WO2009031495A1 - 蛍光体及びその製造方法、並びにそれを用いた発光装置 - Google Patents

蛍光体及びその製造方法、並びにそれを用いた発光装置 Download PDF

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Publication number
WO2009031495A1
WO2009031495A1 PCT/JP2008/065668 JP2008065668W WO2009031495A1 WO 2009031495 A1 WO2009031495 A1 WO 2009031495A1 JP 2008065668 W JP2008065668 W JP 2008065668W WO 2009031495 A1 WO2009031495 A1 WO 2009031495A1
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WIPO (PCT)
Prior art keywords
same
phosphor
producing
light
emitting device
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PCT/JP2008/065668
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English (en)
French (fr)
Inventor
Kousuke Shioi
Naoto Hirosaki
Hisayuki Miki
Original Assignee
Showa Denko K.K.
National Institute For Materials Science
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Application filed by Showa Denko K.K., National Institute For Materials Science filed Critical Showa Denko K.K.
Priority to EP08829849.2A priority Critical patent/EP2189509B1/en
Priority to CN2008801052608A priority patent/CN101796157B/zh
Priority to US12/676,094 priority patent/US8398892B2/en
Publication of WO2009031495A1 publication Critical patent/WO2009031495A1/ja
Priority to US13/765,602 priority patent/US8608980B2/en

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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • C09K11/592—Chalcogenides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)

Abstract

　本発明は、一般式Ｍ（０）ａＭ（１）ｂＭ（２）ｘ－（ｖｍ＋ｎ）Ｍ（３）（ｖｍ＋ｎ）－ｙＯｎＮｚ－ｎで示される組成の蛍光材料を有する蛍光体であって、Ｍ（０）はＬｉ、Ｎａ，Ｂｅ，Ｍｇ，Ｃａ，Ｓｒ，Ｂａ，Ｓｃ，Ｙ，Ｌａ，Ｇｄ，Ｌｕから選ばれ、Ｍ（１）はＭｎ，Ｃｅ，Ｐｒ，Ｎｄ，Ｓｍ，Ｅｕ，Ｔｂ，Ｄｙ，Ｈｏ，Ｅｒ，Ｔｍ，Ｙｂから選ばれ、Ｍ（２）はＳｉ，Ｇｅ，Ｓｎ，Ｔｉ，Ｈｆ，Ｚｒから選ばれ、Ｍ（３はＢｅ，Ｂ，Ａｌ，Ｇａ，Ｉｎ，Ｔｌ，Ｚｎから選ばれ、Ｏは酸素であり、Ｎは窒素であり、３３≦ｘ≦５１，８≦ｙ≦１２，３６≦ｚ≦５６、３≦ａ＋ｂ≦７、０．００１≦ｂ≦１．２、ｍｅ＝ａ＋ｂ、０．８・ｍｅ≦ｍ≦１．２・ｍｅ、０≦ｎ≦７、ｖ＝｛ａ・ｖ（０）＋ｂ・ｖ（１）｝／（ａ＋ｂ）のすべてを満たすことを特徴とする蛍光体に関する。さらに、本発明は、該蛍光体の製造方法、及び該蛍光体を用いた発光装置に関する。
PCT/JP2008/065668 2007-09-03 2008-09-01 蛍光体及びその製造方法、並びにそれを用いた発光装置 WO2009031495A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08829849.2A EP2189509B1 (en) 2007-09-03 2008-09-01 Phosphor, method for producing the same, and light-emitting device using the same
CN2008801052608A CN101796157B (zh) 2007-09-03 2008-09-01 荧光体和其制造方法、以及使用该荧光体的发光装置
US12/676,094 US8398892B2 (en) 2007-09-03 2008-09-01 Phosphor, method for producing the same and light-emitting device using the same
US13/765,602 US8608980B2 (en) 2007-09-03 2013-02-12 Phosphor, method for producing the same and light-emitting device using the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-228243 2007-09-03
JP2007228243 2007-09-03
JP2008118949 2008-04-30
JP2008-118949 2008-04-30
JP2008214366A JP5578597B2 (ja) 2007-09-03 2008-08-22 蛍光体及びその製造方法、並びにそれを用いた発光装置
JP2008-214366 2008-08-22

Related Child Applications (2)

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US12/676,094 A-371-Of-International US8398892B2 (en) 2007-09-03 2008-09-01 Phosphor, method for producing the same and light-emitting device using the same
US13/765,602 Division US8608980B2 (en) 2007-09-03 2013-02-12 Phosphor, method for producing the same and light-emitting device using the same

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US (2) US8398892B2 (ja)
EP (1) EP2189509B1 (ja)
JP (1) JP5578597B2 (ja)
KR (1) KR101216923B1 (ja)
CN (1) CN101796157B (ja)
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WO2011016486A1 (ja) * 2009-08-06 2011-02-10 昭和電工株式会社 蛍光体及びその製造方法、並びにそれを用いた発光装置
WO2011024882A1 (ja) * 2009-08-31 2011-03-03 シャープ株式会社 液晶表示装置
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JP2012527110A (ja) * 2009-05-11 2012-11-01 セミエルイーディーズ オプトエレクトロニクス カンパニー リミテッド 光抽出粗面構造を有するｌｅｄ装置及びその製造方法
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CN105199721A (zh) * 2015-09-23 2015-12-30 江苏博睿光电有限公司 一种用于液晶背光源的氮氧化物荧光粉及其制备方法
CN105529392A (zh) * 2010-06-22 2016-04-27 欧司朗光电半导体有限公司 半导体器件和用于制造半导体器件的方法
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JP5319743B2 (ja) * 2010-09-08 2013-10-16 株式会社東芝 発光装置
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JP2012131999A (ja) * 2010-12-02 2012-07-12 Niigata Univ 結晶性物質、並びにそれを用いた発光装置及び白色ｌｅｄ
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US20100200874A1 (en) 2010-08-12
EP2189509A1 (en) 2010-05-26
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JP2009286995A (ja) 2009-12-10
JP5578597B2 (ja) 2014-08-27
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