CN102408542B - 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置 - Google Patents
光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置 Download PDFInfo
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- CN102408542B CN102408542B CN201110309724.0A CN201110309724A CN102408542B CN 102408542 B CN102408542 B CN 102408542B CN 201110309724 A CN201110309724 A CN 201110309724A CN 102408542 B CN102408542 B CN 102408542B
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- optical semiconductor
- resin composition
- luminous reflectance
- hot curing
- curing resin
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- 230000000704 physical effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- Injection Moulding Of Plastics Or The Like (AREA)
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Abstract
Description
Claims (8)
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CN201110309972.5A Active CN102516712B (zh) | 2006-11-15 | 2007-11-14 | 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置 |
CN201110309960.2A Active CN102408541B (zh) | 2006-11-15 | 2007-11-14 | 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置 |
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CN201110309968.9A Active CN102408543B (zh) | 2006-11-15 | 2007-11-14 | 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置 |
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CN201110309960.2A Active CN102408541B (zh) | 2006-11-15 | 2007-11-14 | 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置 |
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