WO2008136373A1 - セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 - Google Patents
セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 Download PDFInfo
- Publication number
- WO2008136373A1 WO2008136373A1 PCT/JP2008/058010 JP2008058010W WO2008136373A1 WO 2008136373 A1 WO2008136373 A1 WO 2008136373A1 JP 2008058010 W JP2008058010 W JP 2008058010W WO 2008136373 A1 WO2008136373 A1 WO 2008136373A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin varnish
- thermosetting resin
- producing
- metal
- prepreg
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/246—Intercrosslinking of at least two polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2387/00—Characterised by the use of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800135285A CN101668806B (zh) | 2007-04-26 | 2008-04-25 | 含有半ipn型复合体的热固性树脂的树脂清漆的制造方法以及使用有其的印刷线路板用树脂清漆、预浸料及贴金属箔层压板 |
KR1020097024645A KR101491188B1 (ko) | 2007-04-26 | 2008-04-25 | 세미 ipn형 복합체의 열경화성 수지를 함유하는 수지 바니시의 제조 방법, 및 이것을 사용한 인쇄 배선판용 수지 바니시, 프리프레그 및 금속장 적층판 |
EP08752084.7A EP2141198B1 (en) | 2007-04-26 | 2008-04-25 | Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
US12/596,165 US8404769B2 (en) | 2007-04-26 | 2008-04-25 | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
US13/588,881 US20130040153A1 (en) | 2007-04-26 | 2012-08-17 | Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-116785 | 2007-04-26 | ||
JP2007116785 | 2007-04-26 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/588,881 Division US20130040153A1 (en) | 2007-04-26 | 2012-08-17 | Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008136373A1 true WO2008136373A1 (ja) | 2008-11-13 |
Family
ID=39943482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058010 WO2008136373A1 (ja) | 2007-04-26 | 2008-04-25 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8404769B2 (ja) |
EP (1) | EP2141198B1 (ja) |
JP (1) | JP5104507B2 (ja) |
KR (1) | KR101491188B1 (ja) |
CN (2) | CN101668806B (ja) |
TW (1) | TWI454526B (ja) |
WO (1) | WO2008136373A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008291227A (ja) * | 2007-04-26 | 2008-12-04 | Hitachi Chem Co Ltd | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
WO2013172388A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社スリーボンド | 硬化性樹脂組成物およびプライマー組成物 |
WO2018186025A1 (ja) * | 2017-04-07 | 2018-10-11 | パナソニックIpマネジメント株式会社 | 金属張積層板、樹脂付き金属部材、及び配線板 |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060292375A1 (en) * | 2005-06-28 | 2006-12-28 | Martin Cary J | Resin compositions with high thermoplatic loading |
JP5303852B2 (ja) * | 2006-04-13 | 2013-10-02 | 日立化成株式会社 | セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5303853B2 (ja) * | 2006-04-14 | 2013-10-02 | 日立化成株式会社 | Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5303854B2 (ja) * | 2006-10-24 | 2013-10-02 | 日立化成株式会社 | 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
WO2009040921A1 (ja) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板 |
KR20120123031A (ko) * | 2009-12-25 | 2012-11-07 | 히다찌 가세이 고오교 가부시끼가이샤 | 열경화성 수지 조성물, 수지 조성물 바니시의 제조 방법, 프리프레그 및 적층판 |
EP2595460B1 (en) | 2010-07-14 | 2017-10-11 | Guangdong Shengyi Sci. Tech Co., Ltd | Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof |
CN102161823B (zh) * | 2010-07-14 | 2012-09-26 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
CN107200859B (zh) * | 2011-01-18 | 2021-02-05 | 昭和电工材料株式会社 | 预浸料及使用了该预浸料的层压板以及印制线路板 |
JP2013000995A (ja) * | 2011-06-17 | 2013-01-07 | Panasonic Corp | 金属張積層板、及びプリント配線板 |
CN102977583B (zh) * | 2011-09-05 | 2015-08-05 | 深圳光启高等理工研究院 | 改性聚苯醚和基于改性聚苯醚制备基材的方法 |
CN102504332A (zh) * | 2011-11-02 | 2012-06-20 | 台光电子材料(昆山)有限公司 | 无机填充物及含该无机填充物的电学材料 |
JP2013123907A (ja) * | 2011-12-16 | 2013-06-24 | Panasonic Corp | 金属張積層板、及びプリント配線板 |
CN104093779A (zh) * | 2012-01-19 | 2014-10-08 | 伊索拉美国有限公司 | 合成树脂以及由其制造的清漆、预浸料和层压板 |
CN103608387B (zh) * | 2012-03-19 | 2016-02-03 | 旭化成电子材料株式会社 | 含有聚苯醚颗粒的预浸料 |
KR20140138677A (ko) * | 2012-03-23 | 2014-12-04 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프리프레그 및 적층판 |
JP5901066B2 (ja) | 2012-04-27 | 2016-04-06 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板 |
US10085336B2 (en) * | 2012-05-10 | 2018-09-25 | Hitachi Chemical Company, Ltd. | Multilayer wiring board |
US8952105B2 (en) * | 2012-05-23 | 2015-02-10 | Baker Hughes Incorporated | Variable TG article, method of making, and use of same |
JP6240613B2 (ja) * | 2012-11-06 | 2017-11-29 | 日本化薬株式会社 | 多価フェニレンエーテルノボラック樹脂、エポキシ樹脂組成物およびその硬化物 |
TWI464213B (zh) * | 2013-03-07 | 2014-12-11 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
JP6167621B2 (ja) * | 2013-04-03 | 2017-07-26 | 日立化成株式会社 | 樹脂組成物、並びに印刷配線板用樹脂フィルム及びその製造方法 |
JP2014213489A (ja) * | 2013-04-24 | 2014-11-17 | 明電ケミカル株式会社 | 不燃性シート及び不燃性シートの製造方法 |
TWI513761B (zh) | 2013-04-30 | 2015-12-21 | Ind Tech Res Inst | 樹脂組合物、膠片、及包含其之基材 |
WO2015062054A1 (en) * | 2013-10-31 | 2015-05-07 | Dow Global Technologies Llc | Curable compositions which form interpenetrating polymer networks |
CN106255713B (zh) * | 2014-04-04 | 2017-12-19 | 日立化成株式会社 | 聚苯醚衍生物、热固化性树脂组合物、树脂清漆、预浸渍体、层叠板及多层印制线路板 |
CN103937212A (zh) * | 2014-04-18 | 2014-07-23 | 安徽省中日农业环保科技有限公司 | 一种汽车塑料件用耐磨碳化硅改性聚苯醚材料 |
US10897818B2 (en) * | 2014-07-16 | 2021-01-19 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board |
KR101865649B1 (ko) | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
TWI518136B (zh) * | 2014-12-23 | 2016-01-21 | Nanya Plastics Corp | A thermosetting resin composition, and a prepreg and a hardened product using the composition |
CN104725857B (zh) * | 2015-03-05 | 2017-11-03 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
US20180197655A1 (en) * | 2015-07-06 | 2018-07-12 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board |
JP2017031276A (ja) * | 2015-07-30 | 2017-02-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 |
JP6896993B2 (ja) * | 2015-09-18 | 2021-06-30 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
WO2017209043A1 (ja) * | 2016-05-31 | 2017-12-07 | 三菱瓦斯化学株式会社 | 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板及び半導体装置 |
WO2018016530A1 (ja) | 2016-07-20 | 2018-01-25 | 日立化成株式会社 | 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板 |
CN108401433B (zh) * | 2016-12-07 | 2019-05-28 | 日立化成株式会社 | 树脂清漆、预浸渍体、层叠板及印制线路板 |
CN110511566B (zh) | 2016-12-07 | 2022-06-03 | 昭和电工材料株式会社 | 热固化性树脂组合物及其制造方法、预浸渍体、层叠板以及印制线路板 |
WO2019012954A1 (ja) | 2017-07-12 | 2019-01-17 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
JP2017210712A (ja) * | 2017-08-15 | 2017-11-30 | 明電ケミカル株式会社 | 不燃性シート |
TW201918378A (zh) * | 2017-11-10 | 2019-05-16 | 日商普林科技有限公司 | 樹脂組成物、清漆、接著劑、密封劑、塗料及成形品 |
WO2020017399A1 (ja) * | 2018-07-19 | 2020-01-23 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
CN112789167A (zh) * | 2018-10-05 | 2021-05-11 | 松下知识产权经营株式会社 | 覆铜箔层压板、布线板、以及带树脂的铜箔 |
CN113574102A (zh) * | 2019-03-27 | 2021-10-29 | 松下知识产权经营株式会社 | 预浸料、覆金属箔层压板、以及布线板 |
CN113518789A (zh) * | 2019-03-29 | 2021-10-19 | 松下知识产权经营株式会社 | 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 |
US11939443B2 (en) * | 2019-08-06 | 2024-03-26 | Nippon Soda Co., Ltd. | Polyphenylene ether resin composition, prepreg, metal-clad laminate |
CN114430752A (zh) * | 2019-09-27 | 2022-05-03 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板 |
KR20220112248A (ko) | 2019-12-03 | 2022-08-10 | 덴카 주식회사 | 경화성 조성물 및 그 경화체 |
WO2022014599A1 (ja) | 2020-07-15 | 2022-01-20 | デンカ株式会社 | 組成物及び硬化体 |
TWI795658B (zh) * | 2020-07-23 | 2023-03-11 | 南亞塑膠工業股份有限公司 | 高頻基板用樹脂組成物及金屬積層板 |
TWI766320B (zh) * | 2020-07-23 | 2022-06-01 | 南亞塑膠工業股份有限公司 | 預浸片及金屬積層板 |
US20230365797A1 (en) | 2020-09-11 | 2023-11-16 | Denka Company Limited | Composition and cured product thereof |
TWI801765B (zh) * | 2020-11-04 | 2023-05-11 | 南亞塑膠工業股份有限公司 | 電路基板材料、預浸基材及電路基板 |
WO2022102780A1 (ja) * | 2020-11-16 | 2022-05-19 | 昭和電工マテリアルズ株式会社 | マレイミド樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板及び半導体パッケージ |
TWI732733B (zh) * | 2021-01-13 | 2021-07-01 | 穗曄實業股份有限公司 | 漿料組成物及其製備方法 |
JP2021080459A (ja) * | 2021-01-26 | 2021-05-27 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
KR20240051988A (ko) | 2021-10-14 | 2024-04-22 | 덴카 주식회사 | 절연층을 포함하는 다층 구조체 |
TWI818811B (zh) * | 2022-11-21 | 2023-10-11 | 南亞塑膠工業股份有限公司 | 樹脂組成物 |
CN116265558B (zh) * | 2023-02-20 | 2023-09-22 | 有行鲨鱼(珠海)新材料科技有限公司 | 一种低比重高导热的聚氨酯结构胶及其制备方法 |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56133355A (en) | 1980-03-24 | 1981-10-19 | Mitsubishi Gas Chem Co Inc | Curable polyphenylene ether resin composition |
JPS5869046A (ja) | 1981-10-21 | 1983-04-25 | 旭化成株式会社 | 積層板及びその成形法 |
JPS58164638A (ja) | 1982-03-25 | 1983-09-29 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPS59193929A (ja) | 1983-04-18 | 1984-11-02 | Shin Kobe Electric Mach Co Ltd | 熱可塑性樹脂積層板の製造法 |
JPS6099162A (ja) * | 1983-11-05 | 1985-06-03 | Eng Plast Kk | 樹脂組成物 |
JPS6118937B2 (ja) | 1980-04-03 | 1986-05-15 | Mitsubishi Gas Chemical Co | |
JPS61286130A (ja) | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | 積層板およびその製法 |
JPS62148512A (ja) | 1985-12-23 | 1987-07-02 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド固化物の改質法 |
JPS63159443A (ja) * | 1986-12-23 | 1988-07-02 | Matsushita Electric Works Ltd | 積層板 |
JPH02208355A (ja) | 1989-02-08 | 1990-08-17 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JPH03275760A (ja) | 1990-03-26 | 1991-12-06 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド系樹脂組成物 |
JPH06179734A (ja) | 1992-12-15 | 1994-06-28 | Asahi Chem Ind Co Ltd | 硬化性の樹脂組成物および硬化性複合材料 |
JPH06184213A (ja) | 1992-12-22 | 1994-07-05 | Asahi Chem Ind Co Ltd | 硬化性樹脂組成物および硬化性複合材料 |
JPH08225665A (ja) * | 1995-02-21 | 1996-09-03 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2004292825A (ja) * | 2004-06-21 | 2004-10-21 | Matsushita Electric Works Ltd | 樹脂組成物、プリプレグ及び積層板 |
JP2005105061A (ja) | 2003-09-29 | 2005-04-21 | Tdk Corp | 樹脂組成物、樹脂付導体箔、プリプレグ、シート、導体箔付シート、積層板およびプリント配線基板 |
JP2007116785A (ja) | 2005-10-18 | 2007-05-10 | Power System:Kk | キャパシタ蓄電電源の制御装置 |
WO2007094359A1 (ja) * | 2006-02-17 | 2007-08-23 | Hitachi Chemical Co., Ltd. | セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP2007302877A (ja) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP2007302876A (ja) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118937A (ja) | 1984-07-06 | 1986-01-27 | Mitsubishi Electric Corp | 工業用テレビカメラの照明装置 |
JPH03166255A (ja) * | 1989-11-25 | 1991-07-18 | Matsushita Electric Works Ltd | 難燃化ポリフェニレンオキサイド系樹脂組成物 |
JPH0652716A (ja) * | 1992-07-28 | 1994-02-25 | Matsushita Electric Works Ltd | 複合誘電体および回路用基板 |
JP3331737B2 (ja) * | 1994-04-27 | 2002-10-07 | 松下電工株式会社 | 積層板の製造方法 |
JPH09290481A (ja) * | 1996-02-29 | 1997-11-11 | Matsushita Electric Works Ltd | 積層板の製法 |
JPH1112456A (ja) * | 1997-06-24 | 1999-01-19 | Matsushita Electric Works Ltd | 樹脂組成物、プリプレグ及び積層板 |
US6455784B1 (en) * | 1999-10-27 | 2002-09-24 | Asahi Kasei Kabushiki Kaisha | Curable sheet for circuit transfer |
JP2004029825A (ja) * | 2003-06-30 | 2004-01-29 | Seiko Epson Corp | 液晶表示装置 |
JP2005105016A (ja) | 2003-09-29 | 2005-04-21 | Mitsubishi Cable Ind Ltd | 水密組成物およびそれを使用した水密絶縁電線 |
US7326748B2 (en) * | 2004-06-14 | 2008-02-05 | The Goodyear Tire & Rubber Company | Thermoplastic composition |
JP5261943B2 (ja) * | 2006-02-17 | 2013-08-14 | 日立化成株式会社 | セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5374891B2 (ja) * | 2007-04-25 | 2013-12-25 | 日立化成株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
JP5104507B2 (ja) * | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
-
2008
- 2008-04-15 JP JP2008105598A patent/JP5104507B2/ja active Active
- 2008-04-24 TW TW97115087A patent/TWI454526B/zh active
- 2008-04-25 CN CN2008800135285A patent/CN101668806B/zh not_active Expired - Fee Related
- 2008-04-25 EP EP08752084.7A patent/EP2141198B1/en not_active Not-in-force
- 2008-04-25 KR KR1020097024645A patent/KR101491188B1/ko active IP Right Grant
- 2008-04-25 CN CN2012100779204A patent/CN102617966A/zh active Pending
- 2008-04-25 WO PCT/JP2008/058010 patent/WO2008136373A1/ja active Application Filing
- 2008-04-25 US US12/596,165 patent/US8404769B2/en active Active
-
2012
- 2012-08-17 US US13/588,881 patent/US20130040153A1/en not_active Abandoned
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56133355A (en) | 1980-03-24 | 1981-10-19 | Mitsubishi Gas Chem Co Inc | Curable polyphenylene ether resin composition |
JPS6118937B2 (ja) | 1980-04-03 | 1986-05-15 | Mitsubishi Gas Chemical Co | |
JPS5869046A (ja) | 1981-10-21 | 1983-04-25 | 旭化成株式会社 | 積層板及びその成形法 |
JPS58164638A (ja) | 1982-03-25 | 1983-09-29 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPS59193929A (ja) | 1983-04-18 | 1984-11-02 | Shin Kobe Electric Mach Co Ltd | 熱可塑性樹脂積層板の製造法 |
JPS6099162A (ja) * | 1983-11-05 | 1985-06-03 | Eng Plast Kk | 樹脂組成物 |
JPS61286130A (ja) | 1985-06-13 | 1986-12-16 | 松下電工株式会社 | 積層板およびその製法 |
JPS62148512A (ja) | 1985-12-23 | 1987-07-02 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド固化物の改質法 |
JPS63159443A (ja) * | 1986-12-23 | 1988-07-02 | Matsushita Electric Works Ltd | 積層板 |
JPH02208355A (ja) | 1989-02-08 | 1990-08-17 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JPH03275760A (ja) | 1990-03-26 | 1991-12-06 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド系樹脂組成物 |
JPH06179734A (ja) | 1992-12-15 | 1994-06-28 | Asahi Chem Ind Co Ltd | 硬化性の樹脂組成物および硬化性複合材料 |
JPH06184213A (ja) | 1992-12-22 | 1994-07-05 | Asahi Chem Ind Co Ltd | 硬化性樹脂組成物および硬化性複合材料 |
JPH08225665A (ja) * | 1995-02-21 | 1996-09-03 | Matsushita Electric Works Ltd | 積層板の製造方法 |
JP2005105061A (ja) | 2003-09-29 | 2005-04-21 | Tdk Corp | 樹脂組成物、樹脂付導体箔、プリプレグ、シート、導体箔付シート、積層板およびプリント配線基板 |
JP2004292825A (ja) * | 2004-06-21 | 2004-10-21 | Matsushita Electric Works Ltd | 樹脂組成物、プリプレグ及び積層板 |
JP2007116785A (ja) | 2005-10-18 | 2007-05-10 | Power System:Kk | キャパシタ蓄電電源の制御装置 |
WO2007094359A1 (ja) * | 2006-02-17 | 2007-08-23 | Hitachi Chemical Co., Ltd. | セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP2007302876A (ja) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP2007302877A (ja) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008291227A (ja) * | 2007-04-26 | 2008-12-04 | Hitachi Chem Co Ltd | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
WO2013172388A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社スリーボンド | 硬化性樹脂組成物およびプライマー組成物 |
JP2013241498A (ja) * | 2012-05-18 | 2013-12-05 | Three Bond Co Ltd | 硬化性樹脂組成物およびプライマー組成物 |
US9688862B2 (en) | 2012-05-18 | 2017-06-27 | Three Bond Fine Chemical Co., Ltd. | Curable resin composition and primer composition |
WO2018186025A1 (ja) * | 2017-04-07 | 2018-10-11 | パナソニックIpマネジメント株式会社 | 金属張積層板、樹脂付き金属部材、及び配線板 |
JPWO2018186025A1 (ja) * | 2017-04-07 | 2020-02-13 | パナソニックIpマネジメント株式会社 | 金属張積層板、樹脂付き金属部材、及び配線板 |
US11330710B2 (en) | 2017-04-07 | 2022-05-10 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminated board, metal member provided with resin, and wiring board |
Also Published As
Publication number | Publication date |
---|---|
TW200904896A (en) | 2009-02-01 |
TWI454526B (zh) | 2014-10-01 |
US8404769B2 (en) | 2013-03-26 |
CN102617966A (zh) | 2012-08-01 |
EP2141198A4 (en) | 2014-11-19 |
EP2141198A1 (en) | 2010-01-06 |
US20130040153A1 (en) | 2013-02-14 |
JP5104507B2 (ja) | 2012-12-19 |
JP2008291227A (ja) | 2008-12-04 |
CN101668806A (zh) | 2010-03-10 |
US20100129676A1 (en) | 2010-05-27 |
KR101491188B1 (ko) | 2015-02-06 |
CN101668806B (zh) | 2013-06-19 |
KR20100017386A (ko) | 2010-02-16 |
EP2141198B1 (en) | 2017-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008136373A1 (ja) | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 | |
TW200740309A (en) | Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same | |
EP2291061A3 (en) | Composite material, high frequency circuit substrate made therefrom and making method thereof | |
EP2241589A3 (en) | Composite material and high-frequency circuit substrate made therefrom | |
TWI513747B (zh) | A high frequency copper foil substrate and the composite material used | |
US10584222B2 (en) | Resin composition and pre-preg and laminate using the composition | |
EP2150094A3 (en) | Composite material, high-frequency circuit substrate made therefrom and making method thereof | |
CN102304264A (zh) | 一种高频铜箔基板及其所使用的复合材料 | |
CN102311614B (zh) | 树脂组合物及使用其制作的半固化片 | |
WO2009022591A1 (ja) | ヒドロキシフェニル末端基を有する芳香族ポリエーテルスルホンとその製造方法 | |
EP1818350A4 (en) | EPOXY RESIN COMPOSITION FOR PREIMPREGNE, PREIMPREGNE AND MULTILAYER CARD FOR PRINTED CIRCUIT | |
CN102731960A (zh) | 一种高韧性阻燃酚醛预浸料复合材料及其制备方法和用途 | |
CN103194010A (zh) | 一种基于丁基橡胶和天然橡胶共混的阻尼材料及其制备方法 | |
CN101423649A (zh) | 树脂组合物及用该树脂组合物生产银浆贯孔阻燃型纸基覆铜板的方法 | |
CN103200766B (zh) | 一种多层印制线路板及其制备方法 | |
KR101202241B1 (ko) | 에폭시 수지 조성물, 프리프레그, 금속 클래드 적층판, 다층 인쇄 배선판 | |
CN107760241A (zh) | 一种胶粘剂、胶粘剂的制备方法、应用该胶粘剂制成的涂胶铜箔 | |
CN111114039A (zh) | 一种减振降噪用环保型复合阻尼板及制备方法 | |
EP4299296A1 (en) | Alternative for fr-4 material | |
CN102285179A (zh) | 利用贴面纸制备的热固性泡沫塑料再生板材及方法 | |
JPS6138023B2 (ja) | ||
JP2020040343A (ja) | 金属張積層板、樹脂付き金属箔、及び配線板 | |
JP3129652B2 (ja) | 積層板の製造方法 | |
KR101420542B1 (ko) | 절연필름용 에폭시수지 조성물, 인쇄회로기판용 절연필름 및 이의 제조방법, 및 이를 구비한 인쇄회로기판 | |
JP3179145B2 (ja) | フェノール樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880013528.5 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08752084 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12596165 Country of ref document: US |
|
REEP | Request for entry into the european phase |
Ref document number: 2008752084 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008752084 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20097024645 Country of ref document: KR Kind code of ref document: A |