CN116978424A - 用于基于存取的目标刷新操作的设备及方法 - Google Patents

用于基于存取的目标刷新操作的设备及方法 Download PDF

Info

Publication number
CN116978424A
CN116978424A CN202310453171.9A CN202310453171A CN116978424A CN 116978424 A CN116978424 A CN 116978424A CN 202310453171 A CN202310453171 A CN 202310453171A CN 116978424 A CN116978424 A CN 116978424A
Authority
CN
China
Prior art keywords
address
bank
sub
refresh
aggressor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310453171.9A
Other languages
English (en)
Inventor
何源
铃木尊雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of CN116978424A publication Critical patent/CN116978424A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408Address circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40618Refresh operations over multiple banks or interleaving
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40622Partial refresh of memory arrays
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40603Arbitration, priority and concurrent access to memory cells for read/write or refresh operations
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40615Internal triggering or timing of refresh, e.g. hidden refresh, self refresh, pseudo-SRAMs
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408Address circuits
    • G11C11/4085Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)

Abstract

本公开揭示用于基于存取的目标刷新操作的设备、系统及方法。存储体具有第一子存储体及第二子存储体。刷新控制电路检测所述子存储体的一者中的侵略者。响应于在另一子存储体中的存取,所述刷新控制电路基于侵略者地址执行基于所述子存储体的目标刷新操作。

Description

用于基于存取的目标刷新操作的设备及方法
技术领域
本公开大体上涉及半导体装置,且更具体来说,涉及半导体存储器装置。特定来说,本公开涉及易失性存储器,例如动态随机存取存储器(DRAM)。
背景技术
信息可作为物理信号(例如,电容元件上的电荷)存储在存储器的个别存储器单元上。当被存取时,存储器单元可耦合到数字线(或位线),并且数字线上的电压可基于存储在经耦合的存储器单元中的信息而改变。
在易失性存储器装置中,信息可随着时间衰减。为了防止信息被刷新,可周期性地刷新信息(例如,通过将存储器单元上的电荷恢复到初始电平)。然而,刷新操作可能需要原本可用于存储器中的存取操作的时间。
发明内容
在一个方面中,本申请案提供一种方法,其包括:检测存储体的第一子存储体中的侵略者地址;存取所述存储体的第二子存储体中的字线;以及响应于存取所述第二子存储体中的所述字线基于所述检测到的侵略者地址对所述第一子存储体执行目标刷新操作。
在另一方面中,本申请案提供一种设备,其包括:存储体的第一子存储体;所述存储体的第二子存储体;及刷新控制电路,其经配置以识别所述第一子存储体中的侵略者地址,并响应于对所述第二子存储体的存取操作,基于所述侵略者地址对所述第一子存储体执行目标刷新操作。
在另一方面中,本申请案提供一种设备,其包括:行锤检测器,其经配置以检测侵略者地址并在检测到所述侵略者地址时设置行锤旗标;比较器,其经配置以将所述侵略者地址与被存取地址进行比较,且当所述侵略者地址和所述被存取地址处在不同的子存储体中时,提供活动匹配信号;以及逻辑电路,其经配置以当所述匹配信号活动时响应于存取命令提供目标刷新命令。
附图说明
图1是根据本公开的实施例的半导体装置的框图。
图2A是根据本公开的一些实施例的刷新逻辑的框图。
图2B是根据本公开的一些实施例的刷新操作的框图。
图3是根据本公开的一些实施例的存储器中的刷新操作的时序图。
图4是根据本公开的一些实施例的刷新逻辑的框图。
图5是根据本公开的一些实施例的刷新操作的时序图。
图6是根据本公开的一些实施例的方法的流程图。
具体实施方式
某些实施例的以下描述本质上仅是示范性的,且绝不希望限制本公开的范围或其应用或使用。在本系统及方法的实施例的以下详细描述中,参考形成其一部分且通过可在其中实践所描述系统及方法的说明特定实施例的方式来展示的附图。足够详细地描述这些实施例以使得所属领域的技术人员能够实践当前揭示的系统及方法,并且应理解,可利用其它实施例且可在不背离本公开的精神及范围的情况下进行结构及逻辑改变。此外,出于清楚的目的,在某些特征的详细描述对于所属领域的技术人员来说是显而易见时将不对其进行论述,以免使本公开的实施例的描述模糊。因此,以下详细描述不应以限制意义来理解,并且本公开的范围仅由所附权利要求书界定。
存储器阵列可大体包含数个存储器单元,其布置在字线(行)及位线/数字线(列)的相交点处。为了防止信息丢失,存储器可逐行(或以行组)刷新存储器单元。在刷新循环的过程中,存储器可刷新存储器单元作为顺序刷新操作的部分。存储器可具有刷新周期tREFI,其确定刷新操作之间的最大时序,以便确保在刷新循环的过程中刷新所有存储器单元。例如,tREFI可基于需要刷新任何个别存储器单元的预期时间除以刷新循环中的刷新操作的总数(例如,行数或每次刷新操作刷新的行数)。刷新周期tREFI可相对较短(例如<10微秒)。存储器可刷新第一字线(或第一组字线)作为第一顺序刷新操作的部分,然后刷新第二字线(或第二组字线)作为第二顺序刷新操作的部分,以此类推,直到所有字线已被刷新,然后可从序列的开始重新开始。
对存储器的某些存取模式可改变信息在存储器单元中衰减的速率。例如,行锤可重复存取存储器的“侵略者”行,这可增加沿着附近的“受害者”字线的存储器单元中的信息衰减速率。由于受害者字线中的信息可比用于计算tREFI的假设衰减得更快,因此识别侵略者并对所述识别出的侵略者的受害者执行目标刷新操作可是重要的。在常规存储器中,可针对每一tREFI调用刷新操作。目标刷新操作可“窃取”其它情况下为顺序刷新操作留出的时隙。然而,这可为低效的,因为仅在已检测到侵略者时才需要执行目标刷新操作。因此,常规存储器可包含管理何时执行目标刷新操作、调用目标刷新操作但未检测到侵略者时做什么、如何调整目标刷新操作对顺序刷新操作的比等的相对逻辑。
本公开涉及用于基于存取的目标刷新操作的设备、系统及方法。存储器包含被分成两个或更多个子存储体的存储体。每一子存储体与包含侵略者检测器的刷新控制电路相关联。当在相关联的子存储体中检测到侵略者地址时,下一次在不同的子存储体中存取字线时,对检测到的侵略者的受害者执行目标刷新操作。以这种方式,目标刷新操作可以基于其它子存储体中的存取的时序“根据需要”发生在子存储体中。这可简化用于确定何时执行目标刷新操作的逻辑。
在一些实施例中,使用其它子存储体中的存取操作来控制目标刷新操作的时序可为有利的。一些存储器可跟踪对存储器的每一行的存取,以确定哪些行是侵略者。例如,每一行可具有留出以存储与所述行相关联的存取计数的存储器单元。基于存取计数(例如,与阈值的比较),所述行可被确定为侵略者。当对所述行的受害者执行目标刷新操作时,应复位计数值,这需要存取侵略者行(以读取、修改和写入计数值)。但是,这需要时间来存取侵略者行。在目标刷新操作已经刷新侵略者的受害者之后,侵略者行可被存取,并且它的计数值响应于在不同的子存储体中存取的字线而复位。这可允许沿着侵略者的计数值复位而不中断正常的存取操作。
图1是根据本公开的实施例的半导体装置的框图。半导体装置100可为半导体存储器装置,例如集成于单个半导体芯片上的DRAM装置。
半导体装置100包含存储器阵列118。存储器阵列118展示为包含多个存储体。在图1的实施例中,存储器阵列118展示为包含八个存储体BANK0到BANK7。在其它实施例的存储器阵列118中可包含更多或更少存储体。如本文更详细解释,每一存储体可进一步分成两个或更多个子存储体。虽然本文大体上描述其中每一存储体包含两个子存储体的实施例,但是其它实施例可包含每一存储体的更多子存储体。
每一存储器子存储体包含多个字线WL、多个位线BL、及布置在多个字线WL与多个位线BL的相交点处的多个存储器单元MC。字线WL的选择由行解码器108执行,且位线BL的选择由列解码器110执行。在图1的实施例中,行解码器108包含每一存储体的相应行解码器,且列解码器110包含每一存储体的相应列解码器。在一些实施例中,逐存储体重复的例如行及列解码器以及刷新控制电路116的组件也可包含逐子存储体重复的组件。例如,对于每一子存储体可存在刷新控制电路116。
位线BL耦合到相应感测放大器(SAMP)。从位线BL读取的数据由感测放大器SAMP放大,且通过本地数据线(LIO)、传送门(TG)及全局数据线(GIO)传送到读取/写入放大器120。相反,从读取/写入放大器120输出的写入数据通过互补主数据线GIO、传送门TG和互补本地数据线LIO传送到感测放大器SAMP,并写入耦合到位线BL的存储器单元MC中。
半导体装置100可采用多个外部端子(例如焊垫),其包含耦合到命令及地址(C/A)总线以接收命令及地址的命令及地址端子、用以接收时钟CK及/CK的时钟端子、耦合到数据总线以提供数据的数据端子DQ及用以接收电源电势VDD、VSS、VDDQ及VSSQ的电源端子。
时钟端子经供应有提供到输入电路112的外部时钟CK及/CK。外部时钟可为互补的。输入电路112基于CK及/CK时钟产生内部时钟ICLK。ICLK时钟经提供到命令解码器106及内部时钟产生器114。内部时钟产生器114基于ICLK时钟提供各种内部时钟LCLK。LCLK时钟可用于各种内部电路的时序操作。内部数据时钟LCLK经提供到输入/输出电路122以对包含于输入/输出电路122中的电路操作计时,例如,经提供到数据接收器以对写入数据的接收计时。输入/输出电路122可包含数个接口连接,每一接口连接可耦合到DQ垫(例如,可充当到装置100的外部连接的焊垫)中的一者。
C/A端子可被供应有存储器地址。供应到C/A端子的存储器地址经由命令/地址输入电路102传送到地址解码器104。地址解码器104接收地址且将经解码行地址XADD供应到行解码器108,且将经解码列地址YADD供应到列解码器110。列解码器110可提供列选择信号CS,其可激活感测放大器SAMP中的选定一者。地址解码器104还可供应经解码存储体地址BADD,所述存储体地址BADD可指示含有经解码行地址XADD和列地址YADD的存储器阵列118的存储体。行地址XADD可指示由BADD指示的存储体内的子存储体。
C/A端子可被供应有命令。命令实例包含用于控制各种操作的时序的时序命令、用于存取存储器的存取命令(例如用于执行读取操作的读取命令及用于执行写入操作的写入命令)以及其它命令及操作。存取命令可与一或多个行地址XADD、列地址YADD及存储体地址BADD相关联以指示要存取的存储器单元。
命令可经由命令/地址输入电路102作为内部命令信号被提供到命令解码器106。命令解码器106包含解码内部命令信号以产生用于执行操作的各种内部信号及命令的电路。举例来说,命令解码器106可提供用以选择字线的行命令信号及用以选择位线的列命令信号。
装置100可接收是读取命令的存取命令。当接收到读取命令且及时与读取命令一起供应存储体地址、行地址及列地址时,从存储器阵列118中对应于行地址及列地址的存储器单元读取读取数据。读取命令由命令解码器106接收,命令解码器106提供内部命令使得从存储器阵列118读取的数据经提供到读取/写入放大器120。读取数据沿着数据总线提供且经由输入/输出电路122从数据端子DQ输出到外部。
装置100可接收是写入命令的存取命令。当接收到写入命令且及时与写入命令一起供应存储体地址、行地址及列地址时,供应到数据端子DQ的写入数据沿着数据总线提供且写入到存储器阵列118中对应于行地址及列地址的存储器单元。写入命令由命令解码器106接收,命令解码器106提供内部命令使得写入数据由输入/输出电路122中的数据接收器接收。写入时钟也可经提供到外部时钟端子以对由输入/输出电路122的数据接收器接收写入数据进行计时。写入数据经由输入/输出电路122供应到读取/写入放大器120,且由读取/写入放大器120供应到存储器阵列118以写入到存储器单元MC中。
装置100包含刷新控制电路116,每一刷新控制电路116与存储器阵列118的存储体或子存储体相关联。每一刷新控制电路116可确定何时对相关联的子存储体执行刷新操作。刷新控制电路116提供刷新地址RXADD(连同一或多个刷新信号,图1中未展示)。行解码器108对与RXADD相关联的一或多个字线执行刷新操作。
刷新控制电路116可执行多种类型的刷新操作,其可确定如何产生地址RXADD,以及例如有多少字线与地址RXADD相关联的其它细节。例如,刷新控制电路116可执行顺序刷新操作,其中基于刷新操作的序列来产生刷新地址RXADD。例如,在使用地址RXADD的第一顺序刷新操作之后,下一顺序刷新操作可产生地址RXADD+1。顺序刷新地址可与多个字线相关联,例如通过与整行地址XADD相比截断地址RXADD,并刷新共享公共截断部分的所有字线。在刷新循环的过程中,顺序刷新操作可刷新子阵列中的所有字线(例如,通过循序产生与所有字线相关联的地址),且然后所述序列可再循环。
刷新控制电路116可用基于刷新间隔tREFI的时序执行顺序刷新操作。刷新间隔tREFI可基于用于刷新任何给定字线的预期时序(例如,基于信息衰减的预期速率)以及完成刷新循环所需的刷新操作的数量(例如,每一刷新循环的顺序刷新操作的数量)。每一tREFI,刷新控制电路116可执行顺序刷新操作。例如,每当tREFI经过时可产生刷新信号REF,并且响应于刷新信号REF,可执行一或多个顺序刷新操作。
连同顺序刷新操作,刷新控制电路116可执行目标刷新操作,其中刷新地址RXADD基于检测到的侵略者字线。对行的某些存取模式可导致其它附近行的存储器单元中的数据衰减速率增加。例如,对单个行的多次存取(“行锤”)可增加沿着附近字线的存储器单元中的衰减速率。由于这些存储器单元的衰减速度可快于tREFI预期的时间,因此识别这些侵略者行使得可刷新其受害者是有用的。
刷新控制电路可包含检测侵略者并随后基于检测到的侵略者产生刷新地址RXADD作为目标刷新操作的部分的逻辑。例如,如果侵略者是AggXADD,那么刷新控制电路可刷新相邻及/或附近的字线,例如AggXADD+1、AggXADD-1、AggXADD+2、AggXADD-2等中的一或多者。可使用各种准则来检测侵略者。例如,存储器可计数对不同字线的存取数(例如,基于从地址解码器104沿着行地址总线提供的行地址XADD),并且当所述计数超过阈值时,将行地址指定为侵略者。在一些实施例中,对给定行的存取计数可沿着所述行的存储器单元存储。因此,当存取字线时,计数可从所述行的存储器单元读取,修改(例如,递增),与阈值进行比较,并且可写回改变的计数(例如,如果计数高于阈值,那么递增或复位)。
虽然本公开通常可涉及检测侵略者地址及其受害者,但是应当理解,这些术语用于意指用于计算目标刷新地址的行。例如,侵略者地址不必遭受攻击(例如,行锤),或者受害者中的数据衰减实际增加。在一些实施例中,存储器可使用采样,这可将随机性的方面引入侵略者地址的选择中。
刷新控制电路116可以部分基于对同一存储体的其它子存储体的存取的时序对子存储体执行目标刷新操作。例如,如果每一存储体有两个子存储体,那么在第一子存储体中存取字线时在第二子存储体中检测到侵略者之后,刷新控制电路116可基于检测到的侵略者来刷新第二子存储体中的一或多个受害者。以这种方式,目标刷新命令可按基于对不同子存储体的存取的时序以“按需”方式执行。
刷新控制电路116还可接收刷新管理RFM命令,其可使刷新控制电路116执行目标刷新操作。RFM命令可由装置100外部的控制器发出。
电源端子被供应有电源电势VDD及VSS。电源电势VDD及VSS被供应到内部电压产生器电路124。内部电压产生器电路124基于供应到电源端子的电源电势VDD及VSS产生各种内部电势VARY及类似物。
电源端子也经供应有电源电势VDDQ及VSSQ。电源电势VDDQ及VSSQ经供应到输入/输出电路122。在本公开的实施例中,供应到电源端子的电源电势VDDQ及VSSQ可为与供应到电源端子的电源电势VDD及VSS相同的电势。在本公开的另一实施例中,供应到电源端子的电源电势VDDQ及VSSQ可为与供应到电源端子的电源电势VDD及VSS不同的电势。供应到电源端子的电源电势VDDQ及VSSQ用于输入/输出电路122使得由输入/输出电路122产生的电源噪声不会传播到其它电路块。
图2是根据本公开的一些实施例的刷新逻辑的框图。在一些实施例中,刷新逻辑可表示存储器装置(例如图1的装置100)的一部分。刷新逻辑200包含刷新控制电路210(例如,图1的116)和一对子存储体202及206,其是同一存储体(例如,图1的阵列118的存储体的一者)的部分。一旦刷新控制电路210已经检测到子存储体的一者中的侵略者地址,那么当在另一子存储体中存取字线时,可执行目标刷新。在图2的实例中,展示与第二子存储体206相关联的刷新控制电路210。每一子存储体可具有类似刷新控制电路。
刷新控制电路210包含侵略者检测器电路212,当在相关联的子存储体206中检测到侵略者地址RHR-RA时,所述侵略者检测器电路212激活旗标。响应于激活命令ACT,如果旗标是活动的,那么逻辑电路218可提供目标刷新信号RHR。如果旗标是活动的,那么比较器214可确定被存取的行地址Act-RA是否与侵略者RHR-RA匹配,并且如果不匹配,那么子存储体逻辑216可确定地址Act-RA和RHR-RA是否在同一子存储体中(例如,是子存储体B 206中的Act-RA)。如果地址Act-RA和RHR-RA不在同一子存储体中,那么子存储体逻辑216在活动电平下提供互补匹配信号matchF。如果RHR命令和matchF两者都是活动的,那么逻辑电路220可向子存储体206提供RHR命令。刷新地址产生器222响应于刷新命令REF或RHR命令提供一或多个刷新地址RXADD。如果RHR命令是活动的,那么刷新地址产生器222可基于RHR-RA产生(若干)刷新地址。响应于来自逻辑电路220的RHR命令,行解码器(未展示)可刷新子存储体206中与RXADD相关联的一或多个字线。
侵略者检测器电路212可基于一或多个准则来检测子存储体206中的侵略者地址。例如,侵略者检测器电路212可计数对不同地址的存取,并且如果存取计数超过阈值,那么可确定所述地址是侵略者。在一些实施例中,侵略者检测器212可接收被存取的地址Act-RA并使用所述地址来检测侵略者。在一些实施例中,存取计数可存储在存储器阵列中(例如,沿着与所述存储器计数相关联的行的存储器单元),并且侵略者检测器可在所述行被存取时接收所述计数。在其它实例实施例中,可使用确定侵略者地址的各种其它技术。当侵略者检测器电路212检测到侵略者时,其可激活旗标并将侵略者地址提供为RHR-RA。
在实例存取操作期间,命令解码器(例如图1的106)提供激活信号ACT,而地址解码器(例如图1的104)提供被存取地址Act-RA。地址Act-RA可与第一子存储体中的字线204相关联。响应于地址Act-RA和激活信号ACT,存取字线204。
比较器电路214可接收来自侵略者检测器212个旗标和RHR-RA以及被存取地址Act-RA。如果旗标是活动的(例如,如果存在检测到的侵略者),那么比较器214可比较地址RHR-RA与Act-RA以确定它们是否相同。如果它们不相同,那么子存储体逻辑电路216可确定地址Act-RA是否在与刷新控制电路210相关联的子存储体中。例如,逻辑216可检查指定子存储体的行地址Act-RA的一部分,以确定地址Act-RA是否与子存储体B 206相关联。如果地址不与子存储体B相关联,那么逻辑216在活动电平(例如,在高逻辑电平)下提供信号matchF。
逻辑电路218接收激活命令ACT(例如,来自命令解码器)和来自侵略者检测器212的旗标信号。如果旗标信号是活动的(例如,如果已经检测到侵略者),那么逻辑电路可提供RHR命令。例如,逻辑218可为具有耦合到旗标和ACT的输入的与门。当信号matchF和RHR命令两者都是活动的时,第二逻辑电路220可向子存储体(或向与子存储体相关联的行解码器)提供RHR命令。例如,第二逻辑电路220也可为与门,其输入端子耦合到来自第一逻辑电路218的RHR及来自子存储体逻辑216的matchF。如果两者都是活动的,那么RHR命令被提供给子存储体206。
刷新逻辑210包含刷新地址产生器222。刷新地址发生器222包含在刷新信号REF活动时产生顺序刷新地址作为刷新地址RXADD的CBR计数器电路224和在目标刷新信号RHR活动时产生目标刷新地址作为刷新地址RXADD的目标刷新地址发生器226。响应于刷新信号REF,CBR计数器电路224可提供刷新地址RXADD作为顺序刷新操作的一部分。例如,作为顺序刷新操作的部分,CBR计数器电路224可更新地址并将其作为刷新地址RXADD提供。例如,先前的顺序刷新地址可由CBR计数器电路224递增以产生新的顺序刷新地址。在一些实施例中,刷新地址产生器222可响应于信号REF提供多个地址并执行多个顺序刷新操作。在一些实施例中,刷新控制电路210可响应于REF的激活执行不同数量个顺序刷新操作。例如,刷新控制电路210可在两个顺序刷新操作与一个顺序刷新操作之间交替。
当提供信号RHR时,目标刷新地址产生器226可基于侵略者地址RHR-RA来提供目标刷新地址RXADD。例如,地址RXADD可表示靠近与RHR-RA相关联的字线的字线。例如,地址RXADD可为与RHR-RA相邻的字线中的一者(例如,RHR-RA+1和RHR-RA-1)。也可使用其它关系。在一些实施例中,刷新地址产生器222可响应于信号RHR提供多个刷新地址RXADD(例如,RHR-RA+1和RHR-RA-1两者)。
响应于信号RHR,在子存储体206中刷新与RXADD相关联的字线。例如,可刷新字线208。以这种方式,当存取第一子存储体202中的字线204时,可对第二子存储体206中的字线208执行目标刷新操作。在刷新所识别的侵略者RHR-RA的(若干)受害者之后,侵略者检测器212可将旗标复位为不活动(或未设置)状态。
图2B是根据本公开的一些实施例的刷新操作的框图。图2A展示当在第一子存储体中执行存取操作时,对第二子存储体执行目标刷新操作的刷新逻辑。图2B展示可对相同的子存储体202和206执行的后续操作。为了简洁起见,图2A中所展示的刷新逻辑210的细节没有关于图2B重复。子存储体202和206中的每一者可与类似于图2A的刷新逻辑210的刷新逻辑相关联。
图2B展示当对第二子存储体206执行存取时对第一子存储体202执行的目标刷新。例如,地址解码器(例如,图1的104)可提供存取地址ACT-RA,而命令解码器(例如,图1的106)提供行激活命令ACT。在图2B所描绘的情况下,地址ACT-RA与第二子存储体206中的字线208相关联。与第一子存储体202相关联的刷新逻辑电路(未展示)也接收信号ACT和ACT-RA。基于地址ACT-RA与第二子存储体206相关联的确定(以及第一子存储体202中侵略者的先前识别),可产生刷新地址RXADD和刷新信号RHR。以这种方式,第一子存储体202中的字线204可响应于第二子存储体中的字线208被存取而刷新。
图3是根据本公开的一些实施例的存储器中的刷新操作的时序图。时序图300可表示例如图1的存储器装置100和/或图2的刷新逻辑200的装置中的刷新操作。
定时时序图展示几个刷新间隔,从时间t0、t1、t2和t3开始,每一间隔由tREFI定时器信号的激活来标记。不同刷新间隔可由时间tREFI分开,tREFI可为存储器的设置。在一些实施例中,刷新间隔可由刷新信号REF(图3中未展示)来标记。
在从t0开始的第一刷新间隔期间,刷新信号导致在两个子存储体中执行两个顺序刷新操作。在时间t0之前,已经在子存储体B中检测到侵略者地址,但在子存储体A中没有检测到。在t0之后,在子存储体B中执行第一存取。因为在子存储体A中没有检测到侵略者(例如,子存储体A的旗标是不活动/未设置的),所以响应于子存储体B中的存取,在子存储体A中没有执行目标刷新。然而,当在子存储体A中存取行时,可在子存储体B中执行目标刷新操作。在对子存储体B的后续存取期间,可检测到第二侵略者。因此,在对子存储体A的稍后存取期间,可在子存储体A中执行第二目标刷新。
在从t1开始的第二刷新间隔期间,可仅执行单个顺序刷新操作。在时间t1,侵略者已经定位于两个子存储体中。因此,在第一子存储体中的第一存取之后,在子存储体B中执行目标刷新。在子存储体B中的第一存取之后,在子存储体A中执行目标刷新。因为在t1与t2之间的时间段中没有检测到进一步的侵略者,所以没有执行进一步目标刷新操作。
在从t2开始的第三刷新间隔期间,执行两个顺序刷新操作。之后,在被确定为侵略者的子存储体A中执行存取。因此,下一次存取子存储体B时,在子存储体A中执行目标刷新操作。类似地,在从t3开始的刷新周期,响应于相反子存储体中的存取操作,在两个子存储体中执行目标刷新操作。
图4是根据本公开的一些实施例的刷新逻辑的框图。图4展示可包含在图1的存储器装置100中,并且可实施图2的刷新逻辑200的一部分的刷新逻辑。图4展示子存储体402(例如,图2A到2B的206)以及子存储体403(例如,图2A到2B的202)和可为刷新控制电路(例如,图2A到2B的210)的部分的几个其它组件。
图4展示实例实施例,其中用于确定行是否是侵略者的存取计数沿着存储器阵列的行存储。当存取所述行时,计数可从字线读出,改变(例如,递增),并与阈值进行比较。如果它满足或超过阈值,那么可将其判断为侵略者,并且可设置侵略者旗标(例如,图2A的旗标)。响应于旗标被设置,可将侵略者地址XADD存储在侵略者寄存器(其可为图2A的刷新控制电路210的组件)中,并且可使所述行地址XADD的计数值复位。在图4的实施例中,刷新逻辑400可响应于存储器的另一子存储体403中的存取而复位执行目标刷新的侵略者计数。
刷新逻辑400展示包含多个字线和位线的子存储体402。存储器单元(未展示)定位于字线与位线的相交点处。沿着每一行的某些存储器单元被留出以存储与所述行相关联的计数值。在图4的实例实施例中,使用沿着字线末端的位线(位线BLj到BLm),然而可在其它值中使用其它位置。位线BLj到BLm与每一字线的相交点处的存储器单元可存储表示对所述字线的存取计数的二进制数。子存储体403也可具有类似结构(例如,位线、字线、存储器单元、存储器单元中的计数值等),但是为了清楚起见,其未在图4中展示。
当存取字线时(例如,响应于存取地址ACT-RA和激活信号ACT),与所述行相关联的计数值CNT可由计数器读取/写入(R/W)电路412读出。计数器控制电路414(其可为例如图2的212的侵略者检测器电路的部分)可改变计数值。在图4的实例中,计数器控制电路414可增加计数(例如,到CNT+1)。计数控制电路414将经更新的计数值与阈值进行比较。如果经更新的计数值满足或超过阈值,那么计数器控制电路414可设置指示地址ACT-RA是侵略者的旗标信号(例如,将信号flag从逻辑低改变为逻辑高)。
经改变的计数值CNT+1被提供给逻辑门410,当复位信号RSTF处于高逻辑电平时,逻辑门410将CNT+1作为新计数值CNT’提供给计数器R/W电路412。响应于接收到经更新的计数值,计数器R/W电路412将经更新的值CNT’写回子存储体402的存储器单元。
侵略者寄存器404(例如,图2的刷新地址产生器222的部分)接收旗标信号flag,并且响应于信号flag被设置(例如,被改变为活动状态),侵略者寄存器404沿着行地址总线捕获地址XADD的当前值。地址XADD可为被存取并且其相关联计数值超过阈值的地址ACT-RA。
比较器406可接收激活地址ACT-RA作为后续存取操作的部分。比较器406比较地址ACT-RA和存储在侵略者寄存器404中的侵略者地址XADD,并确定它们是否在同一子存储体中。如果它们不是(例如,如果ACT-RA与子存储体403相关联),那么比较器406在活动电平下提供复位信号RST。当信号RST处于活动电平时,反相器408在低逻辑电平下提供信号RSTF。当信号RSTF处于低逻辑电平时,逻辑门410提供是复位值的值CNT’。例如,逻辑门410可为与逻辑,并且当信号RSTF处于低逻辑电平时,值CNT’的位可处于低逻辑电平(例如,二进制数可为0)。因此,当侵略者寄存器404将侵略者地址XADD存储在子存储体402中并且提供与第二子存储体403相关联的后续存取地址时,那么将复位计数值CNT’写入沿着与RST-RA相关联的字线(例如,侵略字线)存储计数的存储器单元。在一些实施例中,比较器406可为用于确定侵略者和被存取地址是否在同一子存储体中的相同比较逻辑(例如,比较器406可表示图2的比较器214和子存储体逻辑216)。
图5是根据本公开的一些实施例的刷新操作的时序图。在一些实施例中,时序图500可表示例如图4的刷新逻辑400的刷新逻辑的操作。时序图500可大体上类似于图3的时序图300。为了简洁起见,将不再描述前面关于图3描述的特征。
在初始时间t0,刷新周期以两个顺序刷新操作开始。之后,在子存储体B中执行存取,并且存取地址被识别为侵略者。当执行子存储体A中的字线时,对与侵略者相关联的受害者执行目标刷新。为了简单起见,在图5的实例中,每一侵略者只执行单个目标刷新。在子存储体A中的下一次存取期间,存取侵略者使得可复位其计数值作为复位操作的部分。
在第一时间t1,在两个子存储体中检测到侵略者。在对子存储体A的第一存取期间,在子存储体B中执行目标刷新。接着,在对子存储体B的存取期间,在子存储体A中执行目标刷新。接着,存取子存储体A,并且复位子存储体B中的侵略者,接着存取子存储体B,这允许对子存储体A中的侵略者执行复位操作。
图6是根据本公开的一些实施例的方法的流程图。在一些实施例中,方法600可由本文描述的一或多个设备或其组件来实施,例如图1的存储器装置100、图2的刷新逻辑200及/或图4的刷新逻辑400。
方法600包含块610,块610描述检测存储体的第一子存储体中的侵略者地址。例如,方法600可包含基于对侵略者地址的存取,用侵略者检测器212检测侵略者地址。例如,方法600可包含计数对被存取地址的存取,并且当其计数达到或超过阈值时,将地址指定为侵略者地址。在一些实施例中,方法600可包含从与侵略者地址相关联的字线的存储器单元读取计数值,并基于计数值确定它是侵略者。
方法600包含框620,框620描述存取存储体的第二子存储体中的字线。例如,存取地址ACT-RA可与第二子存储体中的字线相关联。
方法600包含框630,框630描述响应于存取第二子存储体中的字线基于检测到的侵略者地址对第一子存储体执行目标刷新操作。例如,方法600可包含基于侵略者地址产生刷新地址,并刷新与刷新地址相关联的字线作为目标刷新操作的部分。方法600可包含在检测到第一子存储体中的侵略者地址之后,响应于第二子存储体中的下一次存取操作,对第一子存储体执行目标刷新操作。方法600还可包含基于周期性提供的刷新信号执行顺序刷新操作。
当然,应了解,本文描述的实例、实施例或过程中的任一者可与一或多个其它实例、实施例及/或过程组合,或者根据本系统、装置及方法,在单独装置或装置部分当中分离和/或执行。
最后,以上论述意在仅说明本系统,并且不应被解释为将所附权利要求书限于任何特定实施例或实施例群组。因此,尽管已经参考示范性实施例对本系统进行详细描述,但还应了解,在不背离如随后在所附权利要求书中阐述的本系统的更广泛及预期的精神及范围的情况下,所属领域的一般技术人员可设计出众多修改及替代实施例。因此,说明书及图式应以说明性方式来看并且不希望限制所附权利要求书的范围。

Claims (20)

1.一种方法,其包括:
检测存储体的第一子存储体中的侵略者地址;
存取所述存储体的第二子存储体中的字线;以及
响应于存取所述第二子存储体中的所述字线基于所述检测到的侵略者地址对所述第一子存储体执行目标刷新操作。
2.根据权利要求1所述的方法,其进一步包括在检测到所述第一子存储体中的所述侵略者地址之后,响应于所述第二子存储体中的下一次存取操作,对所述第一子存储体执行所述目标刷新操作。
3.根据权利要求1所述的方法,其进一步包括:
检测所述第二子存储体中的第二侵略者地址;
存取所述第一子存储体中的字线;以及
响应于存取所述第一子存储体中的所述字线基于所述第二侵略者地址对所述第二子存储体执行目标刷新操作。
4.根据权利要求1所述的方法,其进一步包括对所述第一子存储体周期性地执行顺序刷新操作。
5.根据权利要求1所述的方法,其进一步包括基于在所述第一子存储体中存取的行地址检测所述侵略者地址。
6.根据权利要求1所述的方法,其进一步包括:
响应于检测到所述侵略者地址,设置检测到的侵略者旗标;
当设置所述旗标时,将与所述被存取字线相关联的行地址与所述侵略者地址进行比较;以及
当所述行地址及所述侵略者地址不在同一子存储体中时,向所述第一子存储体提供目标刷新命令。
7.根据权利要求1所述的方法,其进一步包括:
基于沿着与所述侵略者地址相关联的侵略者字线存储的计数值来检测所述侵略者地址;
在执行所述目标刷新操作之后存取所述第二子存储体中的所述字线或不同字线;
响应于存取所述字线或所述不同字线,存取所述字线以复位所述计数值。
8.一种设备,其包括:
存储体的第一子存储体;
所述存储体的第二子存储体;及
刷新控制电路,其经配置以识别所述第一子存储体中的侵略者地址,并响应于对所述第二子存储体的存取操作,基于所述侵略者地址对所述第一子存储体执行目标刷新操作。
9.根据权利要求8所述的设备,其中所述刷新控制电路包括侵略者检测器电路,所述侵略者检测器电路经配置以响应于检测到所述侵略者地址而提供旗标和所述侵略者地址。
10.根据权利要求9所述的设备,其中所述刷新控制电路包含比较器,所述比较器经配置以当设置旗标时将所述侵略者地址与被存取地址进行比较,其中所述刷新控制电路经配置以响应于所述比较器确定所述侵略者地址和所述被存取地址不在同一子存储体中而提供目标刷新信号。
11.根据权利要求9所述的设备,其中所述侵略击检测器电路经配置以基于从所述侵略者地址的存储器单元读取的计数值来识别所述侵略者地址。
12.根据权利要求8所述的设备,其中所述刷新控制电路包含刷新地址产生器电路,所述刷新地址产生器电路经配置以基于所述侵略者地址产生刷新地址,其中对与所述刷新地址相关联的字线执行所述目标刷新操作。
13.根据权利要求12所述的设备,其中所述刷新地址产生器电路进一步经配置以响应于刷新信号产生刷新地址,其中基于所述刷新地址及所述刷新信号执行顺序刷新操作。
14.根据权利要求8所述的设备,其中所述刷新控制电路进一步经配置以识别所述第二子存储体中的第二侵略者地址,并响应于对所述第一子存储体的存取操作,基于所述第二侵略者地址对所述第二子存储体执行目标刷新操作。
15.一种设备,其包括:
行锤检测器,其经配置以检测侵略者地址并在检测到所述侵略者地址时设置行锤旗标;
比较器,其经配置以将所述侵略者地址与被存取地址进行比较,并且当所述侵略者地址和所述被存取地址在不同的子存储体中时,提供有效匹配信号;以及
逻辑电路,其经配置以当所述匹配信号有效时响应于存取命令提供目标刷新命令。
16.根据权利要求15所述的设备,其进一步包括经配置以响应于所述目标刷新命令基于所述侵略者地址提供刷新地址的刷新地址产生器。
17.根据权利要求15所述的设备,其进一步包括:
计数器读取/写入电路,其经配置以从存储器阵列接收计数值,其中所述行锤检测器经配置以基于所述计数值检测所述侵略者地址。
18.根据权利要求17所述的设备,其进一步包括:
刷新地址产生器电路,其经配置以在所述目标刷新命令之后提供复位地址,
其中所述比较器经配置以当所述被存取地址不在与所述复位地址相同的子存储体中时提供复位信号,以及
其中所述计数器读取/写入电路进一步经配置以响应于所述复位信号复位所述计数值。
19.根据权利要求15所述的设备,其进一步包括存储体,所述存储体包含第一子存储体和第二子存储体,其中被存取地址与所述第一子存储体相关联,且所述侵略者地址与所述第二子存储体相关联。
20.根据权利要求19所述的设备,其中响应于所述被存取的地址,在所述第一子存储体中存取第一字线,而响应于所述目标刷新命令,在所述第二子存储体中刷新字线。
CN202310453171.9A 2022-04-28 2023-04-25 用于基于存取的目标刷新操作的设备及方法 Pending CN116978424A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/731,645 2022-04-28
US17/731,645 US12112787B2 (en) 2022-04-28 2022-04-28 Apparatuses and methods for access based targeted refresh operations

Publications (1)

Publication Number Publication Date
CN116978424A true CN116978424A (zh) 2023-10-31

Family

ID=88482150

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310453171.9A Pending CN116978424A (zh) 2022-04-28 2023-04-25 用于基于存取的目标刷新操作的设备及方法

Country Status (2)

Country Link
US (1) US12112787B2 (zh)
CN (1) CN116978424A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10685696B2 (en) 2018-10-31 2020-06-16 Micron Technology, Inc. Apparatuses and methods for access based refresh timing
CN113168861B (zh) 2018-12-03 2024-05-14 美光科技公司 执行行锤刷新操作的半导体装置
US12112787B2 (en) 2022-04-28 2024-10-08 Micron Technology, Inc. Apparatuses and methods for access based targeted refresh operations
US12118221B2 (en) * 2022-06-22 2024-10-15 Samsung Electronics Co., Ltd. Semiconductor memory devices and memory systems including the same

Family Cites Families (439)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2279101A1 (fr) 1974-02-20 1976-02-13 Labo Electronique Physique Systeme d'analyse par ultrasons
US5225839A (en) 1980-12-29 1993-07-06 Okurowski Frank A All weather tactical strike system (AWTSS) and method of operation
JP2537181B2 (ja) 1985-10-08 1996-09-25 キヤノン株式会社 映像信号補正装置
DE69127518T2 (de) 1990-06-19 1998-04-02 Dell Usa Lp Digitalrechner, der eine Anlage für das aufeinanderfolgende Auffrischen einer erweiterbaren dynamischen RAM-Speicherschaltung hat
US5299159A (en) 1992-06-29 1994-03-29 Texas Instruments Incorporated Serial register stage arranged for connection with a single bitline
US5699297A (en) 1995-05-30 1997-12-16 Kabushiki Kaisha Toshiba Method of rewriting data in a microprocessor additionally provided with a flash memory
US5835436A (en) 1995-07-03 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Dynamic type semiconductor memory device capable of transferring data between array blocks at high speed
US5654929A (en) 1995-09-14 1997-08-05 Samsung Electronics Co., Ltd. Refresh strategy for DRAMs
JPH09161478A (ja) 1995-12-12 1997-06-20 Mitsubishi Electric Corp 半導体記憶装置
KR0172404B1 (ko) 1995-12-21 1999-03-30 김광호 반도체 메모리장치의 리프레쉬별 내부 승압전원 제어방법
KR100234365B1 (ko) 1997-01-30 1999-12-15 윤종용 반도체 메모리장치의 리프레쉬 방법 및 회로
JP3964491B2 (ja) 1997-03-25 2007-08-22 株式会社ルネサステクノロジ 半導体記憶装置及び半導体記憶装置の欠陥救済方法
US5999473A (en) 1997-04-25 1999-12-07 Texas Instruments Incorporated Circuit and method for internal refresh counter
US5883849A (en) 1997-06-30 1999-03-16 Micron Technology, Inc. Method and apparatus for simultaneous memory subarray testing
US5943283A (en) 1997-12-05 1999-08-24 Invox Technology Address scrambling in a semiconductor memory
KR100276386B1 (ko) 1997-12-06 2001-01-15 윤종용 반도체메모리장치의리프레시방법및회로
JP3194368B2 (ja) 1997-12-12 2001-07-30 日本電気株式会社 半導体記憶装置及びその駆動方法
US5956288A (en) 1997-12-22 1999-09-21 Emc Corporation Modular memory system with shared memory access
JPH11203862A (ja) 1998-01-13 1999-07-30 Mitsubishi Electric Corp 半導体記憶装置
WO1999046775A2 (en) 1998-03-10 1999-09-16 Rambus, Inc. Performing concurrent refresh and current control operations in a memory subsystem
US6011734A (en) 1998-03-12 2000-01-04 Motorola, Inc. Fuseless memory repair system and method of operation
US6049505A (en) 1998-05-22 2000-04-11 Micron Technology, Inc. Method and apparatus for generating memory addresses for testing memory devices
JPH11339493A (ja) 1998-05-27 1999-12-10 Mitsubishi Electric Corp 同期型半導体記憶装置
US6356485B1 (en) 1999-02-13 2002-03-12 Integrated Device Technology, Inc. Merging write cycles by comparing at least a portion of the respective write cycle addresses
JP4106811B2 (ja) 1999-06-10 2008-06-25 富士通株式会社 半導体記憶装置及び電子装置
US6535980B1 (en) 1999-06-21 2003-03-18 International Business Machines Corporation Keyless encryption of messages using challenge response
US6567340B1 (en) 1999-09-23 2003-05-20 Netlogic Microsystems, Inc. Memory storage cell based array of counters
DE19955601C2 (de) 1999-11-18 2001-11-29 Infineon Technologies Ag Verfahren zur Durchführung von Auto-Refresh-Sequenzen an einem DRAM
JP3964584B2 (ja) 1999-11-26 2007-08-22 東芝マイクロエレクトロニクス株式会社 半導体記憶装置
TW535161B (en) 1999-12-03 2003-06-01 Nec Electronics Corp Semiconductor memory device and its testing method
JP3376998B2 (ja) 2000-03-08 2003-02-17 日本電気株式会社 半導体記憶装置
JP3957469B2 (ja) 2000-04-11 2007-08-15 Necエレクトロニクス株式会社 半導体記憶装置
JP2002015593A (ja) 2000-06-27 2002-01-18 Toshiba Corp 半導体記憶装置
CA2313954A1 (en) 2000-07-07 2002-01-07 Mosaid Technologies Incorporated High speed dram architecture with uniform latency
JP2002074988A (ja) 2000-08-28 2002-03-15 Mitsubishi Electric Corp 半導体装置および半導体装置のテスト方法
JP4216457B2 (ja) 2000-11-30 2009-01-28 富士通マイクロエレクトロニクス株式会社 半導体記憶装置及び半導体装置
JP2002216473A (ja) 2001-01-16 2002-08-02 Matsushita Electric Ind Co Ltd 半導体メモリ装置
US6306721B1 (en) 2001-03-16 2001-10-23 Chartered Semiconductor Maufacturing Ltd. Method of forming salicided poly to metal capacitor
US6392952B1 (en) 2001-05-15 2002-05-21 United Microelectronics Corp. Memory refresh circuit and memory refresh method
JP2002373489A (ja) 2001-06-15 2002-12-26 Mitsubishi Electric Corp 半導体記憶装置
TW514920B (en) 2001-07-20 2002-12-21 United Microelectronics Corp Selective memory refreshing circuit and refreshing method
JP4768163B2 (ja) 2001-08-03 2011-09-07 富士通セミコンダクター株式会社 半導体メモリ
GB2380035B (en) 2001-09-19 2003-08-20 3Com Corp DRAM refresh command operation
JP2003123470A (ja) 2001-10-05 2003-04-25 Mitsubishi Electric Corp 半導体記憶装置
US6704228B2 (en) 2001-12-28 2004-03-09 Samsung Electronics Co., Ltd Semiconductor memory device post-repair circuit and method
KR100431994B1 (ko) 2002-01-24 2004-05-22 주식회사 하이닉스반도체 개선된 펄스 생성기를 사용한 디램 리프레쉬 콘트롤러
JP4416372B2 (ja) 2002-02-25 2010-02-17 富士通マイクロエレクトロニクス株式会社 半導体記憶装置
US6618314B1 (en) 2002-03-04 2003-09-09 Cypress Semiconductor Corp. Method and architecture for reducing the power consumption for memory devices in refresh operations
US6751143B2 (en) 2002-04-11 2004-06-15 Micron Technology, Inc. Method and system for low power refresh of dynamic random access memories
US6741515B2 (en) 2002-06-18 2004-05-25 Nanoamp Solutions, Inc. DRAM with total self refresh and control circuit
US7043599B1 (en) 2002-06-20 2006-05-09 Rambus Inc. Dynamic memory supporting simultaneous refresh and data-access transactions
US7290080B2 (en) 2002-06-27 2007-10-30 Nazomi Communications Inc. Application processors and memory architecture for wireless applications
JP3821066B2 (ja) 2002-07-04 2006-09-13 日本電気株式会社 磁気ランダムアクセスメモリ
JP4246971B2 (ja) 2002-07-15 2009-04-02 富士通マイクロエレクトロニクス株式会社 半導体メモリ
KR100480607B1 (ko) 2002-08-02 2005-04-06 삼성전자주식회사 리던던시 워드라인에 의하여 결함 워드라인을 대체하는경우 대체효율을 향상시키는 반도체 메모리 장치
JP4236901B2 (ja) 2002-10-23 2009-03-11 Necエレクトロニクス株式会社 半導体記憶装置及びその制御方法
JP2004199842A (ja) 2002-12-20 2004-07-15 Nec Micro Systems Ltd 半導体記憶装置及びその制御方法
KR100474551B1 (ko) 2003-02-10 2005-03-10 주식회사 하이닉스반도체 셀프 리프레쉬 장치 및 방법
WO2004077444A1 (ja) 2003-02-27 2004-09-10 Fujitsu Limited 半導体記憶装置及びそのリフレッシュ方法
JP4381013B2 (ja) 2003-03-17 2009-12-09 富士通マイクロエレクトロニクス株式会社 半導体記憶装置
KR100497164B1 (ko) 2003-04-30 2005-06-23 주식회사 하이닉스반도체 반도체 메모리 장치 및 그의 동작 방법
JP4139734B2 (ja) 2003-05-16 2008-08-27 セイコーエプソン株式会社 擬似スタティックメモリ装置および電子機器
KR100546347B1 (ko) 2003-07-23 2006-01-26 삼성전자주식회사 온도 검출 회로 및 온도 검출 방법
DE10337855B4 (de) 2003-08-18 2005-09-29 Infineon Technologies Ag Schaltung und Verfahren zur Auswertung und Steuerung einer Auffrischungsrate von Speicherzellen eines dynamischen Speichers
JP4664208B2 (ja) 2003-08-18 2011-04-06 富士通セミコンダクター株式会社 半導体メモリおよび半導体メモリの動作方法
JP2005116106A (ja) 2003-10-09 2005-04-28 Elpida Memory Inc 半導体記憶装置とその製造方法
US7095669B2 (en) 2003-11-07 2006-08-22 Infineon Technologies Ag Refresh for dynamic cells with weak retention
KR100621619B1 (ko) 2003-11-14 2006-09-13 삼성전자주식회사 리플레쉬 동작을 수행하는 반도체 메모리 장치
US20050108460A1 (en) 2003-11-14 2005-05-19 Intel Corporation Partial bank DRAM refresh
JP4478974B2 (ja) 2004-01-30 2010-06-09 エルピーダメモリ株式会社 半導体記憶装置及びそのリフレッシュ制御方法
US20050213408A1 (en) 2004-03-29 2005-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Ripple refresh circuit and method for sequentially refreshing a semiconductor memory system
JP2005285271A (ja) 2004-03-30 2005-10-13 Nec Electronics Corp 半導体記憶装置
KR100668822B1 (ko) 2004-04-28 2007-01-16 주식회사 하이닉스반도체 메모리 장치의 셀프 리프레쉬 주기 제어 장치
KR100653688B1 (ko) 2004-04-29 2006-12-04 삼성전자주식회사 반도체 메모리 장치 및 이 장치의 리프레쉬 방법, 및 이장치를 위한 메모리 시스템
US7020038B2 (en) 2004-05-05 2006-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Efficient refresh operation for semiconductor memory devices
US7184350B2 (en) 2004-05-27 2007-02-27 Qualcomm Incorporated Method and system for providing independent bank refresh for volatile memories
WO2006001212A1 (ja) 2004-06-23 2006-01-05 Sanyo Electric Co., Ltd. メモリ
US7116602B2 (en) 2004-07-15 2006-10-03 Micron Technology, Inc. Method and system for controlling refresh to avoid memory cell data losses
US7164615B2 (en) 2004-07-21 2007-01-16 Samsung Electronics Co., Ltd. Semiconductor memory device performing auto refresh in the self refresh mode
US7035152B1 (en) 2004-10-14 2006-04-25 Micron Technology, Inc. System and method for redundancy memory decoding
US7248528B2 (en) 2004-10-21 2007-07-24 Elpida Memory Inc. Refresh control method of a semiconductor memory device and semiconductor memory device
KR100608370B1 (ko) 2004-11-15 2006-08-08 주식회사 하이닉스반도체 메모리 장치의 리프레쉬 수행 방법
DE102004062150A1 (de) 2004-12-23 2006-07-13 Braun Gmbh Auswechselbares Zubehörteil für ein Elektrokleingerät und Verfahren zum Bestimmen der Benutzungsdauer des Zubehörteils
US7167401B2 (en) 2005-02-10 2007-01-23 Micron Technology, Inc. Low power chip select (CS) latency option
US7254074B2 (en) 2005-03-07 2007-08-07 Micron Technology, Inc. Open digit line array architecture for a memory array
US7170808B2 (en) 2005-03-25 2007-01-30 Infineon Technologies Ag Power saving refresh scheme for DRAMs with segmented word line architecture
JP4309368B2 (ja) 2005-03-30 2009-08-05 エルピーダメモリ株式会社 半導体記憶装置
US7212457B2 (en) 2005-05-18 2007-05-01 Macronix International Co., Ltd. Method and apparatus for implementing high speed memory
KR100682174B1 (ko) 2005-05-18 2007-02-13 주식회사 하이닉스반도체 반도체 메모리 장치의 페이지 액세스 회로
JP4609813B2 (ja) 2005-05-18 2011-01-12 エルピーダメモリ株式会社 半導体装置
US7532532B2 (en) 2005-05-31 2009-05-12 Micron Technology, Inc. System and method for hidden-refresh rate modification
JP4524645B2 (ja) 2005-06-01 2010-08-18 エルピーダメモリ株式会社 半導体装置
KR100670665B1 (ko) 2005-06-30 2007-01-17 주식회사 하이닉스반도체 반도체 메모리 장치의 레이턴시 제어 회로
KR101183684B1 (ko) 2005-07-13 2012-10-18 삼성전자주식회사 디램 메모리 장치 및 부분 어레이 셀프 리프레시 방법
JP2007035151A (ja) 2005-07-26 2007-02-08 Elpida Memory Inc 半導体メモリ装置およびメモリシステムのリフレッシュ制御方法
US7694082B2 (en) 2005-07-29 2010-04-06 International Business Machines Corporation Computer program and method for managing resources in a distributed storage system
US7734866B2 (en) 2005-08-04 2010-06-08 Rambus Inc. Memory with address-differentiated refresh rate to accommodate low-retention storage rows
US7565479B2 (en) 2005-08-04 2009-07-21 Rambus Inc. Memory with refresh cycle donation to accommodate low-retention-storage rows
US7444577B2 (en) 2005-08-04 2008-10-28 Rambus Inc. Memory device testing to support address-differentiated refresh rates
WO2007020567A1 (en) 2005-08-19 2007-02-22 Nxp B.V. Circuit arrangement with non-volatile memory module and method for registering attacks on said non-volatile memory module
KR100725992B1 (ko) 2005-11-04 2007-06-08 삼성전자주식회사 리프레시 정보에 따라 반도체 메모리 장치의 리프레시를제어하는 장치 및 그 방법
US7894282B2 (en) 2005-11-29 2011-02-22 Samsung Electronics Co., Ltd. Dynamic random access memory device and method of determining refresh cycle thereof
US20070165042A1 (en) 2005-12-26 2007-07-19 Seitaro Yagi Rendering apparatus which parallel-processes a plurality of pixels, and data transfer method
KR100745074B1 (ko) 2005-12-28 2007-08-01 주식회사 하이닉스반도체 반도체 장치
US7362640B2 (en) 2005-12-29 2008-04-22 Mosaid Technologies Incorporated Apparatus and method for self-refreshing dynamic random access memory cells
KR100776737B1 (ko) 2006-02-10 2007-11-19 주식회사 하이닉스반도체 반도체 메모리의 액티브 싸이클 제어장치 및 방법
US7313047B2 (en) 2006-02-23 2007-12-25 Hynix Semiconductor Inc. Dynamic semiconductor memory with improved refresh mechanism
JP4912718B2 (ja) 2006-03-30 2012-04-11 富士通セミコンダクター株式会社 ダイナミック型半導体メモリ
KR100776747B1 (ko) 2006-05-09 2007-11-19 주식회사 하이닉스반도체 반도체 메모리 장치의 로우 어드레스 제어 회로 및 방법
US8000134B2 (en) 2006-05-15 2011-08-16 Apple Inc. Off-die charge pump that supplies multiple flash devices
US8069377B2 (en) 2006-06-26 2011-11-29 Micron Technology, Inc. Integrated circuit having memory array including ECC and column redundancy and method of operating the same
FR2903219A1 (fr) 2006-07-03 2008-01-04 St Microelectronics Sa Procede de rafraichissement d'un memoire vive dynamique et dispositif de memoire vive dynamique correspondant,en particulier incorpore dans un telephone mobile cellulaire
JP2008033995A (ja) 2006-07-26 2008-02-14 Matsushita Electric Ind Co Ltd メモリシステム
US7522464B2 (en) 2006-07-26 2009-04-21 Zmos Technology, Inc. Dynamic memory refresh configurations and leakage control methods
US20080028137A1 (en) 2006-07-31 2008-01-31 Schakel Keith R Method and Apparatus For Refresh Management of Memory Modules
JP4353331B2 (ja) 2006-12-05 2009-10-28 エルピーダメモリ株式会社 半導体記憶装置
JP2008165847A (ja) 2006-12-26 2008-07-17 Elpida Memory Inc 半導体メモリ装置、半導体装置、メモリシステム及びリフレッシュ制御方法
KR100929155B1 (ko) 2007-01-25 2009-12-01 삼성전자주식회사 반도체 메모리 장치 및 그것의 메모리 셀 억세스 방법
US7577231B2 (en) 2007-03-16 2009-08-18 International Business Machines Corporation Clock multiplier structure for fixed speed testing of integrated circuits
JP2008262616A (ja) 2007-04-10 2008-10-30 Matsushita Electric Ind Co Ltd 半導体記憶装置、内部リフレッシュ停止方法、外部アクセスと内部リフレッシュとの競合処理方法、カウンタ初期化手法、外部リフレッシュのリフレッシュアドレス検出方法、及び外部リフレッシュ実行選択方法
JP4911510B2 (ja) 2007-04-16 2012-04-04 エルピーダメモリ株式会社 半導体記憶装置
CN101067972B (zh) 2007-04-23 2012-04-25 北京兆易创新科技有限公司 一种存储器检错纠错编码电路及利用其读写数据的方法
US20080270683A1 (en) 2007-04-25 2008-10-30 International Business Machines Corporation Systems and methods for a dram concurrent refresh engine with processor interface
US20080266990A1 (en) 2007-04-30 2008-10-30 Infineon Technologies North America Corp. Flexible redundancy replacement scheme for semiconductor device
US20080306723A1 (en) 2007-06-08 2008-12-11 Luca De Ambroggi Emulated Combination Memory Device
TWI335035B (en) 2007-06-20 2010-12-21 Etron Technology Inc Memory row scheme having memory row redundancy repair function
KR101125953B1 (ko) 2007-07-11 2012-03-22 후지쯔 세미컨덕터 가부시키가이샤 반도체 기억 장치 및 시스템
JP5104864B2 (ja) 2007-07-11 2012-12-19 富士通セミコンダクター株式会社 半導体記憶装置及びシステム
JP5405007B2 (ja) 2007-07-20 2014-02-05 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
US7813210B2 (en) 2007-08-16 2010-10-12 Unity Semiconductor Corporation Multiple-type memory
KR100899392B1 (ko) 2007-08-20 2009-05-27 주식회사 하이닉스반도체 리프레시 특성 테스트 회로 및 이를 이용한 리프레시 특성테스트 방법
US7623365B2 (en) 2007-08-29 2009-11-24 Micron Technology, Inc. Memory device interface methods, apparatus, and systems
US8072256B2 (en) 2007-09-14 2011-12-06 Mosaid Technologies Incorporated Dynamic random access memory and boosted voltage producer therefor
US7864588B2 (en) 2007-09-17 2011-01-04 Spansion Israel Ltd. Minimizing read disturb in an array flash cell
US7945825B2 (en) 2007-11-25 2011-05-17 Spansion Isreal, Ltd Recovery while programming non-volatile memory (NVM)
US7551505B1 (en) 2007-12-05 2009-06-23 Qimonda North America Corp. Memory refresh method and apparatus
JP5228472B2 (ja) 2007-12-19 2013-07-03 富士通セミコンダクター株式会社 半導体メモリおよびシステム
JP5513730B2 (ja) 2008-02-08 2014-06-04 ピーエスフォー ルクスコ エスエイアールエル 半導体記憶装置
JP2009252278A (ja) 2008-04-04 2009-10-29 Toshiba Corp 不揮発性半導体記憶装置及びメモリシステム
US7768847B2 (en) 2008-04-09 2010-08-03 Rambus Inc. Programmable memory repair scheme
KR20090124506A (ko) 2008-05-30 2009-12-03 삼성전자주식회사 피크 전류를 감소시키기 위한 리프레쉬 회로를 가지는반도체 메모리 장치 및 그에 따른 워드라인 액티베이팅방법
US8289760B2 (en) 2008-07-02 2012-10-16 Micron Technology, Inc. Multi-mode memory device and method having stacked memory dice, a logic die and a command processing circuit and operating in direct and indirect modes
US8756486B2 (en) 2008-07-02 2014-06-17 Micron Technology, Inc. Method and apparatus for repairing high capacity/high bandwidth memory devices
TW201011777A (en) 2008-09-09 2010-03-16 Amic Technology Corp Refresh method for a non-volatile memory
JP4843655B2 (ja) 2008-09-24 2011-12-21 株式会社東芝 半導体記憶装置
KR101481578B1 (ko) 2008-10-16 2015-01-21 삼성전자주식회사 지연 동기 루프 회로의 동작을 제어하는 반도체 메모리 장치
KR20100054985A (ko) 2008-11-17 2010-05-26 삼성전자주식회사 모드 가변 리프레쉬 동작을 갖는 반도체 메모리 장치
US8127184B2 (en) 2008-11-26 2012-02-28 Qualcomm Incorporated System and method including built-in self test (BIST) circuit to test cache memory
KR101020284B1 (ko) 2008-12-05 2011-03-07 주식회사 하이닉스반도체 초기화회로 및 이를 이용한 뱅크액티브회로
KR101596281B1 (ko) 2008-12-19 2016-02-22 삼성전자 주식회사 온도 관련 공유 제어회로를 갖는 반도체 메모리 장치
JP2010152962A (ja) 2008-12-24 2010-07-08 Toshiba Corp 半導体記憶装置
JP2010170596A (ja) 2009-01-20 2010-08-05 Elpida Memory Inc 半導体記憶装置
JP2010170608A (ja) 2009-01-21 2010-08-05 Elpida Memory Inc 半導体記憶装置
WO2010085405A1 (en) 2009-01-22 2010-07-29 Rambus Inc. Maintenance operations in a dram
US8102720B2 (en) 2009-02-02 2012-01-24 Qualcomm Incorporated System and method of pulse generation
JP5343734B2 (ja) 2009-06-26 2013-11-13 富士通株式会社 半導体記憶装置
JP2011034645A (ja) 2009-08-03 2011-02-17 Elpida Memory Inc 半導体装置
US20110055495A1 (en) 2009-08-28 2011-03-03 Qualcomm Incorporated Memory Controller Page Management Devices, Systems, and Methods
KR20110030779A (ko) 2009-09-18 2011-03-24 삼성전자주식회사 메모리 장치, 이를 구비하는 메모리 시스템 및 이의 제어 방법
US8862973B2 (en) 2009-12-09 2014-10-14 Intel Corporation Method and system for error management in a memory device
JP5538958B2 (ja) 2010-03-05 2014-07-02 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP2011192343A (ja) 2010-03-12 2011-09-29 Elpida Memory Inc 半導体装置及びそのリフレッシュ制御方法並びにコンピュータシステム
WO2011115648A1 (en) 2010-03-15 2011-09-22 Rambus Inc. Chip selection in a symmetric interconnection topology
JP2011258259A (ja) 2010-06-07 2011-12-22 Elpida Memory Inc 半導体装置
JP5731179B2 (ja) 2010-06-21 2015-06-10 ルネサスエレクトロニクス株式会社 半導体記憶装置
US8572423B1 (en) 2010-06-22 2013-10-29 Apple Inc. Reducing peak current in memory systems
JP2012022751A (ja) 2010-07-15 2012-02-02 Elpida Memory Inc 半導体装置
KR101728067B1 (ko) 2010-09-03 2017-04-18 삼성전자 주식회사 반도체 메모리 장치
US9286965B2 (en) 2010-12-03 2016-03-15 Rambus Inc. Memory refresh method and devices
US8799566B2 (en) 2010-12-09 2014-08-05 International Business Machines Corporation Memory system with a programmable refresh cycle
WO2012082656A2 (en) 2010-12-13 2012-06-21 Aplus Flash Technology, Inc. Universal timing waveforms sets to improve random access read and write speed of memories
JP5695895B2 (ja) 2010-12-16 2015-04-08 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体装置
JP5684590B2 (ja) 2011-01-28 2015-03-11 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体装置
JP2012174297A (ja) 2011-02-18 2012-09-10 Elpida Memory Inc 半導体装置
US8711647B2 (en) 2011-05-09 2014-04-29 Inphi Corporation DRAM refresh method and system
JP2012252742A (ja) 2011-06-02 2012-12-20 Elpida Memory Inc 半導体装置
JP2013004158A (ja) 2011-06-21 2013-01-07 Elpida Memory Inc 半導体記憶装置及びそのリフレッシュ制御方法
JP5742508B2 (ja) 2011-06-27 2015-07-01 富士通セミコンダクター株式会社 半導体メモリ、システムおよび半導体メモリの動作方法
KR20130003333A (ko) 2011-06-30 2013-01-09 삼성전자주식회사 스페어 안티퓨즈 어레이를 구비한 반도체 메모리 장치 및 그에 따른 안티퓨즈 리페어 방법
JP2013030001A (ja) 2011-07-28 2013-02-07 Elpida Memory Inc 情報処理システム
US8588022B2 (en) 2011-08-24 2013-11-19 Micron Technology, Inc. Memory refresh methods, memory section control circuits, and apparatuses
KR20130024158A (ko) 2011-08-30 2013-03-08 에스케이하이닉스 주식회사 반도체메모리장치 및 반도체메모리장치의 리프레쉬 방법
KR20130032703A (ko) 2011-09-23 2013-04-02 에스케이하이닉스 주식회사 반도체메모리장치
US9236143B2 (en) 2011-12-28 2016-01-12 Intel Corporation Generic address scrambler for memory circuit test engine
US8645777B2 (en) 2011-12-29 2014-02-04 Intel Corporation Boundary scan chain for stacked memory
US9087613B2 (en) 2012-02-29 2015-07-21 Samsung Electronics Co., Ltd. Device and method for repairing memory cell and memory system including the device
CN102663155B (zh) 2012-03-09 2014-05-28 中国科学院微电子研究所 优化版图栅长的方法及其装置
US9158619B2 (en) 2012-03-30 2015-10-13 Intel Corporation On chip redundancy repair for memory devices
WO2013147841A1 (en) 2012-03-30 2013-10-03 Intel Corporation Generic address scrambler for memory circuit test engine
KR20130117198A (ko) 2012-04-18 2013-10-25 삼성전자주식회사 메모리 셀의 리프레쉬 방법 및 이를 이용한 반도체 메모리 장치
KR101962874B1 (ko) 2012-04-24 2019-03-27 삼성전자주식회사 메모리 장치, 메모리 컨트롤러, 메모리 시스템 및 이의 동작 방법
US9257169B2 (en) 2012-05-14 2016-02-09 Samsung Electronics Co., Ltd. Memory device, memory system, and operating methods thereof
KR101975029B1 (ko) 2012-05-17 2019-08-23 삼성전자주식회사 리프레쉬 주기를 조절하는 반도체 메모리 장치, 메모리 시스템 및 그 동작방법
KR20140002928A (ko) 2012-06-28 2014-01-09 에스케이하이닉스 주식회사 셀 어레이 및 이를 포함하는 메모리 장치
US8811110B2 (en) 2012-06-28 2014-08-19 Intel Corporation Configuration for power reduction in DRAM
US9117544B2 (en) 2012-06-30 2015-08-25 Intel Corporation Row hammer refresh command
US8938573B2 (en) 2012-06-30 2015-01-20 Intel Corporation Row hammer condition monitoring
US9236110B2 (en) 2012-06-30 2016-01-12 Intel Corporation Row hammer refresh command
KR101977665B1 (ko) 2012-07-12 2019-08-28 삼성전자주식회사 리프레쉬 주기를 조절하는 반도체 메모리 장치, 메모리 시스템 및 그 동작방법
US8717841B2 (en) 2012-07-20 2014-05-06 Etron Technology, Inc. Method of controlling a refresh operation of PSRAM and related device
TWI498890B (zh) 2012-08-10 2015-09-01 Etron Technology Inc 偽靜態隨機存取記憶體之運作方法及相關記憶裝置
JP2014038674A (ja) 2012-08-14 2014-02-27 Ps4 Luxco S A R L 半導体装置
US9165679B2 (en) 2012-09-18 2015-10-20 Samsung Electronics Co., Ltd. Post package repairing method, method of preventing multiple activation of spare word lines, and semiconductor memory device including fuse programming circuit
US8988956B2 (en) 2012-09-18 2015-03-24 Mosys, Inc. Programmable memory built in self repair circuit
US9030903B2 (en) 2012-09-24 2015-05-12 Intel Corporation Method, apparatus and system for providing a memory refresh
KR102050473B1 (ko) 2012-09-24 2019-11-29 삼성전자주식회사 리프레쉬 주기를 조절하는 반도체 메모리 장치 및 메모리 시스템
US8949698B2 (en) 2012-09-27 2015-02-03 Intel Corporation Method, apparatus and system for handling data faults
US9299400B2 (en) 2012-09-28 2016-03-29 Intel Corporation Distributed row hammer tracking
KR20140042546A (ko) 2012-09-28 2014-04-07 에스케이하이닉스 주식회사 반도체 장치 및 그 동작 방법
US20150294711A1 (en) 2012-10-22 2015-10-15 Hewlett-Packard Development Company, L.P. Performing refresh of a memory device in response to access of data
KR102048255B1 (ko) 2012-10-25 2019-11-25 삼성전자주식회사 비트 라인 감지 증폭기 및 이를 포함하는 반도체 메모리 장치 및 메모리 시스템
CN102931187A (zh) 2012-10-25 2013-02-13 北京七芯中创科技有限公司 一种温度补偿时钟芯片的版图结构
US8972652B2 (en) 2012-11-19 2015-03-03 Spansion Llc Data refresh in non-volatile memory
US9076548B1 (en) 2012-11-22 2015-07-07 Samsung Electronics Co., Ltd. Semiconductor memory device including refresh control circuit and method of refreshing the same
US9384821B2 (en) 2012-11-30 2016-07-05 Intel Corporation Row hammer monitoring based on stored row hammer threshold value
US9032141B2 (en) 2012-11-30 2015-05-12 Intel Corporation Row hammer monitoring based on stored row hammer threshold value
KR20140076735A (ko) 2012-12-13 2014-06-23 삼성전자주식회사 휘발성 메모리 장치 및 메모리 시스템
US10079044B2 (en) 2012-12-20 2018-09-18 Advanced Micro Devices, Inc. Processor with host and slave operating modes stacked with memory
US9286964B2 (en) 2012-12-21 2016-03-15 Intel Corporation Method, apparatus and system for responding to a row hammer event
US9076499B2 (en) 2012-12-28 2015-07-07 Intel Corporation Refresh rate performance based on in-system weak bit detection
US9251885B2 (en) 2012-12-28 2016-02-02 Intel Corporation Throttling support for row-hammer counters
US9355704B2 (en) 2012-12-28 2016-05-31 Mediatek Inc. Refresh method for switching between different refresh types based on at least one parameter of volatile memory and related memory controller
US9324398B2 (en) 2013-02-04 2016-04-26 Micron Technology, Inc. Apparatuses and methods for targeted refreshing of memory
KR102107470B1 (ko) 2013-02-07 2020-05-07 삼성전자주식회사 메모리 장치 및 메모리 장치의 리프레시 방법
KR102133573B1 (ko) 2013-02-26 2020-07-21 삼성전자주식회사 반도체 메모리 및 반도체 메모리를 포함하는 메모리 시스템
US9224449B2 (en) 2013-03-11 2015-12-29 Nvidia Corporation Variable dynamic memory refresh
US9269436B2 (en) 2013-03-12 2016-02-23 Intel Corporation Techniques for determining victim row addresses in a volatile memory
US9412432B2 (en) 2013-03-15 2016-08-09 Ps4 Luxco S.A.R.L. Semiconductor storage device and system provided with same
US9449671B2 (en) 2013-03-15 2016-09-20 Intel Corporation Techniques for probabilistic dynamic random access memory row repair
WO2014193376A1 (en) 2013-05-30 2014-12-04 Hewlett-Packard Development Company, L.P. Separate memory controllers to access data in memory
KR102105894B1 (ko) 2013-05-30 2020-05-06 삼성전자주식회사 휘발성 메모리 장치 및 그것의 리프레쉬 방법
JP2015008029A (ja) 2013-06-26 2015-01-15 マイクロン テクノロジー, インク. 半導体装置
US9524771B2 (en) 2013-07-12 2016-12-20 Qualcomm Incorporated DRAM sub-array level autonomic refresh memory controller optimization
JP2015032325A (ja) 2013-07-31 2015-02-16 マイクロン テクノロジー, インク. 半導体装置
KR102194791B1 (ko) 2013-08-09 2020-12-28 에스케이하이닉스 주식회사 메모리, 이를 포함하는 메모리 시스템 및 메모리의 동작방법
KR20150019317A (ko) 2013-08-13 2015-02-25 에스케이하이닉스 주식회사 메모리 및 이를 포함 하는 메모리 시스템
KR102124987B1 (ko) 2013-08-14 2020-06-22 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
US9047978B2 (en) 2013-08-26 2015-06-02 Micron Technology, Inc. Apparatuses and methods for selective row refreshes
US9117546B2 (en) 2013-09-19 2015-08-25 Elite Semiconductor Memory Technology Inc. Method for auto-refreshing memory cells in semiconductor memory device and semiconductor memory device using the method
KR20150033950A (ko) 2013-09-25 2015-04-02 에스케이하이닉스 주식회사 어드레스 검출회로, 메모리 및 메모리 시스템
US9396786B2 (en) 2013-09-25 2016-07-19 SK Hynix Inc. Memory and memory system including the same
US9934143B2 (en) 2013-09-26 2018-04-03 Intel Corporation Mapping a physical address differently to different memory devices in a group
US9117542B2 (en) 2013-09-27 2015-08-25 Intel Corporation Directed per bank refresh command
WO2015047304A1 (en) 2013-09-27 2015-04-02 Hewlett-Packard Development Company, L.P. Refresh row address
KR102157769B1 (ko) 2013-10-28 2020-09-18 에스케이하이닉스 주식회사 메모리 시스템 및 이의 동작 방법
US20150127389A1 (en) 2013-11-07 2015-05-07 Wagesecure, Llc System, method, and program product for calculating premiums for employer-based supplemental unemployment insurance
JP2015092423A (ja) 2013-11-08 2015-05-14 マイクロン テクノロジー, インク. 半導体装置
US9911485B2 (en) 2013-11-11 2018-03-06 Qualcomm Incorporated Method and apparatus for refreshing a memory cell
US10020045B2 (en) 2013-11-26 2018-07-10 Micron Technology, Inc. Partial access mode for dynamic random access memory
KR20150064953A (ko) 2013-12-04 2015-06-12 에스케이하이닉스 주식회사 반도체 메모리 장치
KR102181373B1 (ko) 2013-12-09 2020-11-23 에스케이하이닉스 주식회사 반도체 장치의 리프레쉬 제어 회로 및 리프레쉬 방법
KR102124973B1 (ko) 2013-12-11 2020-06-22 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
KR102157772B1 (ko) 2013-12-18 2020-09-18 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
KR102189533B1 (ko) 2013-12-18 2020-12-11 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
US9535831B2 (en) 2014-01-10 2017-01-03 Advanced Micro Devices, Inc. Page migration in a 3D stacked hybrid memory
KR102168115B1 (ko) 2014-01-21 2020-10-20 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 메모리 시스템
US10534686B2 (en) 2014-01-30 2020-01-14 Micron Technology, Inc. Apparatuses and methods for address detection
KR20150105054A (ko) 2014-03-07 2015-09-16 에스케이하이닉스 주식회사 반도체 메모리 장치
KR102116920B1 (ko) 2014-03-26 2020-06-01 에스케이하이닉스 주식회사 반도체 메모리 장치 및 이를 포함하는 반도체 메모리 시스템
US9431085B2 (en) 2014-03-28 2016-08-30 Synopsys, Inc. Most activated memory portion handling
JP2015207334A (ja) 2014-04-23 2015-11-19 マイクロン テクノロジー, インク. 半導体装置
JP2015219938A (ja) 2014-05-21 2015-12-07 マイクロン テクノロジー, インク. 半導体装置
WO2015183245A1 (en) 2014-05-27 2015-12-03 Hewlett-Packard Development Company, L.P. Validation of a repair to a selected row of data
US9684622B2 (en) 2014-06-09 2017-06-20 Micron Technology, Inc. Method and apparatus for controlling access to a common bus by multiple components
KR20160000626A (ko) 2014-06-25 2016-01-05 에스케이하이닉스 주식회사 메모리 장치
US10127964B2 (en) 2014-07-03 2018-11-13 Yale University Circuitry for ferroelectric FET-based dynamic random access memory and non-volatile memory
KR20160011021A (ko) 2014-07-21 2016-01-29 에스케이하이닉스 주식회사 메모리 장치
KR20160011483A (ko) 2014-07-22 2016-02-01 에스케이하이닉스 주식회사 메모리 장치
US9490002B2 (en) 2014-07-24 2016-11-08 Rambus Inc. Reduced refresh power
US9905199B2 (en) 2014-09-17 2018-02-27 Mediatek Inc. Processor for use in dynamic refresh rate switching and related electronic device and method
KR20160035444A (ko) 2014-09-23 2016-03-31 에스케이하이닉스 주식회사 스마트 리프레쉬 장치
US9799412B2 (en) 2014-09-30 2017-10-24 Sony Semiconductor Solutions Corporation Memory having a plurality of memory cells and a plurality of word lines
KR20160045461A (ko) 2014-10-17 2016-04-27 에스케이하이닉스 주식회사 반도체 장치 및 그의 구동방법
KR102315277B1 (ko) 2014-11-03 2021-10-20 삼성전자 주식회사 리프레쉬 특성이 개선된 반도체 메모리 장치
KR20160056056A (ko) 2014-11-11 2016-05-19 삼성전자주식회사 반도체 메모리 장치 및 이를 포함하는 메모리 시스템
CN107077883B (zh) 2014-11-25 2021-04-27 三星电子株式会社 基于概率信息检测半导体存储器的被最频繁存取的地址的方法
US20160155491A1 (en) 2014-11-27 2016-06-02 Advanced Micro Devices, Inc. Memory persistence management control
KR20160069213A (ko) 2014-12-08 2016-06-16 에스케이하이닉스 주식회사 반도체 메모리 장치
US9418723B2 (en) 2014-12-23 2016-08-16 Intel Corporation Techniques to reduce memory cell refreshes for a memory device
KR102250622B1 (ko) 2015-01-07 2021-05-11 삼성전자주식회사 메모리 장치의 동작 방법 및 이를 포함하는 메모리 시스템의 동작 방법
KR20160093988A (ko) 2015-01-30 2016-08-09 에스케이하이닉스 주식회사 구동회로 및 구동회로를 이용한 구동방법
KR102285772B1 (ko) 2015-02-02 2021-08-05 에스케이하이닉스 주식회사 메모리 장치 및 이를 포함하는 메모리 시스템
US9728245B2 (en) 2015-02-28 2017-08-08 Intel Corporation Precharging and refreshing banks in memory device with bank group architecture
US9349491B1 (en) 2015-04-17 2016-05-24 Micron Technology, Inc. Repair of memory devices using volatile and non-volatile memory
KR20160132243A (ko) 2015-05-08 2016-11-17 에스케이하이닉스 주식회사 반도체 메모리 장치
KR102304928B1 (ko) 2015-05-13 2021-09-27 삼성전자 주식회사 리프레시 명령을 분산시키는 메모리 장치 및 상기 장치를 포함하는 메모리 시스템
US9685219B2 (en) 2015-05-13 2017-06-20 Samsung Electronics Co., Ltd. Semiconductor memory device for deconcentrating refresh commands and system including the same
US9570142B2 (en) 2015-05-18 2017-02-14 Micron Technology, Inc. Apparatus having dice to perorm refresh operations
KR20170024307A (ko) 2015-08-25 2017-03-07 삼성전자주식회사 내장형 리프레쉬 콘트롤러 및 이를 포함하는 메모리 장치
KR102326018B1 (ko) 2015-08-24 2021-11-12 삼성전자주식회사 메모리 시스템
EP3160176B1 (en) 2015-10-19 2019-12-11 Vodafone GmbH Using a service of a mobile packet core network without having a sim card
KR20170045795A (ko) 2015-10-20 2017-04-28 삼성전자주식회사 메모리 장치 및 이를 포함하는 메모리 시스템
US9812185B2 (en) 2015-10-21 2017-11-07 Invensas Corporation DRAM adjacent row disturb mitigation
KR102373544B1 (ko) 2015-11-06 2022-03-11 삼성전자주식회사 요청 기반의 리프레쉬를 수행하는 메모리 장치, 메모리 시스템 및 메모리 장치의 동작방법
KR20170055222A (ko) 2015-11-11 2017-05-19 삼성전자주식회사 리페어 단위 변경 기능을 가지는 메모리 장치 및 메모리 시스템
KR20170057704A (ko) 2015-11-17 2017-05-25 삼성전자주식회사 액세스 동작과 리프레쉬 동작의 충돌을 제어하는 메모리 장치 및 이를 포함하는 메모리 시스템
KR102432701B1 (ko) 2015-11-18 2022-08-16 에스케이하이닉스 주식회사 리프레시 액티브 제어회로 및 이를 포함하는 메모리 장치
KR20170060205A (ko) 2015-11-23 2017-06-01 에스케이하이닉스 주식회사 적층형 메모리 장치 및 이를 포함하는 반도체 메모리 시스템
US9754655B2 (en) 2015-11-24 2017-09-05 Qualcomm Incorporated Controlling a refresh mode of a dynamic random access memory (DRAM) die
US9865328B1 (en) 2015-12-04 2018-01-09 Integrated Device Technology, Inc. Nullifying incorrect sampled data contribution in decision feedback equalizer at restart of forwarded clock in memory system
US10048877B2 (en) 2015-12-21 2018-08-14 Intel Corporation Predictive memory maintenance
KR102399475B1 (ko) 2015-12-28 2022-05-18 삼성전자주식회사 리프레쉬 콘트롤러 및 이를 포함하는 메모리 장치
KR102352557B1 (ko) 2015-12-29 2022-01-20 에스케이하이닉스 주식회사 반도체 메모리 장치
KR102329673B1 (ko) 2016-01-25 2021-11-22 삼성전자주식회사 해머 리프레쉬 동작을 수행하는 메모리 장치 및 이를 포함하는 메모리 시스템
KR102709074B1 (ko) 2016-02-03 2024-09-26 삼성전자주식회사 리프레시 정보 생성기를 포함하는 휘발성 메모리 장치 및 전자 장치, 그것의 정보 제공 방법, 그리고 그것의 리프레시 제어 방법
US9928895B2 (en) 2016-02-03 2018-03-27 Samsung Electronics Co., Ltd. Volatile memory device and electronic device comprising refresh information generator, information providing method thereof, and refresh control method thereof
US10725677B2 (en) 2016-02-19 2020-07-28 Sandisk Technologies Llc Systems and methods for efficient power state transitions
US10268405B2 (en) 2016-03-17 2019-04-23 Mediatek, Inc. Dynamic rank switching for low power volatile memory
KR102403341B1 (ko) 2016-03-17 2022-06-02 에스케이하이닉스 주식회사 메모리 및 이를 포함하는 시스템
US9734887B1 (en) 2016-03-21 2017-08-15 International Business Machines Corporation Per-die based memory refresh control based on a master controller
JP2017182854A (ja) 2016-03-31 2017-10-05 マイクロン テクノロジー, インク. 半導体装置
KR102441031B1 (ko) 2016-04-01 2022-09-07 에스케이하이닉스 주식회사 리프레쉬 제어 장치 및 이를 포함하는 반도체 장치
US9741421B1 (en) 2016-04-05 2017-08-22 Micron Technology, Inc. Refresh circuitry
KR102439671B1 (ko) 2016-04-25 2022-09-02 에스케이하이닉스 주식회사 메모리 장치
US9576637B1 (en) 2016-05-25 2017-02-21 Advanced Micro Devices, Inc. Fine granularity refresh
KR102433093B1 (ko) 2016-06-01 2022-08-18 에스케이하이닉스 주식회사 리프레쉬 제어 장치 및 이를 포함하는 메모리 장치
KR102469065B1 (ko) 2016-06-03 2022-11-23 에스케이하이닉스 주식회사 메모리 장치
US9697913B1 (en) 2016-06-10 2017-07-04 Micron Technology, Inc. Ferroelectric memory cell recovery
KR20190028719A (ko) 2016-06-28 2019-03-19 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 발전기 및 모터용의, 에폭시 수지계 전기 절연 시스템
US9911484B2 (en) 2016-06-29 2018-03-06 Micron Technology, Inc. Oscillator controlled random sampling method and circuit
KR102550685B1 (ko) 2016-07-25 2023-07-04 에스케이하이닉스 주식회사 반도체장치
US10468087B2 (en) 2016-07-28 2019-11-05 Micron Technology, Inc. Apparatuses and methods for operations in a self-refresh state
US10354714B2 (en) 2016-08-23 2019-07-16 Micron Technology, Inc. Temperature-dependent refresh circuit configured to increase or decrease a count value of a refresh timer according to a self-refresh signal
KR102468728B1 (ko) 2016-08-23 2022-11-21 에스케이하이닉스 주식회사 리프레쉬 제어 회로, 반도체 메모리 장치 및 그의 동작 방법
KR102455027B1 (ko) 2016-09-05 2022-10-17 에스케이하이닉스 주식회사 리프레쉬 제어 장치 및 이를 포함하는 반도체 장치
KR20180028783A (ko) 2016-09-09 2018-03-19 삼성전자주식회사 커맨드 컨트롤러를 포함하는 메모리 장치
KR102632534B1 (ko) 2016-09-20 2024-02-05 에스케이하이닉스 주식회사 어드레스 디코더, 액티브 제어 회로 및 이를 포함하는 반도체 메모리
KR102436992B1 (ko) 2016-09-21 2022-08-29 에스케이하이닉스 주식회사 리프레시 제어 장치
KR102600320B1 (ko) 2016-09-26 2023-11-10 에스케이하이닉스 주식회사 리프레쉬 제어 장치
WO2018063308A1 (en) 2016-09-30 2018-04-05 Intel Corporation Two transistor, one resistor non-volatile gain cell memory and storage element
US20180096719A1 (en) 2016-09-30 2018-04-05 Intel Corporation Staggering initiation of refresh in a group of memory devices
US10381327B2 (en) 2016-10-06 2019-08-13 Sandisk Technologies Llc Non-volatile memory system with wide I/O memory die
KR102671073B1 (ko) 2016-10-06 2024-05-30 에스케이하이닉스 주식회사 반도체장치
US20180102776A1 (en) 2016-10-07 2018-04-12 Altera Corporation Methods and apparatus for managing application-specific power gating on multichip packages
KR102710360B1 (ko) 2016-10-17 2024-09-30 에스케이하이닉스 주식회사 메모리 장치
KR102710476B1 (ko) 2016-10-20 2024-09-26 에스케이하이닉스 주식회사 리프레쉬 타이밍 생성 회로, 리프레쉬 제어 회로 및 이를 포함하는 반도체 장치
EP3533058B1 (en) 2016-10-31 2021-09-22 Intel Corporation Applying chip select for memory device identification and power management control
KR20180049314A (ko) 2016-10-31 2018-05-11 에스케이하이닉스 주식회사 어드레스 카운팅 회로, 메모리 장치 및 메모리 장치의 동작 방법
US10249351B2 (en) 2016-11-06 2019-04-02 Intel Corporation Memory device with flexible internal data write control circuitry
US20180137005A1 (en) 2016-11-15 2018-05-17 Intel Corporation Increased redundancy in multi-device memory package to improve reliability
US9799391B1 (en) 2016-11-21 2017-10-24 Nanya Technology Corporation Dram circuit, redundant refresh circuit and refresh method
KR102699088B1 (ko) 2016-12-06 2024-08-26 삼성전자주식회사 해머 리프레쉬 동작을 수행하는 메모리 시스템
KR20180075761A (ko) 2016-12-26 2018-07-05 에스케이하이닉스 주식회사 메모리 장치, 이를 포함하는 메모리 시스템, 및, 그의 리프레시 동작방법
US9761297B1 (en) 2016-12-30 2017-09-12 Intel Corporation Hidden refresh control in dynamic random access memory
US10490251B2 (en) 2017-01-30 2019-11-26 Micron Technology, Inc. Apparatuses and methods for distributing row hammer refresh events across a memory device
US9805782B1 (en) 2017-02-02 2017-10-31 Elite Semiconductor Memory Technology Inc. Memory device capable of determining candidate wordline for refresh and control method thereof
KR20180092513A (ko) 2017-02-09 2018-08-20 에스케이하이닉스 주식회사 반도체장치
US10347333B2 (en) 2017-02-16 2019-07-09 Micron Technology, Inc. Efficient utilization of memory die area
KR102650497B1 (ko) 2017-02-28 2024-03-25 에스케이하이닉스 주식회사 적층형 반도체 장치
KR20180100804A (ko) 2017-03-02 2018-09-12 에스케이하이닉스 주식회사 반도체 장치 및 그의 구동 방법
US10020046B1 (en) 2017-03-03 2018-07-10 Micron Technology, Inc. Stack refresh control for memory device
KR20180102267A (ko) 2017-03-07 2018-09-17 에스케이하이닉스 주식회사 반도체장치 및 반도체시스템
US10198369B2 (en) 2017-03-24 2019-02-05 Advanced Micro Devices, Inc. Dynamic memory remapping to reduce row-buffer conflicts
US10545692B2 (en) 2017-04-04 2020-01-28 Sandisk Technologies Llc Memory maintenance operations during refresh window
KR20180114712A (ko) 2017-04-11 2018-10-19 에스케이하이닉스 주식회사 리프레쉬 컨트롤러 및 그를 포함하는 반도체 메모리 장치
JP6780897B2 (ja) 2017-04-14 2020-11-04 ホアウェイ・テクノロジーズ・カンパニー・リミテッド メモリリフレッシュ技術及びコンピュータシステム
US10192608B2 (en) 2017-05-23 2019-01-29 Micron Technology, Inc. Apparatuses and methods for detection refresh starvation of a memory
US10141042B1 (en) 2017-05-23 2018-11-27 Micron Technology, Inc. Method and apparatus for precharge and refresh control
US10452480B2 (en) 2017-05-25 2019-10-22 Micron Technology, Inc. Memory device with dynamic processing level calibration
JP6281030B1 (ja) 2017-08-02 2018-02-14 ゼンテルジャパン株式会社 半導体記憶装置
US10332582B2 (en) 2017-08-02 2019-06-25 Qualcomm Incorporated Partial refresh technique to save memory refresh power
US10310757B2 (en) 2017-08-23 2019-06-04 Qualcomm Incorporated Systems and methods for memory power saving via kernel steering to memory balloons
US10504580B2 (en) 2017-08-31 2019-12-10 Micron Technology, Inc. Systems and methods for refreshing a memory bank while accessing another memory bank using a shared address path
JP2019054200A (ja) 2017-09-19 2019-04-04 東芝メモリ株式会社 抵抗変化型メモリ
US10319437B2 (en) 2017-09-20 2019-06-11 Sandisk Technologies Llc Apparatus and method for identifying memory cells for data refresh based on monitor cell in a resistive memory device
CN109658961B (zh) 2017-10-12 2021-08-03 华邦电子股份有限公司 易失性存储器存储装置及其刷新方法
US10672449B2 (en) 2017-10-20 2020-06-02 Micron Technology, Inc. Apparatus and methods for refreshing memory
US10303398B2 (en) 2017-10-26 2019-05-28 Advanced Micro Devices, Inc. Swizzling in 3D stacked memory
KR102350957B1 (ko) 2017-10-26 2022-01-14 에스케이하이닉스 주식회사 메모리 시스템 및 메모리 시스템의 리프레시 제어 방법
US10170174B1 (en) 2017-10-27 2019-01-01 Micron Technology, Inc. Apparatus and methods for refreshing memory
KR102312178B1 (ko) 2017-10-30 2021-10-14 에스케이하이닉스 주식회사 트윈 셀 모드를 가지는 메모리 장치 및 그의 리프레쉬 방법
KR102341261B1 (ko) 2017-11-13 2021-12-20 삼성전자주식회사 매스비트 카운터를 포함하는 메모리 장치 및 그의 동작 방법
US20190161341A1 (en) 2017-11-28 2019-05-30 Micron Technology, Inc. Systems and methods for temperature sensor access in die stacks
US11004495B2 (en) 2017-12-18 2021-05-11 SK Hynix Inc. Data storage device and operating method thereof
KR102408867B1 (ko) 2017-12-20 2022-06-14 삼성전자주식회사 반도체 메모리 장치, 메모리 시스템 및 반도체 메모리 장치의 동작 방법
US11262921B2 (en) 2017-12-21 2022-03-01 Qualcomm Incorporated Partial area self refresh mode
US10431301B2 (en) 2017-12-22 2019-10-01 Micron Technology, Inc. Auto-referenced memory cell read techniques
US10679685B2 (en) 2017-12-27 2020-06-09 Spin Memory, Inc. Shared bit line array architecture for magnetoresistive memory
US10297307B1 (en) 2017-12-29 2019-05-21 Micron Technology, Inc. Methods for independent memory bank maintenance and memory devices and systems employing the same
US11237972B2 (en) 2017-12-29 2022-02-01 Advanced Micro Devices, Inc. Method and apparatus for controlling cache line storage in cache memory
US10580475B2 (en) 2018-01-22 2020-03-03 Micron Technology, Inc. Apparatuses and methods for calculating row hammer refresh addresses in a semiconductor device
US20190237132A1 (en) 2018-01-30 2019-08-01 Micron Technology, Inc. Semiconductor device performing row hammer refresh operation
KR102425614B1 (ko) 2018-03-07 2022-07-28 에스케이하이닉스 주식회사 리프레쉬 제어 회로, 반도체 메모리 장치 및 그의 리프레쉬 방법
JP6622843B2 (ja) 2018-04-19 2019-12-18 華邦電子股▲ふん▼有限公司Winbond Electronics Corp. メモリデバイス及びそのリフレッシュ方法
KR20190123875A (ko) 2018-04-25 2019-11-04 삼성전자주식회사 반도체 메모리 장치 및 이를 구비하는 메모리 시스템
US10497420B1 (en) 2018-05-08 2019-12-03 Micron Technology, Inc. Memory with internal refresh rate control
KR102358563B1 (ko) 2018-05-09 2022-02-04 삼성전자주식회사 로우 해머 핸들링과 함께 리프레쉬 동작을 수행하는 메모리 장치 및 이를 포함하는 메모리 시스템
KR102534631B1 (ko) 2018-05-11 2023-05-19 에스케이하이닉스 주식회사 카운팅 회로 블록을 포함하는 반도체 시스템
WO2019222960A1 (en) 2018-05-24 2019-11-28 Micron Technology, Inc. Apparatuses and methods for pure-time, self adopt sampling for row hammer refresh sampling
JP6709825B2 (ja) 2018-06-14 2020-06-17 華邦電子股▲ふん▼有限公司Winbond Electronics Corp. Dram及びその操作方法
US10536069B2 (en) 2018-06-15 2020-01-14 Ford Global Technologies, Llc Virtual resistance gate driver
US11152050B2 (en) 2018-06-19 2021-10-19 Micron Technology, Inc. Apparatuses and methods for multiple row hammer refresh address sequences
US10872652B2 (en) 2018-06-19 2020-12-22 Apple Inc. Method and apparatus for optimizing calibrations of a memory subsystem
KR102471414B1 (ko) 2018-06-19 2022-11-29 에스케이하이닉스 주식회사 반도체 장치
US10510396B1 (en) 2018-06-19 2019-12-17 Apple Inc. Method and apparatus for interrupting memory bank refresh
JP2020003838A (ja) 2018-06-25 2020-01-09 キオクシア株式会社 メモリシステム
US10573370B2 (en) 2018-07-02 2020-02-25 Micron Technology, Inc. Apparatus and methods for triggering row hammer address sampling
KR102479500B1 (ko) 2018-08-09 2022-12-20 에스케이하이닉스 주식회사 메모리 장치, 메모리 시스템 및 그 메모리 장치의 리프레시 방법
US10490250B1 (en) 2018-08-14 2019-11-26 Micron Technology, Inc. Apparatuses for refreshing memory of a semiconductor device
US10468076B1 (en) 2018-08-17 2019-11-05 Micron Technology, Inc. Redundancy area refresh rate increase
TWI676180B (zh) 2018-09-04 2019-11-01 華邦電子股份有限公司 記憶體裝置以及虛擬靜態隨機存取記憶體之刷新方法
US10572377B1 (en) 2018-09-19 2020-02-25 Micron Technology, Inc. Row hammer refresh for content addressable memory devices
US10923171B2 (en) 2018-10-17 2021-02-16 Micron Technology, Inc. Semiconductor device performing refresh operation in deep sleep mode
US10685696B2 (en) 2018-10-31 2020-06-16 Micron Technology, Inc. Apparatuses and methods for access based refresh timing
US10636476B2 (en) 2018-11-01 2020-04-28 Intel Corporation Row hammer mitigation with randomization of target row selection
US10504577B1 (en) 2018-11-05 2019-12-10 Micron Technology, Inc. Apparatus with a row hit rate/refresh management mechanism
CN113168861B (zh) 2018-12-03 2024-05-14 美光科技公司 执行行锤刷新操作的半导体装置
KR20200068942A (ko) 2018-12-06 2020-06-16 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그의 동작 방법
US10790004B2 (en) 2018-12-12 2020-09-29 Micron Technology, Inc. Apparatuses and methods for multi-bank and multi-pump refresh operations
CN111354393B (zh) 2018-12-21 2023-10-20 美光科技公司 用于目标刷新操作的时序交错的设备和方法
US10957377B2 (en) 2018-12-26 2021-03-23 Micron Technology, Inc. Apparatuses and methods for distributed targeted refresh operations
US10943637B2 (en) 2018-12-27 2021-03-09 Micron Technology, Inc. Apparatus with a row-hammer address latch mechanism
US10817371B2 (en) 2018-12-31 2020-10-27 Micron Technology, Inc. Error correction in row hammer mitigation and target row refresh
US11615831B2 (en) 2019-02-26 2023-03-28 Micron Technology, Inc. Apparatuses and methods for memory mat refresh sequencing
US10950288B2 (en) 2019-03-29 2021-03-16 Intel Corporation Refresh command control for host assist of row hammer mitigation
US11227649B2 (en) 2019-04-04 2022-01-18 Micron Technology, Inc. Apparatuses and methods for staggered timing of targeted refresh operations
US10790005B1 (en) 2019-04-26 2020-09-29 Micron Technology, Inc. Techniques for reducing row hammer refresh
US11158364B2 (en) 2019-05-31 2021-10-26 Micron Technology, Inc. Apparatuses and methods for tracking victim rows
US11069393B2 (en) 2019-06-04 2021-07-20 Micron Technology, Inc. Apparatuses and methods for controlling steal rates
US10978132B2 (en) 2019-06-05 2021-04-13 Micron Technology, Inc. Apparatuses and methods for staggered timing of skipped refresh operations
US10832792B1 (en) 2019-07-01 2020-11-10 Micron Technology, Inc. Apparatuses and methods for adjusting victim data
US11386946B2 (en) * 2019-07-16 2022-07-12 Micron Technology, Inc. Apparatuses and methods for tracking row accesses
US10943636B1 (en) 2019-08-20 2021-03-09 Micron Technology, Inc. Apparatuses and methods for analog row access tracking
US10964378B2 (en) 2019-08-22 2021-03-30 Micron Technology, Inc. Apparatus and method including analog accumulator for determining row access rate and target row address used for refresh operation
US11302374B2 (en) 2019-08-23 2022-04-12 Micron Technology, Inc. Apparatuses and methods for dynamic refresh allocation
US11302377B2 (en) 2019-10-16 2022-04-12 Micron Technology, Inc. Apparatuses and methods for dynamic targeted refresh steals
TWI737140B (zh) 2020-01-22 2021-08-21 緯創資通股份有限公司 檢測裝置
US20210406170A1 (en) 2020-06-24 2021-12-30 MemRay Corporation Flash-Based Coprocessor
US11309010B2 (en) 2020-08-14 2022-04-19 Micron Technology, Inc. Apparatuses, systems, and methods for memory directed access pause
US11348631B2 (en) 2020-08-19 2022-05-31 Micron Technology, Inc. Apparatuses, systems, and methods for identifying victim rows in a memory device which cannot be simultaneously refreshed
US11380382B2 (en) 2020-08-19 2022-07-05 Micron Technology, Inc. Refresh logic circuit layout having aggressor detector circuit sampling circuit and row hammer refresh control circuit
US11417384B2 (en) 2020-08-27 2022-08-16 Micron Technology, Inc. Apparatuses and methods for control of refresh operations
US11809743B2 (en) * 2020-09-21 2023-11-07 Advanced Micro Devices, Inc. Refresh management list for DRAM
US11557331B2 (en) 2020-09-23 2023-01-17 Micron Technology, Inc. Apparatuses and methods for controlling refresh operations
US11222686B1 (en) 2020-11-12 2022-01-11 Micron Technology, Inc. Apparatuses and methods for controlling refresh timing
US11688454B2 (en) * 2020-12-10 2023-06-27 SK Hynix Inc. Semiconductor memory device and memory system including the same
US11264079B1 (en) 2020-12-18 2022-03-01 Micron Technology, Inc. Apparatuses and methods for row hammer based cache lockdown
US12099388B2 (en) * 2020-12-22 2024-09-24 Intel Corporation Temperature-based runtime variability in victim address selection for probabilistic schemes for row hammer
US12112787B2 (en) 2022-04-28 2024-10-08 Micron Technology, Inc. Apparatuses and methods for access based targeted refresh operations

Also Published As

Publication number Publication date
US12112787B2 (en) 2024-10-08
US20230352076A1 (en) 2023-11-02

Similar Documents

Publication Publication Date Title
US11984148B2 (en) Apparatuses and methods for tracking victim rows
US12002501B2 (en) Apparatuses and methods for distributed targeted refresh operations
US11798610B2 (en) Apparatuses and methods for controlling steal rates
US11955158B2 (en) Apparatuses and methods for access based refresh timing
US11257535B2 (en) Apparatuses and methods for managing row access counts
US11424005B2 (en) Apparatuses and methods for adjusting victim data
US11749331B2 (en) Refresh modes for performing various refresh operation types
US11380382B2 (en) Refresh logic circuit layout having aggressor detector circuit sampling circuit and row hammer refresh control circuit
CN112242160A (zh) 用于跟踪行存取的设备和方法
US12112787B2 (en) Apparatuses and methods for access based targeted refresh operations
US11482275B2 (en) Apparatuses and methods for dynamically allocated aggressor detection
CN116264090A (zh) 用于1t和2t存储器单元架构的设备和方法
KR102711894B1 (ko) 스틸 속도를 제어하기 위한 장치 및 방법
US12125514B2 (en) Apparatuses and methods for access based refresh operations
US20230352075A1 (en) Apparatuses and methods for access based refresh operations

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication