JP6365606B2 - 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置 Download PDF

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JP6365606B2
JP6365606B2 JP2016147434A JP2016147434A JP6365606B2 JP 6365606 B2 JP6365606 B2 JP 6365606B2 JP 2016147434 A JP2016147434 A JP 2016147434A JP 2016147434 A JP2016147434 A JP 2016147434A JP 6365606 B2 JP6365606 B2 JP 6365606B2
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resin composition
light reflecting
optical semiconductor
thermosetting light
molding
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JP2017020026A (ja
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勇人 小谷
勇人 小谷
直之 浦崎
直之 浦崎
加奈子 湯浅
加奈子 湯浅
晃 永井
永井  晃
光祥 濱田
光祥 濱田
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日立化成株式会社
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