JP2005535787A5 - - Google Patents
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- Publication number
- JP2005535787A5 JP2005535787A5 JP2004529271A JP2004529271A JP2005535787A5 JP 2005535787 A5 JP2005535787 A5 JP 2005535787A5 JP 2004529271 A JP2004529271 A JP 2004529271A JP 2004529271 A JP2004529271 A JP 2004529271A JP 2005535787 A5 JP2005535787 A5 JP 2005535787A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- plating solution
- copper
- solution according
- vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007747 plating Methods 0.000 claims 19
- 239000002253 acid Substances 0.000 claims 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 10
- 229910052802 copper Inorganic materials 0.000 claims 10
- 239000010949 copper Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 10
- -1 aryl sulfonic acid Chemical compound 0.000 claims 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 5
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims 4
- 229910052794 bromium Inorganic materials 0.000 claims 4
- 229910052801 chlorine Inorganic materials 0.000 claims 4
- 150000001879 copper Chemical class 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 4
- 229910052731 fluorine Inorganic materials 0.000 claims 4
- 229910052740 iodine Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 238000001465 metallisation Methods 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 230000000737 periodic effect Effects 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 150000001450 anions Chemical class 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 150000002431 hydrogen Chemical class 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 229940098779 methanesulfonic acid Drugs 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 claims 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims 1
- RBOISUKOFPWLAM-UHFFFAOYSA-N 1,2-dichloroethane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(Cl)(CCl)S(O)(=O)=O RBOISUKOFPWLAM-UHFFFAOYSA-N 0.000 claims 1
- BMWQTFJPPVXOQN-UHFFFAOYSA-N 2-chloroethane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(CCl)S(O)(=O)=O BMWQTFJPPVXOQN-UHFFFAOYSA-N 0.000 claims 1
- LKKLYYNHLAODSF-UHFFFAOYSA-N 3-chloropropane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(S(O)(=O)=O)CCCl LKKLYYNHLAODSF-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 claims 1
- JFABEGSTCBAFEC-UHFFFAOYSA-N chloromethanedisulfonic acid Chemical compound OS(=O)(=O)C(Cl)S(O)(=O)=O JFABEGSTCBAFEC-UHFFFAOYSA-N 0.000 claims 1
- VRTISJSEHVIMNN-UHFFFAOYSA-N dichloromethanedisulfonic acid Chemical compound OS(=O)(=O)C(Cl)(Cl)S(O)(=O)=O VRTISJSEHVIMNN-UHFFFAOYSA-N 0.000 claims 1
- DBNBYVDVUHEYAX-UHFFFAOYSA-N ethane-1,1-disulfonate;hydron Chemical compound OS(=O)(=O)C(C)S(O)(=O)=O DBNBYVDVUHEYAX-UHFFFAOYSA-N 0.000 claims 1
- AFAXGSQYZLGZPG-UHFFFAOYSA-N ethanedisulfonic acid Chemical compound OS(=O)(=O)CCS(O)(=O)=O AFAXGSQYZLGZPG-UHFFFAOYSA-N 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- RJQRCOMHVBLQIH-UHFFFAOYSA-M pentane-1-sulfonate Chemical compound CCCCCS([O-])(=O)=O RJQRCOMHVBLQIH-UHFFFAOYSA-M 0.000 claims 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 claims 1
- 229940044654 phenolsulfonic acid Drugs 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- CAXRKYFRLOPCAB-UHFFFAOYSA-N propane-1,1-disulfonic acid Chemical compound CCC(S(O)(=O)=O)S(O)(=O)=O CAXRKYFRLOPCAB-UHFFFAOYSA-N 0.000 claims 1
- MGNVWUDMMXZUDI-UHFFFAOYSA-N propane-1,3-disulfonic acid Chemical compound OS(=O)(=O)CCCS(O)(=O)=O MGNVWUDMMXZUDI-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40395402P | 2002-08-16 | 2002-08-16 | |
| US10/620,042 US20040045832A1 (en) | 1999-10-14 | 2003-07-15 | Electrolytic copper plating solutions |
| PCT/US2003/024747 WO2004016829A2 (en) | 2002-08-16 | 2003-08-08 | Electrolytic copper plating solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005535787A JP2005535787A (ja) | 2005-11-24 |
| JP2005535787A5 true JP2005535787A5 (https=) | 2006-09-14 |
Family
ID=31891409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004529271A Abandoned JP2005535787A (ja) | 2002-08-16 | 2003-08-08 | 電解銅めっき液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040045832A1 (https=) |
| EP (1) | EP1529126A4 (https=) |
| JP (1) | JP2005535787A (https=) |
| CN (1) | CN1592800A (https=) |
| AU (1) | AU2003259049A1 (https=) |
| CA (1) | CA2465363A1 (https=) |
| TW (1) | TWI285687B (https=) |
| WO (1) | WO2004016829A2 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
| JP4238051B2 (ja) * | 2003-03-11 | 2009-03-11 | 日本ペイント株式会社 | カチオン電着塗料組成物及びカチオン電着塗料組成物の安定化方法 |
| JP2005272874A (ja) * | 2004-03-23 | 2005-10-06 | Sumitomo Bakelite Co Ltd | 回路基板の製造方法 |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| JP4704761B2 (ja) * | 2005-01-19 | 2011-06-22 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| US20060231409A1 (en) * | 2005-03-31 | 2006-10-19 | Tdk Corporation | Plating solution, conductive material, and surface treatment method of conductive material |
| JP4764718B2 (ja) * | 2005-12-28 | 2011-09-07 | 新光電気工業株式会社 | スルーホールの充填方法 |
| US7575666B2 (en) * | 2006-04-05 | 2009-08-18 | James Watkowski | Process for electrolytically plating copper |
| US20080110759A1 (en) * | 2006-11-14 | 2008-05-15 | Tower Semiconductor Ltd. | Self Terminating Overburden Free Plating (STOP) Of Metals On Patterned Wafers |
| TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
| JP2009041097A (ja) * | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
| DE502008000573D1 (de) * | 2008-02-29 | 2010-06-02 | Atotech Deutschland Gmbh | Pyrophosphat-basiertes Bad zur Abscheidung von Zinn-Legierungsschichten |
| WO2011149965A2 (en) | 2010-05-24 | 2011-12-01 | Enthone Inc. | Copper filling of through silicon vias |
| US8388824B2 (en) | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
| US20100206737A1 (en) * | 2009-02-17 | 2010-08-19 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
| CN104195602B (zh) * | 2009-04-07 | 2017-05-31 | 巴斯夫欧洲公司 | 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 |
| WO2010115796A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| US20100320081A1 (en) * | 2009-06-17 | 2010-12-23 | Mayer Steven T | Apparatus for wetting pretreatment for enhanced damascene metal filling |
| TWI465609B (zh) * | 2009-07-07 | 2014-12-21 | Furukawa Electric Co Ltd | An electrolytic copper film, a method for producing the same, and a copper electrolytic solution for manufacturing a copper electrolytic film |
| US20120175744A1 (en) * | 2009-09-28 | 2012-07-12 | Basf Se | Copper electroplating composition |
| WO2011102276A1 (ja) * | 2010-02-22 | 2011-08-25 | Jx日鉱日石金属株式会社 | 高純度スルホン酸銅水溶液及びその製造方法 |
| KR101705734B1 (ko) * | 2011-02-18 | 2017-02-14 | 삼성전자주식회사 | 구리 도금 용액 및 이것을 이용한 구리 도금 방법 |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| CN103361694A (zh) * | 2013-08-08 | 2013-10-23 | 上海新阳半导体材料股份有限公司 | 一种用于3d铜互连高深宽比硅通孔技术微孔电镀填铜方法 |
| CN104762643A (zh) * | 2014-12-17 | 2015-07-08 | 安捷利电子科技（苏州）有限公司 | 一种通孔、盲孔和线路共镀的镀铜药水 |
| CN107532324A (zh) * | 2015-04-27 | 2018-01-02 | 株式会社杰希优 | 硫酸铜镀液的管理方法 |
| CN108174615B (zh) | 2015-09-29 | 2023-02-17 | 大日本印刷株式会社 | 布线构造体制造方法、图案构造体形成方法及压印用模具 |
| JP2017222903A (ja) * | 2016-06-15 | 2017-12-21 | 公立大学法人大阪府立大学 | ハロゲンフリーまたは低ハロゲン電解穴埋め銅めっき浴 |
| JP7039601B2 (ja) * | 2016-09-22 | 2022-03-22 | マクダーミッド エンソン インコーポレイテッド | マイクロエレクトロニクスにおける銅電着 |
| CN106757191B (zh) * | 2016-11-23 | 2019-10-01 | 苏州昕皓新材料科技有限公司 | 一种具有高择优取向的铜晶体颗粒及其制备方法 |
| TWI647342B (zh) * | 2017-08-03 | 2019-01-11 | 國家中山科學研究院 | Copper-silver two-component metal plating liquid for semiconductor wires and plating method |
| US11387108B2 (en) * | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN108914171B (zh) * | 2018-07-19 | 2020-05-19 | 广东工业大学 | 一种加速铜沉积添加剂及其制备方法和应用 |
| CN110983389B (zh) * | 2019-12-31 | 2020-11-13 | 广州三孚新材料科技股份有限公司 | 一种钢铁件无氰碱性电镀铜液及其制备方法 |
| CN113279026B (zh) * | 2021-04-25 | 2022-09-02 | 厦门理工学院 | 一种用于铜箔盲孔填孔的药水 |
| CN116856022B (zh) * | 2023-07-05 | 2024-02-20 | 诺博环保科技(中山)有限公司 | 一种电镀用合金添加剂及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2252942A (en) * | 1938-07-01 | 1941-08-19 | Clyde M Mourer | Metal spray gun |
| US2525943A (en) * | 1947-09-24 | 1950-10-17 | Standard Oil Co | Copper plating bath and process |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| DE2204326C3 (de) * | 1972-01-26 | 1981-07-09 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und duktilen Kupferüberzügen |
| US3956084A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4374709A (en) * | 1980-05-01 | 1983-02-22 | Occidental Chemical Corporation | Process for plating polymeric substrates |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
| US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| US4673459A (en) * | 1985-06-18 | 1987-06-16 | Kamyr, Inc. | Radial configuration of evaporator heating elements and method |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
| US5174886A (en) * | 1991-02-22 | 1992-12-29 | Mcgean-Rohco, Inc. | High-throw acid copper plating using inert electrolyte |
| US5385661A (en) * | 1993-09-17 | 1995-01-31 | International Business Machines Corporation | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
| DE4338148C2 (de) * | 1993-11-04 | 1997-01-30 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung matter und pickelfreier Kupferschichten mit hoher Bruchdehnung auf Substratoberflächen |
| DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| JPH10310881A (ja) * | 1997-05-12 | 1998-11-24 | Toppan Printing Co Ltd | 銅系金属材料のエッチング方法 |
| US6270601B1 (en) * | 1998-11-02 | 2001-08-07 | Coorstek, Inc. | Method for producing filled vias in electronic components |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US6605204B1 (en) * | 1999-10-14 | 2003-08-12 | Atofina Chemicals, Inc. | Electroplating of copper from alkanesulfonate electrolytes |
-
2003
- 2003-07-15 US US10/620,042 patent/US20040045832A1/en not_active Abandoned
- 2003-08-08 AU AU2003259049A patent/AU2003259049A1/en not_active Abandoned
- 2003-08-08 CN CN03801591.9A patent/CN1592800A/zh active Pending
- 2003-08-08 EP EP03788347A patent/EP1529126A4/en not_active Withdrawn
- 2003-08-08 WO PCT/US2003/024747 patent/WO2004016829A2/en not_active Ceased
- 2003-08-08 JP JP2004529271A patent/JP2005535787A/ja not_active Abandoned
- 2003-08-08 CA CA002465363A patent/CA2465363A1/en not_active Abandoned
- 2003-08-15 TW TW092122506A patent/TWI285687B/zh not_active IP Right Cessation
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