DE69627226D1 - Herstellungsverfahren für eine Licht emittierende Halbleitervorrichtung - Google Patents

Herstellungsverfahren für eine Licht emittierende Halbleitervorrichtung

Info

Publication number
DE69627226D1
DE69627226D1 DE69627226T DE69627226T DE69627226D1 DE 69627226 D1 DE69627226 D1 DE 69627226D1 DE 69627226 T DE69627226 T DE 69627226T DE 69627226 T DE69627226 T DE 69627226T DE 69627226 D1 DE69627226 D1 DE 69627226D1
Authority
DE
Germany
Prior art keywords
manufacturing
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69627226T
Other languages
English (en)
Other versions
DE69627226T2 (de
Inventor
Yawara Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds LLC filed Critical Lumileds LLC
Publication of DE69627226D1 publication Critical patent/DE69627226D1/de
Application granted granted Critical
Publication of DE69627226T2 publication Critical patent/DE69627226T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004Confining in the direction perpendicular to the layer structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223Buried stripe structure
    • H01S5/2231Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0421Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0421Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • H01S5/0422Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2059Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054Methods of obtaining the confinement
    • H01S5/2059Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
    • H01S5/2068Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by radiation treatment or annealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3054Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3211Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/3235Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
    • H01S5/32358Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers containing very small amounts, usually less than 1%, of an additional III or V compound to decrease the bandgap strongly in a non-linear way by the bowing effect
    • H01S5/32366(In)GaAs with small amount of N
DE69627226T 1995-01-17 1996-01-16 Herstellungsverfahren für eine Licht emittierende Halbleitervorrichtung Expired - Lifetime DE69627226T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2345295 1995-01-17
JP7023452A JPH08222797A (ja) 1995-01-17 1995-01-17 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE69627226D1 true DE69627226D1 (de) 2003-05-15
DE69627226T2 DE69627226T2 (de) 2004-02-19

Family

ID=12110899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69627226T Expired - Lifetime DE69627226T2 (de) 1995-01-17 1996-01-16 Herstellungsverfahren für eine Licht emittierende Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US6258614B1 (de)
EP (1) EP0723303B1 (de)
JP (1) JPH08222797A (de)
DE (1) DE69627226T2 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3399216B2 (ja) * 1996-03-14 2003-04-21 ソニー株式会社 半導体発光素子
JPH10209569A (ja) * 1997-01-16 1998-08-07 Hewlett Packard Co <Hp> p型窒化物半導体装置とその製造方法
US5943359A (en) * 1997-04-23 1999-08-24 Motorola, Inc. Long wavelength VCSEL
JPH11204833A (ja) * 1998-01-08 1999-07-30 Pioneer Electron Corp 半導体発光素子の製造方法
JPH11238692A (ja) * 1998-02-23 1999-08-31 Nichia Chem Ind Ltd 窒化物半導体の低抵抗化方法
DE19813180A1 (de) * 1998-03-25 1999-10-07 Siemens Ag Verfahren zur Herstellung eines Stegwellenleiters in III-V-Verbindungshalbleiter-Schichtstrukturen und Halbleiterlaservorrichtung besonders für niedere Serienwiderstände
US6249534B1 (en) * 1998-04-06 2001-06-19 Matsushita Electronics Corporation Nitride semiconductor laser device
KR100499117B1 (ko) * 1998-05-08 2005-07-04 삼성전자주식회사 화합물 반도체 박막의 p형으로의 활성화 방법
US6690700B2 (en) 1998-10-16 2004-02-10 Agilent Technologies, Inc. Nitride semiconductor device
JP2000124552A (ja) * 1998-10-16 2000-04-28 Agilent Technol Inc 窒化物半導体レーザ素子
DE19920871B4 (de) 1999-05-06 2004-07-01 Steag Rtp Systems Gmbh Verfahren zum Aktivieren von Ladungsträgern durch strahlungsunterstützte Wärmebehandlung
JP2000332362A (ja) * 1999-05-24 2000-11-30 Sony Corp 半導体装置および半導体発光素子
US6829273B2 (en) 1999-07-16 2004-12-07 Agilent Technologies, Inc. Nitride semiconductor layer structure and a nitride semiconductor laser incorporating a portion of same
JP3285341B2 (ja) 2000-06-01 2002-05-27 士郎 酒井 窒化ガリウム系化合物半導体の製造方法
JP2002026456A (ja) * 2000-06-30 2002-01-25 Toshiba Corp 半導体装置、半導体レーザ及びその製造方法並びにエッチング方法
JP3466144B2 (ja) 2000-09-22 2003-11-10 士郎 酒井 半導体の表面を荒くする方法
US6970644B2 (en) 2000-12-21 2005-11-29 Mattson Technology, Inc. Heating configuration for use in thermal processing chambers
US7015422B2 (en) * 2000-12-21 2006-03-21 Mattson Technology, Inc. System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
JP3520919B2 (ja) 2001-03-27 2004-04-19 士郎 酒井 窒化物系半導体装置の製造方法
JP3548735B2 (ja) 2001-06-29 2004-07-28 士郎 酒井 窒化ガリウム系化合物半導体の製造方法
DE10141352A1 (de) * 2001-08-23 2003-06-05 Osram Opto Semiconductors Gmbh Verfahren zur Oberflächenbehandlung eines Halbleiters
TWI262606B (en) 2001-08-30 2006-09-21 Osram Opto Semiconductors Gmbh Radiation-emitting semiconductor-element and its production method
DE10142653A1 (de) * 2001-08-31 2003-04-30 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung
AU2002359779A1 (en) * 2001-12-21 2003-07-30 Regents Of The University Of California, The Office Of Technology Transfer Implantation for current confinement in nitride-based vertical optoelectronics
EP1333478A1 (de) * 2002-01-23 2003-08-06 Shiro Sakai Verfahren zur Herstellung von Hableiterelement aus Galliumnitridverbindung und Hableiterelement aus Galliumnitridverbindung
US7005685B2 (en) 2002-02-28 2006-02-28 Shiro Sakai Gallium-nitride-based compound semiconductor device
JP2003264346A (ja) * 2002-03-08 2003-09-19 Sanyo Electric Co Ltd 窒化物系半導体レーザ素子
US7386205B2 (en) * 2002-06-17 2008-06-10 Jian Wang Optical device and method for making same
US20040047039A1 (en) * 2002-06-17 2004-03-11 Jian Wang Wide angle optical device and method for making same
JP2004134750A (ja) * 2002-09-19 2004-04-30 Toyoda Gosei Co Ltd p型III族窒化物系化合物半導体の製造方法
US7795623B2 (en) 2004-06-30 2010-09-14 Cree, Inc. Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
US20060002442A1 (en) * 2004-06-30 2006-01-05 Kevin Haberern Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
US7335920B2 (en) * 2005-01-24 2008-02-26 Cree, Inc. LED with current confinement structure and surface roughening
CN100375303C (zh) * 2005-10-27 2008-03-12 晶能光电(江西)有限公司 含有金锗镍的欧姆电极、铟镓铝氮半导体发光元件及制造方法
GB2432455A (en) * 2005-11-17 2007-05-23 Sharp Kk Growth of a semiconductor layer structure
JP2007250909A (ja) * 2006-03-16 2007-09-27 Sumitomo Electric Ind Ltd 半導体発光素子
US20070228385A1 (en) * 2006-04-03 2007-10-04 General Electric Company Edge-emitting light emitting diodes and methods of making the same
JP2008226884A (ja) * 2007-03-08 2008-09-25 Canon Inc n型の13族窒化物半導体の製造方法、面発光レーザ、面発光レーザにおける電流狭窄構造の製造方法、窒化物半導体の抵抗を変化させる方法、及び半導体レーザの製造方法
JP2009212336A (ja) * 2008-03-05 2009-09-17 Mitsubishi Electric Corp 窒化物系半導体レーザの製造方法および窒化物系半導体レーザ
TW201005994A (en) * 2008-07-23 2010-02-01 Walsin Lihwa Corp Light emitting diode and the method for manufacturing the same
KR20110102293A (ko) * 2008-11-28 2011-09-16 스미또모 가가꾸 가부시키가이샤 반도체 기판의 제조 방법, 반도체 기판, 전자 디바이스의 제조 방법, 및 반응 장치
KR100999695B1 (ko) * 2009-02-16 2010-12-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
TWI447958B (zh) * 2009-07-10 2014-08-01 Toyoda Gosei Kk 半導體發光元件之製造方法及燈、電子機器、及機械裝置
US8623501B2 (en) * 2010-03-04 2014-01-07 Basf Se Lignocellulose materials having good mechanical properties
JP6190582B2 (ja) * 2012-10-26 2017-08-30 古河電気工業株式会社 窒化物半導体装置の製造方法
JP2017045745A (ja) * 2015-08-24 2017-03-02 セイコーエプソン株式会社 発光装置、発光装置の製造方法、およびプロジェクター
CN107293557B (zh) * 2017-05-23 2019-01-18 深圳信息职业技术学院 一种制作集成多种光电器件的基材结构及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151008A (en) * 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
JPS55166975A (en) * 1979-06-14 1980-12-26 Fujitsu Ltd Manufacture of semiconductor light emitting device
US4318752A (en) * 1980-05-16 1982-03-09 Bell Telephone Laboratories, Incorporated Heterojunction semiconductor laser fabrication utilizing laser radiation
JPS6072287A (ja) * 1983-09-28 1985-04-24 Matsushita Electric Ind Co Ltd 半導体レ−ザ装置の製造方法
US4539743A (en) * 1983-11-28 1985-09-10 At&T Bell Laboratories Production of semiconductor structures with buried resistive or conductive regions by controlled ion bombardment and heat treatment
FR2582455B1 (fr) * 1985-05-21 1987-08-14 Menigaux Louis Procede de fabrication d'un laser a semiconducteur a geometrie a ruban et laser obtenu par ce procede
US5306662A (en) * 1991-11-08 1994-04-26 Nichia Chemical Industries, Ltd. Method of manufacturing P-type compound semiconductor
US5372836A (en) * 1992-03-27 1994-12-13 Tokyo Electron Limited Method of forming polycrystalling silicon film in process of manufacturing LCD
JP3182893B2 (ja) * 1992-07-10 2001-07-03 ソニー株式会社 薄膜トランジスタの製造方法
JPH06338454A (ja) * 1993-04-01 1994-12-06 Japan Energy Corp 化合物半導体基板の製造方法

Also Published As

Publication number Publication date
JPH08222797A (ja) 1996-08-30
US6258614B1 (en) 2001-07-10
EP0723303B1 (de) 2003-04-09
DE69627226T2 (de) 2004-02-19
EP0723303A3 (de) 1997-05-28
EP0723303A2 (de) 1996-07-24

Similar Documents

Publication Publication Date Title
DE69627226D1 (de) Herstellungsverfahren für eine Licht emittierende Halbleitervorrichtung
DE69518793D1 (de) Herstellungsverfahren für eine Halbleitervorrichtung
DE69832324D1 (de) Herstellungsverfahren für einen Halbleiter
DE69738595D1 (de) Herstellungsmethode für ein Halbleiter-Bauteil
DE69836177D1 (de) Lichtemittierende Halbleitervorrichtung, die Nanokristalle enthält
KR960012575A (ko) 반도체 장치 제조 방법
KR900012368A (ko) 반도체 장치의 제조 방법
DE69832110D1 (de) Herstellungsverfahren für eine Prüfnadel für Halbleitergeräte
DE69600261T2 (de) Herstellungsmethode für Halbleiterbauelement mit Salizid-Bereich
DE69841770D1 (de) Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren dafür
KR960012574A (ko) 반도체장치 제조방법
DE69428578T2 (de) Herstellungsverfahren für lichtemittierenden Halbleitervorrichtungen
FI952719A (fi) Menetelmä puolijohdelaitteen valmistamiseksi
DE69712080D1 (de) Herstellungsverfahren für eine halbleitervorrichtung
DE69518684D1 (de) Herstellungsverfahren für ein Feldeffekt-Halbleiterbauelement
FI954241A (fi) Puolijohdelaitteen valmistusmenetelmä
DE69832380D1 (de) Herstellungsmethode für die verdrahtung von halbleiteranordnungen
DE69635180D1 (de) Lichtemittierende Halbleitervorrichtung
DE69625007D1 (de) Halbleiterelement-Herstellungsverfahren
KR910005477A (ko) 반도체 장치의 제조방법
DE69841080D1 (de) Montageverfahren für eine Halbleiteranordnung
FI956099A0 (fi) Menetelmä puolijohdelaitteen valmistamiseksi
DE69627800D1 (de) Herstellungsverfahren für halbleiteranordnung
DE69826046D1 (de) Herstellungsverfahren für Halbleitervorrichtung
DE69534487D1 (de) Herstellungsverfahren für Kompressionshalbleiterbauelement

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS LUMILEDS LIGHTING COMPANY,LLC, SAN JOS, US