof |
-
2006
- 2006-08-22 KR KR1020087010338A patent/KR100999207B1/ko active IP Right Grant
- 2006-08-22 WO PCT/JP2006/316388 patent/WO2007039992A1/ja active Application Filing
- 2006-08-22 US US11/992,209 patent/US8568856B2/en active Active
- 2006-08-22 JP JP2007538659A patent/JP4771552B2/ja active Active
- 2006-08-22 CN CN200680036650A patent/CN100588309C/zh active Active
- 2006-09-12 TW TW095133584A patent/TWI343767B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN100588309C (zh) | 2010-02-03 |
JPWO2007039992A1 (ja) | 2009-04-16 |
JP4771552B2 (ja) | 2011-09-14 |
WO2007039992A1 (ja) | 2007-04-12 |
CN101278604A (zh) | 2008-10-01 |
US20090092789A1 (en) | 2009-04-09 |
US8568856B2 (en) | 2013-10-29 |
TW200715919A (en) | 2007-04-16 |
KR20080061387A (ko) | 2008-07-02 |
TWI343767B (en) | 2011-06-11 |
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