DE69535276D1 - Herstellungsverfahren für eine thermoelektrische Anordnung - Google Patents
Herstellungsverfahren für eine thermoelektrische AnordnungInfo
- Publication number
- DE69535276D1 DE69535276D1 DE69535276T DE69535276T DE69535276D1 DE 69535276 D1 DE69535276 D1 DE 69535276D1 DE 69535276 T DE69535276 T DE 69535276T DE 69535276 T DE69535276 T DE 69535276T DE 69535276 D1 DE69535276 D1 DE 69535276D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- thermoelectric device
- thermoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10875794 | 1994-05-23 | ||
JP12287394 | 1994-06-03 | ||
JP6122873A JP2893373B2 (ja) | 1994-06-03 | 1994-06-03 | 熱電素子 |
JP17898794 | 1994-07-29 | ||
JP17898794 | 1994-07-29 | ||
JP10875794 | 1994-07-29 | ||
JP8290695 | 1995-04-07 | ||
JP08290695A JP3592395B2 (ja) | 1994-05-23 | 1995-04-07 | 熱電変換素子とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69535276D1 true DE69535276D1 (de) | 2006-11-30 |
DE69535276T2 DE69535276T2 (de) | 2007-08-30 |
Family
ID=27466757
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69535276T Expired - Lifetime DE69535276T2 (de) | 1994-05-23 | 1995-05-23 | Herstellungsverfahren für eine thermoelektrische Anordnung |
DE69529019T Expired - Lifetime DE69529019T2 (de) | 1994-05-23 | 1995-05-23 | Thermoelektrische Anordnung und Herstellungsverfahren dafür |
DE69535235T Expired - Lifetime DE69535235T2 (de) | 1994-05-23 | 1995-05-23 | Thermoelektrische Vorrichtung |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69529019T Expired - Lifetime DE69529019T2 (de) | 1994-05-23 | 1995-05-23 | Thermoelektrische Anordnung und Herstellungsverfahren dafür |
DE69535235T Expired - Lifetime DE69535235T2 (de) | 1994-05-23 | 1995-05-23 | Thermoelektrische Vorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5824561A (de) |
EP (3) | EP1154495B1 (de) |
DE (3) | DE69535276T2 (de) |
TW (1) | TW393788B (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3982080B2 (ja) * | 1997-12-05 | 2007-09-26 | 松下電工株式会社 | 熱電モジュールの製造法と熱電モジュール |
WO1999007024A1 (en) | 1997-08-01 | 1999-02-11 | Citizen Watch Co., Ltd. | Thermoelectric element and method for manufacturing the same |
JP2946205B1 (ja) * | 1997-12-25 | 1999-09-06 | セイコーインスツルメンツ株式会社 | 熱発電ユニット並びに該ユニットを用いた携帯用電子機器 |
US6586835B1 (en) * | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
DE19845104A1 (de) * | 1998-09-30 | 2000-04-06 | Siemens Ag | Verfahren zum Herstellen eines thermoelektrischen Wandlers |
JP3600486B2 (ja) * | 1999-08-24 | 2004-12-15 | セイコーインスツル株式会社 | 熱電変換素子の製造方法 |
JP2001085351A (ja) * | 1999-09-14 | 2001-03-30 | Tokyo Electron Ltd | 半導体製造装置及びその方法 |
US6476483B1 (en) | 1999-10-20 | 2002-11-05 | International Business Machines Corporation | Method and apparatus for cooling a silicon on insulator device |
US6288426B1 (en) | 2000-02-28 | 2001-09-11 | International Business Machines Corp. | Thermal conductivity enhanced semiconductor structures and fabrication processes |
CA2443691A1 (en) * | 2001-04-09 | 2002-10-17 | Research Triangle Institute | Thermoelectric device for dna genomic and proteonic chips and thermo-optical switching circuits |
JP2005506693A (ja) | 2001-10-05 | 2005-03-03 | リサーチ・トライアングル・インスティチュート | フォノンブロッキング電子伝達低次元構造 |
US20040178517A9 (en) * | 2001-12-21 | 2004-09-16 | Siu Wing Ming | Split body peltier device for cooling and power generation applications |
KR20050000514A (ko) | 2002-04-15 | 2005-01-05 | 리써치 트라이앵글 인스티튜트 | 양면 펠티어 접합을 이용하는 열전 장치 및 그 열전장치의 제조 방법 |
JP4255691B2 (ja) * | 2002-12-27 | 2009-04-15 | 独立行政法人物質・材料研究機構 | 熱電変換材料を利用した電子部品の冷却装置 |
US20050045702A1 (en) * | 2003-08-29 | 2005-03-03 | William Freeman | Thermoelectric modules and methods of manufacture |
JP4765328B2 (ja) * | 2004-04-16 | 2011-09-07 | 東京エレクトロン株式会社 | 被処理体の処理装置 |
US8063298B2 (en) | 2004-10-22 | 2011-11-22 | Nextreme Thermal Solutions, Inc. | Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields |
US7523617B2 (en) | 2004-10-22 | 2009-04-28 | Nextreme Thermal Solutions, Inc. | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
WO2007002342A2 (en) | 2005-06-22 | 2007-01-04 | Nextreme Thermal Solutions | Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures |
US8623687B2 (en) * | 2005-06-22 | 2014-01-07 | Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures |
JP2007150231A (ja) * | 2005-10-27 | 2007-06-14 | Denso Corp | 熱電変換装置 |
EP1949078A2 (de) * | 2005-11-07 | 2008-07-30 | Koninklijke Philips Electronics N.V. | Biosensor auf säulenbasis und verfahren zur herstellung davon |
US7679203B2 (en) | 2006-03-03 | 2010-03-16 | Nextreme Thermal Solutions, Inc. | Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
WO2009026466A1 (en) | 2007-08-21 | 2009-02-26 | The Regents Of The University Of California | Nanostructures having high performance thermoelectric properties |
US20090090409A1 (en) * | 2007-10-05 | 2009-04-09 | Marlow Industries, Inc. | System and Method for Assembling a Microthermoelectric Device |
DE102008030191A1 (de) * | 2008-06-25 | 2010-01-07 | Micropelt Gmbh | Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
US9214618B2 (en) * | 2008-09-18 | 2015-12-15 | University Of Florida Research Foundation, Inc. | Miniature thermoelectric power generator |
US20110114146A1 (en) * | 2009-11-13 | 2011-05-19 | Alphabet Energy, Inc. | Uniwafer thermoelectric modules |
US9601677B2 (en) | 2010-03-15 | 2017-03-21 | Laird Durham, Inc. | Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces |
US9240328B2 (en) | 2010-11-19 | 2016-01-19 | Alphabet Energy, Inc. | Arrays of long nanostructures in semiconductor materials and methods thereof |
US8736011B2 (en) | 2010-12-03 | 2014-05-27 | Alphabet Energy, Inc. | Low thermal conductivity matrices with embedded nanostructures and methods thereof |
US20120291454A1 (en) * | 2011-05-20 | 2012-11-22 | Baker Hughes Incorporated | Thermoelectric Devices Using Sintered Bonding |
TWI473249B (zh) * | 2011-12-23 | 2015-02-11 | Taiwan Textile Res Inst | 光致冷裝置及其製備方法 |
WO2013116107A1 (en) * | 2012-02-01 | 2013-08-08 | Baker Hughes Incorporated | Thermoelectric devices using sintered bonding |
US9051175B2 (en) | 2012-03-07 | 2015-06-09 | Alphabet Energy, Inc. | Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same |
US9257627B2 (en) | 2012-07-23 | 2016-02-09 | Alphabet Energy, Inc. | Method and structure for thermoelectric unicouple assembly |
US9846089B2 (en) | 2012-08-07 | 2017-12-19 | National University Corporation Kyoto Institute Of Technology | Calorimeter and method for designing calorimeter |
US9082930B1 (en) | 2012-10-25 | 2015-07-14 | Alphabet Energy, Inc. | Nanostructured thermolectric elements and methods of making the same |
WO2015157501A1 (en) | 2014-04-10 | 2015-10-15 | Alphabet Energy, Inc. | Ultra-long silicon nanostructures, and methods of forming and transferring the same |
JP6394491B2 (ja) * | 2014-06-03 | 2018-09-26 | 株式会社デンソー | 熱電変換素子シートの製造方法、熱電変換装置の製造方法 |
JP6881885B2 (ja) | 2015-03-13 | 2021-06-02 | 株式会社Kelk | 熱電発電モジュール |
CN105070821A (zh) * | 2015-08-01 | 2015-11-18 | 河南鸿昌电子有限公司 | 一种致冷件的制造方法 |
JP6794732B2 (ja) * | 2015-09-28 | 2020-12-02 | 三菱マテリアル株式会社 | 熱電変換モジュール及び熱電変換装置 |
JP6447577B2 (ja) * | 2016-05-27 | 2019-01-09 | 株式会社デンソー | 熱電変換装置およびその製造方法 |
WO2018021540A1 (ja) * | 2016-07-28 | 2018-02-01 | 株式会社 東芝 | 熱電材料、熱電材料の製造方法、熱電変換素子、および熱電変換モジュール |
JP6767928B2 (ja) * | 2017-05-26 | 2020-10-14 | 株式会社Kelk | 熱電発電トランスミッタ |
KR20190093516A (ko) * | 2018-02-01 | 2019-08-09 | 엘지이노텍 주식회사 | 열전장치 |
CN113285009A (zh) * | 2021-05-26 | 2021-08-20 | 杭州大和热磁电子有限公司 | 一种通过沉积金锡焊料组装的tec及制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3580743A (en) * | 1966-01-07 | 1971-05-25 | Borg Warner | Thermoelectric module with diagonal construction and method of manufacturing |
US3884726A (en) * | 1972-05-11 | 1975-05-20 | Kurt Landecker | Thermoelectric element |
JPS57147287A (en) * | 1981-03-06 | 1982-09-11 | Citizen Watch Co Ltd | Manufacture of radiation thermocouple |
JPS5864075A (ja) * | 1981-10-13 | 1983-04-16 | Citizen Watch Co Ltd | 熱電堆の製造方法 |
JPS58171873A (ja) * | 1982-04-02 | 1983-10-08 | Showa Denko Kk | サ−モパイルの製造方法 |
DD209545B1 (de) * | 1982-09-16 | 1989-05-24 | Manfred Teubner | Verfahren zur herstellung von thermoelektrischen moduln |
US4497973A (en) * | 1983-02-28 | 1985-02-05 | Ecd-Anr Energy Conversion Company | Thermoelectric device exhibiting decreased stress |
US4493939A (en) * | 1983-10-31 | 1985-01-15 | Varo, Inc. | Method and apparatus for fabricating a thermoelectric array |
JP2602646B2 (ja) * | 1986-09-18 | 1997-04-23 | セイコー電子工業株式会社 | 電子腕時計用熱電素子の製造方法 |
US4845542A (en) * | 1987-03-19 | 1989-07-04 | Unisys Corporation | Interconnect for layered integrated circuit assembly |
US4902648A (en) * | 1988-01-05 | 1990-02-20 | Agency Of Industrial Science And Technology | Process for producing a thermoelectric module |
JP3223257B2 (ja) * | 1991-03-27 | 2001-10-29 | 株式会社フェローテック | 熱電変換モジュールの製造方法 |
DE4134685A1 (de) * | 1991-10-21 | 1993-04-22 | Univ Dresden Tech | Peltier-kuehlmodul |
US5434744A (en) * | 1993-10-22 | 1995-07-18 | Fritz; Robert E. | Thermoelectric module having reduced spacing between semiconductor elements |
US5523628A (en) * | 1994-08-05 | 1996-06-04 | Hughes Aircraft Company | Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips |
-
1995
- 1995-05-19 US US08/445,168 patent/US5824561A/en not_active Expired - Lifetime
- 1995-05-23 DE DE69535276T patent/DE69535276T2/de not_active Expired - Lifetime
- 1995-05-23 DE DE69529019T patent/DE69529019T2/de not_active Expired - Lifetime
- 1995-05-23 EP EP01202364A patent/EP1154495B1/de not_active Expired - Lifetime
- 1995-05-23 EP EP95303464A patent/EP0687020B1/de not_active Expired - Lifetime
- 1995-05-23 EP EP01202362A patent/EP1152474B1/de not_active Expired - Lifetime
- 1995-05-23 DE DE69535235T patent/DE69535235T2/de not_active Expired - Lifetime
- 1995-06-05 TW TW087117354A patent/TW393788B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69535276T2 (de) | 2007-08-30 |
EP1152474A1 (de) | 2001-11-07 |
DE69535235T2 (de) | 2007-01-04 |
DE69535235D1 (de) | 2006-11-02 |
EP1152474B1 (de) | 2006-09-20 |
TW393788B (en) | 2000-06-11 |
EP1154495B1 (de) | 2006-10-18 |
US5824561A (en) | 1998-10-20 |
EP0687020A1 (de) | 1995-12-13 |
EP0687020B1 (de) | 2002-12-04 |
DE69529019T2 (de) | 2003-04-30 |
DE69529019D1 (de) | 2003-01-16 |
EP1154495A3 (de) | 2002-03-06 |
EP1154495A2 (de) | 2001-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |