DE69841080D1 - Montageverfahren für eine Halbleiteranordnung - Google Patents
Montageverfahren für eine HalbleiteranordnungInfo
- Publication number
- DE69841080D1 DE69841080D1 DE69841080T DE69841080T DE69841080D1 DE 69841080 D1 DE69841080 D1 DE 69841080D1 DE 69841080 T DE69841080 T DE 69841080T DE 69841080 T DE69841080 T DE 69841080T DE 69841080 D1 DE69841080 D1 DE 69841080D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- assembly method
- assembly
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12889897 | 1997-05-19 | ||
JP9289836A JP3030271B2 (ja) | 1997-05-19 | 1997-10-22 | 半導体部品の実装方法 |
Publications (1)
Publication Number | Publication Date |
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DE69841080D1 true DE69841080D1 (de) | 2009-10-01 |
Family
ID=26464467
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69826062T Expired - Lifetime DE69826062T2 (de) | 1997-05-19 | 1998-03-20 | Montierungsverfahren für eine Halbleiteranordnung |
DE69841080T Expired - Lifetime DE69841080D1 (de) | 1997-05-19 | 1998-03-20 | Montageverfahren für eine Halbleiteranordnung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69826062T Expired - Lifetime DE69826062T2 (de) | 1997-05-19 | 1998-03-20 | Montierungsverfahren für eine Halbleiteranordnung |
Country Status (4)
Country | Link |
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US (2) | US6458237B1 (de) |
EP (2) | EP0880170B1 (de) |
JP (1) | JP3030271B2 (de) |
DE (2) | DE69826062T2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3301075B2 (ja) * | 1999-04-20 | 2002-07-15 | ソニーケミカル株式会社 | 半導体装置の製造方法 |
DE10019443A1 (de) * | 2000-04-19 | 2001-10-31 | Texas Instruments Deutschland | Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger |
US7076867B2 (en) * | 2001-12-28 | 2006-07-18 | Matsushita Electric Industrial Co., Ltd. | Pressurizing method |
US6967123B2 (en) * | 2002-04-11 | 2005-11-22 | Agilent Technologies, Inc. | Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method |
DE10245398B3 (de) * | 2002-09-28 | 2004-06-03 | Mühlbauer Ag | Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern |
JP2007103486A (ja) * | 2005-09-30 | 2007-04-19 | Kyocera Kinseki Corp | 実装部品の固着方法 |
DE102007054503A1 (de) | 2007-11-13 | 2009-05-20 | Hydac Fluidtechnik Gmbh | Ventilvorrichtung |
KR100986000B1 (ko) | 2008-06-09 | 2010-10-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
DE102015006981B4 (de) * | 2015-05-29 | 2018-09-27 | Mühlbauer Gmbh & Co. Kg | Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat |
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US5783465A (en) * | 1997-04-03 | 1998-07-21 | Lucent Technologies Inc. | Compliant bump technology |
-
1997
- 1997-10-22 JP JP9289836A patent/JP3030271B2/ja not_active Expired - Fee Related
-
1998
- 1998-03-20 EP EP98302110A patent/EP0880170B1/de not_active Expired - Lifetime
- 1998-03-20 US US09/045,115 patent/US6458237B1/en not_active Expired - Lifetime
- 1998-03-20 EP EP03016690A patent/EP1369910B1/de not_active Expired - Lifetime
- 1998-03-20 DE DE69826062T patent/DE69826062T2/de not_active Expired - Lifetime
- 1998-03-20 DE DE69841080T patent/DE69841080D1/de not_active Expired - Lifetime
-
2001
- 2001-03-14 US US09/805,559 patent/US6787925B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0880170A3 (de) | 2000-04-05 |
EP1369910B1 (de) | 2009-08-19 |
EP1369910A2 (de) | 2003-12-10 |
JPH1140609A (ja) | 1999-02-12 |
EP0880170B1 (de) | 2004-09-08 |
US6787925B2 (en) | 2004-09-07 |
JP3030271B2 (ja) | 2000-04-10 |
EP0880170A2 (de) | 1998-11-25 |
US20010011774A1 (en) | 2001-08-09 |
US6458237B1 (en) | 2002-10-01 |
DE69826062D1 (de) | 2004-10-14 |
EP1369910A3 (de) | 2006-04-19 |
DE69826062T2 (de) | 2005-01-20 |
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