DE69529019D1 - Thermoelektrische Anordnung und Herstellungsverfahren dafür - Google Patents

Thermoelektrische Anordnung und Herstellungsverfahren dafür

Info

Publication number
DE69529019D1
DE69529019D1 DE69529019T DE69529019T DE69529019D1 DE 69529019 D1 DE69529019 D1 DE 69529019D1 DE 69529019 T DE69529019 T DE 69529019T DE 69529019 T DE69529019 T DE 69529019T DE 69529019 D1 DE69529019 D1 DE 69529019D1
Authority
DE
Germany
Prior art keywords
manufacturing process
process therefor
thermoelectric arrangement
thermoelectric
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69529019T
Other languages
English (en)
Other versions
DE69529019T2 (de
Inventor
Matsuo Kishi
Hirohiko Nemoto
Hiroshi Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6122873A external-priority patent/JP2893373B2/ja
Priority claimed from JP08290695A external-priority patent/JP3592395B2/ja
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Application granted granted Critical
Publication of DE69529019D1 publication Critical patent/DE69529019D1/de
Publication of DE69529019T2 publication Critical patent/DE69529019T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69529019T 1994-05-23 1995-05-23 Thermoelektrische Anordnung und Herstellungsverfahren dafür Expired - Lifetime DE69529019T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10875794 1994-05-23
JP6122873A JP2893373B2 (ja) 1994-06-03 1994-06-03 熱電素子
JP17898794 1994-07-29
JP08290695A JP3592395B2 (ja) 1994-05-23 1995-04-07 熱電変換素子とその製造方法

Publications (2)

Publication Number Publication Date
DE69529019D1 true DE69529019D1 (de) 2003-01-16
DE69529019T2 DE69529019T2 (de) 2003-04-30

Family

ID=27466757

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69535276T Expired - Lifetime DE69535276T2 (de) 1994-05-23 1995-05-23 Herstellungsverfahren für eine thermoelektrische Anordnung
DE69529019T Expired - Lifetime DE69529019T2 (de) 1994-05-23 1995-05-23 Thermoelektrische Anordnung und Herstellungsverfahren dafür
DE69535235T Expired - Lifetime DE69535235T2 (de) 1994-05-23 1995-05-23 Thermoelektrische Vorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69535276T Expired - Lifetime DE69535276T2 (de) 1994-05-23 1995-05-23 Herstellungsverfahren für eine thermoelektrische Anordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69535235T Expired - Lifetime DE69535235T2 (de) 1994-05-23 1995-05-23 Thermoelektrische Vorrichtung

Country Status (4)

Country Link
US (1) US5824561A (de)
EP (3) EP1154495B1 (de)
DE (3) DE69535276T2 (de)
TW (1) TW393788B (de)

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JP3982080B2 (ja) * 1997-12-05 2007-09-26 松下電工株式会社 熱電モジュールの製造法と熱電モジュール
US6310383B1 (en) 1997-08-01 2001-10-30 Citizen Watch Co., Ltd. Thermoelectric element and method for manufacturing the same
JP2946205B1 (ja) * 1997-12-25 1999-09-06 セイコーインスツルメンツ株式会社 熱発電ユニット並びに該ユニットを用いた携帯用電子機器
US6586835B1 (en) * 1998-08-31 2003-07-01 Micron Technology, Inc. Compact system module with built-in thermoelectric cooling
DE19845104A1 (de) * 1998-09-30 2000-04-06 Siemens Ag Verfahren zum Herstellen eines thermoelektrischen Wandlers
JP3600486B2 (ja) * 1999-08-24 2004-12-15 セイコーインスツル株式会社 熱電変換素子の製造方法
JP2001085351A (ja) * 1999-09-14 2001-03-30 Tokyo Electron Ltd 半導体製造装置及びその方法
US6476483B1 (en) 1999-10-20 2002-11-05 International Business Machines Corporation Method and apparatus for cooling a silicon on insulator device
US6288426B1 (en) 2000-02-28 2001-09-11 International Business Machines Corp. Thermal conductivity enhanced semiconductor structures and fabrication processes
US7164077B2 (en) 2001-04-09 2007-01-16 Research Triangle Institute Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags
EP1433208A4 (de) 2001-10-05 2008-02-20 Nextreme Thermal Solutions Inc Phononenblockierende, elektronendurchlassende niedrigdimensionale strukturen
US20040178517A9 (en) * 2001-12-21 2004-09-16 Siu Wing Ming Split body peltier device for cooling and power generation applications
EP1495498B1 (de) 2002-04-15 2013-04-10 Nextreme Thermal Solutions, Inc. Thermoelektrische einrichtung mit doppelseitigen peltier-übergängen
JP4255691B2 (ja) * 2002-12-27 2009-04-15 独立行政法人物質・材料研究機構 熱電変換材料を利用した電子部品の冷却装置
US20050045702A1 (en) * 2003-08-29 2005-03-03 William Freeman Thermoelectric modules and methods of manufacture
JP4765328B2 (ja) * 2004-04-16 2011-09-07 東京エレクトロン株式会社 被処理体の処理装置
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US8063298B2 (en) 2004-10-22 2011-11-22 Nextreme Thermal Solutions, Inc. Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
WO2007002342A2 (en) 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including electrically insulating matrixes between conductive traces and related structures
WO2007002337A2 (en) * 2005-06-22 2007-01-04 Nextreme Thermal Solutions Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures
JP2007150231A (ja) * 2005-10-27 2007-06-14 Denso Corp 熱電変換装置
JP2009515162A (ja) * 2005-11-07 2009-04-09 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 支柱ベースバイオセンサー及びその作製方法
US7679203B2 (en) 2006-03-03 2010-03-16 Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices using islands of thermoelectric material and related structures
KR20100056478A (ko) 2007-08-21 2010-05-27 더 리전트 오브 더 유니버시티 오브 캘리포니아 고성능 열전 속성을 갖는 나노구조체
US20090090409A1 (en) * 2007-10-05 2009-04-09 Marlow Industries, Inc. System and Method for Assembling a Microthermoelectric Device
DE102008030191A1 (de) * 2008-06-25 2010-01-07 Micropelt Gmbh Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
WO2010033428A2 (en) * 2008-09-18 2010-03-25 University Of Florida Research Foundation, Inc. Miniature thermoelectric power generator
US20110114146A1 (en) * 2009-11-13 2011-05-19 Alphabet Energy, Inc. Uniwafer thermoelectric modules
US9601677B2 (en) 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
US9240328B2 (en) 2010-11-19 2016-01-19 Alphabet Energy, Inc. Arrays of long nanostructures in semiconductor materials and methods thereof
US8736011B2 (en) 2010-12-03 2014-05-27 Alphabet Energy, Inc. Low thermal conductivity matrices with embedded nanostructures and methods thereof
US20120291454A1 (en) * 2011-05-20 2012-11-22 Baker Hughes Incorporated Thermoelectric Devices Using Sintered Bonding
TWI473249B (zh) * 2011-12-23 2015-02-11 Taiwan Textile Res Inst 光致冷裝置及其製備方法
WO2013116107A1 (en) * 2012-02-01 2013-08-08 Baker Hughes Incorporated Thermoelectric devices using sintered bonding
US9051175B2 (en) 2012-03-07 2015-06-09 Alphabet Energy, Inc. Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same
US9257627B2 (en) 2012-07-23 2016-02-09 Alphabet Energy, Inc. Method and structure for thermoelectric unicouple assembly
WO2014024945A1 (ja) 2012-08-07 2014-02-13 国立大学法人京都工芸繊維大学 熱量計および熱量計の設計方法
US9082930B1 (en) 2012-10-25 2015-07-14 Alphabet Energy, Inc. Nanostructured thermolectric elements and methods of making the same
WO2015157501A1 (en) 2014-04-10 2015-10-15 Alphabet Energy, Inc. Ultra-long silicon nanostructures, and methods of forming and transferring the same
JP6394491B2 (ja) * 2014-06-03 2018-09-26 株式会社デンソー 熱電変換素子シートの製造方法、熱電変換装置の製造方法
JP6881885B2 (ja) 2015-03-13 2021-06-02 株式会社Kelk 熱電発電モジュール
CN105070821A (zh) * 2015-08-01 2015-11-18 河南鸿昌电子有限公司 一种致冷件的制造方法
JP6794732B2 (ja) * 2015-09-28 2020-12-02 三菱マテリアル株式会社 熱電変換モジュール及び熱電変換装置
JP6447577B2 (ja) * 2016-05-27 2019-01-09 株式会社デンソー 熱電変換装置およびその製造方法
WO2018021540A1 (ja) * 2016-07-28 2018-02-01 株式会社 東芝 熱電材料、熱電材料の製造方法、熱電変換素子、および熱電変換モジュール
JP6767928B2 (ja) * 2017-05-26 2020-10-14 株式会社Kelk 熱電発電トランスミッタ
KR20190093516A (ko) * 2018-02-01 2019-08-09 엘지이노텍 주식회사 열전장치
CN113285009A (zh) * 2021-05-26 2021-08-20 杭州大和热磁电子有限公司 一种通过沉积金锡焊料组装的tec及制备方法

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Publication number Priority date Publication date Assignee Title
US3580743A (en) * 1966-01-07 1971-05-25 Borg Warner Thermoelectric module with diagonal construction and method of manufacturing
US3884726A (en) * 1972-05-11 1975-05-20 Kurt Landecker Thermoelectric element
JPS57147287A (en) * 1981-03-06 1982-09-11 Citizen Watch Co Ltd Manufacture of radiation thermocouple
JPS5864075A (ja) * 1981-10-13 1983-04-16 Citizen Watch Co Ltd 熱電堆の製造方法
JPS58171873A (ja) * 1982-04-02 1983-10-08 Showa Denko Kk サ−モパイルの製造方法
DD209545B1 (de) * 1982-09-16 1989-05-24 Manfred Teubner Verfahren zur herstellung von thermoelektrischen moduln
US4497973A (en) * 1983-02-28 1985-02-05 Ecd-Anr Energy Conversion Company Thermoelectric device exhibiting decreased stress
US4493939A (en) * 1983-10-31 1985-01-15 Varo, Inc. Method and apparatus for fabricating a thermoelectric array
JP2602646B2 (ja) * 1986-09-18 1997-04-23 セイコー電子工業株式会社 電子腕時計用熱電素子の製造方法
US4845542A (en) * 1987-03-19 1989-07-04 Unisys Corporation Interconnect for layered integrated circuit assembly
US4902648A (en) * 1988-01-05 1990-02-20 Agency Of Industrial Science And Technology Process for producing a thermoelectric module
JP3223257B2 (ja) * 1991-03-27 2001-10-29 株式会社フェローテック 熱電変換モジュールの製造方法
DE4134685A1 (de) * 1991-10-21 1993-04-22 Univ Dresden Tech Peltier-kuehlmodul
US5434744A (en) * 1993-10-22 1995-07-18 Fritz; Robert E. Thermoelectric module having reduced spacing between semiconductor elements
US5523628A (en) * 1994-08-05 1996-06-04 Hughes Aircraft Company Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips

Also Published As

Publication number Publication date
US5824561A (en) 1998-10-20
EP0687020A1 (de) 1995-12-13
DE69535276T2 (de) 2007-08-30
TW393788B (en) 2000-06-11
EP0687020B1 (de) 2002-12-04
DE69529019T2 (de) 2003-04-30
EP1154495A2 (de) 2001-11-14
DE69535235D1 (de) 2006-11-02
EP1152474B1 (de) 2006-09-20
DE69535235T2 (de) 2007-01-04
EP1154495B1 (de) 2006-10-18
DE69535276D1 (de) 2006-11-30
EP1152474A1 (de) 2001-11-07
EP1154495A3 (de) 2002-03-06

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Legal Events

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