CN106658977B - 电路板的线路制作方法及利用该方法制作的电路板 - Google Patents
电路板的线路制作方法及利用该方法制作的电路板 Download PDFInfo
- Publication number
- CN106658977B CN106658977B CN201510726669.3A CN201510726669A CN106658977B CN 106658977 B CN106658977 B CN 106658977B CN 201510726669 A CN201510726669 A CN 201510726669A CN 106658977 B CN106658977 B CN 106658977B
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- China
- Prior art keywords
- layer
- line
- copper
- layers
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510726669.3A CN106658977B (zh) | 2015-10-29 | 2015-10-29 | 电路板的线路制作方法及利用该方法制作的电路板 |
TW104138178A TWI615071B (zh) | 2015-10-29 | 2015-11-19 | 封裝基板之線路製作方法及利用該方法製作之封裝基板 |
US14/967,907 US9992873B2 (en) | 2015-10-29 | 2015-12-14 | Method of manufacturing a package substrate |
US15/953,560 US10412835B2 (en) | 2015-10-29 | 2018-04-16 | Package substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510726669.3A CN106658977B (zh) | 2015-10-29 | 2015-10-29 | 电路板的线路制作方法及利用该方法制作的电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106658977A CN106658977A (zh) | 2017-05-10 |
CN106658977B true CN106658977B (zh) | 2019-11-12 |
Family
ID=58635287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510726669.3A Active CN106658977B (zh) | 2015-10-29 | 2015-10-29 | 电路板的线路制作方法及利用该方法制作的电路板 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9992873B2 (zh) |
CN (1) | CN106658977B (zh) |
TW (1) | TWI615071B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107708297A (zh) * | 2017-08-31 | 2018-02-16 | 深圳崇达多层线路板有限公司 | 一种基于焊盘的电镀引线设计 |
CN108133886A (zh) * | 2017-12-11 | 2018-06-08 | 上海申和热磁电子有限公司 | 一种dbc基板背面研磨的方法 |
US10615109B2 (en) * | 2018-05-10 | 2020-04-07 | Advanced Semiconductor Engineering, Inc. | Substrate, semiconductor device package and method of manufacturing the same |
KR102698875B1 (ko) * | 2018-12-13 | 2024-08-27 | 엘지이노텍 주식회사 | 인쇄회로기판 |
TWI727651B (zh) * | 2020-02-10 | 2021-05-11 | 仁寶電腦工業股份有限公司 | 多層線路板 |
CN113630977B (zh) * | 2020-05-06 | 2023-01-17 | 鹏鼎控股(深圳)股份有限公司 | 厚铜电路板及其制作方法 |
CN114501801A (zh) * | 2020-10-28 | 2022-05-13 | 深南电路股份有限公司 | 一种线路板的加工方法及线路板 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US6660941B2 (en) * | 2001-02-21 | 2003-12-09 | Sony Corporation | Electronic parts mounting board and production method thereof |
CN1591805A (zh) * | 2003-09-04 | 2005-03-09 | 美龙翔微电子科技(深圳)有限公司 | 热增强型球栅阵列集成电路封装基板制造方法及封装基板 |
CN101189924A (zh) * | 2005-06-01 | 2008-05-28 | 三井金属矿业株式会社 | 电路基板形成用铸型及其制造方法、电路基板及其制造方法、多层层压电路基板的制造方法以及导电孔的形成方法 |
CN101593705A (zh) * | 2008-05-29 | 2009-12-02 | 欣兴电子股份有限公司 | 芯片载板的制造方法 |
CN101728355A (zh) * | 2008-11-03 | 2010-06-09 | 巨擘科技股份有限公司 | 多层基板的导孔结构及其制造方法 |
CN101888738A (zh) * | 2009-05-13 | 2010-11-17 | 日月光半导体制造股份有限公司 | 具有侧斜面的线路层组件的内埋式基板及其制造方法 |
CN103915421A (zh) * | 2012-12-28 | 2014-07-09 | 台湾积体电路制造股份有限公司 | 用于形成堆叠封装件的方法和装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19620095B4 (de) * | 1996-05-18 | 2006-07-06 | Tamm, Wilhelm, Dipl.-Ing. (FH) | Verfahren zur Herstellung von Leiterplatten |
US6663946B2 (en) * | 2001-02-28 | 2003-12-16 | Kyocera Corporation | Multi-layer wiring substrate |
JP2002329966A (ja) * | 2001-04-27 | 2002-11-15 | Sumitomo Bakelite Co Ltd | 多層配線板製造用配線基板及び多層配線板 |
US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
US20080043447A1 (en) * | 2002-05-01 | 2008-02-21 | Amkor Technology, Inc. | Semiconductor package having laser-embedded terminals |
KR100761706B1 (ko) * | 2006-09-06 | 2007-09-28 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
US7632753B1 (en) * | 2007-10-04 | 2009-12-15 | Amkor Technology, Inc. | Wafer level package utilizing laser-activated dielectric material |
TW200919601A (en) * | 2007-10-26 | 2009-05-01 | Fupo Electronics Corp | Elastic bumps on tilt sidewall and method of manufacturing same |
TWI468093B (zh) * | 2008-10-31 | 2015-01-01 | Princo Corp | 多層基板之導孔結構及其製造方法 |
TWI447864B (zh) * | 2011-06-09 | 2014-08-01 | Unimicron Technology Corp | 封裝基板及其製法 |
US8866311B2 (en) * | 2012-09-21 | 2014-10-21 | Advanced Semiconductor Engineering, Inc. | Semiconductor package substrates having pillars and related methods |
US9659853B2 (en) * | 2015-04-24 | 2017-05-23 | Advanced Semiconductor Engineering, Inc. | Double side via last method for double embedded patterned substrate |
-
2015
- 2015-10-29 CN CN201510726669.3A patent/CN106658977B/zh active Active
- 2015-11-19 TW TW104138178A patent/TWI615071B/zh active
- 2015-12-14 US US14/967,907 patent/US9992873B2/en active Active
-
2018
- 2018-04-16 US US15/953,560 patent/US10412835B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US6660941B2 (en) * | 2001-02-21 | 2003-12-09 | Sony Corporation | Electronic parts mounting board and production method thereof |
CN1591805A (zh) * | 2003-09-04 | 2005-03-09 | 美龙翔微电子科技(深圳)有限公司 | 热增强型球栅阵列集成电路封装基板制造方法及封装基板 |
CN101189924A (zh) * | 2005-06-01 | 2008-05-28 | 三井金属矿业株式会社 | 电路基板形成用铸型及其制造方法、电路基板及其制造方法、多层层压电路基板的制造方法以及导电孔的形成方法 |
CN101593705A (zh) * | 2008-05-29 | 2009-12-02 | 欣兴电子股份有限公司 | 芯片载板的制造方法 |
CN101728355A (zh) * | 2008-11-03 | 2010-06-09 | 巨擘科技股份有限公司 | 多层基板的导孔结构及其制造方法 |
CN101888738A (zh) * | 2009-05-13 | 2010-11-17 | 日月光半导体制造股份有限公司 | 具有侧斜面的线路层组件的内埋式基板及其制造方法 |
CN103915421A (zh) * | 2012-12-28 | 2014-07-09 | 台湾积体电路制造股份有限公司 | 用于形成堆叠封装件的方法和装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201720255A (zh) | 2017-06-01 |
US20170127519A1 (en) | 2017-05-04 |
US9992873B2 (en) | 2018-06-05 |
TWI615071B (zh) | 2018-02-11 |
CN106658977A (zh) | 2017-05-10 |
US20180235085A1 (en) | 2018-08-16 |
US10412835B2 (en) | 2019-09-10 |
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Effective date of registration: 20230926 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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