KR102698875B1 - 인쇄회로기판 - Google Patents
인쇄회로기판 Download PDFInfo
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- KR102698875B1 KR102698875B1 KR1020180161314A KR20180161314A KR102698875B1 KR 102698875 B1 KR102698875 B1 KR 102698875B1 KR 1020180161314 A KR1020180161314 A KR 1020180161314A KR 20180161314 A KR20180161314 A KR 20180161314A KR 102698875 B1 KR102698875 B1 KR 102698875B1
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- 230000003746 surface roughness Effects 0.000 claims abstract description 133
- 238000007747 plating Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 93
- 239000000853 adhesive Substances 0.000 description 27
- 230000001070 adhesive effect Effects 0.000 description 27
- 239000000758 substrate Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000010931 gold Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000004020 conductor Substances 0.000 description 14
- 230000002500 effect on skin Effects 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 11
- 230000008054 signal transmission Effects 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
도 2 및 도 3은 도 1의 회로패턴을 구체적으로 나타낸 도면이다.
도 4(a), 4(b), 4(c)는 주파수가 커짐에 따른 신호 이동을 도시한 도면이다.
도 5는 실시예에 따른 인쇄회로기판이 적용되는 일례를 설명하기 위한 도면이다.
표면조도1(Ra) | 표면조도2(Rq) | 임피던스(Ω) | |
실시예1 | 0.31 | 0.42 | 35.3 |
실시예2 | 0.17 | 0.21 | 33.8 |
실시예3 | 0.13 | 0.16 | 33.4 |
실시예4 | 0.10 | 0.12 | 32.6 |
비교예1 | 0.68 | 0.86 | 37.4 |
비교예2 | 0.82 | 1.07 | 38.5 |
Claims (9)
- 절연층; 및
상기 절연층 상에 배치되는 회로패턴을 포함하고,
상기 회로패턴은 상면, 하면, 제 1 측면 및 제 2 측면을 포함하고,
상기 회로패턴의 상면, 하면, 제1 측면 및 제2 측면 중 상기 하면을 포함하는 적어도 3개의 면의 표면 조도(Ra)는 0.1㎛ 내지 0.31㎛이고,
상기 회로패턴은,
상기 절연층 상에 배치된 도금 시드층; 및
상기 도금시드층 상에 배치된 패턴층을 포함하고,
상기 회로 패턴의 상면은 상기 패턴층의 상면이고,
상기 회로 패턴의 하면은 상기 도금 시드층의 하면인 인쇄회로기판. - 제 1항에 있어서,
상기 회로패턴의 상면, 제 1 측면 및 제 2 측면의 표면 조도(Ra)는 0.1㎛ 내지 0.13㎛인 인쇄회로기판. - 제 1항에 있어서,
상기 회로패턴의 상면, 하면, 제 1 측면 및 제 2 측면의 표면 조도(Ra)는 0.1㎛ 내지 0.17㎛인 인쇄회로기판. - 제 2항에 있어서,
상기 회로패턴의 폭 방향 단면에서의 상면, 제 1 측면, 및 제 2 측면은 서로 다른 길이를 가지고,
상기 회로패턴의 상면, 제 1 측면, 및 제 2 측면의 표면 조도는 각각의 길이에 따라 서로 다른 값을 가진, 인쇄회로기판. - 제 4항에 있어서,
상기 회로패턴의 상면의 길이는 상기 제 1 측면 및 제 2 측면의 길이보다 크고,
상기 회로패턴의 상면의 표면 조도는 상기 제 1 측면 및 제 2 측면의 표면 조도보다 작은 인쇄회로기판. - 제 3항에 있어서,
상기 회로패턴의 폭 방향 단면에서의 상면, 하면, 제 1 측면, 및 제 2 측면은 서로 다른 길이를 가지고,
상기 회로패턴의 상면, 하면, 제 1 측면, 및 제 2 측면의 표면 조도는 각각의 길이에 따라 서로 다른 값을 가진 인쇄회로기판. - 제 6항에 있어서,
상기 회로패턴의 상면 및 하면의 길이는 상기 제 1 측면 및 제 2 측면의 길이보다 크고,
상기 회로패턴의 상면 및 하면의 표면 조도는 상기 제 1 측면 및 제 2 측면의 표면 조도보다 작은 인쇄회로기판. - 삭제
- 제 1항에 있어서,
상기 회로 패턴의 임피던스는 35.3Ω 이하인 인쇄회로기판.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180161314A KR102698875B1 (ko) | 2018-12-13 | 2018-12-13 | 인쇄회로기판 |
CN201980083094.4A CN113243145B (zh) | 2018-12-13 | 2019-12-12 | 印刷电路板 |
EP19894509.9A EP3897078A4 (en) | 2018-12-13 | 2019-12-12 | PCB |
US17/413,427 US11528801B2 (en) | 2018-12-13 | 2019-12-12 | Printed circuit board |
PCT/KR2019/017566 WO2020122626A1 (ko) | 2018-12-13 | 2019-12-12 | 인쇄회로기판 |
JP2021532343A JP2022511878A (ja) | 2018-12-13 | 2019-12-12 | 印刷回路基板 |
TW111105483A TWI784881B (zh) | 2018-12-13 | 2019-12-13 | 印刷電路板 |
TW108145774A TWI759667B (zh) | 2018-12-13 | 2019-12-13 | 印刷電路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180161314A KR102698875B1 (ko) | 2018-12-13 | 2018-12-13 | 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
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KR20200073051A KR20200073051A (ko) | 2020-06-23 |
KR102698875B1 true KR102698875B1 (ko) | 2024-08-27 |
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KR1020180161314A Active KR102698875B1 (ko) | 2018-12-13 | 2018-12-13 | 인쇄회로기판 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11528801B2 (ko) |
EP (1) | EP3897078A4 (ko) |
JP (1) | JP2022511878A (ko) |
KR (1) | KR102698875B1 (ko) |
CN (1) | CN113243145B (ko) |
TW (2) | TWI759667B (ko) |
WO (1) | WO2020122626A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US12336092B2 (en) | 2016-03-09 | 2025-06-17 | Lg Innotek Co., Ltd. | Circuit board, lens driving device, and camera module including the same |
US12267952B2 (en) | 2020-07-08 | 2025-04-01 | Sumitomo Electric Industries, Ltd. | Flexible printed wiring board and method of manufacturing the same |
CN114080088B (zh) * | 2020-08-10 | 2024-05-31 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制备方法 |
KR20220042632A (ko) * | 2020-09-28 | 2022-04-05 | 삼성전기주식회사 | 인쇄회로기판 |
US20220319741A1 (en) * | 2021-03-30 | 2022-10-06 | Averatek Corporation | Methods and Devices for High Resistance and Low Resistance Conductor Layers Mitigating Skin Depth Loss |
CN114823555B (zh) | 2022-03-04 | 2022-12-13 | 珠海越亚半导体股份有限公司 | 封装结构及其制作方法 |
WO2024150746A1 (ja) * | 2023-01-10 | 2024-07-18 | Jx金属株式会社 | 金属材料 |
WO2024150745A1 (ja) * | 2023-01-10 | 2024-07-18 | Jx金属株式会社 | 金属材料 |
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US20040229024A1 (en) | 2003-04-04 | 2004-11-18 | Toshikazu Harada | Multi-layer printed circuit board and method for manufacturing the same |
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US20150156863A1 (en) | 2007-10-26 | 2015-06-04 | Dell Products L.P. | Method of fabricating a circuit board |
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2018
- 2018-12-13 KR KR1020180161314A patent/KR102698875B1/ko active Active
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2019
- 2019-12-12 US US17/413,427 patent/US11528801B2/en active Active
- 2019-12-12 JP JP2021532343A patent/JP2022511878A/ja active Pending
- 2019-12-12 EP EP19894509.9A patent/EP3897078A4/en active Pending
- 2019-12-12 CN CN201980083094.4A patent/CN113243145B/zh active Active
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20040229024A1 (en) | 2003-04-04 | 2004-11-18 | Toshikazu Harada | Multi-layer printed circuit board and method for manufacturing the same |
US20090120673A1 (en) | 2005-08-23 | 2009-05-14 | Tohoku Unversity | Multilayer circuit board and electronic device |
US20150156863A1 (en) | 2007-10-26 | 2015-06-04 | Dell Products L.P. | Method of fabricating a circuit board |
Also Published As
Publication number | Publication date |
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TWI784881B (zh) | 2022-11-21 |
JP2022511878A (ja) | 2022-02-01 |
TW202025430A (zh) | 2020-07-01 |
EP3897078A4 (en) | 2022-09-07 |
US20220061147A1 (en) | 2022-02-24 |
EP3897078A1 (en) | 2021-10-20 |
CN113243145A (zh) | 2021-08-10 |
WO2020122626A1 (ko) | 2020-06-18 |
TW202224135A (zh) | 2022-06-16 |
KR20200073051A (ko) | 2020-06-23 |
US11528801B2 (en) | 2022-12-13 |
CN113243145B (zh) | 2023-12-15 |
TWI759667B (zh) | 2022-04-01 |
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