WO2011002087A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- WO2011002087A1 WO2011002087A1 PCT/JP2010/061345 JP2010061345W WO2011002087A1 WO 2011002087 A1 WO2011002087 A1 WO 2011002087A1 JP 2010061345 W JP2010061345 W JP 2010061345W WO 2011002087 A1 WO2011002087 A1 WO 2011002087A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77217—Silicon Nitrides or Silicon Oxynitrides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77218—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Definitions
- Patent Document 1 since a green phosphor and an orange phosphor are combined and the emission spectrum matches human visibility, it is compared with a configuration in which a red phosphor is combined with a blue LED and a yellow phosphor. High luminous efficiency.
- the present invention has been made in view of the above problems, and an object thereof is to provide a light emitting device that emits light having high luminous efficiency and high color rendering properties.
- the light emitting device includes a semiconductor light emitting element that emits blue light, a green phosphor that absorbs the blue light and emits green light, and an orange that absorbs the blue light and emits orange light.
- the emission spectrum of the fluorescence emitted from the green phosphor and the orange phosphor has a peak wavelength in the range of 540 nm to 565 nm, the emission intensity at the peak wavelength is PI (MAX), and the peak When the emission intensity at a wavelength 90 nm longer than the wavelength is PI (90), the following relationship is set: 0.70> PI (90) / PI (MAX)> 0.55 It is characterized by satisfying.
- 10 is a graph showing an emission spectrum of the light emitting device manufactured in Example 7.
- 10 is a graph showing an emission spectrum of the light emitting device manufactured in Example 8.
- 6 is a graph showing an emission spectrum of the light emitting device manufactured in Comparative Example 1.
- 6 is a graph showing an emission spectrum of a light emitting device manufactured in Comparative Example 2. It is a graph which shows the relationship between Ra and PI (90) / PI (MAX) of a semiconductor light-emitting device. It is a graph which shows the relationship between R9 and PI (90) / PI (MAX) of a semiconductor light-emitting device.
- 4 is a graph showing the relationship between Ra and PI ( ⁇ 35) / PI (MAX) in a semiconductor light emitting device.
- the “green phosphor” is a substance that emits green light when excited by the blue light
- the “orange phosphor” is a substance that emits yellow orange light when excited by the blue light. means.
- the semiconductor light emitting device 1 according to the present embodiment is not limited to the structure shown in FIG. 1, and a conventionally known general semiconductor light emitting device structure can be adopted.
- the peak wavelength of the emission spectrum is in the above range, the emission intensity near 555 nm, which has the highest human visibility, is increased, and as a result, a light emitting device with high emission efficiency can be realized.
- the fluorescence spectrum of the fluorescence emitted from the phosphor satisfies PI ( ⁇ 35) / PI (MAX) ⁇ 0.60 as described above, and is shown in FIG.
- the emission spectrum has a valley where the intensity changes sharply between the blue region and the green region.
- the semiconductor light emitting element 2 is a light emitting diode (LED).
- the semiconductor light emitting element 2 is not limited to a light emitting diode (LED), but a semiconductor laser, an inorganic EL (A conventionally known element that emits blue light, such as an electroluminescence element, can be used.
- a commercially available product such as manufactured by Cree can be used.
- the orange phosphor 13 When the absorption rate of the orange phosphor 13 satisfies the above conditions, the orange phosphor 13 sufficiently suppresses the absorption of green light, and a light emitting device with higher luminous efficiency can be realized.
- the orange phosphor 13 is not particularly limited as long as it is an orange phosphor exhibiting an emission spectrum with the above peak wavelength and half width, but is preferably a Ce activated phosphor activated by Ce. This is because Ce has a large ground level splitting, so the Ce-activated phosphor exhibits a wide emission spectrum.
- a Ce-activated nitride phosphor or a Ce-activated oxynitride phosphor can be suitably used as the Ce-activated phosphor.
- Nitride-based phosphors and oxynitride-based phosphors for example, have a stronger matrix covalent bond than oxide-based phosphors and sulfide-based phosphors. However, the emission intensity is unlikely to decrease.
- the orange phosphor has the following general formula (1) (1-a-b) (Ln ′ p M (II) ′ (1-p) M (III) ′ M (IV) ′ N 3 ) ⁇ a (M (IV) ′ (3n + 2) / 4 N n O) ⁇ b (A ⁇ M (IV) ′ 2 N 3 ) (1)
- Ln ′ is at least one metal element selected from the group consisting of lanthanoids, Mn and Ti
- M (II) ′ is one or more elements selected from the group consisting of divalent metal elements other than the Ln ′ element
- M (III) ′ is one or more elements selected from the group consisting of trivalent metal elements
- M (IV) ′ is one or more elements selected from the group consisting of tetravalent metal elements
- A is one or more monovalent metal elements selected from the group consisting of Li, Na, and K
- p is a number satisfying 0 ⁇ p ⁇ 0.2; a, b
- p is 0 ⁇ p ⁇ 0.2, more preferably 0.005 ⁇ p ⁇ 0.1, and a is 0 ⁇ a ⁇ 0.45.
- 0 ⁇ a ⁇ 0.3 is preferable, 0.002 ⁇ a ⁇ 0.3 is more preferable, and 0.15 ⁇ a ⁇ 0.3 is still more preferable.
- y is 0 ⁇ y ⁇ 0.2, preferably 0.003 ⁇ y ⁇ 0.2, x is 0 ⁇ x ⁇ 1.0, It is preferable that 0.02 ⁇ x ⁇ 0.4, and more preferably 0.03 ⁇ x ⁇ 0.35.
- oxygen and Li are contained in the base crystal of the Ce-activated phosphor.
- the host crystal may contain only one of oxygen and Li, or both, and more preferably both.
- the Ce-activated phosphor is cCaAlSiN 3 ⁇ (1-c) LiSi 2 N 3 (Where 0.2 ⁇ c ⁇ 0.8)
- the crystal having the following composition is more preferable as an orange phosphor because the luminous efficiency of orange light emission is particularly high.
- the Li concentration in the solid solution crystal in which Ce and oxygen are in solid solution is preferably 4% by weight or less from the viewpoint of luminous efficiency.
- the semiconductor light emitting element when used for a lighting fixture or the like, it is necessary to pass a larger current than when it is used for an indicator or the like, and the ambient temperature of the semiconductor light emitting element reaches 100 ° C. to 150 ° C.
- a YAG: Ce phosphor exemplified in Japanese Patent Publication “JP-A-2003-321675” has an ambient temperature of 150 as disclosed in Japanese Patent Publication “JP-A-2008-127529”.
- the light emission intensity decreases to 50% of the room temperature in a high temperature environment of ° C.
- the oxynitride phosphors exemplified in the present specification have excellent light emission characteristics particularly in a high temperature environment.
- non-patent literature Science and Technology of Advanced Materials 8). (2007) 588-600
- the light emission intensity of about 85% to 90% of room temperature is maintained even in a high temperature environment of ambient temperature of 100 ° C. to 150 ° C.
- Green phosphor 14 having a narrow emission spectrum half-width and a peak wavelength in the range of 520 nm to 545 nm can be preferably used.
- the peak wavelength of the emission spectrum of the green phosphor 14 is within the above range, when the light emitting device 1 that emits white light is combined with the orange phosphor 13 and the semiconductor light emitting element 2 that emits blue light, The peak wavelength of the emission spectrum can be in the range of 540 nm to 565 nm. For this reason, a light emitting device with high luminous efficiency can be realized.
- the green phosphor 14 preferably has a half-value width of its emission spectrum of 55 nm or less, and particularly preferably one having a range of 30 nm to 55 nm.
- the half-value width of the emission spectrum of the green phosphor 14 is in the above range, the half-value width of the emission spectrum of the green phosphor 14 is sufficiently narrow compared to the half-value width of the emission spectrum of the orange phosphor 13. Absorption of green light by the body 13 is suppressed, and a light emitting device with higher luminous efficiency can be realized.
- Eu-activated ⁇ sialon phosphor specifically, Si 6-z ′ Al z ′ O z ′ N 8-z ′ (However, 0 ⁇ z ′ ⁇ 4.2)
- a phosphor having the following composition is preferable, and a more preferable range of z ′ is 0 ⁇ z ′ ⁇ 0.5.
- the green phosphor 14 as described above has a light absorption rate of 10 at 600 nm which is a wavelength region which does not contribute to the light emission of the ⁇ sialon phosphor at all and is near the peak wavelength of the orange phosphor. % Or less can be suitably used.
- the mold resin 5 used for sealing the semiconductor light emitting element 2 is made of a translucent resin such as a silicone resin or an epoxy resin, for example, the orange phosphor 13 and the green phosphor 14. Are dispersed.
- the dispersion method is not particularly limited, and a conventionally known method can be employed.
- the mixing ratio of the orange phosphor 13 and the green phosphor 14 to be dispersed is not particularly limited and can be appropriately determined so that a spectrum showing a desired white point can be obtained.
- the Ce-activated phosphor is cCaAlSiN 3 ⁇ (1-c) LiSi 2 N 3 (However, 0.2 ⁇ c ⁇ 0.8)
- a solid solution crystal in which Ce and oxygen are dissolved in a crystal having the following composition is preferable.
- the Li concentration taken into the crystal is preferably in the range of 1.5 wt% to 4 wt%.
- the excitation spectrum of the orange phosphor has an excitation peak in the range of 440 nm to 470 nm, and the fluorescence spectrum of the orange phosphor has an emission peak in the range of 580 nm to 620 nm. It is preferable to have.
- the absorptivity at 600 nm of the Eu-activated ⁇ sialon phosphor is 10% or less.
- This mixed powder was placed in a boron nitride crucible and set in a graphite resistance heating type electric furnace.
- the firing atmosphere is evacuated with a diffusion pump, and the temperature is raised from room temperature to 800 ° C. at a rate of 1200 ° C. per hour.
- nitrogen having a purity of 99.999% by volume is introduced to increase the pressure.
- the temperature was set to 0.92 MPa, and the temperature was raised to 600 ° C. per hour up to a firing temperature of 1800 ° C., and kept at the firing temperature of 1800 ° C. for 2 hours.
- the obtained fired product was washed with water to remove excess Li 3 N, and then coarsely pulverized and then manually pulverized using an alumina mortar to obtain a phosphor powder.
- the Li concentration of the phosphor powder was measured by ICP (manufactured by Nippon Jarrell-Ash: IRIS Advantage) and found to be 3.84% by weight.
- the Li concentration by ICP measurement is a value lower than 4.9% by weight of the theoretical composition, and this is considered to be the effect of volatilization of Li during firing and washing with water after firing.
- the Ce concentration measured by ICP was 1.25% by weight.
- the phosphor powder is a solid solution crystal in which Ce and oxygen are in solid solution because the raw material powder contains an oxide raw material.
- the obtained phosphor powder was subjected to powder X-ray diffraction measurement (XRD) using Cu K ⁇ rays. As a result, an XRD chart shown in FIG. 34 was obtained.
- the phosphor powder had a CaAlSiN 3 phase as a main phase. It was confirmed to have a crystal structure. Moreover, as a result of irradiating the phosphor powder with a lamp that emits light having a wavelength of 365 nm, it was confirmed that the phosphor powder emitted orange light.
- the “main phase” means the most abundant phase, and specifically means the phase present at 50% by weight or more.
- FIG. 2 is a graph showing the emission spectrum of the obtained phosphor powder, where the vertical axis represents the emission intensity (arbitrary unit) and the horizontal axis represents the wavelength (nm).
- FIG. 3 is a graph showing the excitation spectrum of the obtained phosphor powder, where the vertical axis represents absorbance (arbitrary unit) and the horizontal axis represents wavelength (nm).
- the excitation spectrum and emission spectrum of the phosphor powder shown in FIGS. 2 and 3 are the results of measurement using F-4500 (manufactured by Hitachi, Ltd.).
- the excitation spectrum was measured by scanning the intensity of the emission peak.
- Each emission spectrum was measured by excitation with light having a peak wavelength in each absorption spectrum.
- the absorption spectrum of the phosphor powder shown in FIG. 4 is the result of measurement using a measurement system combining MCPD-7000 (manufactured by Otsuka Electronics) and an integrating sphere.
- the obtained fired product was washed with water to remove excess Li 3 N, and then coarsely pulverized and then manually pulverized using an alumina mortar to obtain a phosphor powder.
- the Li concentration of the phosphor powder was measured by ICP (manufactured by Nippon Jarrell-Ash: IRIS Advantage) and found to be 3.24% by weight.
- the Li concentration by ICP measurement is a value lower than 4.17% by weight of the theoretical composition, and this is considered to be the effect of volatilization of Li during firing and washing with water after firing.
- the Ce concentration measured by ICP was 1.21% by weight.
- the phosphor powder is a solid solution crystal in which Ce and oxygen are in solid solution because the raw material powder contains an oxide raw material.
- FIG. 5 is a graph showing the emission spectrum of the phosphor powder obtained in this production example, where the vertical axis represents the emission intensity (arbitrary unit) and the horizontal axis represents the wavelength (nm).
- FIG. 6 is a graph showing the excitation spectrum of the phosphor powder obtained in this production example, where the vertical axis represents absorbance (arbitrary unit) and the horizontal axis represents wavelength (nm).
- FIG. 7 is an absorption spectrum of the phosphor powder obtained in this production example.
- the absorption spectrum of the phosphor powder shown in FIG. 7 is the result of measurement using a measurement system combining MCPD-7000 (manufactured by Otsuka Electronics) and an integrating sphere.
- FIG. 30 shows a graph showing the Li concentration dependence of the luminescence intensity of the obtained various solid solution crystals.
- FIG. 33 shows the Li concentration dependence of the half-value width of the emission spectrum when the various solid solution crystals are excited with light having a wavelength of 450 nm. From FIG. 33, it can be seen that when the Li concentration is 1.5% by weight or more, the full width at half maximum of the emission spectrum tends to increase.
- the emission intensity described in this production example was measured using an apparatus combining MCPD-7000 (manufactured by Otsuka Electronics) and an integrating sphere.
- the crucible is set in a graphite resistance heating type pressure electric furnace, the firing atmosphere is evacuated by a diffusion pump, heated from room temperature to 800 ° C. at a rate of 500 ° C. per hour, and the purity is 99.800 at 800 ° C.
- the temperature was raised to 1900 ° C. at 500 ° C. per hour, and further maintained at that temperature for 8 hours to obtain a phosphor sample.
- the obtained phosphor sample was pulverized using an agate mortar and further treated in a 1: 1 mixed acid of 50% hydrofluoric acid and 70% nitric acid to obtain a phosphor powder.
- the emission spectrum shown in FIG. 8 was obtained.
- the vertical axis represents emission intensity (arbitrary unit), and the horizontal axis represents wavelength (nm).
- the obtained slurry was oven-dried at 100 ° C., and the obtained powder aggregate was pulverized by a dry rolling ball mill using an agate ball and a nylon pot to obtain fine particles having a particle size of about 10 ⁇ m. After filling the obtained fine particles into an alumina crucible and applying compression molding with light weighting, it is fired in air at 1100 ° C. for 3 hours, and the resulting fired body is pulverized with an agate mortar to produce a precursor sample Got.
- the crucible is set in a graphite resistance heating type pressure electric furnace, the firing atmosphere is evacuated by a diffusion pump, heated from room temperature to 800 ° C. at a rate of 500 ° C. per hour, and the purity is 99.800 at 800 ° C.
- the temperature was raised to 1300 ° C. at 500 ° C. per hour and further maintained at that temperature for 2 hours to obtain a phosphor sample.
- the fired product obtained was pulverized using an agate mortar, filled again into an alumina crucible, lightly loaded and compression molded, and then fired in a nitrogen atmosphere at 1300 ° C. for 48 hours. Was pulverized with an agate mortar to obtain phosphor powder.
- the emission spectrum shown in FIG. 9 was obtained.
- the vertical axis represents emission intensity (arbitrary unit), and the horizontal axis represents wavelength (nm).
- the obtained slurry was oven-dried at 100 ° C., and the obtained powder aggregate was pulverized by a dry rolling ball mill using an agate ball and a nylon pot to obtain fine particles having a particle size of about 10 ⁇ m.
- the obtained fine particles are filled in a quartz crucible, fired under conditions of 1000 ° C. for 2 hours in an Ar atmosphere, and the fired powder obtained is pulverized again by a dry rolling ball mill, and ZnSe 0.1 S 0.9 : Cu phosphor powder was obtained.
- the vertical axis represents emission intensity (arbitrary unit), and the horizontal axis represents wavelength (nm).
- the crucible is set in a graphite resistance heating type pressure electric furnace, nitrogen having a purity of 99.999% by volume is introduced to a pressure of 1 MPa, and the temperature is raised to 1800 ° C. at 500 ° C. per hour, A phosphor sample was obtained by holding at 1800 ° C. for 2 hours.
- the obtained phosphor sample was pulverized using an agate mortar to obtain phosphor powder.
- XRD X-ray diffraction measurement
- FIG. 28 is a graph showing an emission spectrum of the obtained phosphor powder, where the vertical axis represents the emission intensity (arbitrary unit) and the horizontal axis represents the wavelength (nm).
- the emission spectrum of the phosphor powder shown in FIG. 28 is a result of measurement using F-4500 (manufactured by Hitachi, Ltd.), and is obtained when excited with light of 450 nm.
- an LED having a peak emission wavelength shown in Table 3 (trade name: EZR, manufactured by Cree) is used, and the ratio of resin, orange phosphor, and green phosphor is 5 for the color temperature of the light emitting device. It adjusted suitably so that it might be set to about 000K.
- FIGS. 12 to 19 show the emission spectra of the semiconductor light emitting devices of Examples 1 to 8, respectively.
- the emission spectra shown in FIGS. 12 to 19 were measured using MCPD-7000 (manufactured by Otsuka Electronics).
- an LED having a peak emission wavelength shown in Table 3 (trade name: EZR, manufactured by Cree) is used, and the ratio of resin, orange phosphor, and green phosphor is 5 for the color temperature of the light emitting device. It adjusted suitably so that it might be set to about 000K.
- FIGS. 20 and 21 show the emission spectra of the semiconductor light emitting devices of Comparative Examples 1 and 2, respectively.
- the emission spectra shown in FIGS. 20 and 21 were measured using MCPD-7000 (manufactured by Otsuka Electronics).
- an LED (trade name: EZR, manufactured by Cree) having an emission peak wavelength at a wavelength of 450 nm is used, and the ratio of resin, orange phosphor, green phosphor, and red phosphor is the color of the light emitting device.
- the temperature was adjusted as appropriate so that the temperature was around 5,000K.
- Table 4 shows the fluorescence peak wavelengths of the fluorescence spectra, PI (90) / PI (MAX), and PI ( ⁇ 35) / PI (MAX) in each of the semiconductor light emitting devices produced in the above examples and comparative examples.
- Table 5 shows the light emission characteristics of the light emitting devices manufactured in Examples and Comparative Examples.
- Each index shown in Tables 4 and 5 was calculated based on an emission spectrum measured by a spectrophotometer MCPD-7000 (manufactured by Otsuka Electronics).
- the luminous intensity of the semiconductor light emitting device was measured using a measurement system in which MCPD-7000 (manufactured by Otsuka Electronics) and an integrating sphere were combined.
- the semiconductor light emitting devices shown in Examples 1 to 8 are requirements in the fluorescence spectrum of the present invention, that the peak wavelength of the fluorescence spectrum is 540 nm to 565 nm, and 0.70> PI (90 ) / PI (MAX)> 0.55, and it can be seen that the semiconductor light emitting devices shown in Examples 1 to 7 further satisfy PI ( ⁇ 35) / PI (MAX) ⁇ 0.60.
- Ra increases rapidly when PI (90) / PI (MAX) exceeds about 0.55.
- Ra is preferably sufficiently higher than 70, and R9 is preferably a positive value.
- the light emitting devices shown in Examples 1 to 7 and Comparative Examples 1 and 2 use the same green phosphor of Production Example 1-1, the light emitting devices of Examples 1 to 7 are the same.
- the reason for the high emission efficiency is that the emission spectra of the light emitting devices of Examples 1 to 7 have a peak wavelength of 540 nm or more and less than 560 nm.
- the light emitting devices shown in Examples 1 to 7 and Comparative Examples 1 and 2 use Examples 1 to 7 in spite of using the green phosphor of Production Example 2-1 which is the same green phosphor.
- the reason why the light emitting device No. 7 shows higher luminous efficiency is that it has PI ( ⁇ 35) / PI (MAX) ⁇ 0.60, and therefore has a sharp peak in a portion with high visibility.
- the light emitting devices of Examples 1 to 8 have particularly high luminous efficiency as compared with Comparative Example 1.
- the orange phosphor used in the light emitting devices of Examples 1 to 8 is ABS (520) / ABS (MAX ) ⁇ 0.60, the absorption of green light emitted from the green phosphor is sufficiently suppressed.
- 24 and 25 are graphs showing how the relative light emission intensities of Ra and LED change depending on the value of PI ( ⁇ 35) / PI (MAX).
- the phosphor described in Production Example 1-1 is used as the orange phosphor, and the luminous efficiency is the same as that of the phosphor described in Production Example 2-1 and Production Example 2-1.
- the phosphors having different emission spectra are combined, and an LED that emits white light is configured using an LED having a peak wavelength of 450 nm in the same manner as in the above-described example.
- the relative emission intensity of Ra and LED is PI ( ⁇ 35) / PI ( It is the graph which confirmed how it changed with the value of (MAX).
- high PI ( ⁇ 35) / PI (MAX) means that a half-width of the emission spectrum as a green phosphor is wide, or a peak wavelength is on the short wavelength side. .
- the half width of the emission spectrum of the green phosphor is wide and the peak wavelength is closer to the short wavelength side, the absorption of green light by the orange phosphor increases, which further reduces the light emission efficiency. This will be described with reference to FIG.
- FIG. 26 is a graph in which the absorption spectrum of the orange phosphor of Production Example 1-1 and the emission spectrum of the green phosphor shown in Production Examples 2-1 and 2-2 are plotted on the same graph.
- the light emitting device of this example uses a green phosphor having an absorption rate of light of 600 nm wavelength of 10% or less, the luminous efficiency is particularly high. This will be described with reference to FIG.
- FIG. 27 is a graph showing how the relative light emission intensity of the LED changes depending on the value of the absorption rate of light having a wavelength of 600 nm of the green phosphor. More specifically, the phosphor obtained in Production Example 1-1 was used as the orange phosphor, the phosphor obtained in Production Example 2-1 as the green phosphor, and the production process of Production Example 2 was changed. Combining phosphors with different 600 nm absorptivity, and using LEDs with a peak wavelength of 450 nm to form an LED that emits white light in the same manner as in the above example, the relative emission intensity of the LED is that of the green phosphor with a wavelength of 600 nm. It is the graph which confirmed how it changed with the value of absorptivity.
- the relative light emission intensity of the LED is dramatically increased in the region where the absorption rate of the green phosphor having a wavelength of 600 nm is 10% or less. This is because the green phosphor has an absorptance of 600 nm wavelength light of 10% or less, so that unnecessary absorption of the green phosphor is sufficiently suppressed, and the luminous efficiency of the green phosphor is improved. This is because unnecessary absorption of orange light in the vicinity of the peak wavelength of the phosphor is sufficiently suppressed.
- FIG. 37 is a comparison of emission spectra when the orange phosphor shown in Production Example 1-1 is excited with light having wavelengths of 440 nm, 450 nm, and 460 nm.
- FIG. 37 shows that the emission spectrum of the orange phosphor in the present invention tends to shift to the longer wavelength side as the excitation wavelength becomes longer. Since the color rendering properties of the light emitting device tend to increase when the wavelength of the emission spectrum of the orange phosphor is increased in a range that satisfies the requirements of the present invention, the light emitting device of the present invention has an LED wavelength of 450 nm to 460 nm as described above. When the wavelength is increased, the color rendering property of the light emitting device increases.
- the semiconductor light emitting device of the present invention has high luminous efficiency and emits white light showing high Ra and R9. For this reason, it can be used suitably for various lighting fixtures such as household lighting and vehicle lamps.
Abstract
Description
0.70>PI(90)/PI(MAX)>0.55
を満たすことを特徴としている。
0.70>PI(90)/PI(MAX)>0.55
を満たすことを特徴としている。
本実施の形態に係る半導体発光装置1では、緑色蛍光体14と橙色蛍光体13とが発する蛍光の発光スペクトルのピーク波長は540nm以上565nm以下の範囲内である。
0.70>PI(90)/PI(MAX)>0.55
に示す関係を満たす。
PI(-35)/PI(MAX)<0.60
を更に満たすことが好ましい。
本実施の形態では、上記半導体発光素子2は発光ダイオード(LED)であるが、上記半導体発光素子2としては発光ダイオード(LED)に限定されず、半導体レーザ、無機EL(electroluminescence)素子等の青色光を発する従来公知の素子を使用することができる。尚、LEDは、例えば、Cree社製等の市販品を用いることができる。
上記橙色蛍光体13は、発光スペクトルのピーク波長が570nm~620nmの範囲内であることが好ましく、当該ピークの半値幅が120nm~150nmの範囲内であることが好ましい。
ABS(520)/ABS(MAX)<0.60
を満たすことが好ましい。
(1-a-b)(Ln’pM(II)’(1-p)M(III)’M(IV)’N3)・a(M(IV)’(3n+2)/4NnO)・b(A・M(IV)’2N3) …(1)
(式中、Ln’は、ランタノイド、Mn及びTiからなる群から選ばれる少なくとも1種の金属元素であり、
M(II)’はLn’元素以外の2価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(III)’は3価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(IV)’は4価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
Aは、Li、Na、及びKからなる群から選ばれる1種類以上の1価の金属元素であり、
pは0<p≦0.2を満足する数であり、
a、b及びnは、0≦a、0≦b、a+b>0、0≦n、及び0.002≦(3n+2)a/4≦0.9を満足する数である)
で表される化学組成を有する、Ceを含有した結晶相を含有する蛍光体であることが好ましい。
(1-a)(CepCa1-pAlSiN3)・aSi2N2O …(2)
(1-x)(Cey(Ca、Sr)1-yAlSiN3)・xLiSi2N3 …(3)
で示される組成が例示でき、日本国公開特許公報「特許公開公報2007-231245号」の記載に準じて製造することができる。
cCaAlSiN3・(1-c)LiSi2N3
(式中、0.2≦c≦0.8である)
の組成を有する結晶に、Ceと酸素とが固溶した固溶体結晶である場合は、橙色発光の発光効率が特に高いため、橙色蛍光体としてより好ましい。
上記緑色蛍光体14は、発光スペクトルの半値幅が狭く、ピーク波長が520nm~545nmの範囲にあるものを好適に用いることができる。
Bay’Eux’Siu’Ov’Nw’
(但し、0≦y’≦3、1.6≦y’+x’≦3、5≦u’≦7、9<v’<15、0<w’≦4)
の組成を有する蛍光体が好ましく、上記y’、x’、u’、v’、w’のさらに好ましい範囲は、1.5≦y’≦3、2≦y’+x’≦3、5.5≦u’≦7、10<v’<13、1.5<w’≦4である。
Si6-z’Alz’Oz’N8-z’
(但し、0<z’<4.2)
の組成を有する蛍光体が好ましく、上記z’のさらに好ましい範囲は、0<z’<0.5である。
上記半導体発光装置1において、半導体発光素子2の封止に用いるモールド樹脂5は、例えば、シリコーン樹脂、エポキシ樹脂等の透光性樹脂に上記橙色蛍光体13及び緑色蛍光体14を分散させたものである。当該分散方法としては、特には限定されず、従来公知の方法を採用することができる。
本実施の形態に係る半導体発光装置において、半導体発光素子2、橙色蛍光体13、緑色蛍光体14、及びモールド樹脂5以外の、プリント配線基板3、接着剤10、金属ワイヤ12等については、従来技術(例えば、日本国公開特許公報「特開2003-321675号公報」、日本国公開特許公報「特開2006-8721号公報」等)と同様の構成を採用することができ、従来技術と同様の方法により製造することができる。
PI(-35)/PI(MAX)<0.60
を更に満たすことが好ましい。
ABS(520)/ABS(MAX)<0.60
を満たすことが好ましい。
(1-a-b)(Ln’pM(II)’(1-p)M(III)’M(IV)’N3)・a(M(IV)’(3n+2)/4NnO)・b(A・M(IV)’2N3) …(1)
(式中、Ln’は、ランタノイド、Mn及びTiからなる群から選ばれる少なくとも1種の金属元素であり、
M(II)’はLn’元素以外の2価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(III)’は3価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(IV)’は4価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
Aは、Li、Na、及びKからなる群から選ばれる1種類以上の1価の金属元素であり、
pは0<p≦0.2を満足する数であり、
a、b及びnは、0≦a、0≦b、0<a+b<1、0≦n、及び0.002≦(3n+2)a/4≦0.9を満足する数である)
で表される化学組成を有する結晶相を含有する蛍光体であることが好ましい。
cCaAlSiN3・(1-c)LiSi2N3
(但し、0.2≦c≦0.8)
の組成を有する結晶にCeと酸素とが固溶した固溶体結晶であることが好ましい。
(製造例1-1:橙色蛍光体の作製1)
0.2CaAlSiN3・0.8LiSi2N3組成の結晶を母体結晶として、これにCeを賦活した蛍光体を合成した。
0.3CaAlSiN3・0.7LiSi2N3組成の結晶を母体結晶として、これにCeを賦活した蛍光体を合成した。
Si3N4、AlN、Li3N、Ca3N2、CeO2を表1に示す組成比率によって混合することにより、Ce濃度及びLi濃度を変化させた、Ceと酸素とが固溶した各種固溶体結晶を合成した。ICPによって得られたCe濃度及びLi濃度を表2に示す。
Si6-z’Alz’Oz’N8-z’で表される組成式において、z’=0.23のものにEuが0.09at.%賦活されたEu賦活βサイアロン蛍光体を得るべく、α型窒化ケイ素粉末95.82質量%、窒化アルミニウム粉末3.37質量%、及び酸化ユーロピウム粉末0.81質量%の組成となるように秤量し、窒化ケイ素焼結体製の乳鉢と乳棒とを用い、10分以上混合し粉体凝集体を得た。この粉体凝集体を窒化ホウ素製のるつぼに自然落下させて充填した。
β型窒化ケイ素粉末17.12質量%、酸化ケイ素粉末29.32質量%、炭酸バリウム粉末50.75質量%、及び酸化ユーロピウム粉末2.81質量%の組成となるようにメノウ製乳鉢と乳棒を用いて混合し、粉体混合物50gを得た。得られた粉体混合物を150ccのエタノール中でメノウ製ボールとナイロンポットを用いた転動ボールミルにより混合し、スラリーを得た。
SrCO3粉末86.13質量%、Eu2O3粉末2.07質量%、SiO2粉末11.80質量%を所定の組成となるように空気中で秤量し、メノウ製ボールとナイロンポットとを用いた転動ボールミルにより混合し、粉体混合物を得た。得られた混合物を石英ルツボに充填し、N2(95%)+H2(5%)の還元雰囲気で1400℃、5時間の条件で焼成し、得られた焼成体をメノウ製乳鉢により粉砕して蛍光体粉末を得た。
ZnS粉末84.75質量%、ZnSe粉末13.95質量%、CuCl2粉末1.30質量%の組成となるようN2雰囲気下で秤量し、ZnS粉末及びZnSe粉末を上記比率でメノウ製乳鉢を用い10分以上混合し、粉体混合物50gを得た。次いで、CuCl2粉末を150mlのメタノールに加え、上記で得られたZnS粉末とZnSe粉末との混合物50gと共に、メノウ製ボールとナイロンポットとを用いた転動ボールミルにより混合し、スラリーを得た。
窒化アルミニウム粉末29.741質量%、α型窒化ケイ素粉末33.925質量%、窒化カルシウム粉末35.642質量%及び窒化ユーロピウム粉末0.692質量%となるように所定量秤量し、窒化ケイ素焼結体製の乳鉢と乳棒とを用い、10分以上混合し粉体凝集体を得た。尚、窒化ユーロピウムは、金属ユーロピウムをアンモニア中で窒化して合成したものを用いた。
<実施例1~8>
シリコーン樹脂(商品名:KER2500、信越シリコーン社製)を用い、表3に示す蛍光体を当該シリコーン樹脂と、表3に示す質量比率でそれぞれ混合分散させモールド樹脂を作製し、図1に示した構造を有する、各実施例の半導体発光装置を作製した。
シリコーン樹脂(商品名:KER2500、信越シリコーン社製)を用い、表3に示す蛍光体を当該シリコーン樹脂と、表3に示す質量比率でそれぞれ混合分散させモールド樹脂を作製し、図1に示した構造を有する、比較例1,2の半導体発光装置を作製した。
シリコーン樹脂(商品名:KER2500、信越シリコーン社製)を用い、製造例1-1に示す蛍光体と、製造例2に示す蛍光体と、比較製造例3に示す蛍光体を、(シリコーン樹脂):(製造例1-1に示す蛍光体):(製造例2に示す蛍光体):(比較製造例3に示す蛍光体)=1:0.117:0.1:0.041の質量比率で混合分散させモールド樹脂を作製し、図1に示した構造を有する、比較例3の半導体発光装置を作製した。
2 半導体発光素子
3 プリント配線基板
4 樹脂枠
5 モールド樹脂
6 InGaN層
7 p側電極
8 n側電極
9 n電極部
10 接着剤
11 p電極部
12 金属ワイヤ
13 橙色蛍光体
14 緑色蛍光体
Claims (15)
- 青色光を発する半導体発光素子と、当該青色光を吸収して緑色光を発する緑色蛍光体と、当該青色光を吸収して橙色光を発する橙色蛍光体とを備え、
上記緑色蛍光体と橙色蛍光体とが発する蛍光の発光スペクトルは、ピーク波長が540nm以上565nm以下の範囲内であり、当該ピーク波長における発光強度をPI(MAX)、当該ピーク波長より90nm長波長における発光強度をPI(90)としたときに以下の関係
0.70>PI(90)/PI(MAX)>0.55
を満たすことを特徴とする半導体発光装置。 - 緑色蛍光体と橙色蛍光体とが発する蛍光の上記発光スペクトルにおいて、ピーク波長より35nm短波長における発光強度をPI(-35)としたときに以下の関係
PI(-35)/PI(MAX)<0.60
を更に満たすことを特徴とする請求項1に記載の半導体発光装置。 - 上記半導体発光素子の発する青色光のピーク波長は440nm以上470nm以下の範囲内であり、
上記橙色蛍光体の発する蛍光の発光スペクトルにおけるピーク波長は570nm以上620nm以下の範囲内であり、
上記橙色蛍光体の発する蛍光の上記発光スペクトルにおける半値幅が120nm以上150nm以下の範囲内であることを特徴とする請求項1に記載の半導体発光装置。 - 420nmより長波長側における、上記橙色蛍光体の吸収率の最大値をABS(MAX)、波長520nmにおける、上記橙色蛍光体の吸収率をABS(520)としたときに以下の関係
ABS(520)/ABS(MAX)<0.60
を満たすことを特徴とする請求項1に記載の半導体発光装置。 - 上記橙色蛍光体は、Ce賦活蛍光体であることを特徴とする請求項1に記載の半導体発光装置。
- 上記Ce賦活蛍光体は、Ce賦活窒化物系蛍光体、又はCe賦活酸窒化物系蛍光体であることを特徴とする請求項5に記載の半導体発光装置。
- 上記Ce賦活蛍光体は、下記一般式(1)
(1-a-b)(Ln’pM(II)’(1-p)M(III)’M(IV)’N3)・a(M(IV)’(3n+2)/4NnO)・b(A・M(IV)’2N3) …(1)
(式中、Ln’は、ランタノイド、Mn及びTiからなる群から選ばれる少なくとも1種の金属元素であり、
M(II)’はLn’元素以外の2価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(III)’は3価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
M(IV)’は4価の金属元素からなる群から選ばれる1種又は2種以上の元素であり、
Aは、Li、Na、及びKからなる群から選ばれる1種類以上の1価の金属元素であり、
pは0<p≦0.2を満足する数であり、
a、b及びnは、0≦a、0≦b、0<a+b<1、0≦n、及び0.002≦(3n+2)a/4≦0.9を満足する数である)
で表される化学組成を有する結晶相を含有する蛍光体であることを特徴とする請求項5に記載の半導体発光装置。 - 上記Ce賦活蛍光体が、
cCaAlSiN3・(1-c)LiSi2N3
(但し、0.2≦c≦0.8)
の組成を有する結晶にCeと酸素とが固溶した固溶体結晶であることを特徴とする請求項7に記載の半導体発光装置。 - Ceと酸素とが固溶した上記固溶体結晶中におけるCe濃度は、6重量%以下の範囲内であることを特徴とする請求項8に記載の半導体発光装置。
- Ceと酸素とが固溶した上記固溶体結晶中におけるLi濃度は、1.5重量%以上4重量%以下の範囲内であることを特徴とする請求項8に記載の半導体発光装置。
- 上記橙色蛍光体の励起スペクトルは、440nm以上470nm以下の範囲内に励起ピークを有し、
上記橙色蛍光体の蛍光スペクトルは、580nm以上620nm以下の範囲内に発光ピークを有することを特徴とする請求項10に記載の半導体発光装置。 - 上記緑色蛍光体の発する発光スペクトルのピーク波長が520nm以上545nm以下の範囲内であることを特徴とする請求項1に記載の半導体発光装置。
- 上記緑色蛍光体の発する発光スペクトルの半値幅が55nm以下であることを特徴とする請求項1に記載の半導体発光装置。
- 上記緑色蛍光体は、Eu賦活βサイアロン蛍光体であることを特徴とする請求項1に記載の半導体発光装置。
- 上記Eu賦活βサイアロン蛍光体の600nmにおける光の吸収率が10%以下であることを特徴とする請求項14に記載の半導体発光装置。
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Cited By (10)
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---|---|---|---|---|
WO2011105157A1 (ja) * | 2010-02-26 | 2011-09-01 | シャープ株式会社 | 発光装置 |
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EP2560218A1 (en) * | 2011-08-18 | 2013-02-20 | Panasonic Corporation | Illumination device |
JP2013163733A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163735A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
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US8901591B2 (en) | 2010-07-26 | 2014-12-02 | Sharp Kabushiki Kaisha | Light-emitting device |
JP7379737B2 (ja) | 2019-03-19 | 2023-11-14 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光モジュール |
JP7436874B2 (ja) | 2021-03-30 | 2024-02-22 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104263359B (zh) * | 2014-09-12 | 2016-10-05 | 江门市科恒实业股份有限公司 | 一种全光谱led荧光粉及其应用 |
US10374133B2 (en) * | 2015-04-03 | 2019-08-06 | Sharp Kabushiki Kaisha | Light emitting apparatus with two primary lighting peaks |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005255895A (ja) * | 2004-03-12 | 2005-09-22 | National Institute For Materials Science | 蛍光体とその製造方法 |
WO2006126567A1 (ja) * | 2005-05-24 | 2006-11-30 | Mitsubishi Chemical Corporation | 蛍光体及びその利用 |
JP2007227928A (ja) * | 2006-02-22 | 2007-09-06 | Samsung Electro-Mechanics Co Ltd | 白色発光装置 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
SG173925A1 (en) | 2002-03-22 | 2011-09-29 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP4543253B2 (ja) | 2004-10-28 | 2010-09-15 | Dowaエレクトロニクス株式会社 | 蛍光体混合物および発光装置 |
JP4756261B2 (ja) | 2005-01-27 | 2011-08-24 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
US8545722B2 (en) | 2005-02-21 | 2013-10-01 | Koninklijke Philips N.V. | Illumination system comprising a radiation source and a luminescent material |
WO2006095285A1 (en) | 2005-03-09 | 2006-09-14 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
JP5046223B2 (ja) | 2005-05-24 | 2012-10-10 | 独立行政法人物質・材料研究機構 | 蛍光体及びその利用 |
JP2007204730A (ja) | 2005-09-06 | 2007-08-16 | Sharp Corp | 蛍光体及び発光装置 |
JP2007088248A (ja) * | 2005-09-22 | 2007-04-05 | Fujikura Ltd | 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置 |
JP2007134606A (ja) | 2005-11-11 | 2007-05-31 | Matsushita Electric Ind Co Ltd | 白色光源 |
JP4769132B2 (ja) | 2005-11-30 | 2011-09-07 | シャープ株式会社 | 発光装置 |
WO2007088966A1 (ja) | 2006-02-02 | 2007-08-09 | Mitsubishi Chemical Corporation | 複合酸窒化物蛍光体、それを用いた発光装置、画像表示装置、照明装置及び蛍光体含有組成物、並びに、複合酸窒化物 |
CN101600778B (zh) | 2006-11-20 | 2013-10-23 | 电气化学工业株式会社 | 荧光物质及其生产方法、以及发光器件 |
JP5594924B2 (ja) | 2006-11-22 | 2014-09-24 | 三菱化学株式会社 | 蛍光体、蛍光体含有組成物、発光装置、画像表示装置、照明装置、及び蛍光体の製造方法 |
JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
JP4920384B2 (ja) | 2006-11-24 | 2012-04-18 | 新日本製鐵株式会社 | 室炉式コークス炉構造及び室炉式コークス炉の構築方法 |
KR100930171B1 (ko) | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
JP2008244468A (ja) | 2007-02-28 | 2008-10-09 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2008244469A (ja) | 2007-02-28 | 2008-10-09 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2008250254A (ja) | 2007-03-30 | 2008-10-16 | Brother Ind Ltd | 光学フィルタ、合波器、光源装置及び画像表示装置 |
JP4466757B2 (ja) | 2007-04-18 | 2010-05-26 | 三菱化学株式会社 | 蛍光体、蛍光体含有組成物、発光装置、照明装置、画像表示装置、及び窒素含有化合物 |
US9279079B2 (en) | 2007-05-30 | 2016-03-08 | Sharp Kabushiki Kaisha | Method of manufacturing phosphor, light-emitting device, and image display apparatus |
JP5263722B2 (ja) | 2007-06-08 | 2013-08-14 | シャープ株式会社 | 蛍光体、発光装置および画像表示装置 |
JP2009049267A (ja) * | 2007-08-22 | 2009-03-05 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP2009073914A (ja) | 2007-09-20 | 2009-04-09 | Koito Mfg Co Ltd | 緑色発光蛍光体とそれを用いた発光モジュール |
US8158026B2 (en) | 2008-08-12 | 2012-04-17 | Samsung Led Co., Ltd. | Method for preparing B-Sialon phosphor |
CN102216421B (zh) | 2008-08-12 | 2014-12-17 | 三星电子株式会社 | 制备β-SiAlON磷光体的方法 |
JP3150457U (ja) | 2009-02-27 | 2009-05-21 | 岡谷電機産業株式会社 | カラー発光ダイオード |
CN102348778B (zh) | 2009-03-26 | 2014-09-10 | 独立行政法人物质·材料研究机构 | 荧光体、其制造方法、发光器具以及图像显示装置 |
EP2541630B1 (en) | 2010-02-26 | 2017-05-31 | Sharp Kabushiki Kaisha | Light-emitting device |
WO2012014702A1 (ja) | 2010-07-26 | 2012-02-02 | シャープ株式会社 | 発光装置 |
CN103347978B (zh) | 2010-11-16 | 2014-12-31 | 电气化学工业株式会社 | 荧光体、发光装置及其用途 |
-
2010
- 2010-07-02 WO PCT/JP2010/061345 patent/WO2011002087A1/ja active Application Filing
- 2010-07-02 JP JP2011520998A patent/JP5450625B2/ja active Active
- 2010-07-02 CN CN201080028595.1A patent/CN102473815B/zh not_active Expired - Fee Related
- 2010-07-02 US US13/381,348 patent/US8928005B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005255895A (ja) * | 2004-03-12 | 2005-09-22 | National Institute For Materials Science | 蛍光体とその製造方法 |
WO2006126567A1 (ja) * | 2005-05-24 | 2006-11-30 | Mitsubishi Chemical Corporation | 蛍光体及びその利用 |
JP2007227928A (ja) * | 2006-02-22 | 2007-09-06 | Samsung Electro-Mechanics Co Ltd | 白色発光装置 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011105157A1 (ja) * | 2010-02-26 | 2011-09-01 | シャープ株式会社 | 発光装置 |
US8674392B2 (en) | 2010-02-26 | 2014-03-18 | Sharp Kabushiki Kaisha | Light-emitting device |
US8901591B2 (en) | 2010-07-26 | 2014-12-02 | Sharp Kabushiki Kaisha | Light-emitting device |
CN102433122A (zh) * | 2011-04-01 | 2012-05-02 | 奇美实业股份有限公司 | 氮化物荧光体及其制造方法与发光装置 |
CN102433122B (zh) * | 2011-04-01 | 2014-03-19 | 奇美实业股份有限公司 | 氮化物荧光体及其制造方法与发光装置 |
EP2560218A1 (en) * | 2011-08-18 | 2013-02-20 | Panasonic Corporation | Illumination device |
US8587190B2 (en) | 2011-08-18 | 2013-11-19 | Panasonic Corporation | Illumination device having improved visual perception of a skin color |
CN103857767B (zh) * | 2011-10-12 | 2017-04-05 | 欧司朗光电半导体有限公司 | 光电子器件和发光材料 |
CN103857767A (zh) * | 2011-10-12 | 2014-06-11 | 欧司朗光电半导体有限公司 | 光电子器件和发光材料 |
JP2013163733A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2013163735A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
JP2014167974A (ja) * | 2013-02-28 | 2014-09-11 | Toyoda Gosei Co Ltd | 蛍光体の選別方法及び発光装置 |
JP7379737B2 (ja) | 2019-03-19 | 2023-11-14 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光モジュール |
JP7436874B2 (ja) | 2021-03-30 | 2024-02-22 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法 |
Also Published As
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JP5450625B2 (ja) | 2014-03-26 |
US20120104448A1 (en) | 2012-05-03 |
CN102473815B (zh) | 2015-04-29 |
US8928005B2 (en) | 2015-01-06 |
JPWO2011002087A1 (ja) | 2012-12-13 |
CN102473815A (zh) | 2012-05-23 |
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