JP2001521288A5 - - Google Patents

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Publication number
JP2001521288A5
JP2001521288A5 JP2000517447A JP2000517447A JP2001521288A5 JP 2001521288 A5 JP2001521288 A5 JP 2001521288A5 JP 2000517447 A JP2000517447 A JP 2000517447A JP 2000517447 A JP2000517447 A JP 2000517447A JP 2001521288 A5 JP2001521288 A5 JP 2001521288A5
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JP
Japan
Prior art keywords
solder
solder bump
semiconductor wafer
integrated circuit
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000517447A
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English (en)
Japanese (ja)
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JP4580550B2 (ja
JP2001521288A (ja
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Priority claimed from US08/954,426 external-priority patent/US6441487B2/en
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Publication of JP2001521288A publication Critical patent/JP2001521288A/ja
Publication of JP2001521288A5 publication Critical patent/JP2001521288A5/ja
Application granted granted Critical
Publication of JP4580550B2 publication Critical patent/JP4580550B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000517447A 1997-10-20 1998-10-19 チップスケールパッケージ、はんだバンプ半導体ウェハ構造及び集積回路用のフリップチップパッケージの形成方法 Expired - Fee Related JP4580550B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/954,426 US6441487B2 (en) 1997-10-20 1997-10-20 Chip scale package using large ductile solder balls
US08/954,426 1997-10-20
PCT/US1998/022071 WO1999021226A1 (en) 1997-10-20 1998-10-19 Chip scale package using large ductile solder balls

Publications (3)

Publication Number Publication Date
JP2001521288A JP2001521288A (ja) 2001-11-06
JP2001521288A5 true JP2001521288A5 (enExample) 2009-03-26
JP4580550B2 JP4580550B2 (ja) 2010-11-17

Family

ID=25495408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000517447A Expired - Fee Related JP4580550B2 (ja) 1997-10-20 1998-10-19 チップスケールパッケージ、はんだバンプ半導体ウェハ構造及び集積回路用のフリップチップパッケージの形成方法

Country Status (6)

Country Link
US (3) US6441487B2 (enExample)
EP (2) EP2053655A3 (enExample)
JP (1) JP4580550B2 (enExample)
KR (1) KR100541827B1 (enExample)
DE (1) DE69840636D1 (enExample)
WO (1) WO1999021226A1 (enExample)

Families Citing this family (262)

* Cited by examiner, † Cited by third party
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