JP5104864B2 - 半導体記憶装置及びシステム - Google Patents
半導体記憶装置及びシステム Download PDFInfo
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- JP5104864B2 JP5104864B2 JP2009522477A JP2009522477A JP5104864B2 JP 5104864 B2 JP5104864 B2 JP 5104864B2 JP 2009522477 A JP2009522477 A JP 2009522477A JP 2009522477 A JP2009522477 A JP 2009522477A JP 5104864 B2 JP5104864 B2 JP 5104864B2
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- 239000004065 semiconductor Substances 0.000 title claims description 46
- 230000004044 response Effects 0.000 claims description 19
- 230000002950 deficient Effects 0.000 claims description 12
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims description 9
- 230000000644 propagated effect Effects 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 77
- 238000010586 diagram Methods 0.000 description 11
- 230000010355 oscillation Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 238000003491 array Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- 230000001360 synchronised effect Effects 0.000 description 1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/24—Accessing extra cells, e.g. dummy cells or redundant cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/406—Management or control of the refreshing or charge-regeneration cycles
- G11C11/40615—Internal triggering or timing of refresh, e.g. hidden refresh, self refresh, pseudo-SRAMs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/408—Address circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/783—Masking faults in memories by using spares or by reconfiguring using programmable devices with refresh of replacement cells, e.g. in DRAMs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C2029/1202—Word line control
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
Description
11 コマンドデコーダ
12 コア制御回路
13 テストモード設定回路
14 アドレス入力バッファ
15 リフレッシュアドレスカウンタ
16 アドレス生成ユニット
17 データ入出力バッファ
18 コア回路
19 オシレータ
20 セル配列
21 冗長制御部
22 ワードデコーダ
23 センスアンプ
24 コラムデコーダ
25 リードライトアンプ
30 フューズ回路
31 アドレス比較部
32 冗長判定回路部
33 プリデコーダ
34 実ワードデコーダ
35 冗長ワードデコーダ
Claims (8)
- 実ワード線及び冗長ワード線を含むメモリセル配列と、
一定時間間隔で並ぶパルスから構成されるリフレッシュタイミング信号を生成するよう構成されるタイミング信号生成回路と、
該リフレッシュタイミング信号の各パルスに応答して該実ワード線及び該冗長ワード線の全てを一本ずつ順次選択するよう構成されるリフレッシュ対象選択回路と、
該タイミング信号生成回路が生成する該リフレッシュタイミング信号のパルス間隔を制御する制御回路
を含み、該リフレッシュ対象選択回路が順次選択したワード線に対してリフレッシュ動作を実行し、
該リフレッシュ対象選択回路は、該実ワード線の本数に等しい数のワード線のみを一本ずつ順次選択する第1のモードと、該実ワード線及び該冗長ワード線の全てを一本ずつ順次選択する第2のモードとを切り替え可能に構成され、
該制御回路は、該第1のモードでは該パルス間隔を第1の間隔に設定し、該第2のモードでは該パルス間隔を該第1の間隔よりも狭い第2の間隔に設定するよう構成される
ことを特徴とする半導体記憶装置。 - 強制冗長指示信号がネゲート状態の場合、冗長アドレスが有効設定されているならばアクセス先を示すアドレスと有効設定された冗長アドレスとの一致又は不一致に応じて該アクセス先を示すアドレスに対応する冗長ワード線又は実ワード線を選択し、冗長アドレスが有効設定されていないならばアクセス先を示すアドレスに対応する実ワード線を選択し、該強制冗長指示信号がアサート状態の場合には該アクセス先を示すアドレスに対応する冗長ワード線又は実ワード線を選択する冗長制御回路を更に含み、
該リフレッシュ対象選択回路はリフレッシュ対象のワード線アドレスを生成するリフレッシュアドレス生成回路であり、該強制冗長指示信号をネゲート状態に設定してワード線アドレスを順次生成する第1の動作と、該強制冗長指示信号をアサート状態に設定してワード線アドレスを順次生成する第2の動作とを実行するよう構成されることを特徴とする請求項1記載の半導体記憶装置。 - 該リフレッシュ対象選択回路は、該第1のモードでは該第1の動作のみを実行し、該第2のモードでは該第1の動作の後に引き続いて該第2の動作を実行するよう構成されることを特徴とする請求項2記載の半導体記憶装置。
- 該リフレッシュ対象選択回路は、
該第1の動作時に活性化され該実ワード線の本数に等しい数のワード線アドレスを生成する第1のカウンタと、
該第2の動作時に活性化され該冗長ワード線の本数に等しい数のワード線アドレスを生成する第2のカウンタと、
該強制冗長指示信号を制御するとともに該第1のカウンタと該第2のカウンタとを選択的に活性化する切り替え回路
を含むことを特徴とする請求項2記載の半導体記憶装置。 - 該リフレッシュ対象選択回路は、
ワード線アドレスを生成するカウンタと、
該強制冗長指示信号を制御するとともに、該第1の動作において該カウンタに該実ワード線の本数に等しい数のワード線アドレスを生成させ、該第2の動作において該カウンタに該冗長ワード線の本数に等しい数のワード線アドレスを生成させる切り替え回路
を含むことを特徴とする請求項2記載の半導体記憶装置。 - 該リフレッシュ対象選択回路は、複数の該実ワード線及び該冗長ワード線に対して一対一に設けられ、リフレッシュ対象であるワード線を指し示すデータを順次シフト動作により伝搬させる複数のシフトレジスタを含み、該第2のモードにおいて該複数のシフトレジスタの全てに該データを順次伝搬させ、該第1のモードにおいて該複数のシフトレジスタのうちで該実使用されるワード線に対応するもののみに該データを順次伝搬させるよう構成されることを特徴とする請求項1記載の半導体記憶装置。
- 複数の該実ワード線及び該冗長ワード線に一対一に対応して設けられる複数のワード線ドライバと、
複数のワード線デコーダと、
該実ワード線のうちで欠陥のあるワード線に対応する該ワード線ドライバを避けながら該複数のワード線デコーダを該複数のワード線ドライバに対応づけるシフト情報生成回路
を更に含むことを特徴とする請求項6記載の半導体記憶装置。 - CPUと、
メモリ
を含むシステムであって、該メモリは、
実ワード線及び冗長ワード線を含むメモリセル配列と、
一定時間間隔で並ぶパルスから構成されるリフレッシュタイミング信号を生成するよう構成されるタイミング信号生成回路と、
該リフレッシュタイミング信号の各パルスに応答して該実ワード線及び該冗長ワード線の全てを一本ずつ順次選択するよう構成されるリフレッシュ対象選択回路と、
該タイミング信号生成回路が生成する該リフレッシュタイミング信号のパルス間隔を制御する制御回路
を含み、該リフレッシュ対象選択回路が順次選択したワード線に対してリフレッシュ動作を実行し、
該リフレッシュ対象選択回路は、該実ワード線の本数に等しい数のワード線のみを一本ずつ順次選択する第1のモードと、該実ワード線及び該冗長ワード線の全てを一本ずつ順次選択する第2のモードとを切り替え可能に構成され、
該制御回路は、該第1のモードでは該パルス間隔を第1の間隔に設定し、該第2のモードでは該パルス間隔を該第1の間隔よりも狭い第2の間隔に設定するよう構成される
ことを特徴とするシステム。
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PCT/JP2007/063856 WO2009008079A1 (ja) | 2007-07-11 | 2007-07-11 | 半導体記憶装置及びシステム |
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US (1) | US8184493B2 (ja) |
JP (1) | JP5104864B2 (ja) |
KR (1) | KR101095222B1 (ja) |
WO (1) | WO2009008079A1 (ja) |
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JPH10269797A (ja) * | 1997-03-25 | 1998-10-09 | Mitsubishi Electric Corp | 半導体記憶装置及び半導体記憶装置の欠陥救済方法 |
JPH11250694A (ja) * | 1998-02-26 | 1999-09-17 | Hitachi Ltd | 半導体記憶装置 |
JP2000357398A (ja) * | 1999-05-04 | 2000-12-26 | Samsung Electronics Co Ltd | 外部アドレスにより自動リフレッシュ動作が行えるテストモードを有する同期式dram及び自動リフレッシュ方法 |
JP2002025291A (ja) * | 2000-07-07 | 2002-01-25 | Mitsubishi Electric Corp | 半導体記憶装置 |
JP2002124096A (ja) * | 2000-10-13 | 2002-04-26 | Nec Corp | 半導体記憶装置及びその試験方法 |
JP2003045178A (ja) * | 2001-07-31 | 2003-02-14 | Hitachi Ltd | 半導体メモリ |
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JPH09293394A (ja) | 1996-04-26 | 1997-11-11 | Fujitsu Ltd | 半導体記憶装置 |
JP3863313B2 (ja) * | 1999-03-19 | 2006-12-27 | 富士通株式会社 | 半導体記憶装置 |
KR100465597B1 (ko) * | 2001-12-07 | 2005-01-13 | 주식회사 하이닉스반도체 | 반도체 메모리 소자의 리프레쉬장치 및 그것의 리프레쉬방법 |
KR100668510B1 (ko) * | 2005-06-30 | 2007-01-12 | 주식회사 하이닉스반도체 | 반도체 메모리 장치 |
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JPH05109268A (ja) * | 1991-10-14 | 1993-04-30 | Sharp Corp | ダイナミツク型半導体記憶装置 |
JPH08147995A (ja) * | 1994-11-22 | 1996-06-07 | Nec Corp | 半導体記憶装置 |
JPH10172297A (ja) * | 1996-12-09 | 1998-06-26 | Fujitsu Ltd | 半導体記憶装置及び半導体記憶装置の試験方法 |
JPH10269797A (ja) * | 1997-03-25 | 1998-10-09 | Mitsubishi Electric Corp | 半導体記憶装置及び半導体記憶装置の欠陥救済方法 |
JPH11250694A (ja) * | 1998-02-26 | 1999-09-17 | Hitachi Ltd | 半導体記憶装置 |
JP2000357398A (ja) * | 1999-05-04 | 2000-12-26 | Samsung Electronics Co Ltd | 外部アドレスにより自動リフレッシュ動作が行えるテストモードを有する同期式dram及び自動リフレッシュ方法 |
JP2002025291A (ja) * | 2000-07-07 | 2002-01-25 | Mitsubishi Electric Corp | 半導体記憶装置 |
JP2002124096A (ja) * | 2000-10-13 | 2002-04-26 | Nec Corp | 半導体記憶装置及びその試験方法 |
JP2003045178A (ja) * | 2001-07-31 | 2003-02-14 | Hitachi Ltd | 半導体メモリ |
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KR20100028096A (ko) | 2010-03-11 |
US8184493B2 (en) | 2012-05-22 |
US20100110810A1 (en) | 2010-05-06 |
WO2009008079A1 (ja) | 2009-01-15 |
JPWO2009008079A1 (ja) | 2010-09-02 |
KR101095222B1 (ko) | 2011-12-20 |
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