JP4771552B2 - 2層フレキシブル基板 - Google Patents
2層フレキシブル基板 Download PDFInfo
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- JP4771552B2 JP4771552B2 JP2007538659A JP2007538659A JP4771552B2 JP 4771552 B2 JP4771552 B2 JP 4771552B2 JP 2007538659 A JP2007538659 A JP 2007538659A JP 2007538659 A JP2007538659 A JP 2007538659A JP 4771552 B2 JP4771552 B2 JP 4771552B2
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- 239000010949 copper Substances 0.000 claims description 57
- 229910052802 copper Inorganic materials 0.000 claims description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 54
- 239000012212 insulator Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 14
- 239000010953 base metal Substances 0.000 claims description 13
- 230000003746 surface roughness Effects 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 23
- 238000007747 plating Methods 0.000 description 23
- 230000007547 defect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- -1 sulfur organic compound Chemical class 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052783 alkali metal Chemical group 0.000 description 3
- 150000001340 alkali metals Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical group OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 208000023514 Barrett esophagus Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
また、その上にレジストを塗布し、更にめっきを行って配線する際に、銅表面の光沢性が高かったため、レジスト剥離が生じる場合があり、レジストとの密着性に優れている2層フレキシブル基板が求められている。
即ち、本発明は、
(1)絶縁体フィルムの片面又は両面上に、予め下地金属層を形成し、その上に所定の厚さの銅層を電気めっきにより形成することにより、接着剤を用いることなく銅層を設けた2層フレキシブル基板であって、該絶縁体フィルム上に形成した銅層の結晶粒径が絶縁体フィルム面に近い程小さく、また銅層の表面粗さ(Ra)が0.10〜0.25μmで、かつ上記銅層断面の、該絶縁体フィルムから1μmの高さの部分の銅の平均結晶粒径が0.8μm以下であることを特徴とする2層フレキシブル基板、
(2)前記絶縁体フィルムがポリイミドフィルムであることを特徴とする前記(1)記載の2層フレキシブル基板、
である。
発明の効果
また、この表面粗さは、ファインライン形成に影響がなく、表面欠陥がなくなり、歩留まりが向上する。
絶縁体フィルムとしては、厚さ10〜50μmのフィルムが好ましい。
下地金属層の厚さは10〜500nmが好ましい。
このときめっき液としては、通常の酸性銅めっき液を使用することができ、硫酸銅水溶液に、塩素、ノニオン系界面活性剤、硫黄系有機化合物を添加剤として混合した水溶液を用いることが好ましく、膜厚3〜30μmの銅層を形成することが好ましい。
X−R1−(S)n−R2−Y (1)
R4−S−R3−SO3Z (2)
(一般式(1)、(2)中、R1、R2、及びR3は炭素数1〜8のアルキレン基であり、R4は、水素、
からなる一群から選ばれるものであり、Xは水素、スルホン酸基、ホスホン酸基、スルホン酸またはホスホン酸のアルカリ金属塩基またはアンモニウム塩基からなる一群から選ばれるものであり、Yはスルホン酸基、ホスホン酸基、スルホン酸またはホスホン酸のアルカリ金属塩基からなる一群から選ばれるものであり、Zは水素、またはアルカリ金属であり、nは2または3である。)
H2O3P−(CH2)3−S−S−(CH2)3−PO3H2
HO3S−(CH2)4−S−S−(CH2)4−SO3H
HO3S−(CH2)3−S−S−(CH2)3−SO3H
NaO3S−(CH2)3−S−S−(CH2)3−SO3Na
HO3S−(CH2)2−S−S−(CH2)2−SO3H
CH3−S−S−CH2−SO3H
NaO3S−(CH2)3−S−S−S−(CH2)3−SO3Na
(CH3)2CH−S−S−(CH2)2−SO3H
表面粗さを上記範囲(表面が適度に荒れている)とすることにより、ソルダーレジストとの密着性が良好となる。また、表面が光沢面であった場合、欠陥となる微小な突起やくぼみは、表面粗さを上記範囲とすることにより、粗さに紛れるので、表面の微小欠陥がなくなり、歩留まりが向上する。表面粗さ(Ra)が0.10〜0.25μmの範囲ではファインラインの対応が可能な表面粗さである。
本発明において、銅層の銅の結晶平均粒径は、上述のように絶縁体フィルム表面に近いほど小さくなる。したがって、絶縁体フィルムから1μmのところの銅の平均結晶粒径が0.8μm以下であると、1μmより絶縁体フィルムに近いところでは、それ以下となる。
絶縁体フィルムから1μmのところの銅の平均結晶粒径は、例えば、FIB切断した後、SIMで観察し、結晶の粒径の観察や測定することにより求めることができる。
実施例1〜2、比較例1〜3
以下のめっき条件で下地金属層を有するポリイミドフィルムに電気めっきを行い、約8μmの銅被膜を作製した。添加剤及びその添加量は表1記載の通りである。
液容量: 約800ml
アノード:鉛電極
カソード:ポリイミドフィルムを巻きつけた回転電極
下地金属層を有するポリイミドフィルム:
37.5μm厚のカプトンE(デュポン製)上にNiCrを10nm+Cuを2000Å
スパッタ成膜したもの。
電流時間:1300As
電流密度:5→10→20→30A/dm2と変化(各電流密度で40秒ずつ保持)
流速: 190r.p.m.
Cu: 70g/L
H2SO4:60g/L
Cl: 75ppm
平均結晶粒径は、FIBより断面を切断した後、SIMで観察し、ポリイミドから1μmの高さの部分(10μm幅)の結晶粒径の平均値を求めた。結果は表1に示す。
欠陥の個数は、銅層表面1dm2の欠陥数(微小な突起またはくぼみの数)を目視にて求めた。尚、結果は表1に示す。
エッチング特性は、エッチング率により評価した。エッチング率は、20μmピッチのラインを形成し、下記に示す計算式に基づき計算した。
エッチング率=h/{(b−t)/2}(=tanθ)
h、b、tは図1に示すように、h=エッチングの深さ、b=基板表面のエッチングの幅、t=エッチング底面のエッチングの幅を示す。
結果は表1に示す。
無電解金めっき耐性により評価した。実施例1〜2、及び比較例1〜2で得られた基板上に市販のソルダーレジストを塗布した。露光、現像後硬化し評価基板を作製した。この評価基板を市販の無電解Niめっき液と無電解金めっき液を用いてめっきを行った。このめっき後の評価基板について、セロテープ(登録商標)によるピールテストを行い、レジストの剥がれについて評価した。実施例1、2の基板を使用したものは、レジストに全く剥がれが認められなかったのに対し、比較例1、2の基板を使用したものは、かすかに剥がれが見られた。
Claims (2)
- 絶縁体フィルムの片面又は両面上に、予め下地金属層を形成し、その上に所定の厚さの銅層を電気めっきにより形成することにより、接着剤を用いることなく銅層を設けた2層フレキシブル基板であって、該絶縁体フィルム上に形成した銅層の結晶粒径が絶縁体フィルム面に近い程小さく、また銅層の表面粗さ(Ra)が0.10〜0.25μmで、かつ上記銅層断面の、該絶縁体フィルムから1μmの高さの部分の銅の平均結晶粒径が0.8μm以下であることを特徴とする2層フレキシブル基板。
- 前記絶縁体フィルムがポリイミドフィルムであることを特徴とする請求項1記載の2層フレキシブル基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007538659A JP4771552B2 (ja) | 2005-10-05 | 2006-08-22 | 2層フレキシブル基板 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005292183 | 2005-10-05 | ||
JP2005292183 | 2005-10-05 | ||
JP2007538659A JP4771552B2 (ja) | 2005-10-05 | 2006-08-22 | 2層フレキシブル基板 |
PCT/JP2006/316388 WO2007039992A1 (ja) | 2005-10-05 | 2006-08-22 | 2層フレキシブル基板 |
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KR (1) | KR100999207B1 (ja) |
CN (1) | CN100588309C (ja) |
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JPWO2008126522A1 (ja) * | 2007-03-15 | 2010-07-22 | 日鉱金属株式会社 | 銅電解液及びそれを用いて得られた2層フレキシブル基板 |
CN101909877B (zh) * | 2007-12-27 | 2013-03-06 | Jx日矿日石金属株式会社 | 双层覆铜层压板的制造方法及双层覆铜层压板 |
JP5544872B2 (ja) * | 2009-12-25 | 2014-07-09 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP5706386B2 (ja) * | 2012-10-16 | 2015-04-22 | 住友金属鉱山株式会社 | 2層フレキシブル基板、並びに2層フレキシブル基板を基材としたプリント配線板 |
CN106575172B (zh) * | 2014-07-31 | 2022-04-29 | 住友金属矿山股份有限公司 | 触控面板用导电性基板、触控面板用导电性基板的制造方法 |
KR102698875B1 (ko) | 2018-12-13 | 2024-08-27 | 엘지이노텍 주식회사 | 인쇄회로기판 |
JP2021034591A (ja) * | 2019-08-26 | 2021-03-01 | キオクシア株式会社 | 半導体装置およびその製造方法 |
JP7446331B2 (ja) * | 2020-04-01 | 2024-03-08 | 住友電気工業株式会社 | フレキシブルプリント配線板及びその製造方法 |
CN116057206A (zh) * | 2020-08-07 | 2023-05-02 | 东洋钢钣株式会社 | 覆铜层叠体及其制造方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0320493A (ja) * | 1989-06-19 | 1991-01-29 | Nippon Denkai Kk | プリント回路用粗面化銅箔とその粗面形成方法 |
JPH0330938A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Chem Co Ltd | フレキシブル銅張積層板 |
JPH0645729A (ja) * | 1992-07-24 | 1994-02-18 | Mitsubishi Electric Corp | プリント配線板の製造方法 |
JPH06270331A (ja) * | 1993-03-19 | 1994-09-27 | Mitsui Mining & Smelting Co Ltd | 銅張り積層板およびプリント配線板 |
JP2000034594A (ja) * | 1998-07-15 | 2000-02-02 | Japan Energy Corp | 銅めっき方法及び銅めっき液 |
JP2002299777A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板及びその製造方法 |
JP2003324258A (ja) * | 2002-05-01 | 2003-11-14 | Nippon Mektron Ltd | プリント配線板用銅張板 |
JP2004031370A (ja) * | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
JP2004237596A (ja) * | 2003-02-06 | 2004-08-26 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板およびその製造方法 |
JP2005113183A (ja) * | 2003-10-06 | 2005-04-28 | Fujikura Ltd | 電解銅箔およびその製造方法、並びに銅張り積層板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01225392A (ja) * | 1988-03-04 | 1989-09-08 | Matsushita Electric Works Ltd | 多層プリント配線基板の製造方法 |
JPH10193505A (ja) | 1997-01-09 | 1998-07-28 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板の製造方法 |
WO2001097578A1 (fr) | 2000-06-16 | 2001-12-20 | Unitika Ltd. | Procede de preparation de substrat destine a un tableau de connexions imprime souple et substrat destine a un tableau de connexions imprime souple |
TWI234210B (en) * | 2002-12-03 | 2005-06-11 | Sanyo Electric Co | Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet |
TWI263461B (en) * | 2003-12-26 | 2006-10-01 | Ind Tech Res Inst | Enhanced flexible copper foil structure and fabrication method thereof |
-
2006
- 2006-08-22 KR KR1020087010338A patent/KR100999207B1/ko active IP Right Grant
- 2006-08-22 WO PCT/JP2006/316388 patent/WO2007039992A1/ja active Application Filing
- 2006-08-22 US US11/992,209 patent/US8568856B2/en active Active
- 2006-08-22 JP JP2007538659A patent/JP4771552B2/ja active Active
- 2006-08-22 CN CN200680036650A patent/CN100588309C/zh active Active
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0320493A (ja) * | 1989-06-19 | 1991-01-29 | Nippon Denkai Kk | プリント回路用粗面化銅箔とその粗面形成方法 |
JPH0330938A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Chem Co Ltd | フレキシブル銅張積層板 |
JPH0645729A (ja) * | 1992-07-24 | 1994-02-18 | Mitsubishi Electric Corp | プリント配線板の製造方法 |
JPH06270331A (ja) * | 1993-03-19 | 1994-09-27 | Mitsui Mining & Smelting Co Ltd | 銅張り積層板およびプリント配線板 |
JP2000034594A (ja) * | 1998-07-15 | 2000-02-02 | Japan Energy Corp | 銅めっき方法及び銅めっき液 |
JP2002299777A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板及びその製造方法 |
JP2003324258A (ja) * | 2002-05-01 | 2003-11-14 | Nippon Mektron Ltd | プリント配線板用銅張板 |
JP2004031370A (ja) * | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
JP2004237596A (ja) * | 2003-02-06 | 2004-08-26 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板およびその製造方法 |
JP2005113183A (ja) * | 2003-10-06 | 2005-04-28 | Fujikura Ltd | 電解銅箔およびその製造方法、並びに銅張り積層板 |
Also Published As
Publication number | Publication date |
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CN100588309C (zh) | 2010-02-03 |
JPWO2007039992A1 (ja) | 2009-04-16 |
WO2007039992A1 (ja) | 2007-04-12 |
CN101278604A (zh) | 2008-10-01 |
US20090092789A1 (en) | 2009-04-09 |
US8568856B2 (en) | 2013-10-29 |
TW200715919A (en) | 2007-04-16 |
KR20080061387A (ko) | 2008-07-02 |
KR100999207B1 (ko) | 2010-12-07 |
TWI343767B (en) | 2011-06-11 |
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