WO2008132954A1 - 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、照明装置、画像表示装置、並びに窒素含有化合物 - Google Patents

蛍光体及びその製造方法、蛍光体含有組成物、発光装置、照明装置、画像表示装置、並びに窒素含有化合物 Download PDF

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Publication number
WO2008132954A1
WO2008132954A1 PCT/JP2008/056673 JP2008056673W WO2008132954A1 WO 2008132954 A1 WO2008132954 A1 WO 2008132954A1 JP 2008056673 W JP2008056673 W JP 2008056673W WO 2008132954 A1 WO2008132954 A1 WO 2008132954A1
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Prior art keywords
phosphor
nitrogen
producing
image display
light
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PCT/JP2008/056673
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English (en)
French (fr)
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Takatoshi Seto
Naoto Kijima
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Mitsubishi Chemical Corporation
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Application filed by Mitsubishi Chemical Corporation filed Critical Mitsubishi Chemical Corporation
Priority to CN200880012510.3A priority Critical patent/CN101663372B/zh
Priority to EP08739780.8A priority patent/EP2141216B1/en
Publication of WO2008132954A1 publication Critical patent/WO2008132954A1/ja
Priority to US12/588,519 priority patent/US8398890B2/en
Priority to US13/842,220 priority patent/US8992797B2/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77747—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77748—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Ceramic Products (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)

Abstract

　発する蛍光が赤色成分を多く含み、半値幅の広い新たな蛍光体を提供するため、蛍光体に式［Ｉ］で表される結晶相を含有させる。 　Ｒ３－ｘ－ｙ－ｚ＋ｗ２ＭｚＡ１．５ｘ＋ｙ－ｗ２Ｓｉ６－ｗ１－ｗ２Ａｌｗ１＋ｗ２Ｏｙ＋ｗ１Ｎ１１－ｙ－ｗ１　[Ｉ] （ＲはＬａ、Ｇｄ、Ｌｕ、Ｙ及び／又はＳｃを示し、ＭはＣｅ、Ｅｕ、Ｍｎ、Ｙｂ、Ｐｒ及び／又はＴｂを示し、ＡはＢａ、Ｓｒ、Ｃａ、Ｍｇ及び／又はＺｎを示し、ｘ、ｙ、ｚ、ｗ１及びｗ２は以下の範囲の数値を示す。 （１／７）≦（３－ｘ－ｙ－ｚ＋ｗ２）／６＜（１／２）、 ０＜（１．５ｘ＋ｙ－ｗ２）／６＜（９／２）、 ０＜ｘ＜３、 ０≦ｙ＜２、 ０＜ｚ＜１、 ０≦ｗ１≦５、 ０≦ｗ２≦５、０≦ｗ１＋ｗ２≦５）
PCT/JP2008/056673 2007-04-18 2008-04-03 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、照明装置、画像表示装置、並びに窒素含有化合物 WO2008132954A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880012510.3A CN101663372B (zh) 2007-04-18 2008-04-03 荧光体及其制造方法、含荧光体组合物、发光装置、照明装置、图像显示装置以及含氮化合物
EP08739780.8A EP2141216B1 (en) 2007-04-18 2008-04-03 Phosphor and method for producing the same, phosphor-containing composition, light-emitting device, illuminating device, image display device, and nitrogen-containing compound
US12/588,519 US8398890B2 (en) 2007-04-18 2009-10-19 Phosphor and production method thereof, phosphor-containing composition, light emitting device, illuminating device, display, and nitrogen-containing compound
US13/842,220 US8992797B2 (en) 2007-04-18 2013-03-15 Phosphor and production method thereof, phosphor-containing composition, light emitting device, illuminating device, display, and nitrogen-containing compound

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-109270 2007-04-18
JP2007109270 2007-04-18

Related Child Applications (1)

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US12/588,519 Continuation-In-Part US8398890B2 (en) 2007-04-18 2009-10-19 Phosphor and production method thereof, phosphor-containing composition, light emitting device, illuminating device, display, and nitrogen-containing compound

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US (2) US8398890B2 (ja)
EP (1) EP2141216B1 (ja)
JP (2) JP4466757B2 (ja)
KR (1) KR101260101B1 (ja)
CN (2) CN101663372B (ja)
WO (1) WO2008132954A1 (ja)

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WO2010114061A1 (ja) 2009-03-31 2010-10-07 三菱化学株式会社 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
WO2013073598A1 (ja) 2011-11-15 2013-05-23 三菱化学株式会社 窒化物蛍光体とその製造方法
JP2013112804A (ja) * 2011-11-30 2013-06-10 Mitsubishi Chemicals Corp 窒化物蛍光体とその製造方法
JP2013112803A (ja) * 2011-11-30 2013-06-10 Mitsubishi Chemicals Corp 窒化物蛍光体とその製造方法
JP2013127061A (ja) * 2011-11-15 2013-06-27 Mitsubishi Chemicals Corp 窒化物蛍光体とその製造方法
JP2013127060A (ja) * 2011-11-15 2013-06-27 Mitsubishi Chemicals Corp 水分吸着した窒化物蛍光体とその製造方法
CN103184049A (zh) * 2011-12-28 2013-07-03 湖南信多利新材料有限公司 一种氮化物荧光粉的制备方法及其设备
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US20130234588A1 (en) 2013-09-12
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