WO2008133182A1 - 金属-樹脂積層体 - Google Patents
金属-樹脂積層体 Download PDFInfo
- Publication number
- WO2008133182A1 WO2008133182A1 PCT/JP2008/057517 JP2008057517W WO2008133182A1 WO 2008133182 A1 WO2008133182 A1 WO 2008133182A1 JP 2008057517 W JP2008057517 W JP 2008057517W WO 2008133182 A1 WO2008133182 A1 WO 2008133182A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- metal foil
- thermoplastic polyimide
- resin laminate
- laminate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800115332A CN101652244B (zh) | 2007-04-18 | 2008-04-17 | 金属-树脂层压体 |
JP2009511846A JP4896219B2 (ja) | 2007-04-18 | 2008-04-17 | 金属−樹脂積層体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007109623 | 2007-04-18 | ||
JP2007-109623 | 2007-04-18 | ||
JP2007306107 | 2007-11-27 | ||
JP2007-306107 | 2007-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133182A1 true WO2008133182A1 (ja) | 2008-11-06 |
Family
ID=39925638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057517 WO2008133182A1 (ja) | 2007-04-18 | 2008-04-17 | 金属-樹脂積層体 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4896219B2 (ja) |
CN (1) | CN101652244B (ja) |
TW (1) | TWI393629B (ja) |
WO (1) | WO2008133182A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010221586A (ja) * | 2009-03-24 | 2010-10-07 | Asahi Kasei E-Materials Corp | 金属箔ポリイミド積層体 |
JP2011037157A (ja) * | 2009-08-12 | 2011-02-24 | Asahi Kasei E-Materials Corp | 金属箔ポリイミド積層体 |
WO2011040440A1 (ja) * | 2009-09-30 | 2011-04-07 | 大日本印刷株式会社 | フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板、フレキシブルデバイス、薄膜素子用基板、薄膜素子、薄膜トランジスタ、薄膜素子用基板の製造方法、薄膜素子の製造方法および薄膜トランジスタの製造方法 |
JP2011097007A (ja) * | 2009-09-30 | 2011-05-12 | Dainippon Printing Co Ltd | フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板およびフレキシブルデバイス |
JP2011138683A (ja) * | 2009-12-28 | 2011-07-14 | Dainippon Printing Co Ltd | 電子素子 |
CN101794766B (zh) * | 2009-01-29 | 2012-07-04 | 雅马哈株式会社 | 热交换单元 |
CN102576735A (zh) * | 2009-09-30 | 2012-07-11 | 大日本印刷株式会社 | 挠性装置用基板、挠性装置用薄膜晶体管基板、挠性装置、薄膜元件用基板、薄膜元件、薄膜晶体管、薄膜元件用基板的制造方法、薄膜元件的制造方法及薄膜晶体管的制造方法 |
CN103171190A (zh) * | 2011-12-21 | 2013-06-26 | 新日铁住金化学株式会社 | 两面覆金属层叠板及其制造方法 |
JP2016192530A (ja) * | 2015-03-31 | 2016-11-10 | 新日鉄住金化学株式会社 | 銅張積層板、プリント配線板及びその使用方法 |
WO2021070232A1 (ja) * | 2019-10-07 | 2021-04-15 | Hdマイクロシステムズ株式会社 | ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
WO2021075395A1 (ja) * | 2019-10-15 | 2021-04-22 | 住友化学株式会社 | 光学フィルム |
JP7556806B2 (ja) | 2021-03-02 | 2024-09-26 | ノリタケ株式会社 | 導電性ペーストおよびその利用 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101437612B1 (ko) * | 2010-12-20 | 2014-09-15 | 에스케이이노베이션 주식회사 | 후막 폴리이미드 연성금속적층판의 제조방법 |
CN103172883B (zh) * | 2011-12-26 | 2016-09-28 | 深圳光启高等理工研究院 | 超材料基板加工方法 |
CN102573315B (zh) * | 2012-01-31 | 2015-05-13 | 云南云天化股份有限公司 | 环氧树脂电路板的电路形成工艺 |
CN102963062B (zh) * | 2012-03-16 | 2013-10-30 | 深圳光启创新技术有限公司 | 复合板、超材料及其加工方法 |
CN106113803A (zh) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | 一种铝基覆铜板及其用途和制备方法 |
CN105916292A (zh) * | 2016-06-16 | 2016-08-31 | 常州市超顺电子技术有限公司 | 可折弯的铝基覆铜板及其用途和制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199668A (ja) * | 1997-10-23 | 1999-07-27 | Kanegafuchi Chem Ind Co Ltd | ポリイミド組成物及びそれからなるtab用テープとフレキシブルプリント基板 |
JP2000058989A (ja) * | 1998-08-13 | 2000-02-25 | Mitsui Chemicals Inc | フレキシブル金属箔積層板 |
JP2005186574A (ja) * | 2003-12-26 | 2005-07-14 | Kaneka Corp | 接着性シートの製造方法および接着性シート、これを用いたフレキシブル金属張積層板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0633267A (ja) * | 1992-07-16 | 1994-02-08 | Asahi Denka Kogyo Kk | アルミニウムの表面処理液 |
JP3587291B2 (ja) * | 1998-12-01 | 2004-11-10 | 株式会社カネカ | Tab用テープ |
CN1241733C (zh) * | 1999-10-21 | 2006-02-15 | 新日铁化学株式会社 | 层压品及其生产方法 |
TW584596B (en) * | 2001-12-10 | 2004-04-21 | Mitsui Chemicals Inc | Method for manufacturing a polyimide and metal compound sheet |
JP4456836B2 (ja) * | 2002-09-13 | 2010-04-28 | 株式会社カネカ | ポリイミドフィルム及びその製造方法並びにその利用 |
KR100710099B1 (ko) * | 2002-09-13 | 2007-04-20 | 카네카 코포레이션 | 폴리이미드 필름 및 그의 제조 방법 및 그의 이용 |
JP4401998B2 (ja) * | 2005-03-31 | 2010-01-20 | 日鉱金属株式会社 | 銅張積層基板用高光沢圧延銅箔及びその製造方法 |
JP2007062274A (ja) * | 2005-09-01 | 2007-03-15 | Shin Etsu Chem Co Ltd | フレキシブル片面銅張積層板及びその製造方法 |
-
2008
- 2008-04-17 JP JP2009511846A patent/JP4896219B2/ja not_active Expired - Fee Related
- 2008-04-17 TW TW097113987A patent/TWI393629B/zh not_active IP Right Cessation
- 2008-04-17 CN CN2008800115332A patent/CN101652244B/zh not_active Expired - Fee Related
- 2008-04-17 WO PCT/JP2008/057517 patent/WO2008133182A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11199668A (ja) * | 1997-10-23 | 1999-07-27 | Kanegafuchi Chem Ind Co Ltd | ポリイミド組成物及びそれからなるtab用テープとフレキシブルプリント基板 |
JP2000058989A (ja) * | 1998-08-13 | 2000-02-25 | Mitsui Chemicals Inc | フレキシブル金属箔積層板 |
JP2005186574A (ja) * | 2003-12-26 | 2005-07-14 | Kaneka Corp | 接着性シートの製造方法および接着性シート、これを用いたフレキシブル金属張積層板 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101794766B (zh) * | 2009-01-29 | 2012-07-04 | 雅马哈株式会社 | 热交换单元 |
JP2010221586A (ja) * | 2009-03-24 | 2010-10-07 | Asahi Kasei E-Materials Corp | 金属箔ポリイミド積層体 |
JP2011037157A (ja) * | 2009-08-12 | 2011-02-24 | Asahi Kasei E-Materials Corp | 金属箔ポリイミド積層体 |
WO2011040440A1 (ja) * | 2009-09-30 | 2011-04-07 | 大日本印刷株式会社 | フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板、フレキシブルデバイス、薄膜素子用基板、薄膜素子、薄膜トランジスタ、薄膜素子用基板の製造方法、薄膜素子の製造方法および薄膜トランジスタの製造方法 |
JP2011097007A (ja) * | 2009-09-30 | 2011-05-12 | Dainippon Printing Co Ltd | フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板およびフレキシブルデバイス |
CN102576735A (zh) * | 2009-09-30 | 2012-07-11 | 大日本印刷株式会社 | 挠性装置用基板、挠性装置用薄膜晶体管基板、挠性装置、薄膜元件用基板、薄膜元件、薄膜晶体管、薄膜元件用基板的制造方法、薄膜元件的制造方法及薄膜晶体管的制造方法 |
US9024312B2 (en) | 2009-09-30 | 2015-05-05 | Dai Nippon Printing Co., Ltd. | Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistor |
JP2011138683A (ja) * | 2009-12-28 | 2011-07-14 | Dainippon Printing Co Ltd | 電子素子 |
JP2013129116A (ja) * | 2011-12-21 | 2013-07-04 | Nippon Steel & Sumikin Chemical Co Ltd | 両面金属張積層板およびその製造方法 |
CN103171190A (zh) * | 2011-12-21 | 2013-06-26 | 新日铁住金化学株式会社 | 两面覆金属层叠板及其制造方法 |
JP2016192530A (ja) * | 2015-03-31 | 2016-11-10 | 新日鉄住金化学株式会社 | 銅張積層板、プリント配線板及びその使用方法 |
WO2021070232A1 (ja) * | 2019-10-07 | 2021-04-15 | Hdマイクロシステムズ株式会社 | ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
JPWO2021070232A1 (ja) * | 2019-10-07 | 2021-04-15 | ||
JP7484926B2 (ja) | 2019-10-07 | 2024-05-16 | Hdマイクロシステムズ株式会社 | ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
WO2021075395A1 (ja) * | 2019-10-15 | 2021-04-22 | 住友化学株式会社 | 光学フィルム |
JP7556806B2 (ja) | 2021-03-02 | 2024-09-26 | ノリタケ株式会社 | 導電性ペーストおよびその利用 |
Also Published As
Publication number | Publication date |
---|---|
TWI393629B (zh) | 2013-04-21 |
CN101652244B (zh) | 2013-06-26 |
JP4896219B2 (ja) | 2012-03-14 |
JPWO2008133182A1 (ja) | 2010-07-22 |
TW200909202A (en) | 2009-03-01 |
CN101652244A (zh) | 2010-02-17 |
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