DE69840636D1 - Herstelungsmethode für eine csp-packung mit grossen duktielen lötkugeln - Google Patents

Herstelungsmethode für eine csp-packung mit grossen duktielen lötkugeln

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Publication number
DE69840636D1
DE69840636D1 DE69840636T DE69840636T DE69840636D1 DE 69840636 D1 DE69840636 D1 DE 69840636D1 DE 69840636 T DE69840636 T DE 69840636T DE 69840636 T DE69840636 T DE 69840636T DE 69840636 D1 DE69840636 D1 DE 69840636D1
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Germany
Prior art keywords
duktields
csp
pack
great
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69840636T
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German (de)
English (en)
Inventor
Peter Elenius
Harry Hollack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FlipChip International LLC
Original Assignee
FlipChip International LLC
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Publication date
Application filed by FlipChip International LLC filed Critical FlipChip International LLC
Application granted granted Critical
Publication of DE69840636D1 publication Critical patent/DE69840636D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G06F1/16—Constructional details or arrangements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/013—Alloys
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    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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  • General Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69840636T 1997-10-20 1998-10-19 Herstelungsmethode für eine csp-packung mit grossen duktielen lötkugeln Expired - Lifetime DE69840636D1 (de)

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US08/954,426 US6441487B2 (en) 1997-10-20 1997-10-20 Chip scale package using large ductile solder balls
PCT/US1998/022071 WO1999021226A1 (en) 1997-10-20 1998-10-19 Chip scale package using large ductile solder balls

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